1433results about "Electroforming processes" patented technology

The invention provides a control method of composite copper foil thickness control equipment, which comprises the following steps: calculating the deposition thickness of each abnormal concentration group at a future moment according to a deposition rate change rule diagram to obtain the copper layer thickness distribution of an abnormal region, and comparing the copper layer thickness distribution of the abnormal region with the thickness distribution of a normal region to obtain the thickness distribution of the abnormal region. Calculating a thickness deviation value of the abnormal area; according to the thickness deviation value, a deviation compensation algorithm is adopted, electroplating process parameters of the abnormal area are adjusted according to the size and the sign of the deviation value, and the electroplating process parameters comprise the current density and the electrolyte flow speed; and according to the optimized electroplating process parameters, performing parameter setting and adjustment on a power supply system and an electrolyte circulation system of the composite copper foil thickness control equipment, so that the composite copper foil thickness control equipment performs production according to the optimized electroplating process parameters.

The invention provides a secondary battery, a preparation method thereof and an electric device. The secondary battery comprises a copper foil, the copper foil comprises copper crystal grains with different particle sizes, the copper crystal grains comprise copper crystal grains with the particle size smaller than or equal to 0.5 mu m and copper crystal grains with the particle size larger than 0.5 mu m, the number of the copper crystal grains with the particle size smaller than or equal to 0.5 mu m accounts for 70%-95% of the total number of the copper crystal grains, and the number of the copper crystal grains with the particle size larger than 0.5 mu m accounts for 10%-20% of the total number of the copper crystal grains. And the amount of the copper grains with the grain size larger than 0.5 mu m accounts for 5%-30% of the total amount of the copper grains. The current collector has excellent mechanical strength and plasticity.

The invention provides a current collector, a pole piece, a secondary battery, an electric device, a copper foil and a preparation method of the copper foil. The current collector comprises a copper foil, the average particle size of crystal grains in the copper foil is 50-400 nm, and based on the total number of the crystal grains in the copper foil, the number ratio of the crystal grains of the nano twin crystals is larger than or equal to 60%. Under the combined action of the high-proportion nano twin crystal structure and the small grain size, the mechanical strength of the current collector is improved while the high plasticity of the current collector is maintained, and a material basis is provided for further improvement of the energy density and the safety of the battery.

Methods are proposed for manufacturing dendrite-resistant lithium metal electrodes suitable for incorporation into lithium metal batteries. In an embodiment, the method involves first electroplating a copper sheet onto a surface of a single crystal of silicon, the silicon being doped to form a p-type or an n-type semiconductor, and then further electroplating the copper sheet with lithium metal. The lithium-electroplated copper sheet thus manufactured provides a lithium electrode that is resistant to dendrite formation during cycling of lithium metal batteries when compared to conventionally manufactured lithium electrodes. Methods are further provided of manufacturing lithium sheets by directly electroplating lithium metal onto single crystals of doped silicon, the lithium sheets configured for incorporation into lithium metal electrodes that are resistant to dendrite formation during cycling of lithium metal batteries.

The invention provides a method for reducing electrolyte impurities based on copper foil production equipment, which comprises the following steps: identifying a pressure fluctuation abnormal region from a pressure time-frequency distribution map, taking the pressure fluctuation abnormal region as the input of a pre-constructed high-deposition region distribution model, outputting to obtain the position distribution of the high-deposition region, and determining potential high-risk nodes of impurity deposition in a pipeline; according to the determined potential high-risk node of impurity deposition in the pipeline, a filtering device is deployed at the potential high-risk node of impurity deposition, impurity particle size separation is carried out through a multi-stage filtering structure arranged in the filtering device, separated impurities with different particle sizes are directionally collected, and impurity data are obtained.

The invention relates to the technical field of batteries, in particular to a copper foil and a preparation method thereof, a current collector, a pole piece and an energy storage device. A connection degree gamma exists between the surface density of the copper foil and the size and arrangement of the through holes, the formula of the connection degree gamma is # imgabs0 #, and the value range of gamma is 1 + / -0.1; the copper foil is prepared through an electrolytic method, and an insulating acid-resistant coating is dispensed on the surface of a cathode of the electrolytic method to form an insulating acid-resistant layer; according to the electrolytic method, an active layer is formed on the surface of an anode by coating a mixed active substance solution and sintering, an inert substance is coated on the surface of the active layer opposite to a point coating position of a cathode to form an inert layer, and the range of the inert layer is smaller than 70% of the area of a pore region. The porous copper foil prepared by the method has a porous structure, the pore size distribution is more uniform, the size is consistent, meanwhile, the parts except the pores are dense copper layers, and the mechanical property of the material is good.

