2results about How to "Enhanced bonding" patented technology

This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.

The application provides an aluminum pad structure and a manufacturing method thereof. The manufacturing method of the aluminum pad structure comprises the following steps: sequentially forming a first aluminum layer, a protective layer and a passivation layer on a substrate; performing dry etching on the passivation layer by using a plasma containing fluoride ions to form a passivation layer opening, wherein the passivation layer opening is located above a preset region of the first aluminum layer and the bottom surface of the passivation layer opening stays on the surface of the protective layer; then forming a second aluminum layer on the protective layer and removing the part of the second aluminum layer which is higher than the passivation layer, thereby obtaining a sandwich-type aluminum pad structure composed of the first aluminum layer, the protective layer and the second aluminum layer. The manufacturing method of the aluminum pad structure can avoid the direct contact of the etching process with the aluminum pad, thereby eliminating the generation of aluminum fluoride compound residues and fluoride ion residues on the surface of the aluminum pad from the root. The aluminum pad structure is in a sandwich type, has less aluminum fluoride compound residues and fluoride ion residues, is beneficial to improve the bonding and yield test results, and reduces fluorine precipitation.