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122results about How to "Low polymerization temperature" patented technology

Preparation method of TiO2/porous g-C3N4 composite material

The invention relates to the field of semiconductor materials and aims at providing a preparation method of a TiO2/porous g-C3N4 composite material. The preparation method of the TiO2/porous g-C3N4 composite material comprises the following steps: dropwise adding H2SO4 aqueous solution into melamine aqueous solution to form a white suspension solution; stirring at the temperature of 80 DEG C for 2 hours to obtain sediment; filtering the sediment and respectively washing the sediment for three times by using distilled water and absolute ethyl alcohol, drying the washed sediment at the temperature of 60 DEG C for 24 hours to obtain melamine sulphate; adding the melamine sulphate into a corundum boat, subsequently sintering the melamine sulphate in a tubular furnace, cooling the melamine sulphate to room temperature and grinding an obtained yellow polymerization product into powder particles to obtain g-C3N4 particles. The preparation method of the TiO2/porous g-C3N4 composite material has the beneficial effects that the g-C3N4 polymerization temperature is effectively reduced; by virtue of the protonation of the melamine, the polymerization energy of melamine is reduced; the melamine can polymerize at relatively low temperature to generate graphite-like g-C3N4.
Owner:ZHEJIANG UNIV

Single-component stable luminescent device embedding composition at room temperature

The invention discloses a single-component encapsulating adhesive of a luminescent device with constant room temperature, and the components are: (1) epoxide resin and/or a monomer containing polymerizable double bond of C=C; (2) cation solicitation; (3) accessory ingredient: one or a combination of more than one of silicone adhesive accessory ingredient, foam killer, release agent, toner, antioxidant, and light scattering agent; the cation solicitation is: one of or a combination of more than one of triarylated matte onium based six fluorine antimonite, triarylated matte onium based six fluorine phosphate, phenyl octyloxy iodobenzene onium based six fluorine antimonite, quaternary ammonium group six fluorine antimonite, and quaternary ammonium group triflate. The encapsulating adhesive of the luminescent device is easy to be preserved; the use is convenient; double constituents of encapsulating adhesive are not needed to be blended when the encapsulation is conducted; the polymerization temperature is relatively low; the curing time is short, and the cured colloid is colorless and transparent with high transmittancy; the agglutinated property is constant; the adhesive is applicable to the encapsulating of the luminescent device, particularly for the encapsulating of a luminous diode.
Owner:杨钢

Branched-structure polyurethane-silicious polyacrylate hot melt adhesive and preparation method thereof

The invention discloses a branched-structure polyurethane-silicious polyacrylate hot melt adhesive and a preparation method thereof. The branched-structure polyurethane-silicious polyacrylate hot melt adhesive mainly comprises the following components of branched-structure polyurethane-silicious polyacrylate resin, tackifier, fillers, wax additive, light stabilizer and antioxidant, wherein the branched-structure polyurethane-silicious polyacrylate resin is a polymer specially synthesized for the invention. The preparation method of the branched-structure polyurethane-silicious polyacrylate hot melt adhesive comprises the following steps of: heating and melting the antioxidant, the light stabilizer, the tackifier and the wax additive according to weight ratio of the hot melt adhesive, controlling temperature, adding the branched-structure polyurethane-silicious polyacrylate resin and the fillers in batches while stirring, discharging after melting and uniformly mixing adhesive solution, cooling, slicing and forming to obtain the prepared hot melt adhesive. According to the branched-structure polyurethane-silicious polyacrylate hot melt adhesive and the preparation method thereof, the problems of poor heat resistance and low strength of the traditional EVA (ethylene-co-vinyl acetate) hot melt adhesives, high energy consumption for preparation, high melt temperature and poor construction performance of polyester hot melt adhesives, and poor weather resistance, poor storage stability and higher cost of moisture-curing polyurethane hot melt adhesive are solved.
Owner:SICHUAN UNIV
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