35 results about "Low modulus" patented technology

A low-modulus, high-resilience modified alcohol-based silicone sealant, its preparation method, and its application are disclosed, relating to the field of sealant materials technology. The silicone sealant comprises the following components in parts by weight: 100 parts of α,ω-alkoxysilane ethylidene-terminated polydimethylsiloxane, 30-80 parts of plasticizer, 80-150 parts of reinforcing filler, 0.5-20 parts of silane crosslinking agent, 0.5-10 parts of silane tackifier, and 0.01-1 part of Lewis acid catalyst; wherein the plasticizer is α-alkoxysilane ethylidene-terminated polydimethylsiloxane. The low-modulus, high-resilience silicone sealant of this invention exhibits fast surface drying speed, low modulus, high elastic recovery rate, good adhesion, and weather resistance.

The application discloses a kind of low modulus high ductility super-retarding concrete, the concrete includes by weight ratio: cement 254~360 parts, fly ash 68~108 parts, slag powder 68~70 parts, 5~16mm gravel 352~393 parts, 16~25mm gravel 660~729 parts, medium sand 669~705 parts, rubber powder 20 parts, polystyrene plastic 15 parts, water 150 parts, water reducing agent 5.9~7.5 parts, super-retarding agent 3.1~4.0 parts, water-based polyurethane 15 parts, nano composite hydrogel 15 parts, polyolefin elastomer 5 parts, polypropylene fiber 1.0 part, can have higher toughness, lower elastic modulus, and can reach design requirement strength and durability, simultaneously, when practical application, first, a layer of low modulus high ductility super-retarding concrete is poured, then continue to pour ordinary concrete, combined with other anti-cracking measures, can effectively reduce the constraint degree of bottom plate to upper portion, prevent temperature cracks.

A two-component polyurethane adhesive for bonding modules in automotive and internet-of-things (IoT) applications is provided. The adhesive comprises a polyisocyanate monomer and an isocyanate-terminated polyurethane prepolymer, along with polyols, diols, polyamines, and a polybutadiene chain compound. It features a high bonding strength of over 3MPa with low modulus in service temperature from -40℃ to 105℃ and is suitable for dissimilar material assembly.

This application relates to a low-temperature, fast-curing, low-modulus, one-component epoxy adhesive and its preparation method. The raw materials for preparation include the following components in parts by weight: 20-60 parts of base epoxy resin, 40-80 parts of silicone-modified epoxy resin, 5-10 parts of silane coupling agent, 100-200 parts of inorganic filler, 50-100 parts of low-temperature flexible curing agent, and 20-40 parts of curing accelerator. The silicone-modified epoxy resin is prepared by reacting an amine-terminated epoxy prepolymer and an epoxy-functionalized silicone using a gradient temperature-controlled process. The low-temperature flexible curing agent is an amine-terminated dynamic flexible curing agent with dynamic covalent bonds in its molecular backbone. This application, through the synergy of the silicone-modified epoxy resin and the low-temperature flexible curing agent, enables the epoxy adhesive to cure rapidly within a low-temperature range while simultaneously exhibiting excellent properties such as low modulus and high adhesive strength, and its resistance to damp heat aging is also simultaneously improved.

This invention provides a temporary bonding adhesive, its preparation method, and its application. The raw materials for preparing the temporary bonding adhesive include the following components: modified polynorbornene resin, SEBS resin, antioxidant, and solvent. The raw materials for preparing the modified polynorbornene resin include: norbornene or its derivatives, maleimide derivatives, olefins or their derivatives, and an initiator. The temporary bonding adhesive provided by this invention, based on modified polynorbornene resin and low-modulus elastomer resin (SEBS resin), not only possesses excellent film-forming properties but also exhibits high modulus at high temperatures, ensuring strong adhesion between the chip and the temporary bonding adhesive.

