131 results about "Cationic polymerization" patented technology

The invention discloses an ultraviolet multi-curing heat-conducting insulating material which comprises an epoxy resin oligomer, a polyacrylate oligomer, a reactive diluent, a composite photoinitiator and a sulfydryl-containing silane coupling agent modified heat-conducting particle filler. After ultraviolet irradiation, multiple curing reactions, including free radical polymerization, cationic polymerization, sulfydryl-alkene click addition reaction and sulfydryl-epoxy ring-opening reaction, can be rapidly initiated. The heat-conducting insulating material disclosed by the invention has very high crosslinking density and a more continuous heat-conducting network, and is high in curing speed, free of volatile gas and simple and convenient in preparation process.

The invention relates to a method for preparing a solid polymer electrolyte by UV photo-initiated tandem cationic polymerization. The method comprises the following steps: mixing a free radical polymerization monomer, a cationic polymerization monomer, an initiator and a lithium salt, carrying out light free radical polymerization under ultraviolet irradiation to obtain a free radical polymerization prepolymer, carrying out extrusion primary shaping on the free radical polymerization prepolymer, and carrying out series cationic polymerization to prepare the solid electrolyte. The solid electrolyte has the characteristics of environment friendliness, good stability, safety in use and difficulty in liquid leakage, does not use redundant monomers and solvents, and can realize rapid and batch production of the solid electrolyte.

The invention belongs to the technical field of rubber additives, and particularly discloses a preparation method and application of cationic polymerization resin with an adjustable softening point, and the preparation method comprises the following steps: adding a solvent and a catalyst into a reaction kettle, and adding a monomer into a high-position dropwise adding tank; cooling the solvent in the reaction kettle to a specified temperature, setting the dropping speed according to the softening point requirement of the target polymer, and starting to drop the overhead tank monomer; along with continuous dropwise adding of the monomer, the viscosity of the system is gradually increased, the viscosity is monitored on line, when the viscosity of the system reaches 150CP, the monomer is continuously dropwise added, meanwhile, the viscosity of the system is controlled to be 150-400CP, when the viscosity is greater than 400CP, the solvent is automatically replenished in the system to dilute the reaction liquid, the softening point of the resin is regulated and controlled by controlling the viscosity of the system to be 150-400CP, and the temperature fluctuation range in the whole dropwise adding process is + / -5 DEG C; the heat preservation temperature is consistent with the dropwise adding temperature, reacting for 6-10 hours, and then desolventizing and granulating. The regulation and control method and the control mechanism of the softening point of the resin in the polymerization stage are defined, so that the resin with the adjustable and controllable softening point is produced through process control.

The present invention provides a method for producing a composition capable of producing a composition having a small temporal change in viscosity and excellent in hardness (in particular, scratch hardness) of a cured film. The method for producing a composition of the present invention includes step 1 of heating a mixture containing a silsesquioxane having a cationically polymerizable group and metal oxide particles at a temperature higher than 60°C; and step 2 of mixing the mixture obtained in the step 1 with a cationic polymerization initiator to produce the composition.

The present invention provides a method for preparing a semi-solid-state battery and its application. The preparation method comprises the following steps: (1) injecting a polymerizing agent into an assembled battery, aging the battery, and then injecting an electrolyte to obtain a battery that has been injected; (2) allowing the battery that has been injected in step (1) to stand for a gelation reaction, and after the gelation reaction is completed, sequentially performing formation, aging, and volume separation on the battery to obtain the semi-solid-state battery; wherein the polymerizing agent in step (1) includes a solvent with a cationic polymerization function and / or a gelling factor with a cationic polymerization function. The present invention uses an in-situ polymerization method to prepare a semi-solid-state battery. After mixing the polymerizing agent and the liquid electrolyte, the polymerizing agent contains a solvent with a cationic polymerization function and / or a gelling factor with a cationic polymerization function, and a gelation polymerization reaction is initiated in the liquid electrolyte, thereby obtaining a semi-solid-state battery with low impedance, high energy density, and high safety performance.

