1085results about "Electroforming processes" patented technology

The invention provides a method for reducing electrolyte impurities based on copper foil production equipment, which comprises the following steps: identifying a pressure fluctuation abnormal region from a pressure time-frequency distribution map, taking the pressure fluctuation abnormal region as the input of a pre-constructed high-deposition region distribution model, outputting to obtain the position distribution of the high-deposition region, and determining potential high-risk nodes of impurity deposition in a pipeline; according to the determined potential high-risk node of impurity deposition in the pipeline, a filtering device is deployed at the potential high-risk node of impurity deposition, impurity particle size separation is carried out through a multi-stage filtering structure arranged in the filtering device, separated impurities with different particle sizes are directionally collected, and impurity data are obtained.

The invention relates to the technical field of batteries, in particular to a copper foil and a preparation method thereof, a current collector, a pole piece and an energy storage device. A connection degree gamma exists between the surface density of the copper foil and the size and arrangement of the through holes, the formula of the connection degree gamma is # imgabs0 #, and the value range of gamma is 1 + / -0.1; the copper foil is prepared through an electrolytic method, and an insulating acid-resistant coating is dispensed on the surface of a cathode of the electrolytic method to form an insulating acid-resistant layer; according to the electrolytic method, an active layer is formed on the surface of an anode by coating a mixed active substance solution and sintering, an inert substance is coated on the surface of the active layer opposite to a point coating position of a cathode to form an inert layer, and the range of the inert layer is smaller than 70% of the area of a pore region. The porous copper foil prepared by the method has a porous structure, the pore size distribution is more uniform, the size is consistent, meanwhile, the parts except the pores are dense copper layers, and the mechanical property of the material is good.

The invention discloses a component gradient iridium tantalum coating anode and a preparation method thereof, the component gradient iridium tantalum coating anode comprises a titanium-based bottom layer, a middle layer and a surface active layer structure with component gradient, and the middle layer and the active layer are both prepared through a thermal decomposition method. And the intermediate layer is prepared on the titanium substrate and is composed of TiO2 / Ta2O5 mixed oxide. The surface active layer is prepared on the outer side of the middle layer and comprises a plurality of layers of IrO2 / Ta2O5 oxide coatings with different iridium-tantalum proportions. Compared with a traditional uniform coating anode, the prepared component gradient iridium tantalum coating anode can relieve the stress concentration phenomenon and reduce coating cracking, the service life of the anode is remarkably prolonged, and the catalytic activity of the anode is remarkably improved; the modified carbon nano tube is added into the active layer precursor solution, so that the conductivity change caused by component gradient is improved, and the cell voltage of the component gradient iridium tantalum coating anode is effectively reduced; and moreover, the iridium content is lower, and the preparation cost of the electrode is reduced.

The invention provides an electrolytic copper foil which is at least provided with a low-roughness surface, copper nodules on the low-roughness surface are rod-shaped protrusions and / or granular protrusions, the distance between every two adjacent protrusions ranges from 10 nm to 650 nm, the height of the copper nodules of the rod-shaped protrusions ranges from 300 nm to 800 nm, and the height of the copper nodules of the granular protrusions ranges from 80 nm to 250 nm. And the number of the rod-shaped bulge copper nodules and / or the granular bulges is 50-150 in every 25 mu m < 2 > of the area of the low-roughness surface. The invention further provides a preparation method and application of the electrolytic copper foil. The electrolytic copper foil provided by the invention has a low-roughness surface, so that the signal integrity of the copper foil substrate is improved, the problem of large signal transmission loss in the prior art is solved, the peeling strength between the copper foil and the substrate is improved, and the defect of insufficient peeling strength in the prior art is overcome.

The invention provides a titanium anode, a titanium anode preparation method, an electrolytic copper foil and application. The titanium anode comprises a titanium substrate and a composite layer on the surface of the titanium substrate. The composite layer comprises a first active layer and a second active layer which are sequentially arranged on the titanium substrate, and the first active layer is arranged on the surface of the titanium substrate; wherein the first active layer includes an oxide of titanium and an oxide of tantalum, and the second active layer includes an oxide of tantalum, an oxide of iridium, and an oxide of cerium. The titanium anode provided by the invention has the characteristics of strong binding force, few cracks, high electrocatalytic activity, good uniformity, good erosion resistance and the like, and is beneficial to prolonging the service life.

