7results about How to "Enhanced bonding" patented technology

The present invention provides a chip packaging structure and a chip packaging method, the chip packaging structure comprising: a chip, a positioning groove is provided on the back of the chip; a substrate, a positioning bump is provided on the upper surface of the substrate; the chip is bonded to the upper surface of the substrate, and the positioning bump is inserted in the positioning groove; a plastic encapsulation layer is located on the upper surface of the substrate and plastic encapsulates the chip; a rewiring layer is located on the upper surface of the plastic encapsulation layer and is electrically connected to the chip; a solder ball bump is located on the upper surface of the rewiring layer and is electrically connected to the rewiring layer. In the chip packaging structure of the present invention, a positioning groove is provided on the back of the chip and a positioning bump is provided on the upper surface of the substrate, the chip is bonded to the upper surface of the substrate, the positioning groove and the positioning bump can enhance the ability of the chip to bond to the upper surface of the substrate, prevent the chip from shifting on the upper surface of the substrate after bonding, thereby ensuring the performance of the chip packaging structure.

This invention discloses a method for metal hot-press bonding and its application. The method specifically includes: providing a first substrate and a second substrate, the first substrate having a first metal bonding surface and the second substrate having a second metal bonding surface; aligning the first and second substrates to bring the first and second metal bonding surfaces into contact; and performing hot-press bonding by controlling temperature and applying pressure. The hot-press bonding includes a heating and high-pressure stage, a heat-holding and low-pressure stage, and a cooling and pressure-releasing stage; the temperature of the heat-holding and low-pressure stage is the bonding temperature. This invention achieves hot-press bonding of metals in an air environment through coordinated temperature and pressure control, resulting in a well-bonded interface that is free of oxidation, dense, and pore-free.

The application provides an aluminum pad structure and a manufacturing method thereof. The manufacturing method of the aluminum pad structure comprises the following steps: sequentially forming a first aluminum layer, a protective layer and a passivation layer on a substrate; performing dry etching on the passivation layer by using a plasma containing fluoride ions to form a passivation layer opening, wherein the passivation layer opening is located above a preset region of the first aluminum layer and the bottom surface of the passivation layer opening stays on the surface of the protective layer; then forming a second aluminum layer on the protective layer and removing the part of the second aluminum layer which is higher than the passivation layer, thereby obtaining a sandwich-type aluminum pad structure composed of the first aluminum layer, the protective layer and the second aluminum layer. The manufacturing method of the aluminum pad structure can avoid the direct contact of the etching process with the aluminum pad, thereby eliminating the generation of aluminum fluoride compound residues and fluoride ion residues on the surface of the aluminum pad from the root. The aluminum pad structure is in a sandwich type, has less aluminum fluoride compound residues and fluoride ion residues, is beneficial to improve the bonding and yield test results, and reduces fluorine precipitation.

The invention relates to the technical field of optical devices, in particular to a preparation method of a planar waveguide. The method comprises the following steps: adding a silk protein solution into a preset printing device; the preset printing device comprises a nozzle and a moving platform; the nozzle is arranged on the moving platform, and the moving platform can drive the nozzle to freely move in a space range; injecting silk protein ink into the cross-linking solution based on a nozzle for curing treatment to obtain an initial planar waveguide structure; wherein the cross-linking solution is a methanol solution with a preset concentration; and drying the initial planar waveguide structure under the conditions of preset temperature and preset humidity to obtain the planar waveguide. Through the treatment, accurate deposition of the silk protein ink is realized, the prepared planar waveguide structure is finer and more accurate, bonding among silk protein molecules is enhanced, and the stability and the mechanical strength are improved, so that the silk protein planar waveguide can be realized, and the biocompatibility of the planar waveguide is improved.

The invention provides a heavy oil reservoir sand control agent, a sand control treatment fluid system and a sand control method, and belongs to the technical field of oil extraction. The sand control agent for the heavy oil reservoir comprises proppant particles, and an inner-layer epoxy resin film and an outer-layer resin film which are sequentially coated on the surfaces of the proppant particles, the outer layer resin film is prepared from a reaction product of polyisocyanate, bisphenol A type polyether glycol, dimer acid and 4, 4-diphenylmethane diamine. The heavy oil reservoir sand control agent has a good water control effect and high compressive strength.

The invention belongs to the field of sodium ion batteries, and discloses a modification preparation method of a sodium manganese titanium phosphate positive electrode material of a sodium ion battery, which comprises the following steps: S1, weighing a metal ion chelating agent to prepare a solution I; s2, weighing a manganese source, a titanium source and a sodium source, and dissolving in the solution I to obtain a solution II; s3, dissolving a Li, Mg or Ca source material in the solution II to obtain a solution III; weighing phosphate to prepare a solution IV; s4, dropwise adding the solution IV into the solution III; and S5, stirring under an oil bath condition, and then drying and calcining to obtain the target modified titanium manganese sodium phosphate positive electrode material. The modified titanium manganese sodium phosphate positive electrode material is obtained by introducing a low-orbital energy level element Li, Mg or Ca into the titanium manganese sodium phosphate Na3MnTi (PO4) 3 positive electrode material and controlling the preparation method at the same time, a Li (Mg, Ca)-O-Mn electron configuration is constructed, the inhibition of antisite defects is realized, and the improvement of electrochemical performance is facilitated.

The utility model discloses a street lamp fixing base which comprises a plurality of screws and a pit, a stone cushion layer is arranged on the periphery of the pit, a concrete base cast by concrete in place is arranged in the stone cushion layer, the screws are embedded in the concrete base and connected through connecting rods, each screw is provided with a plurality of arc-shaped claws, and the arc-shaped claws are arranged on the periphery of the pit. A plurality of leveling seats capable of supporting the bottoms of the screws are arranged at the bottoms of the screws; an embedding groove is formed in the top of the concrete seat; the screw supports are connected together, so that the multiple screws can form a whole, the overall firmness is improved, certain fixing force and limiting can be provided for the screws in the horizontal direction through the connecting rods, the screws are prevented from being pulled out integrally, in addition, the arc-shaped claws are arranged on the screws and can provide certain grabbing force for the screws, and therefore the screws are prevented from being pulled out integrally. The firm connection effect of the screw and the concrete base is improved, and the screw is prevented from falling off.