The invention discloses an ultrathin back-drilled base plate and a preparation method thereof, and a circuit board and a
processing method thereof, and the ultrathin back-drilled base plate comprises a structural layer, a first
adhesive layer disposed on one side of the structural layer, and a second
adhesive layer disposed on one side, opposite to the structural layer, of the first
adhesive layer. Wherein the structural layer is made of a
composite material containing a first high-heat-resistance
polymer and a reinforcing filler; the material of the first adhesive layer comprises high-molecular resin, and the high-molecular resin contains at least one of a second high-heat-resistance
polymer and a hot-melt adhesive, wherein the main chain of the second high-heat-resistance
polymer contains an aromatic ring and / or a heterocyclic ring; and the material of the second adhesive layer comprises a
hot melt adhesive. According to the invention, extremely high physical rigidity and chemical barrier capability can be maintained in circuit board
hot pressing and wet
processing processes, and the defects of back drilling hole flashing and orifice retreating are effectively inhibited; and the controlled interface stripping force is utilized in the plate stripping stage, so that the integral pure physical tearing of the base plate is realized, the secondary
erosion of chemical film stripping liquid is avoided, and the residual glue on the surface of the base plate is eliminated.