The invention discloses a preparation method of an ultra-thin copper foil with a carrier, and belongs to the technical field of copper foil manufacturing. The method comprises the steps that S1, a titanium plate is adopted as a cathode, an iridium-plated titanium plate is adopted as an anode, the washed titanium plate is immersed in a copper electroplating solution at the temperature of 30-70 DEG C, and after electro-deposition is conducted, a carrier copper foil is prepared; s2, immersing the carrier copper foil prepared in the step S1 into an organic solution containing ionic liquid for adsorption to obtain a carrier copper foil with a stripping layer; and S3, taking the carrier copper foil with the stripping layer prepared in the step S2 as a cathode, carrying out water washing treatment, then immersing the carrier copper foil into another copper electroplating solution at the temperature of 30-70 DEG C, and carrying out electro-deposition by taking an iridium-plated titanium plate as an anode, so as to prepare the ultra-thin copper foil. The ultrathin and uniform single organic stripping layer is prepared in an organic adsorption mode, the method is simple in preparation process, and the stripping layer enables the ultrathin copper foil to be stably and completely stripped from the carrier copper foil by regulating and controlling the binding force between the carrier copper foil and the ultrathin copper foil.

The invention discloses a copper foil production system and method.The copper foil production system comprises an electrolytic bath and a cathode roller arranged in the electrolytic bath and further comprises a partition anode module, a partition cooling module, a detection module and a control system; the partitioned anode module comprises a plurality of anode assemblies which are arranged along the axial direction of the cathode roller, and an electric control module which is respectively connected with each anode assembly; the subarea cooling module comprises a plurality of cooling structures which are arranged in the cathode roller and are in one-to-one correspondence with the anode subareas, and a cooling control module which is respectively connected with each cooling structure; the control system is electrically connected with the electric control module, the cooling control module and the detection module. According to the method, differentiated cooperative control of partition current and cooling can be intelligently executed according to the source and size of supersaturation degree deviation, so that rapid directional compensation is performed at any axial position, and the defects of response lag and extensive regulation and control in a traditional mode are effectively overcome.

The invention relates to the technical field of electrolytic copper foil processing, printed circuit board processing and electrolytic copper foil, in particular to a preparation method of a bi-component stripping layer carrier copper foil and the bi-component stripping layer carrier copper foil. The preparation method provided by the invention comprises the following steps: preparing a carrier copper layer; preparing a first inorganic stripping layer on the smooth surface of the carrier copper layer through an electrochemical / physical vapor deposition method; preparing a second inorganic stripping layer on the surface of the first inorganic stripping layer through a low-temperature chemical vapor deposition method; preparing an ultra-thin copper layer on the surface of the second inorganic stripping layer through a pulse electrochemical deposition method; carrying out roughening treatment on the ultra-thin copper layer; and constructing a non-copper functional layer on the surface of the roughened ultra-thin copper layer, and carrying out silane coupling agent coating treatment to obtain the double-component stripping layer carrier copper foil. The two-component inorganic matter is used as the stripping layer of the carrier copper foil, the heat resistance of the stripping layer of the carrier copper foil is improved, and meanwhile the stability of the separating force between the ultra-thin copper layer and the carrier copper layer is improved.

The invention provides a preparation method of a porous copper foil with a regular polygonal hole array, which comprises the following steps of: grinding and polishing a titanium plate until the titanium plate is matte, punching holes with the regular polygonal hole array in the titanium plate by laser, finely trimming vertex angles of the regular polygonal holes by laser, and polishing and grinding the titanium plate to obtain the porous copper foil with the regular polygonal hole array. The method comprises the following steps: preparing a titanium plate, cleaning with pure water and alcohol to obtain a clean titanium plate, preparing a copper sulfate electrolyte, adding a proper amount of a brightener, a wetting agent and a high resistance agent into the electrolyte, mixing, pouring the mixed solution into an electrolytic bath, putting the clean titanium plate and a carbon plate into the electrolytic bath, and carrying out electrolytic foil generation by taking the titanium plate as a cathode and the carbon plate as an anode; and after foil generation is finished, the copper foil is stripped from the surface of the titanium plate, and the porous copper foil with the regular polygon holes is obtained. According to the method, the holes of the titanium plate are the regular polygon holes, and the vertex angles of the regular polygon holes are finely trimmed, so that the copper foil of the electrolytic raw foil is not easy to adhere to the titanium plate during stripping, and the production yield of the copper foil is further improved.