This invention discloses a low-modulus epoxy-based underfill adhesive, its preparation method, and its application, belonging to the field of electronic packaging materials technology. The low-modulus epoxy-based underfill adhesive comprises the following raw materials in parts by weight: 20-50 parts epoxy resin, 5-30 parts epoxy diluent, 30-50 parts curing agent, 0.1-2 parts curing accelerator, 5-15 parts toughening agent, 2-5 parts inorganic filler, 0.1-1 parts silane coupling agent, and 0.1-1 parts pigment. By introducing a toughening agent and controlling the content of low-content inorganic filler, this invention effectively reduces the storage modulus of the underfill adhesive without significantly increasing viscosity. This reduces thermal stress caused by the difference in thermal expansion coefficients between the chip and the substrate during thermal cycling, while maintaining a high glass transition temperature and good flowability. This underfill adhesive is particularly suitable for high-density, narrow-gap flip-chip packaging.

The application provides a kind of aluminum alloy die-casting die's isomorphic modulus multilayer protective coating and its preparation method, the protective coating is composed of matrix, adhesive layer, TiN transition layer, isomorphic support layer, TiAlSiN transition layer and corrosion-resistant functional layer.The preparation method comprises: (1) sample surface pretreatment; (2) glow cleaning; (3) Ti layer deposition; (4) TiN transition layer deposition; (5) TiN layer deposition; (7) high / low modulus TiAlSiN layer deposition.The application has reasonable concept, adopts high-power pulse magnetron sputtering technology to prepare modulus multilayer composite functional coating, plays the role of single-layer coating and the synergistic effect of multilayer coating, integrates high bonding force, high hardness and toughness and corrosion resistance, and obtains a kind of multifunctional composite coating with strong resistance to impact or corrosion, high hardness and toughness, thereby significantly improving the service life of the die.

The application provides a chip bonding film with adjustable modulus and a preparation method and application thereof, the film comprises the following components in parts by weight: 30-70 parts of epoxy resin, 30-70 parts of acrylic resin, 10-20 parts of heat-conducting filler, 2-5 parts of curing agent, 0.5-2 parts of coupling agent and 0.1-1 part of anti-aging agent; the chip bonding film with adjustable modulus comprises a high modulus type DAF film, a medium modulus type DAF film and a low modulus type DAF film. The modulus of the DAF film is adjusted by adjusting the mixing ratio of the epoxy resin and the acrylic resin, the modulus of the DAF film can be efficiently and accurately adjusted, meanwhile, the core performances such as bonding strength, heat conductivity, flexibility and stress buffering capacity are good, and the film is suitable for the requirements of various different semiconductor packaging scenes such as 3D chip stacking, rigid chip packaging, consumer electronic packaging, ultra-thin chip packaging and flexible electronic packaging.

This invention discloses a liquid metal composite conductive material, its preparation method, and its applications, relating to the field of liquid metal composite material preparation technology. The preparation method of this invention includes the following steps: sequentially catalytically activating a matrix material, depositing a metal layer on its surface, and then immersing it in liquid metal. Upon completion of the immersion process, the liquid metal composite conductive material is obtained. This method, which involves catalytically activating the matrix material, depositing a metal layer on its surface, and then immersing it in liquid metal, enables the preparation of both two-dimensional and three-dimensional liquid metal materials. It retains the advantages of liquid metal, such as low modulus, high deformability, and high conductivity, and maintains good electrical stability even under large deformation scenarios, with controllable resistance changes. This makes it more suitable for flexible or stretchable three-dimensional electronic devices with large deformation.

The application discloses a high-stability flexible liquid crystal display screen, relates to the technical field of flexible liquid crystal display screens, and comprises a mounting shell, a flexible liquid crystal display body, a composite structure and an adjusting device; the composite structure is composed of a high-modulus first buffer sublayer, a medium-modulus grid-shaped second buffer sublayer and a low-modulus third buffer sublayer, the three cooperate to realize edge concentrated stress bearing and dispersion, in-plane homogenization and local micro-strain absorption and crack arrest, and effectively reduce the stress peak value transmitted to the electrode; the adjusting device provides bidirectional power output through a driving assembly, switches the angle adjustment and heat dissipation modes as required through an adjusting switching assembly, the connecting plate is fast-locked with the mounting shell, and the heat dissipation assembly is communicated with the mounting shell to realize forced air cooling and heat dissipation. The application has the effects of high structural stability, long bending life, flexible angle adjustment and good heat dissipation effect.

