854 results about "Low modulus" patented technology

In a semiconductor integrated circuit sandwiched between a pair of a first impact resistance layer and a second impact resistance layer, an impact diffusion layer is provided between the semiconductor integrated circuit and the second impact resistance layer. By provision of the impact resistance layer against the external stress and the impact diffusion layer for diffusing the impact, force applied to the semiconductor integrated circuit per unit area is reduced, so that the semiconductor integrated circuit is protected. The impact diffusion layer preferably has a low modulus of elasticity and high breaking modulus.

Woven fabric laminates having superior resistance to penetration by ballistic projectiles, assemblies thereof, and the method by which they are made. In one embodiment, among others, a laminate of the invention is comprised of a fabric woven from a high strength, high modulus yarn, a surface coating of a low modulus elastomer and a plastic film bonded to its elastomer-coated surface.

The present invention provides an electrically conductive adhesive composition having cured low modulus elastomer and metallurgically-bonded micron-sized metal particles and nano-sized metal particles. The low modulus elastomer provides the mechanical robustness and reliability by relieving the stresses generated; and the metallurgically-bonded micron-sized metal particles and nano-sized metal particles provide a continuous conducting path with minimized interface resistance. Addition of nano-sized metal particles lowers the fusion temperature and allows the metallurgical-bonding to occur at manageable temperatures.

An intraocular accommodating lens comprising a resilient polymer monolith with a peripheral component that has a Young's modulus and an equilibrium memory shape that imparts to the capsular sac's periphery the natural shape of the capsule in an accommodated state. The intraocular lens includes a central deformable optic that provides accommodated and disaccommodated shapes. The peripheral component is deformable to a disequilibrium, stressed shape in responsive to equatorial tensioning-and is capable of applying restorative forces to move the lens toward the accommodated shape from a disequilibrium disaccommodated shape. In one embodiment, the central optic portion includes a displaceable media than can be displaced by very low forces of zonular excursion, wherein the displaceable media can comprise a very low modulus polymer or an index-matched fluid.

A multilayer heat-sealable chlorine-free film of relatively low modulus, high interlaminar strength, and low noise upon flexing is provided. The film comprises an odor barrier layer of polyester resin and at least one heat-sealable skin layer, preferably two such skin layers on opposite sides of said odor barrier layer, composed of a homopolymer of ethylene or a copolymer of ethylene and an alpha-olefin or an ester-containing monomer. In a preferred embodiment, the odor barrier layer is formed of polyethylene terephthalate and adhesive tie layers are interposed between the odor barrier layer and the skin layers, resulting in a multilayer film of five layers. Pouches formed of such multilayer films are also disclosed.

Disclosed is an improved optical fiber that employs a novel coating system. When combined with a bend-insensitive glass fiber, the novel coating system according to the present invention yields an optical fiber having exceptionally low losses.

The coating system features (i) a softer primary coating with excellent low-temperature characteristics to protect against microbending in any environment and in the toughest physical situations and, optionally, (ii) a colored secondary coating possessing enhanced color strength and vividness.

The improved coating system provides optical fibers that are useful in relatively thin-walled, low-modulus buffer tubes (i.e., “flextubes”) that can be readily accessed without special tools.

A prosthetic glenoid component for attachment to a scapula to provide a bearing for a humeral head in a shoulder prosthesis has a one-piece bearing element having a concave lateral bearing surface for contact with the humeral head with which it is to be used. An opposing relatively hard medial surface of the bearing element is provided for attachment to a scapula. The lateral surface is a soft low modulus concave lateral bearing surface extends around the periphery of the bearing element and increases its thickness to provide a deformable rim to simulate the labrum in an anatomical glenoid. The bearing element preferably has two affixation pegs which project from the medial face thereof, one at a superior position which projects in a superior direction and the other which is located in an inferior position and which projects in an inferior direction which is angled in relation to the medial-lateral direction.

A biocompatible titanium alloy with low modulus comprising alpha'' phase as a major phase and containing from about 6 to about 9 wt % of molybdenum, from 0 to about 1 wt % of an alloying element and the balance titanium. The alloying element is niobium and/or zirconium. The biocompatible titanium alloy is suitable for use as a material for a medical prosthetic implant.