The invention discloses a preparation method of a 3-micron ultrathin lithium battery copper foil. The preparation method comprises the following steps: preparing a copper sulfate electrolyte; a wetting agent, a brightening agent and a high resistance agent are added into the copper sulfate electrolyte, the high resistance agent is at least one of thiazolidinethione, polyethyleneimine, 2-mercaptobenzimidazole and ethylene thiourea, and a mixed additive is formed; polishing and grinding a cathode roller by adopting a flying wing wheel, and carrying out electrolytic treatment on the mixed additive through the polished and ground cathode roller to obtain a first-stage copper foil; and the first-stage copper foil is placed in a nitrogen furnace to be subjected to annealing treatment, and the 3-micron ultrathin lithium battery copper foil is obtained. The invention aims to solve the technical problems that in the prior art, edge tearing, foil breaking, warping, dark appearance oxidation and the like are prone to occurring in the production process of the ultrathin copper foil, the tensile strength and the ductility are difficult to consider at the same time, and stable mass production of the 3-micron copper foil is still difficult.

The invention relates to an electrolytic copper foil anode plate electrode and a preparation process thereof, and belongs to the technical field of electrolytic copper foil production. The electrolytic copper foil anode plate electrode sequentially comprises a titanium substrate, an Ir-Ta oxide transition layer and an IrO2-RuO2-SnO2 oxide composite coating from inside to outside. The preparation process comprises the following steps: firstly, forming a micron-sized rough surface by utilizing acetone and ethanol ultrasonic cleaning and oxalic acid etching; the transition layer is subjected to sol dispersion and sintering treatment through polyethylene glycol, so that the balance of low porosity and high bonding strength is realized; the composite coating adopts an acetylacetone-ethylene glycol monomethyl ether solvent system, and a nanocrystalline structure is formed through step-by-step sintering; and an Ir-rich passivation layer is generated through electrochemical activation, and the finally obtained anode plate electrode has more excellent electrochemical activity and longer service life.

The invention relates to the technical field of iron-nickel alloy foil preparation, and discloses a low-curl iron-nickel alloy foil suitable for an all-solid-state battery and a preparation method of the low-curl iron-nickel alloy foil. The electrolyte solution is added into an electrolytic cell, and current is applied to the electrolyte solution; the method comprises the following steps: depositing an iron-nickel alloy on the surface of a cathode roller, stripping to obtain an iron-nickel alloy foil, carrying out electrophoresis on the iron-nickel alloy foil by using a magnesium oxide electrophoresis solution in an electrophoresis cell to form a magnesium oxide coating on the iron-nickel alloy foil, cleaning with an acid solution, and carrying out electrochemical fluorination treatment on the iron-nickel alloy foil to obtain the magnesium oxide coating on the iron-nickel alloy foil. Forming a fluorinated layer on the magnesium oxide coating; and the iron-nickel alloy foil is subjected to heat treatment at the temperature not exceeding 600 DEG C in a heat treatment chamber, and the iron-nickel alloy foil is obtained after cooling. The high-quality iron-nickel invar iron-nickel alloy foil can solve the curling problem and is suitable for all-solid-state batteries.