The invention discloses a component gradient iridium tantalum coating anode and a preparation method thereof, the component gradient iridium tantalum coating anode comprises a titanium-based bottom layer, a middle layer and a surface active layer structure with component gradient, and the middle layer and the active layer are both prepared through a thermal decomposition method. And the intermediate layer is prepared on the titanium substrate and is composed of TiO2 / Ta2O5 mixed oxide. The surface active layer is prepared on the outer side of the middle layer and comprises a plurality of layers of IrO2 / Ta2O5 oxide coatings with different iridium-tantalum proportions. Compared with a traditional uniform coating anode, the prepared component gradient iridium tantalum coating anode can relieve the stress concentration phenomenon and reduce coating cracking, the service life of the anode is remarkably prolonged, and the catalytic activity of the anode is remarkably improved; the modified carbon nano tube is added into the active layer precursor solution, so that the conductivity change caused by component gradient is improved, and the cell voltage of the component gradient iridium tantalum coating anode is effectively reduced; and moreover, the iridium content is lower, and the preparation cost of the electrode is reduced.

The invention provides an electrolytic copper foil which is at least provided with a low-roughness surface, copper nodules on the low-roughness surface are rod-shaped protrusions and / or granular protrusions, the distance between every two adjacent protrusions ranges from 10 nm to 650 nm, the height of the copper nodules of the rod-shaped protrusions ranges from 300 nm to 800 nm, and the height of the copper nodules of the granular protrusions ranges from 80 nm to 250 nm. And the number of the rod-shaped bulge copper nodules and / or the granular bulges is 50-150 in every 25 mu m < 2 > of the area of the low-roughness surface. The invention further provides a preparation method and application of the electrolytic copper foil. The electrolytic copper foil provided by the invention has a low-roughness surface, so that the signal integrity of the copper foil substrate is improved, the problem of large signal transmission loss in the prior art is solved, the peeling strength between the copper foil and the substrate is improved, and the defect of insufficient peeling strength in the prior art is overcome.

The invention provides a titanium anode, a titanium anode preparation method, an electrolytic copper foil and application. The titanium anode comprises a titanium substrate and a composite layer on the surface of the titanium substrate. The composite layer comprises a first active layer and a second active layer which are sequentially arranged on the titanium substrate, and the first active layer is arranged on the surface of the titanium substrate; wherein the first active layer includes an oxide of titanium and an oxide of tantalum, and the second active layer includes an oxide of tantalum, an oxide of iridium, and an oxide of cerium. The titanium anode provided by the invention has the characteristics of strong binding force, few cracks, high electrocatalytic activity, good uniformity, good erosion resistance and the like, and is beneficial to prolonging the service life.

To provide a surface treatment method of a copper foil, an antioxidant copper foil, and a cathode of a lithium battery.SOLUTION: An antioxidant copper foil includes a copper foil substrate and an antioxidant layer formed thereon. The antioxidant layer contains chromium elements derived from a chromic acid compound, and contains nitrogen elements at least partially derived from an aminotetrazole compound and a nitrogen-containing heterocyclic compound. The antioxidant copper foil satisfies the following characteristics: (a) the antioxidant layer has a chromium content of 5 μg / m2 to 35 μg / m2 determined by X-ray fluorescence analyzer (XRF); (b) the antioxidant layer has a nitrogen content of 0.1 to 10 mass% determined by X-ray photoelectron spectrometer (XPS); (c) the antioxidant layer has a C-N signal detected by headspace GC-MS; and (d) a color difference ΔE before and after baking the antioxidant copper foil at 250°C for 10 minutes is 8 or less.SELECTED DRAWING: Figure 3

The invention discloses a cathode roller with a honeycomb surface structure. A precise honeycomb micro-pattern structure is arranged on the surface of the cathode roller. The invention also discloses a method for manufacturing alloy foil by using the cathode roller, which comprises the following steps: dissolving ferric salt in ultrapure water to obtain a ferric salt solution; dissolving nickel salt in ultrapure water to obtain a nickel salt solution; mixing the two solutions and filtering; preparing various additive solutions, mixing all the additive solutions with the obtained iron-nickel solution to obtain an electrolyte, filtering the electrolyte, and transferring the filtered electrolyte into an electrolytic cell of a crude foil engine; and applying current to a cathode roller and an anode plate which are separately arranged in the electrolytic bath, electrically depositing iron and nickel on the surface of the cathode roller, and rolling through a roll-to-roll process to obtain the iron-nickel alloy foil. The alloy foil manufactured by the method has the characteristics of low surface roughness, high tensile strength and high ductility.

