1520 results about "Heat curing" patented technology

The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.

This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device.

The present invention discloses an ultra-high performance concrete with compressive strength of 300MPa or more and a preparation method, and the ultra-high performance concrete comprises the following components in parts by mass: 100 parts of cement, 15 to 70 parts of an admixture, 1 to 5 parts of a nanomaterial, 1 to 20 parts of a viscosity reducer, 110 to 290 parts of sand, 20-50 parts of fibers, 2 to 5 parts of a superplasticizer, 0.1 to 0.5 part of a powder dispersing agent and 15 to 25 parts of water. The ultra-high performance concrete has ultrahigh mechanical properties, the compressive strength after heat curing at 85 DEG C-90 DEG C in standard atmospheric pressure environment can be 300MPa or more, the flexural strength is greater than 55MPa, and the ultra-high performance concrete has excellent working performance and ultrahigh durability.

It is possible to manufacture a highly reliable image display device capable of proceeding with resin cure even in the case where a protective panel is provided with a light shielding portion.

A liquid crystal display unit 2 having a liquid crystal display panel 8 and a light transmissive protective panel 3 having a light shielding portion 5 are disposed face to face, a resin composition 10 is interposed between the liquid crystal display unit and the protective panel, and the resin composition is cured into a cured resin layer 11. As the resin composition 10, a light-heat-curing resin composition and containing a photopolymerization initiator and organic peroxide of thermal polymerization initiator is used. In curing the resin composition 10, cure by light (ultraviolet rays) irradiation is performed until a cure ratio of the resin composition becomes 30% or more and thereafter thermal cure is performed.

The invention relates to differently blocked polyurethane polymers of formula, to their use as impact resistance modifiers, to heat-curable epoxy resin compositions containing said impact resistance modifiers and to methods for the production of said compositions. The invention also relates to bonding methods using said compositions and to articles produced by said methods.

The invention discloses closed type ultraviolet light solidifying waterborne polyurethane resin and a method for preparing the same. The polyurethane resin and the method are characterized in that the double bond of acrylic ester is introduced to the side chain of the polyurethane by utilizing a chain extender mode, and an end NCO group is sealed and protected by a sealer; and the side chain of a molecular chain of the obtained product has the double bond of an acrylic ester group, wherein the double bond is capable of ultraviolet light solidifying, and the end of a molecular main chain of the product has an unsealable sealer group. The polyurethane resin has the advantages of good storage stability and high hardness after solidification, and further improves the solidifying degree and the adhesive force of a solidifying film and is applied to the coating of workpiece shadow areas, thicker coatings and three-dimensional parts which are hard to penetrate by ultraviolet light. Because the resin coating film is subjected to triple solidification of natural drying solidification, ultraviolet solidification and unsealing-hot solidification, the resin coating film has the advantages of high solidifying degree, high hardness and high adhesive force of base materials. The product of the invention is obviously environmental friendly, and can be widely applied in fields of thick coatings of various base materials and an adhesive.

The invention discloses a hard polyimide foaming structural material and a preparation method thereof. The method comprises the following steps of: mixing aromatic dianhydride and/or aromatic acid ester, high molecular alcohol, low molecular alcohol, a catalyst and a surfactant according to a ratio into a polar solvent and reacting to form polyimide foam precursor solution; reacting the precursor solution with isocyanate in a die; pressurizing and foaming to form a polyimide foam intermediate; and performing microwave radiation or/and performing heat curing by using an oven to obtain the hard polyimide foaming structural material. The preparation process route is short and the process is simple; the storage stability of the foam precursor solution is high; and the prepared hard polyimide foaming structural material has uniform aperture, hard quality, high strength, low density and high temperature resistance, is non-toxic and environmentally-friendly in the foaming process and easy to industrialize, and can be applied in the fields of electron, carrier rockets, aviation, ships, railway locomotives and the like.

The invention discloses a prepreg/resin transfer molding co-curing process method for composite materials. The method comprises the following steps: step 1, tailoring prepregs and dry fibers; step 2, spreading the prepregs and sizing dry fiber preforms; step 3, packaging a mould; step 4, injecting resin and carrying out heat curing; and step 5, demolding a product. The method combines a prepreg process with a resin transfer molding process in the mould. According to the structure features and performance requirements of the product, a composite material blank is formed by the prepregs and the dry fibers, then the resin is injected to impregnate the dry fibers, and finally the composite material product is thermally cured. The co-curing of the prepreg part and the liquid forming part is realized, and therefore, the purpose of efficient low-cost manufacture of the composite material structure is achieved. The method can significantly improve the forming efficiency of the composite material structure, reduce the manufacture cost, improve the quality of products and increase the weight loss benefit and is of great significance to the efficient low-cost manufacture of the composite material structure.