The invention provides a copper-nickel alloy foil and a preparation method and application thereof, and belongs to the technical field of lithium ion battery negative electrode current collectors, and the preparation method comprises the following steps: preparing a copper-nickel composite electrolyte, and adding a coordination agent, a pH buffer agent and an additive into the copper-nickel composite electrolyte to obtain a mixed electrolyte; the coordination agent comprises a main coordination agent and an auxiliary coordination agent, and the main coordination agent comprises at least one of trisodium citrate, potassium sodium tartrate and sodium pyrophosphate; the auxiliary coordination agent comprises at least one of ammonia water, glycine and triethanolamine; and a cathode and an anode are placed in the mixed electrolyte, the pH of the mixed electrolyte is controlled to be 6-10, direct current is applied for electrochemical deposition, and the copper-nickel alloy foil is obtained. According to the method, the alkalescence system is adopted, the main coordination agent and the auxiliary coordination agent are used, full coordination of free Cu < 2 + > and Ni < 2 + > is achieved, precipitation is avoided, the hydrogen evolution phenomenon is greatly reduced, and the alloy foil quality is improved.

The invention relates to the technical field of electrolytic copper foil processing, and particularly provides a method for reducing the rough surface roughness of an HVLP copper foil by using a composite additive, which comprises the following steps: step (1): enabling the composite additive to flow into a high-level tank through an additive flow pump, uniformly mixing the composite additive with a copper sulfate electrolyte, and enabling the mixture to flow into a crude foil machine; step (2), then adjusting process parameters of a crude foil machine, including current and line speed of a cathode roller; (3) foil generation and foil drawing are carried out; the composite additive comprises one or two of gelatin and collagen. One or more composite additives composed of gelatin, collagen, sodium dithiodipropane sulfonate, N, N-dimethyl-dithioformamide sodium propanesulfonate, 3-sulfydryl-1-sodium propane sulfonate, hydroxyethyl cellulose and polyethylene glycol are added into the raw foil electrolyte, so that the copper electrodeposition reaction potential can be effectively changed; and uniform and compact copper crystallization peaks are obtained, the rough surface roughness of the raw foil is reduced, and the uniformity of a plating layer is improved.

The invention relates to a copper foil and a preparation method and application thereof, the copper foil comprises an electrolytic copper foil layer and secondary long copper layers located on the surfaces of the two sides of the electrolytic copper foil layer, the maximum Feret diameter average value of crystal grains of the secondary long copper layers is 2.5-3 microns, and the maximum Feret diameter average value of crystal grains of the electrolytic copper foil layer is 1-2 microns. The maximum Feret diameter average value of grains of the secondary growing copper layer on the surface of the copper foil is 2.3-3 microns, the maximum Feret diameter average value of grains of the internal electrolytic copper foil layer is 1-2 microns, a structure with the grain size of the surface layer being large and the grain size of the inner layer being small is formed, and when the copper foil is used for transmitting a high-speed high-frequency electric signal, due to the skin effect of current, the high-speed high-frequency electric signal can be transmitted. More electric signals are transmitted along the surface layer of the copper foil, the grain size of the surface layer is large, the grain boundary is correspondingly reduced, and the obstruction to current is reduced, so that the loss of the electric signals is reduced, and the transmission integrity of the electric signals is improved.

The invention discloses an Archimedes spiral anode rotary scanning electroforming device, and belongs to the technical field of electroforming. The Archimedes spiral anode is made of platinum with the width of 50 micrometers and the purity of 99.999%, the Archimedes spiral anode is embedded in the center of a line anode carrying plate, and the polar coordinate equation is that during electroforming, a cathode carrying plate rotates along with a rotating shaft at the rotating speed of 0.1-20 r / s, and uniform coverage of a cathode global electric field is achieved; the device is provided with an adjustable gap of 0.5-4 mm between two electrodes, a liquid supply channel is formed in the center of a wire anode carrying disc, the carrying disc is parallel to a cathode carrying plate, and the distance between the carrying disc and the cathode carrying plate is adjustable. The spiral line anode structure can solve the problem that a traditional radial anode is uneven in electric field; through the flow-rotating speed synergistic effect, the rotating centrifugal force of the cathode can be counteracted, and the interelectrode ion concentration is kept stable; the continuous helical structure can also eliminate non-effective working time. According to the method, the edge effect and the bubble defect are effectively restrained, the deposition uniformity, the electroforming efficiency and the deposition layer performance are improved, and the method is suitable for high-precision electroforming manufacturing of the chip type disc-shaped cathode substrate.

