Organic silica gel used for packaging IGBT (insulated gate bipolar translator) module, and preparation method of organic silica gel

A technology of module encapsulation and silicone, which is applied in the direction of circuits, electric solid devices, semiconductor devices, etc., can solve the problems of inability to achieve transparent flame retardancy, low adhesion of substrate materials, and poor adhesion, so as to maintain automatic repairability, Good flame retardant performance and easy pouring effect
CN102807757AInactive Publication Date: 2012-12-05YANTAI DEBANG ADVANCED SILICON MATERIALS
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
YANTAI DEBANG ADVANCED SILICON MATERIALS
Publication Date
2012-12-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to an organic silica gel used for packaging an IGBT (insulated gate bipolar translator) module and a preparation method of the organic silica gel. The organic silica gel comprises a component A and a component B according to the weight proportion of 1:1, wherein the component A comprises the following raw materials by weight part: 94 to 99.89 parts of base material, 0.01 to 5 parts of silane coupling agent, and 0.1 to 1 part of catalyst; the component B comprises the following raw materials by weight part: 79 to 95 parts of base material, 5 to 15 parts of crosslinking agent, 0.01 to 5 parts of fire retardant and 0.1 to 1 part of inhibitor. The organic silica gel used for packaging the IGBT module has excellent optical property, high strength, low oil leakage, and fire resistance, is transparent, is solidified fast at high temperature, is capable of satisfying the long-term operating requirements under high and / or low temperature environments, and is mainly beneficial to sealing and encapsulation protection of the IGBT modules.
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Description

technical field

[0001] The invention relates to a silicone gel for IGBT module packaging and a preparation method thereof, belonging to the technical field of potting materials. Background technique

[0002] At present, high-lead solder is used for sealing and potting protection of medium and high frequency IGBT modules, and lead-containing solder used in IGBTs accounts for 90% of lead-containing applications in ICs used. Lead-containing solder contains lead, an element harmful to humans, which is explicitly prohibited by the European Union and RoHS, so some lead-free solder must be selected to replace it.

[0003] There are many types of packaging materials for IGBT modules, and there are three main types of commonly used materials: epoxy resin, silicone and polyurethane.

[0004] Epoxy resin has good adhesion to hard materials, high hardness, good insulation performance and temperature resistance, and simple process, but it cannot achieve high elasticity after curing, and...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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