This invention provides a method for forming multi-layered coating film excelling in appearance, corrosion resistance and chipping resistance, which comprises applying a first coloring paint (B), second coloring paint (C) and clear paint (D) onto cured coating film of a specific electrodeposition paint (A) of low weight loss under heating, wet-on-wet by the order stated; and heat-curing the three-layered coating film simultaneously.

The present invention relates to heat-curing epoxy resin compositions, which are characterized by high impact strength, good storage stability, and a low curing temperature. The epoxy resin compositions are suitable for use as a construction shell adhesive and for producing structural foams. They can already be cured in so-called bottom-baking conditions. Furthermore, it has been found that the use of an accelerator of the formula (Ia) or (Ib) results in an increase of the impact strength of heat-curing epoxy resin compositions.

A silicone coating composition comprising (A) a silicone resin resulting from (co)hydrolytic condensation of an alkoxysilane or a partial hydrolytic condensate thereof, (B) an aromatic-free compound for curing the silicone resin, and (C) a solvent remains stable during shelf storage. It is applied and heat cured to a plastic substrate to form a protective coat having a high hardness, mar resistance, adhesion, toughness and crack resistance.

The invention belongs to the field of liquid silicone rubber, and particularly relates to single-component heat-curing liquid silicone rubber and a preparation method thereof. Ethenyl polysiloxane is used as base rubber, hydrogen polysiloxane is used as a cross-linking agent, a complex of transition metal platinum is used as a catalyst, an alkynol mixture is used as an efficient polymerization inhibitor, aluminum oxide and aluminium nitride are used as heat conductive fillers, a silane coupling agent is used as a tackifier, aluminium hydroxide is used as a fire retardant, and fumed silica is used as a reinforcing agent. As a process is strictly controlled, and a process route that raw materials are treated and dried in advance, and mixed at room temperature to prepare the rubber is adopted, the low-viscosity single-component heat-curing silicone rubber is prepared. The fire retardant single-component heat-curing liquid silicone rubber can be stored for a long term at normal temperature, is low in viscosity, single in component, good in heat conductivity and temperature tolerance, and good in adhesion with a base material.

A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent. The light and heat curable liquid crystal sealing agent composition is employable in one drop fill, is excellent in properties of a cured product particularly after first-stage light curing, achieves stable cell gap after cell gap formation, permits prevention of contamination of the liquid crystal in second-stage heat curing, is excellent in curing properties in shaded area, and shows superior bonding reliability.

The invention relates to a heat curing in-situ forming high-conductivity silicon rubber composition and application thereof. The composition is composed of the following components: (1) 60-90 parts by weight of mixture of ethylene end-blocked polyorganosiloxane in the same or different viscosities; (2) 10-35 parts by weight of silicone oil containing hydrogen; (3) 1-25 parts by weight of one or multiple R<6>cSiX4-c or partial hydrolytic condensation product thereof; (4) 100-500 parts by weight of metal base conductive filler with the average particle size of 10-150 Mum; (5) 0.01-10 parts by weight of organic metal compound or chelate which contains chloroplatinic acid or contains platinum or palladium and is used as metal base catalyst of heat curing; (6) 1-30 parts by weight of reinforcing filler or functional filler. The invention is applied to the shielding case part of RF equipment requiring electromagnetic shielding and sealed environment. The invention reduces material consumption, simplifies production technology and improves production efficiency and cost performance of product.

Bonding compositions are provided herein for bonding a curable fluoroelastomer composition, and preferably a perfluoroelastomer composition, to a substrate during a heat curing process. The compositions include (a) a compound selected from the group consisting of aluminum acrylates, silicon acrylates, ammonia acrylates, and combinations thereof, (b) an adhesive compound; and (c) a solvent. Methods of bonding fluoro- and perfluoroelastomers to a substrate surface are also including herein which utilize the bonding compositions.