Disclosed in the present invention are a high-temperature ultrahigh-strength high-elongation copper foil for a lithium-ion battery, and a production process therefor. The production process comprises the following steps: step S1, preparing an electrolyte by dissolving raw copper in a sulfuric acid solution to form a dissolved solution, filtering same to remove impurities and then mixing same with a composite additive to obtain the electrolyte, wherein the composite additive comprises an organic sulfide, gelatin, polyethylene glycol, a nitrogen-containing compound, a polyether compound and Cl-; step S2, preparing a primary copper foil by introducing the electrolyte into an electrolytic cell of a crude foil machine via a pipeline and carrying out electroplating to obtain the primary copper foil; and step S3, subjecting the primary copper foil to a surface passivation treatment, drying and winding to obtain an ultrahigh-strength copper foil for a lithium-ion battery. A high-performance additive is introduced to control the grain refinement and uniform distribution of the copper foil, thereby improving the strength and ductility thereof; the thermal stability and strength of the improved copper foil in a high-temperature environment are maintained, thereby ensuring long-term stable operation of the improved copper foil after high-temperature cyclic charging and discharging of a silicon negative-electrode battery.

The invention relates to a preparation method of an electrolytic nickel-iron-copper alloy foil, which comprises the following steps: dissolving corresponding salt of an alloy in dilute sulphuric acid, realizing metal coprecipitation through a complexing agent and regulating and controlling the pH value of an electrolyte, and uniformly distributing the metal content of the alloy foil. The mechanical property of the alloy foil is controlled by adopting an additive, and the nickel-iron-copper alloy foil is obtained through direct-current electrolytic electrodeposition. According to the invention, the problems of high cost, complex production process, non-uniform thickness, easy generation of holes and the like, which are caused by a plurality of working procedures in the traditional mechanical rolling method, are solved, and the problems of low tensile strength of the traditional pure copper foil at normal temperature and unstable tensile strength after high-temperature aging are solved; and the problem of thin surface cracking caused by non-uniform metal components of the alloy foil is solved, and the corrosion resistance of the foil layer is improved.

The invention relates to the field of electrolytic copper foil processing and application, and discloses a chromium-free environment-friendly passivation solution and an electrolytic copper foil preparation method, and the passivation solution is composed of 80-120 mg / L of silver phosphate, 5-20 mg / L of o-tert-butylphenol, 60-100 mg / L of potassium pyrophosphate and 10-40 mg / L of sulfuric acid. The o-tert-butylphenol can be adsorbed to the crystal boundary of a silver layer to form antioxidant free radicals, and the antioxidant free radicals are preferentially combined with oxygen molecules to form a stable compound, so that the oxidation resistance is improved; and meanwhile, the o-tert-butylphenol can be combined with a silica group of the silane coupling agent, so that the adhesive force of the silane coupling agent on the metal surface is increased, and the stripping resistance of the copper foil is improved.

The invention relates to the field of electrolytic copper foil processing and application, and discloses a production method for reducing seersucker defects of an HVLP electrolytic copper foil, which comprises the following steps: forming a copper foil on the surface of a cathode roller; the method comprises the following steps: processing a copper foil to form single-sided hair, sequentially carrying out acid pickling, water washing, coarsening, curing, water washing, alloying treatment, silane coupling agent treatment and drying treatment, and in the coarsening treatment process, adding trace elements and adjusting the running current and the current density in real time; an intelligent optimization algorithm is adopted to adjust annealing process parameters in real time, the copper foil is subjected to annealing treatment, and the surface deformation pressure of the copper foil is reduced; the annealed copper foil is rolled, and the stability and uniformity of the rolling process are ensured; a high-resolution camera and an image processing algorithm are adopted to monitor the seersucker defect on the surface of the copper foil in real time, if the seersucker defect is found, annealing process parameters are adjusted, and closed-loop control is completed. According to the method, the seersucker defect of the HVLP electrolytic copper foil is remarkably reduced, and the surface quality and the processing performance of the copper foil are improved.

The invention discloses a preparation method and application of a composite metal foil. The method comprises the following steps: preparing a high polymer material into a continuous film; carrying out surface pretreatment on the continuous film; carrying out chemical plating on the pretreated film to form a metal conductive layer; and after the metal conductive layer is formed, electrochemically depositing a metal layer to obtain the composite metal foil. According to the composite metal foil prepared according to the technical scheme, the plating layer is high in binding force, more uniform and high in conductivity; the preparation method is simple to operate, short in technological process, low in production cost and high in production efficiency.