The invention discloses a preparation method of an ultra-thin copper foil with a carrier, and belongs to the technical field of copper foil manufacturing. The method comprises the steps that S1, a titanium plate is adopted as a cathode, an iridium-plated titanium plate is adopted as an anode, the washed titanium plate is immersed in a copper electroplating solution at the temperature of 30-70 DEG C, and after electro-deposition is conducted, a carrier copper foil is prepared; s2, immersing the carrier copper foil prepared in the step S1 into an organic solution containing ionic liquid for adsorption to obtain a carrier copper foil with a stripping layer; and S3, taking the carrier copper foil with the stripping layer prepared in the step S2 as a cathode, carrying out water washing treatment, then immersing the carrier copper foil into another copper electroplating solution at the temperature of 30-70 DEG C, and carrying out electro-deposition by taking an iridium-plated titanium plate as an anode, so as to prepare the ultra-thin copper foil. The ultrathin and uniform single organic stripping layer is prepared in an organic adsorption mode, the method is simple in preparation process, and the stripping layer enables the ultrathin copper foil to be stably and completely stripped from the carrier copper foil by regulating and controlling the binding force between the carrier copper foil and the ultrathin copper foil.

The invention discloses a copper foil production system and method.The copper foil production system comprises an electrolytic bath and a cathode roller arranged in the electrolytic bath and further comprises a partition anode module, a partition cooling module, a detection module and a control system; the partitioned anode module comprises a plurality of anode assemblies which are arranged along the axial direction of the cathode roller, and an electric control module which is respectively connected with each anode assembly; the subarea cooling module comprises a plurality of cooling structures which are arranged in the cathode roller and are in one-to-one correspondence with the anode subareas, and a cooling control module which is respectively connected with each cooling structure; the control system is electrically connected with the electric control module, the cooling control module and the detection module. According to the method, differentiated cooperative control of partition current and cooling can be intelligently executed according to the source and size of supersaturation degree deviation, so that rapid directional compensation is performed at any axial position, and the defects of response lag and extensive regulation and control in a traditional mode are effectively overcome.

The invention belongs to the technical field of copper foils, and particularly relates to a production process of a copper foil and the copper foils, and the production process of the copper foils comprises the following steps: reacting a copper raw material with sulfuric acid to generate a copper sulfate solution; the copper sulfate solution is electrolyzed, and crude foil is obtained; the raw foil is subjected to surface treatment, the surface treatment comprises a roughening process, in the roughening process, a roughening solution comprises an additive C and an additive D, the additive C comprises one or a mixed solution of two or more of sodium tungstate, sodium molybdate, ammonium molybdate, tin sulfate and titanium sulfate, and the concentration of the additive C is 10-60 ppm; the additive D comprises high-molecular organic matters such as hydroxyethyl cellulose and ethylene glycol, and the concentration of the additive D is 30-50 ppm; and carrying out target temperature treatment on the crude foil subjected to the surface treatment to obtain the copper foil. Through the copper foil production process in the scheme, the peeling strength attenuation rate of the copper foil after high-temperature treatment can be reduced.

The present application relates to an electrolytic copper foil and a preparation method thereof and a lithium battery, wherein the electrolytic copper foil contains: a copper content ≥ 99.9wt%, a chlorine content of 100-200μg / g, and further contains: a gold content of 80-200μg / g, and a platinum content of 80-200μg / g. The electrolytic copper foil containing gold and platinum elements can improve the broken belt during the rolling process of lithium-ion batteries and the safety problems during the use of batteries, can improve the elongation, improve the process production efficiency and prevent the occurrence of safety accidents; at the same time, a small amount of gold and platinum is added for better conductivity, which improves the conductivity of the foil.