A technique facilitates construction of high temperature fiber reinforced polymer oilfield tubulars. The technique comprises a method of combining a fiber material and a high temperature thermoset resin to create a high performance composite material. The composite material is formed into an oilfield tubular that can be used in a variety of downhole applications. The method of combining the high performance materials with low modulus, high temperature coating materials during the manufacturing process produces composite tubular products that can survive prolonged exposure to deleterious well fluids in high temperature and high pressure downhole environments.

The present invention provides a thermoplastic film or sheet comprising two surface layers made of acid copolymers, or ionomers, or combinations thereof and at least one inner layer made of ethylene acrylate ester copolymers, a solar cell module comprising at least one encapsulant layer derived therefrom, and a process of manufacturing the solar cell module.

A catheter balloon formed of a polymeric material such as expanded polytetrafluoroethylene (ePTFE) bonded to a second layer formed of a low tensile set polymer and/or impregnated with a low tensile set polymer. In a presently preferred embodiment, the low tensile set polymer is a silicone-polyurethane copolymer elastomer or a diene polymer elastomer. The low tensile set polymer has high strength, low modulus, high elongation, and low tensile set. The diene or silicone-polyurethane has a low tensile set, which facilitates deflation of the balloon to a low profile deflated configuration. One aspect of the invention provides improved attachment of the diene to the ePTFE. In one embodiment, the second layer is formed of a diene mixed with a bonding promoter such as a vulcanizing agent which is covalently bonded to the diene.

The present invention provides a method and a formulation for consistently producing a silicone hydrogel material having relatively high oxygen permeability, relatively high ion permeability, and low modulus, and contact lenses prepared from a formulation of the invention or made of a silicone hydrogel material of the invention.

A needle trace transfer member to which needle traces of probes are transferred is installed at a movable mounting table to align the probes before electrical characteristics of a target object on the mounting table are inspected by bringing the probes into electrical contact with the target object. The needle trace transfer member is made of a shape memory polymer transformed reversibly and rapidly between a glass state with a high modulus elasticity and a rubber state with a low modulus of elasticity near its glass transition temperature. The glass transition temperature is set to a temperature close to a set temperature of the mounting table. The shape memory polymer is mainly made of polyurethane-based resin.

A chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices or the like. The invention is directed to a polishing pad composition comprising a high modulus phase component and a low modulus phase component. The multi-phase polishing pads are very efficient and effective in providing high performance polishing along an entire polishing surface interface.

The invention discloses low-modulus single-component silane modified polyether sealing gum which consists of the following components: silane modified polyether, a plasticizer, pigment, fillers, a thixotropic agent, an ultraviolet light absorber, a catalyst, a dehydrating agent and an adhesion promoter. According to the silane modified polyether sealing gum disclosed by the invention, by controlling the technical parameters such as the types and contents of the fillers, the types and content of the plasticizer, and the types and content of the thixotropic agent, the prepared silane modified polyether sealing gum does not need prime coat, does not contain isocyanate, is economical and environmentally-friendly, low in modulus, can bear dynamic juncture, has good flexibility, cohesiveness and good storage stability, can be firmly adhered with concrete, PVC (Polyvinyl Chloride) materials, aluminum sheets, glass, steel products, ceramic and the like, and can be widely applied to the fields of roads, bridges and buildings.

The invention is based on the discovery that adhesive compositions containing certain low-viscosity, mono-ethylenically unsaturated monomers have surprisingly good cure parameters, resulting in very little weight loss upon cure. Many of these monofunctional monomers used alone or in combination with other monofunctional monomers described herein have high glass transition temperatures when cured. Moreover, since these monomers are monofunctional the crosslink density of the adhesive composition does not increase (relative to multi-functional monomers), which in turns results in lower stress, lower modulus adhesive compositions. As such, these monomers are useful in a variety of thermoset adhesive compositions, such as for example, die attach adhesive compositions.

A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.