8 results about "Silver colloid" patented technology

The invention belongs to the technical field of electronic packaging materials, and particularly relates to silver colloid, a preparation method thereof and a semiconductor device. The silver colloid comprises silver particles, epoxy resin, a curing agent and a coupling agent; wherein the curing agent comprises phenolic resin and a thiol curing agent, and the thiol curing agent contains at least two sulfydryl groups. The sulfydryl of the thiol curing agent reacts with part of epoxy groups before phenolic hydroxyl groups of phenolic resin at a low temperature, a silver powder network is preliminarily stabilized through the bonding effect of the sulfydryl and the silver powder, and an initial cross-linked network with toughness is formed. After the temperature is continuously increased, the phenolic resin reacts with the remaining epoxy groups, and a main body curing reaction is started to construct a high-strength and high-crosslinking-density three-dimensional network, so that the structural strength and the heat resistance are improved. And the compact three-dimensional network can more stably wrap the silver powder particles stacked at high density, so that the quality of a conductive path under high silver content is ensured, and the mechanical bonding strength of an adhesive layer is remarkably improved.

The utility model discloses a supporting seat for a Jacquard piezoelectric ceramic piece, which not only can accurately accommodate the piezoelectric ceramic piece, but also can effectively disperse the stress of the piezoelectric ceramic piece and provide an elastic piece leading-out device for supplying power to the piezoelectric ceramic piece through arranging a supporting groove with a wave-shaped cross section on a base, and can improve the supporting stability. The elastic pieces are limited and clamped through multiple points, the positive electrode and the negative electrode of the piezoelectric ceramic can be led out to the PCB through respective contact conductive contact pieces at the same time, the installation and conduction aspects are very simple, independent lead welding is not needed, or silver colloid is not needed for conducting filling of each point to achieve conduction, and the cost is reduced. It is ensured that the electric ceramic chip is firm and does not move in a high-frequency vibration or dynamic load environment, the mechanical fatigue or loosening risk is reduced, and a powerful guarantee is provided for long-acting stable operation of a system.

The utility model discloses a raincoat surface elargol spraying and drying device, which relates to the technical field of drying devices and comprises a base, a conveying mechanism is arranged on the inner side of the base, a spraying bin is fixedly connected to the top of the base, a controller is fixedly connected to the side wall of the spraying bin, and a flow guide pipe is arranged at the top of the spraying bin. The flow guide pipe is connected with an external feeding device, the end, located on the inner side of the spraying bin, of the flow guide pipe is fixedly connected with a flow distribution plate, the bottom of the flow distribution plate is fixedly connected with fifteen atomizing nozzles, the infrared generator array emits infrared rays to irradiate a raincoat sprayed with silver colloid, the infrared rays are converted into heat energy after being absorbed by the silver colloid, and the temperature of the silver colloid is increased; meanwhile, an air heater is started to blow hot air to the raincoat through an air guide pipe and a flow dividing pipe, the raincoat is rapidly dried in cooperation with an infrared drying mechanism, and the problems that an existing device is single in drying effect and low in drying efficiency are solved.

The utility model provides an environment-friendly packaging elargol cleaning device which comprises two cleaning pools, a pumping box and a collecting box are arranged between the two cleaning pools respectively, the outer side of the pumping box is fixedly connected with the outer side of the collecting box, the two ends of the cleaning pools are communicated with a liquid inlet pipe and a liquid outlet pipe respectively, the other end of the liquid outlet pipe is connected with a telescopic pipe in a sliding mode, and the telescopic pipe is connected with the pumping box. One side of the pumping box is respectively communicated with a first one-way valve and a second one-way valve, and one side of the collecting box is communicated with a steering pipe. According to the silver colloid cleaning device, the number of the cleaning pools, the number of the pumping boxes, the number of the collecting boxes and the like are increased, so that a cleaning agent during silver colloid cleaning is fully used, the environmental protection property of the whole cleaning device is improved, the silver colloid in liquid obtained after the cleaning agent is used can be filtered and collected through the arranged filter screen, and the cleaning agent can be reused conveniently.