The invention relates to the technical field of electrolytic copper foil processing, printed circuit board processing and electrolytic copper foil, in particular to a preparation method of a bi-component stripping layer carrier copper foil and the bi-component stripping layer carrier copper foil. The preparation method provided by the invention comprises the following steps: preparing a carrier copper layer; preparing a first inorganic stripping layer on the smooth surface of the carrier copper layer through an electrochemical / physical vapor deposition method; preparing a second inorganic stripping layer on the surface of the first inorganic stripping layer through a low-temperature chemical vapor deposition method; preparing an ultra-thin copper layer on the surface of the second inorganic stripping layer through a pulse electrochemical deposition method; carrying out roughening treatment on the ultra-thin copper layer; and constructing a non-copper functional layer on the surface of the roughened ultra-thin copper layer, and carrying out silane coupling agent coating treatment to obtain the double-component stripping layer carrier copper foil. The two-component inorganic matter is used as the stripping layer of the carrier copper foil, the heat resistance of the stripping layer of the carrier copper foil is improved, and meanwhile the stability of the separating force between the ultra-thin copper layer and the carrier copper layer is improved.

The invention provides a preparation method of a porous copper foil with a regular polygonal hole array, which comprises the following steps of: grinding and polishing a titanium plate until the titanium plate is matte, punching holes with the regular polygonal hole array in the titanium plate by laser, finely trimming vertex angles of the regular polygonal holes by laser, and polishing and grinding the titanium plate to obtain the porous copper foil with the regular polygonal hole array. The method comprises the following steps: preparing a titanium plate, cleaning with pure water and alcohol to obtain a clean titanium plate, preparing a copper sulfate electrolyte, adding a proper amount of a brightener, a wetting agent and a high resistance agent into the electrolyte, mixing, pouring the mixed solution into an electrolytic bath, putting the clean titanium plate and a carbon plate into the electrolytic bath, and carrying out electrolytic foil generation by taking the titanium plate as a cathode and the carbon plate as an anode; and after foil generation is finished, the copper foil is stripped from the surface of the titanium plate, and the porous copper foil with the regular polygon holes is obtained. According to the method, the holes of the titanium plate are the regular polygon holes, and the vertex angles of the regular polygon holes are finely trimmed, so that the copper foil of the electrolytic raw foil is not easy to adhere to the titanium plate during stripping, and the production yield of the copper foil is further improved.

The invention discloses a preparation method of a 3-micron ultrathin lithium battery copper foil. The preparation method comprises the following steps: preparing a copper sulfate electrolyte; a wetting agent, a brightening agent and a high resistance agent are added into the copper sulfate electrolyte, the high resistance agent is at least one of thiazolidinethione, polyethyleneimine, 2-mercaptobenzimidazole and ethylene thiourea, and a mixed additive is formed; polishing and grinding a cathode roller by adopting a flying wing wheel, and carrying out electrolytic treatment on the mixed additive through the polished and ground cathode roller to obtain a first-stage copper foil; and the first-stage copper foil is placed in a nitrogen furnace to be subjected to annealing treatment, and the 3-micron ultrathin lithium battery copper foil is obtained. The invention aims to solve the technical problems that in the prior art, edge tearing, foil breaking, warping, dark appearance oxidation and the like are prone to occurring in the production process of the ultrathin copper foil, the tensile strength and the ductility are difficult to consider at the same time, and stable mass production of the 3-micron copper foil is still difficult.

The invention relates to an electrolytic copper foil anode plate electrode and a preparation process thereof, and belongs to the technical field of electrolytic copper foil production. The electrolytic copper foil anode plate electrode sequentially comprises a titanium substrate, an Ir-Ta oxide transition layer and an IrO2-RuO2-SnO2 oxide composite coating from inside to outside. The preparation process comprises the following steps: firstly, forming a micron-sized rough surface by utilizing acetone and ethanol ultrasonic cleaning and oxalic acid etching; the transition layer is subjected to sol dispersion and sintering treatment through polyethylene glycol, so that the balance of low porosity and high bonding strength is realized; the composite coating adopts an acetylacetone-ethylene glycol monomethyl ether solvent system, and a nanocrystalline structure is formed through step-by-step sintering; and an Ir-rich passivation layer is generated through electrochemical activation, and the finally obtained anode plate electrode has more excellent electrochemical activity and longer service life.