The application discloses a low-modulus high-elasticity epoxy resin, a preparation method and application thereof, and belongs to the technical field of flexible electronic packaging materials. Through molecular structure design, long-chain flexible polyether chain segments are introduced into a rigid aromatic epoxy skeleton containing a fluorene group through chemical bonding of a urethane bond, an interpenetrating crosslinking network of soft and hard segments is constructed, a flexible long chain is formed into a continuous and penetrating flexible phase in a curing system, the obtained epoxy resin curing product has a Young's modulus of less than 50 MPa and an elongation at break of more than 60%, has low curing shrinkage, excellent interfacial adhesion and water and oxygen blocking properties, and can be widely applied to the high-reliability packaging of flexible display screens, wearable medical devices and other flexible electronic devices as packaging glue.

This invention discloses a hybrid cord and a method for manufacturing the same, which eliminates the non-uniformity caused by the difference in fineness between two different filaments by pre-twisting a low-modulus first yarn, reduces the difference in twist index between the low-modulus first yarn and the high-modulus second yarn, ensures functional uniformity and maintains better functional balance, and has not only high strength but also strong adhesion to rubber and excellent fatigue resistance, thereby realizing high performance and weight reduction of tires.

This invention relates to a steam pressure reducer and method for low-modulus treatment of cellulose acetate tow, comprising: a steam pipeline, an air pipeline, an intelligent control system component, and a low-modulus insulated box; the steam pipeline and the air pipeline are connected in parallel, and are joined together by a T-joint before entering the low-modulus insulated box; the intelligent control system component includes a sensor unit and an execution unit, which are respectively installed on the steam pipeline, the air pipeline, and the low-modulus insulated box, and connected by electrical wiring. Its advantages are: this invention achieves stable temperature and humidity control during tow treatment through a dual-pipeline parallel design, a hardware linkage protection mechanism, and a precise pressure regulation structure, while simultaneously eliminating the risk of steam leakage during maintenance by opening the box, thus improving process stability and operational safety.

The present invention relates to crosslinkable compositions, preferably one-component crosslinkable compositions, based on organic oxy-silane terminated polymers and to their use as adhesives and sealants, in particular as low modulus sealants.

This invention provides a small-diameter single-mode optical fiber with reduced coating thickness without significantly compromising puncture resistance. [Solution] The optical fiber comprises a core region, a cladding region surrounding the core region, which includes an inner cladding directly adjacent to the core region and an outer cladding surrounding the inner cladding, and a polymer coating comprising a high modulus coating layer surrounding the cladding region and a low modulus coating layer disposed between the cladding region and the high modulus coating layer. The low modulus coating layer has a layer thickness in the range of 4 μm to 20 μm and an elastic modulus of about 0.35 MPa or less, and the high modulus coating layer has a layer thickness in the range of 4 μm to 20 μm and an elastic modulus of about 1.6 GPa or more. The optical fiber has puncture resistance of more than 20 g and a microbend attenuation penalty of less than 0.03 dB / km, and the outer diameter of the coated optical fiber is 175 μm or less.

This invention discloses a balancing layer for aging-friendly engineered wood flooring and its preparation method. The balancing layer is composed of reconstituted fibers and flexible polymer materials, and sequentially includes a high-modulus region, a transitional modulus region, and a low-modulus region in the thickness direction, forming a gradient modulus distribution structure. The high-modulus region contains reconstituted fibers, thermoplastic polyurethane elastomer, interfacial compatibilizer, and thermally conductive filler; the transitional modulus region contains reconstituted fibers, thermoplastic polyurethane elastomer, plasticizer, interfacial compatibilizer, and thermally conductive filler; and the low-modulus region contains reconstituted fibers, foamed elastomer material, and interfacial compatibilizer. The preparation method includes raw material premixing, three-layer co-extrusion molding, plasma activation treatment, surface treatment agent spraying, and ultraviolet curing treatment. This balancing layer combines structural support and flexible buffering performance, exhibiting good dimensional stability, interfacial bonding strength, and resistance to damp heat aging, making it suitable for aging-friendly engineered wood flooring.