The utility model provides a semiconductor packaging elargol uniform coating device which comprises a workbench, two lifting frames are connected to the two sides of the top end of the workbench in a sliding mode, a top frame is fixedly installed on the inner walls of the top ends of the two lifting frames, a plurality of adhesive storage pipes are connected to the inner side wall of the top frame in a sliding mode, and sealing pistons are connected to the inner side walls of the adhesive storage pipes in a sliding mode. The silver adhesive feeding device has the advantages that the adhesive storage pipe can be used for storage transition of silver adhesive, so that in the pumping process of the sealing piston, the silver adhesive can be conveyed into the adhesive storage pipe from the feeding pipe and then output to the bottom of the pressing plate from the output pipe to be output outwards; and the outer cover slides downwards along with the sealing piston under the action of the connecting rod and is in contact with the top of the semiconductor, and the part between the pressing plate and the outer cover can be filled with the silver colloid under the action of the pressing plate on the inner wall of the outer cover, so that the uniform coating of the semiconductor packaging silver colloid can be improved.

The utility model provides a multi-material composite glass ornament, which relates to the technical field of ornaments and comprises a glass substrate, a hollow cavity, a copper foil layer, a glass inlay, a wedge-shaped occlusion structure, a UV (ultraviolet) transfer printing sticking layer, a wire inlay metal frame and a nano-silver colloid buffer layer, the hollow cavity is connected with the copper foil layer coated on the glass inlay through a wedge-shaped occlusion structure, so that the stability of combination between the glass substrate and the glass inlay is improved; the nano-silver colloid buffer layer is arranged between the inner wall of the hollow cavity and the corresponding copper foil layer, so that the swelling amount generated by thermal expansion is buffered, and the cracking risk of a contact interface is reduced; the UV transfer printing pasting layers are arranged on the front side wall and the rear side wall of the glass inlay to increase colors and patterns, the side edges of the UV transfer printing pasting layers serve as a wire inlay metal frame fixing base body, the installation adhesive force of the wire inlay metal frame is improved, and the falling risk of the wire inlay metal frame is reduced.

The invention relates to a carbon fiber composite preparation method and application, and relates to the technical field of carbon fiber composite materials. A preparation method of a carbon fiber composite material comprises the following steps that S1, at least two layers of carbon fiber prepreg are sequentially arranged from bottom to top, the length of the (N + 1) th layer is smaller than that of the Nth layer, and the two ends of the (N + 1) th layer and the two ends of the Nth layer in the length direction are of a stepped structure; s2, the surfaces of the stepped structures at the two ends of each layer of carbon fiber prepreg are coated with silver colloid, the silver colloid is covered with conductive metal, the conductive metal is connected with the wire, and an electrode is constructed; and S3, electrifying and heating the electrode to a set temperature, and curing and forming to prepare the carbon fiber composite material. The carbon fiber composite material is formed by self-heating and curing after being electrified, so that the temperature uniformity and the heating efficiency of an electrode area are improved. The contact resistance of the end of the prepreg is effectively reduced, scorching caused by overheating of the end area is avoided, and the uniformity of the overall temperature in the electric heating process is improved.

The application provides a kind of silver telluride quantum dots and its preparation method, belongs to the field of nanometer materials.The preparation method of silver telluride quantum dots provided by the application includes the following steps: under the protection of inert gas, silver source, mercaptan, halogenated alkane, tellurium precursor and solvent are mixed, the synthesis of quantum dots is regulated by nucleophilic substitution reaction, and silver telluride colloidal quantum dots are obtained.The results of examples show that the preparation method provided by the application enhances the colloidal stability of quantum dots, and the fluorescence emission peak of silver telluride colloidal quantum dots is 1176-2023nm, with a wide fluorescence emission window.