The invention relates to the technical field of iron-nickel alloy foil preparation, and discloses a low-curl iron-nickel alloy foil suitable for an all-solid-state battery and a preparation method of the low-curl iron-nickel alloy foil. The electrolyte solution is added into an electrolytic cell, and current is applied to the electrolyte solution; the method comprises the following steps: depositing an iron-nickel alloy on the surface of a cathode roller, stripping to obtain an iron-nickel alloy foil, carrying out electrophoresis on the iron-nickel alloy foil by using a magnesium oxide electrophoresis solution in an electrophoresis cell to form a magnesium oxide coating on the iron-nickel alloy foil, cleaning with an acid solution, and carrying out electrochemical fluorination treatment on the iron-nickel alloy foil to obtain the magnesium oxide coating on the iron-nickel alloy foil. Forming a fluorinated layer on the magnesium oxide coating; and the iron-nickel alloy foil is subjected to heat treatment at the temperature not exceeding 600 DEG C in a heat treatment chamber, and the iron-nickel alloy foil is obtained after cooling. The high-quality iron-nickel invar iron-nickel alloy foil can solve the curling problem and is suitable for all-solid-state batteries.

The invention provides a copper-nickel alloy foil and a preparation method and application thereof, and belongs to the technical field of lithium ion battery negative electrode current collectors, and the preparation method comprises the following steps: preparing a copper-nickel composite electrolyte, and adding a coordination agent, a pH buffer agent and an additive into the copper-nickel composite electrolyte to obtain a mixed electrolyte; the coordination agent comprises a main coordination agent and an auxiliary coordination agent, and the main coordination agent comprises at least one of trisodium citrate, potassium sodium tartrate and sodium pyrophosphate; the auxiliary coordination agent comprises at least one of ammonia water, glycine and triethanolamine; and a cathode and an anode are placed in the mixed electrolyte, the pH of the mixed electrolyte is controlled to be 6-10, direct current is applied for electrochemical deposition, and the copper-nickel alloy foil is obtained. According to the method, the alkalescence system is adopted, the main coordination agent and the auxiliary coordination agent are used, full coordination of free Cu < 2 + > and Ni < 2 + > is achieved, precipitation is avoided, the hydrogen evolution phenomenon is greatly reduced, and the alloy foil quality is improved.

The invention discloses a production method of an ultrathin copper foil with high tensile strength and high elongation, which applies a synergistic effect of chloride ions, a leveling agent, an inhibitor, a brightener and a sulfur-containing additive, so that crystal grains are more compact, and the copper foil is smoother, brighter, finer and more uniform in SEM (scanning electron microscope) observation. And data measured by a tension test can show that the tensile strength and the ductility are remarkably improved through the synergistic effect of several additives. The thickness of the copper foil prepared by the production method disclosed by the invention is 4 # imgabs 0 # and 12 # imgabs 1 # m, the rough surface roughness Ra is (0.04-0.46) # imgabs 2 # m, the Rz is (0.66 # imgabs 3 # 1.63) # imgabs 4 # m, and the tensile strength is 650 # imgabs 5 # 950 MPa.

The invention relates to an additive capable of improving oxidation resistance of an ultrathin copper foil and a copper foil produced by the additive. The additive comprises ytterbium ions, butylated hydroxytoluene, polyethylene glycol and a brightener. The additive is simple in formula, the number of contained components is small, the process is easy to control, the additive is added into electrolyte to electrolyze the copper foil, and it can be achieved that the 6-micron ultrathin copper foil is free of oxidation discoloration after being placed for 120 h at the temperature of 85 DEG C and the relative humidity of 85% and free of oxidation discoloration after being baked for 60 min at the temperature of 230 DEG C.

The invention discloses an epoxy modified porphyrin leveling agent and a preparation method thereof. The epoxy modified porphyrin leveling agent is obtained by partially or completely substituting hydrogen groups on amino groups and imino groups on tetraaminophenyl porphyrin by ethylene oxide blocks. Compared with the existing leveling agent, the epoxy modified porphyrin leveling agent provided by the invention can obviously improve the surface appearance and mechanical property of a copper foil, eliminate the defect phenomena of pinholes, hemp sand and the like on the surface of a plating layer, realize high-efficiency flat copper deposition, ensure the surface roughness and thickness uniformity, have excellent tensile strength and ductility, and can be widely applied to the field of copper plating. And the appearance stability and the performance quality of the copper foil are effectively improved.

