58 results about "Tape-automated bonding" patented technology

A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection between an active electronic device and its components. The electrically conducting adhesive can be a mixture comprising a polymer resin, a no-clean solder flux, a plurality of electrically conducting particles with an electrically conducting fusible coating which provides a metallurgical bond between the conducting particles as well as to the substrates. The advantages of using the electrically conducting adhesives include reduction in bonding pressure and/or bonding temperature, control of interfacial reactions, promotion of stable metallurgical bonds, enhanced reliability of the joints, and others.

A two-dimensional LD (laser diode) array light-emitting device constituted by stacking light-emitting units each having a LD bar and a cooling assembly for cooling the LD bar with a simplified electrical connection structure to reduce manufacturing cost. The cooling assembly is electrically connected with one electrode of the LD bar through the die spacer so that a part of the cooling assembly serves as one electrode of the light-emitting unit. The other electrode of the LD bar is electrically connected with a webbed extending section of a conductive layer of a TAB (tape-automated bonding) sheet so that the conductive layer serves as the other electrode of the light-emitting unit. A space between the adjacent cooling assemblies for arranging the LD bar is adjusted by the spacer sheet intervened between the TAB sheet and the cooling assembly.

A method of resizing a liquid crystal display (LCD) includes the steps of first determining a desired size for the LCD, thereby identifying an undesired portion of the LCD. Any tape automated bonding strips (TABs) corresponding to the undesired portions of the LCD are then removed. Any flex circuits, or portion thereof, corresponding to the undesired portion of the LCD are cut and removed. Any circuit boards, or portions thereof, corresponding to the undesired portion of the LCD are cut and removed. The display panel is cut to remove a portion of the display panel corresponding to the undesired portion of the LCD. Finally, the cut edge of the display panel is sealed.

The present invention relates to a chip package that includes a semiconductor device and at least one micro electromechanical structure (MEMS) such that the semiconductor device and the MEMS form an integrated package. One embodiment of the present invention includes a semiconductor device, a first MEMS device disposed in a conveyance such as a film, and a second MEMS device disposed upon the semiconductor device through a via in the conveyance.

The present invention also relates to a process of forming a chip package that includes providing a conveyance such as a tape automated bonding (TAB) structure, that may hold at least one MEMS device. The method is further carried out by disposing the conveyance over the active surface of the device in a manner that causes the at least one MEMS to communicate electrically to the active surface. Where appropriate, a sealing structure such as a solder ring may be used to protect the MEMS.

The invention relates to an electrolytic foil, an electrical component containing the electrolytic foil and a battery. The invention provides the electrolytic foil, wherein the average diameter of pores of an area among prominent surface elements of a separating-out surface is 1 nanometer to 100 nanometers. The electrolytic foil shows high elongation rate while maintaining low roughness and high strength, thus being applicable to semiconductor packaging substrates for tape automated bonding used in current collector and tape carrier package of large and medium lithium ion secondary batteries.

Disclosed herein is an electrolytic copper foil in which an average diameter of a pore which is a region between surface elements protruding from a matte side is 1 mm to 100 nm. The electrolytic copper foil has high elongation while maintaining low roughness and high strength and thus may be used in a current collector of a medium-large size lithium ion secondary battery and a semiconductor packaging substrate, and the like, for tape automated bonding (TAB) which is used in a tape carrier package (TCP).

The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Means to increase the UPH of TAB bonding on an HSA manufacturing line to allow a higher UPH to keep cost down and also allow the use of one or more grounds to be add to an HSA to help control ESD without lowering the UPH or redesigning the lines through the use of a multi-head contact TAB bonding tool as described herein A bonding tool for use in tape automated bonding (TAB) is provided that is for multi-contact. The multi-contact TAB bonding tool is ESD safe so as not to damage a device being bonded.

Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (μm), a maximum height Rmax (μm), and a ten-point height average Rz (μm) of a matte side satisfy an Equation below, 1.5≦(Rmax−Rz)/Ra≦6.5. The electrodeposited copper foil according to the present invention maintains low roughness and high strength, and exhibits a high elongation rate, and particularly, has excellent glossiness, so that the electrodeposited copper foil may be used in a current collector of a medium and large lithigum ion secondary battery and a semiconductor packaging substrate for Tape Automated Bonding (TAB) used in a Tape Carrier Package (TCP).

A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip. The connection surface includes a first edge and a second edge that are substantially parallel to each other and are opposite each other on a respective first side and second side of the chip, and a third edge and fourth edge that are substantially perpendicular to the first and second edges, and are opposite each other on a respective third side and fourth side of the chip. A plurality of input pads of the set of input pads are adjacent the first edge, and are arranged in a first row substantially parallel to the first edge and extending in a first direction; a plurality of first output pads of the set of output pads are adjacent the second edge, and are arranged in a second row substantially parallel to the second edge and extending in the first direction; and a plurality of second output pads of the set of output pads are located between the first row and the second row. The plurality of second output pads include at least first and second outermost pads located a certain distance from the respective third edge and fourth edge, and at least first and second inner pads located a greater distance from the respective third edge and fourth edge than the first and second outermost pads.

An ink supply unit for supplying separate color inks to a portable ink jet print head, the ink supply unit including: a slot for insertion of the printhead; a series of elongated chambers for the storage of the separate color inks, the chambers being interconnected with the slot for the supply of ink to the printhead; a series of conductive rails along the outside of the ink supply unit, each conductive rail interconnected to a power supply at a series of points along the conductive rail; a tape automated bonding strip along the outside of the ink supply unit having a series of control lines along one surface thereof for mating with a corresponding external series of control lines, the tape automated bonding strip further having a repeating series of interconnects to the printhead, the interconnects interconnecting the control lines and the conductive rails to the printhead. The unit can be detachable from the power supply and the external series of control lines.

In the neighborhood of each connecting region of a panel substrate, tape automated bonding (TAB) substrates, and a flexible substrate, marks for a visual inspection are provided at a preset distance apart from the connecting region. According to the present marks, inferior products are eliminated with a high rate of accuracy upon visual inspection after completing a connection of display panel.

The invention discloses an inner pin bonding package, which is suitable for bonding a chip on a soft panel by using tape automated bonding technology. The inner lead bonding package comprises a chip, the soft panel and a plurality of pins arranged on the soft panel and extended to a chip bonding section. The chip includes a bump eutectically bonded with the pins, and the pins include a first pin and a second pin, wherein the first pin includes a first eutectic-bonding region with the same width as that of the first pin at one end corresponding to the bump, and the second pin includes at least one groove at one end corresponding to the bump to form a second eutectic bonding region with a smaller width than that of the second pin. Accordingly, the eutectic bonding area between the first/second pin and the bump is uniformized. Accordingly, the inner pin bonding package process can be achieved in one step without causing the problems of poor bonding strength or solder wicking.

The invention provides a carrier tape for an intelligent card, a packaging module for the intelligent card adopting the carrier tape and a method for making the same. The carrier tape for the intelligent card has an open window, a beam lead is led out from each contact pin to the middle part of the open window; and at least one part of the front end of the beam lead is positioned in the same horizontal line. The packaging module for the intelligent card comprises the carrier tape, a semiconductor chip and a colloid, wherein the semiconductor chip is adhered to the lower surface of the carrier tape faceup from a bonding pad under the carrier tape through adhesive; and after adhered to the carrier tape, the bonding pad of the semiconductor chip is positioned in the middle of the open window. A tape automated bonding (TAB) process is adopted to realize bonding between all bonding pads and corresponding beam leads at one time, thereby improving packaging efficiency and reducing manufacturing cost.

An organic EL display device is disclosed, which is fabricated in a tape automated bonding (TAB) method. The organic EL display device includes a driving part; a display panel including a substrate, a plurality of first and second electrodes formed on the substrate in a matrix type; and first and second lines having different lengths for being alternately arranged, and respectively applying signals from the driving part to the first and second electrodes; and a connecting part including a third line for electrically connecting the first and second lines to the driving part.