The invention relates to a preparation method of a low-profile HTE copper foil for a mini LED. The preparation method comprises the following steps: (1) electrolyzing a raw foil under the action of a composite additive to prepare a compact copper layer; (2) feeding the compact copper layer into a surface treatment section, and performing acid pickling, coarsening, curing and water washing to form a low-profile roughened structure, wherein a coarsening additive is added into a coarsening solution; (3) electroplating non-copper metal anti-oxidation layers on the two surfaces of the copper foil subjected to surface treatment; and (4) the copper foil electroplated with the anti-oxidation layer is coated with a silane coupling agent in a roller coating mode, and the low-profile HTE copper foil for the mini LED is obtained. The method has the capacity of continuous batch production, and the problem of layering and bubbling in outer layer pressing of the PCB for the mini LED is greatly solved while spontaneous heating of the copper foil is reduced.

This invention relates to a method for surface roughening of high-end copper foil for electronic circuits, comprising the following steps: sequentially performing acid washing, roughening, blackening, ashing, passivation, and coupling agent coating on raw copper foil, with water washing steps interspersed between these steps, and finally drying and winding. The method is characterized in that the roughening step uses an alkaline plating solution containing copper pyrophosphate. This invention provides an alkaline plating solution for alkaline roughening of raw copper foil, generating grains with lower roughness on the already extremely thin surface of high-end copper foil. The grain size is between 0.02 and 0.1 micrometers. After deposition on the raw foil, the surface roughness of the finished foil increases by approximately 0.2 to 0.3 micrometers, ensuring that the surface roughness of the final product meets the requirements of high-end copper foil while maintaining peel strength.

The invention discloses a preparation method of a porous copper foil based on a hydrogel template and the porous copper fores.The method comprises the steps that firstly, a hydrogel solution is applied to the surface of a cathode roller in a spraying mode, and a hydrogel shielding point array is formed by means of the self-polymerization characteristic of the hydrogel solution; secondly, performing electrolysis operation by taking a cathode roller area outside the shielding point as a deposition site to prepare a composite copper foil mingled with the hydrogel shielding point; and then, stripping the composite copper foil from the cathode roller, placing the composite copper foil in an alkaline solution for ultrasonic treatment for 0.5-5 minutes, so that the hydrogel shielding point is swelled and then falls off through ultrasonic oscillation, and a pure porous copper foil is obtained. And finally, performing surface treatment on the porous copper foil by adopting a passivation solution to improve the stability of the porous copper foil. According to the method, accurate regulation and control of the porous structure are achieved through the hydrogel template, the preparation process is green and efficient, and the obtained porous copper foil is uniform in pore distribution, large in specific surface area and good in mechanical property.

The invention discloses a palladium-doped Ir-Sn oxide titanium anode with high catalytic activity and a preparation method of the palladium-doped Ir-Sn oxide titanium anode, and belongs to the technical field of electrolytic anodes. The anode comprises a titanium substrate, a TiO2-Ta2O5 intermediate layer and an Ir-Sn-Pd oxide catalyst layer, the molar ratio of Ir to Sn to Pd in the catalyst layer is (5-6): 3: (1-2), and the total metal ion concentration is 0.3 mol L. The preparation method is realized through titanium substrate pretreatment (sand blasting and etching), intermediate layer coating sintering (a TiCl4-TaCl5 solution) and catalyst layer circulating coating sintering (an H2IrCl6-SnCl4-PdCl2 mixed solution). The relatively cheap palladium element is introduced, the electron structure of the catalyst layer is optimized by utilizing the defect effect, the charge transfer resistance is reduced to 6.7 omegacm, and meanwhile, the iridium consumption is reduced by more than 30%. Experiments show that the cell voltage of the anode is stabilized at 0.95 V (the current density is 5Acm <-2 >), the accelerated life reaches 1630 hours, the coating binding force is 62N, and the corrosion rate in an acidic electrolyte is only 0.01 mm / year. Compared with a traditional iridium tantalum anode, the cost is reduced by 40%, and the overpotential in the oxygen evolution reaction is as low as 0.45 V.