A method for forming structured or micro-structured film comprising the steps of: A. Coating a photocuring or heat-curing adhesive resin layer on a substrate layer; B. Molding or forming or imprinting a structured or micro-structured pattern including prismatic array on the adhesive resin layer by a tape die having the structured pattern preformed on the tape die; and C. Curing the photocuring or heat-curing adhesive resin layer on the substrate layer to obtain a layered film having a structured pattern surface. The structured pattern is formed on the tape, rather than on the rotary die or die roller, to prevent from sticking of the adhesive resin on the roller to prolong the service life of the production equipment and also to ensure a reliable film product quality.

Disclosed is a method of manufacturing a flat-panel display device, includes: laminating a thermosetting resin film on a sealing substrate; stacking the sealing substrate having the thermosetting resin film laminated thereon, and an element substrate having a light-emitting element together under a vacuum atmosphere with the thermosetting resin film and the light-emitting element facing inwardly, and with a frame-shaped sealing material around the thermosetting resin film interposed between the two substrates; joining the sealing substrate and the element substrate together under a vacuum atmosphere by the sealing material situated between the sealing substrate and the element substrate stacked together; and heat-curing the thermosetting resin film situated between the sealing substrate and the element substrate stacked together, under an air atmosphere.

The present invention provides a preparation method for a light-heat dual-cured woodware UV varnish coating. The method comprises: uniformly mixing an acrylic acid monomer, a catalyst and a polymerization inhibitor; adding the resulting mixture to epoxy resin with a temperature of 90-120 DEG C to carry out a reaction at a certain temperature; adopting acid value detecting to monitor the extent of the reaction, wherein the epoxy acrylate (EA) is obtained when the acid value is reduced to less than 5 mg/g; adding a thermal initiator, a photoinitiator, an antifoaming agent, a wetting and dispersing agent, a thickening agent and a leveling agents to the EA, then mixing and stirring to obtain the UV varnish coating. The prepared UV varnish coating through the method provided by the present invention has the dual functions of light curing and heat curing, the surface dry can be rapidly achieved in 4-8 seconds under the light intensity of 250-400 mJ/cm<2>, the film forming and the curing can be achieved in 1-5 hours at the temperature of 50-70 DEG C. In addition, the prepared UV varnish coating has characteristics of high adhesion, good chemical corrosion resistance, high film hardness and low cost, and provides more excellent construction performance, curing method and film performance than ordinary UV-cured coatings.

The invention relates to an anti-static release liner, comprising a base membrane and a functional layer, wherein the functional layer is prepared from the following components in parts by weight: 0.5-1 part of conducting polymer resin, 1-2 parts of hydrogen-containing silicon oil, 5-10 parts of vinyl organic silicon resin, 0.05-0.2 part of platinum complex catalyst and 0.05-0.2 part of photoinitiator. The anti-static release liner disclosed by the invention has stable characteristics, double curing, namely heat curing and photo curing, is adopted, curing is thorough, chemical and physical properties are stable, stripping resistance and anti-static capacity are stable, an adhesive force is good, and less silicon is transferred. The invention has the advantages of a simple process, high production efficiency, low cost and less waste in production.

A flat panel display device comprises a substrate, an organic light emitting diode formed on the substrate, an inner stack encapsulating the light emitting diode and comprising at least one organic layer and one inorganic layer, and an outer stack deposited to cover the inner stack and comprising at least two polymer layers and an adhesive and bonding layer disposed therebetween to combine the at least two polymer layers and a polymer heat-curing film disposed at an interface of each of the polymer layers and the adhesive and bonding layer and cured by heat treatment. According to the present invention, the flat panel display device and a manufacturing method for the same reliably seals the organic light emitting device and prevents degradation by permeation of external harmful materials, while providing high flexibility and low manufacturing cost.

The invention provides a dual-curing adhesive composition, comprising a) (methyl)-acrylics oligomer with at least an unsaturated group; b) monofunctional monomer, multifunctional monomer or mixture thereof; c) (methyl)-acrylate resin with isocyanate group; d) polyester polyol resin; e) an initiator; and f) a plasticizer with refractive index of more than 1.49. The dual-curing adhesive composition has themocuring and photocuring properties at the same time, and has good translucency and high refraction index. The dual-curing adhesive composition can be used in optical products, and preparing process is simplified. The dual-curing adhesive composition has good adhesiveness, good optical property, and good reprocessing property.