LED display screen package process based on COB (chip on board) technology and LED display screen
A technology of LED display and packaging technology, which is applied in the direction of identification devices, instruments, electrical components, etc., can solve problems such as difficult to produce LED displays with higher pixels, achieve overall performance and quality improvement, improve heat dissipation, and increase pixels Effect
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[0022] The present invention will be described in more detail below in conjunction with the accompanying drawings and embodiments.
[0023] The invention discloses an LED display packaging process based on COB technology, which combines Figure 1 to Figure 4 As shown, it includes the following steps:
[0024] a. Clean PCB1 with a plasma machine, the cleaning conditions are argon 10sccm, vacuum pressure 180mTorr, plasma time 5s;
[0025] b. Use a crystal expander to evenly expand a plurality of LED chips 20, and every three LED chips 20 form a point light source 2, and the distance between two adjacent point light sources 2 is <2mm;
[0026] c. Fix the LED chip 20 on the PCB1 with silver glue, and then use red light to solidify the crystal. The conditions for the solidification of the crystal are: the temperature is set to 160±5°C, and the baking time is 2h; then red light, green light and blue light are used to solidify crystal, the crystal-bonding conditions are: the temper...
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