The utility model provides a low modulus glue production is with vacuum stirring defoaming machine relates to low modulus glue production technical field, the utility model discloses a defoaming machine main part and the rotation bucket, the inner wall rotation of defoaming machine main part is installed with the rotation frame, the utility model discloses a supplementary device and drive mechanism can effectively with the gas bubble in glue through centrifugal force, mechanical extrusion and vacuum environment combined mode carries out high -efficient defoaming. The equipment is through the rotation of the rotation bucket synchronous rotation, and through the reciprocating motion of extruding plate on the inner wall of the rotation bucket, utilizes extrusion and the synergistic effect of centrifugal force, makes the bubble breakage, combines and rapidly discharges to improve the defoaming effect, improves the quality of glue. The design of exhaust mechanism, pin and reinforcing rod etc. structure strengthens the intervention to the glue, further promotes the breakage and discharge of the bubble, improves the defoaming efficiency and the durability of equipment of whole, ensures the high -quality production of low modulus glue.

The application relates to a preparation method of a ZrO2 reinforced TiZrNbTaCu high-entropy alloy, specifically to introducing an antibacterial element copper into a TiZrNbTa base body, and preparing the ZrO2 reinforced TiZrNbTaCu high-entropy alloy through high-energy ball milling and spark plasma sintering. The atomic ratio of titanium powder, zirconium powder, niobium powder and tantalum powder is 1-5:1:1:1, the mass ratio of copper powder and TiZrNbTa powder is 3-7:97-93, and the mass ratio of stearic acid and titanium-zirconium-niobium-tantalum-copper powder is 0.05-1.5:100. The ZrO2 reinforced TiZrNbTaCu high-entropy alloy prepared by the application has the integrated characteristics of low modulus, high strength, high wear resistance, strong antibacterial property and good biocompatibility, and is a very potential hard tissue repair substitute material.

According to an electronic device, an assembling method for the screen component provided in this application, in the screen component assembled structure, a protective gap is provided between a side wall of a screen component and a border frame portion, a protective glue layer fills the protective gap, and the protective glue layer blocks the protective gap, so that entire machine protection is performed by using the protective glue layer. The protective glue layer has a high-modulus portion and a low-modulus portion, and the high-modulus portion is located on one side of the low-modulus portion facing away from a middle plate portion of a middle frame. The high-modulus portion has a high modulus and high hardness, and the low-modulus portion has a low modulus and good elasticity, so that the protective glue layer can have both a protective function and a buffering function.

The present application relates to damping material, provide a kind of micro-nano laminated damping material, including low modulus damping material and high modulus damping material of alternative overlap arrangement;The modulus of low modulus damping material is 2-5MPa, and the modulus of high modulus damping material is 15-30MPa;The thickness ratio of high modulus damping material and low modulus damping material is 4-5:1.The micro-nano laminated damping material and its preparation method of the present application, by setting the thickness, number of layers of high modulus damping material and low modulus damping material and thickness ratio, to make the final damping material have optimal damping performance.

The application discloses a composite material, a preparation method and application thereof, and a piezoelectric sensor. The composite material comprises polyvinylidene fluoride microspheres and a flexible matrix material; the polyvinylidene fluoride microspheres are dispersed in the flexible matrix material. The composite material has low modulus and excellent piezoelectric performance.

This invention discloses a self-reinforced gradient modulus silicone underfill composition, its preparation method, and its application in advanced packaging, belonging to the field of electronic packaging materials technology. The composition comprises: a carboxyl- and acryloyloxy-containing polysiloxane, a vinyl-containing polysiloxane, a hydrogen-containing polysiloxane, a photoinitiator, a platinum catalyst, and a reactive surface energy modifier. The composition rapidly cures at 80-120°C through the autocatalytic effect of acryloyloxy UV products; and forms a gradient structure with high modulus on the chip side and low modulus on the substrate side through reaction-induced phase separation induced by the reactive surface energy modifier. This underfill can simultaneously solve chip warpage and solder joint fatigue problems in advanced packaging, with a thermal cycling reliability retention rate >80%.