A negative electrode current collector according to the present invention is 6-10 µm thick and has work-hardening exponent n of 0.10-0.25 according to the following formula 1. [Formula 1] σ = K × εn where σ is true stress, K is a strength coefficient, ε is true strain, and n is a work-hardening exponent.

The invention discloses a manganese-doped Ir-Ta oxide composite coating titanium anode and a preparation method thereof. The titanium anode comprises an insoluble titanium base material, an oxide middle layer and an oxide catalyst layer which are sequentially arranged, wherein the oxide catalyst layer is composed of an iridium (Ir) oxide, a tantalum (Ta) oxide and a doped manganese (Mn) element. The preparation method comprises the following steps: carrying out sand blasting and surface treatment on a titanium substrate to increase the roughness and binding force of the surface, then carrying out proper intermediate layer coating on the surface of the substrate, and finally preparing the manganese-doped Ir-Ta oxide composite coating on the surface of the intermediate layer. Compared with a traditional titanium anode, the prepared manganese-doped Ir-Ta oxide composite coating titanium anode has the advantages of being higher in reaction specific surface area, lower in oxygen evolution potential, longer in catalytic life and the like, and meanwhile the transition metal element manganese is higher in reserve, lower in price and high in oxygen evolution activity.

The utility model provides an electrolytic copper foil auxiliary cathode mold and an electrolytic copper foil system, and belongs to the technical field of electrolytic copper foil. The auxiliary cathode mold for the electrolytic copper foil comprises a first mold, a second mold and a third mold, the second die reciprocates in the first direction, and the first die and the third die reciprocates in the second direction. The second mold is located between the first mold and the third mold, at least one of the first mold and the third mold is provided with a plurality of first bending parts, and the second mold is provided with second bending parts matched with the first bending parts. The auxiliary cathode is prepared through mutual movement among the first mold, the second mold and the third mold, and the first direction is perpendicular to the second direction. The auxiliary cathode prepared through the electrolytic copper foil auxiliary cathode mold solves the problems that the auxiliary cathode is different in size and length. The irregular design effectively increases the contact area between the auxiliary cathode and the electrolyte, prolongs the replacement time of the auxiliary cathode, and saves the cost.

The invention relates to a preparation method and a regeneration method of an anode for electrolysis. The preparation method comprises the following steps: S1, treating the surface of a titanium substrate; s2, the titanium substrate treated in the step S1 is coated with first coating liquid of intermediate bonding layer coating liquid containing three elements of an iridium source, a tantalum source and a platinum source or a ruthenium source, and roasting is conducted after drying; the operation is repeated for 2-15 times; s3, coating the electrode roasted in the step S2 with a catalytic coating solution containing an iridium source and a tantalum source, and roasting after drying; repeating the operation for 15-30 times; and S4, roasting. According to the anode obtained by the preparation and regeneration method provided by the invention, the service life of the electrode is prolonged, the electrolysis voltage is reduced, the service life of the related DSA anode is prolonged, lower electrolysis energy consumption is obtained, the electrolysis efficiency is improved, and the anode is particularly suitable for an electrolytic copper foil. The method provided by the invention also solves the problems of easy oxygen permeation and electrode failure of the anode in the prior art.

Provided is a copper foil for an electromagnetic wave shield in which high corrosion resistance is obtained and in which surface wettability is controlled. A copper foil (50) for an electromagnetic wave shield according to one embodiment of the present invention comprises a copper foil base body (10) and a surface treatment layer (40) formed on one or both surfaces of the copper foil base body (10), wherein: the surface treatment layer (40) is provided with a nickel layer (20) containing nickel or a nickel-phosphorus alloy, and a hydrophilic rust prevention treatment layer (30) formed on the surface of the nickel layer (20) on the side opposite from the surface facing the copper foil base body (10); and when the surface roughness of a surface (40a) of the surface treatment layer (40) is measured in conformance with the method specified in ISO 25178, the developed surface area ratio Sdr is 0.01-20%, and the peak density Spd [1 / μm2] of peaks is 0.5-10.