The invention relates to the technical field of electrolytic copper foil processing, and particularly provides a method for reducing the rough surface roughness of an HVLP copper foil by using a composite additive, which comprises the following steps: step (1): enabling the composite additive to flow into a high-level tank through an additive flow pump, uniformly mixing the composite additive with a copper sulfate electrolyte, and enabling the mixture to flow into a crude foil machine; step (2), then adjusting process parameters of a crude foil machine, including current and line speed of a cathode roller; (3) foil generation and foil drawing are carried out; the composite additive comprises one or two of gelatin and collagen. One or more composite additives composed of gelatin, collagen, sodium dithiodipropane sulfonate, N, N-dimethyl-dithioformamide sodium propanesulfonate, 3-sulfydryl-1-sodium propane sulfonate, hydroxyethyl cellulose and polyethylene glycol are added into the raw foil electrolyte, so that the copper electrodeposition reaction potential can be effectively changed; and uniform and compact copper crystallization peaks are obtained, the rough surface roughness of the raw foil is reduced, and the uniformity of a plating layer is improved.

The invention relates to a copper foil and a preparation method and application thereof, the copper foil comprises an electrolytic copper foil layer and secondary long copper layers located on the surfaces of the two sides of the electrolytic copper foil layer, the maximum Feret diameter average value of crystal grains of the secondary long copper layers is 2.5-3 microns, and the maximum Feret diameter average value of crystal grains of the electrolytic copper foil layer is 1-2 microns. The maximum Feret diameter average value of grains of the secondary growing copper layer on the surface of the copper foil is 2.3-3 microns, the maximum Feret diameter average value of grains of the internal electrolytic copper foil layer is 1-2 microns, a structure with the grain size of the surface layer being large and the grain size of the inner layer being small is formed, and when the copper foil is used for transmitting a high-speed high-frequency electric signal, due to the skin effect of current, the high-speed high-frequency electric signal can be transmitted. More electric signals are transmitted along the surface layer of the copper foil, the grain size of the surface layer is large, the grain boundary is correspondingly reduced, and the obstruction to current is reduced, so that the loss of the electric signals is reduced, and the transmission integrity of the electric signals is improved.

The invention discloses an Archimedes spiral anode rotary scanning electroforming device, and belongs to the technical field of electroforming. The Archimedes spiral anode is made of platinum with the width of 50 micrometers and the purity of 99.999%, the Archimedes spiral anode is embedded in the center of a line anode carrying plate, and the polar coordinate equation is that during electroforming, a cathode carrying plate rotates along with a rotating shaft at the rotating speed of 0.1-20 r / s, and uniform coverage of a cathode global electric field is achieved; the device is provided with an adjustable gap of 0.5-4 mm between two electrodes, a liquid supply channel is formed in the center of a wire anode carrying disc, the carrying disc is parallel to a cathode carrying plate, and the distance between the carrying disc and the cathode carrying plate is adjustable. The spiral line anode structure can solve the problem that a traditional radial anode is uneven in electric field; through the flow-rotating speed synergistic effect, the rotating centrifugal force of the cathode can be counteracted, and the interelectrode ion concentration is kept stable; the continuous helical structure can also eliminate non-effective working time. According to the method, the edge effect and the bubble defect are effectively restrained, the deposition uniformity, the electroforming efficiency and the deposition layer performance are improved, and the method is suitable for high-precision electroforming manufacturing of the chip type disc-shaped cathode substrate.

The present invention relates to a dense ultra-thin copper foil with an adhesion layer and a preparation method thereof, wherein the copper foil comprises an adhesion layer, an isolation layer and an ultra-thin copper foil; the cross-sectional crystal grains of the ultra-thin copper foil present a stacked form of large and small crystal grains. The cross-sectional crystal grains of the ultra-thin copper layer in the copper foil of the present invention present a stacked form of large and small crystal grains, large crystal grains constitute the main body of the copper foil, and small crystal grains are filled therein, so that the copper layer is dense, the pinhole problem of the pinhole ultra-thin copper foil is improved, thereby improving the mechanical strength and electrical properties of the copper foil, and being beneficial to improving the quality and reliability of electronic products; the doping of large and small crystal grains in the cross-sectional area of ​​the ultra-thin copper foil improves the grain boundary density and grain boundary energy, the copper foil has a small performance difference before and after downstream processing, the grain size and performance are stable, and the grain size changes little even after high-temperature treatment, which fundamentally solves the problem of grain size stability.

A preparation method of a collagen material stripped from an electrode and a use of the collagen material are provided. The preparation method of a collagen material stripped from an electrode includes the following step: subjecting a collagen solution including hydrogen peroxide and / or acetic acid to electro-deposition (EDP) to obtain the collagen material on the electrode. The preparation method can lead to a collagen material directly on a surface of an electrode.