The invention discloses a photopolymer type holographic recording medium and a preparation method and application thereof, the photopolymer type holographic recording medium comprises a writing monomer, and the writing monomer comprises epoxy resin and a polymerizable monomer, the polymerizable monomer is selected from an alkenyl naphthalene compound, an alkenyl anthracene compound, an alkenyl benzene compound, an acrylic acid compound, a methacrylic acid compound, an acrylate compound, a methacrylate compound, N-vinyl pyrrole, N-vinyl carbazole, N-vinyl imidazole, N-vinyl indole and N-vinyl pyrrolidone; the carbazole is at least one of trans-N-3-alkyne butenyl carbazole. According to the epoxy resin disclosed by the invention, the volume shrinkage of the polymerizable monomer after polymerization can be effectively reduced, the cationic polymerization of the epoxy resin can be accelerated while the polymerizable monomer forms free radical polymerization, and the photopolymer type holographic recording medium disclosed by the invention is high in light sensitivity, stable in holographic performance and high in volume holographic grating diffraction efficiency.

The invention relates to the field of antibacterial functional polymer materials, and discloses a quaternary phosphonium salt type isobutyl cationic polymer as well as a preparation method and application thereof. The preparation method of the polymer comprises the following steps: under a cationic polymerization condition and in the presence of a solvent and a catalyst, isobutene and alkyl styrene are contacted for cationic polymerization, a terminator is added for terminating to obtain a solution containing an isobutene-alkyl styrene copolymer, the solution and a halogenating agent are subjected to a halogenating reaction, and the isobutene-alkyl styrene copolymer is obtained. The preparation method comprises the following steps: preparing a halogenated isobutylene-alkyl styrene copolymer solution, contacting the halogenated isobutylene-alkyl styrene copolymer solution with an organic phosphine compound, carrying out an ionization reaction to obtain a slurry material containing solid particles, carrying out solid-liquid separation to obtain a solid phase, and washing and drying the solid phase with a solvent and deionized water to obtain the quaternary phosphonium salt type isobutylene cationic polymer. The solvent is selected from dichloromethane and / or trichloromethane. The polymer prepared by the method is high in purity, high in quaternary phosphonium salt group content and higher in antibacterial property.

The invention discloses cationic polymerization modified pure monomer resin and a preparation method and application thereof.The preparation method of the cationic polymerization modified pure monomer resin adopts a micro-flow field technology and comprises the following steps that a mixed monomer phase and a catalytic solvent phase are prepared and then pumped into a reactor according to the proportion for a reaction; a material receiving container is connected in series behind the reactor and is used for centralized post-treatment of cached materials, and a high-performance modified pure monomer resin product is obtained through a series of post-treatment. The modified pure monomer resin is prepared by using a micro-flow field technology cationic polymerization method, so that the reaction safety is improved, the reaction time is greatly shortened, the production efficiency is improved, meanwhile, the molecular weight distribution of the resin can be reduced, the softening point range is accurately controlled, the product batch is stable, the occupied area of equipment is small, the construction cost is saved, and the workshop utilization rate is improved.

This invention provides a polymer solid electrolyte monomer and its preparation method, as well as a secondary battery. The polymer solid electrolyte monomer provided by this invention has the structure shown in Formulas 1-4. The secondary battery provided by this invention introduces the polymer solid electrolyte monomer and a certain functional material solution, both of which are used on the positive electrode side. Simultaneously, an acrylate monomer is introduced on the negative electrode side. After battery assembly, heat treatment is performed to initiate gradient in-situ polymerization of the precursors on both the positive and negative electrode sides. Specifically, cationic polymerization initiates mild polymerization on the positive electrode side, free radical polymerization initiates high polymerization on the negative electrode side, and the two monomers interpenetrate at the separator to complete cross-linking copolymerization, thereby forming a gradient polymerization system with increasing polymerization degree from the positive to the negative electrode. The in-situ solid battery prepared using this method has lower internal resistance and faster Li + This improves the electrochemical performance of the battery by creating a transmission channel.

The invention belongs to the field of initiators, and particularly relates to a single-component initiator as well as a preparation method and application thereof. The single-component initiator provided by the invention can be cracked to generate free radicals and protonic acid at the same time under 365 nm / 395 nm UV-LED illumination, acrylate free radical polymerization and epoxy resin cationic polymerization are initiated respectively, the problems of quenching effect and poor storage stability of a traditional compound system are avoided, and when the single-component initiator is applied to a solder resist dry film, the problem of poor storage stability is solved. Compared with a commercially available initiator, the initiator provided by the invention has the advantages that the ultrahigh resolution of 12 microns can be realized under the exposure energy which is 20-50% lower than that of the commercially available initiator, the gelation time is shortened to 3.2 seconds, the finger touch drying time is 12.5 seconds, the curing efficiency is improved by more than or equal to 40%, and the initiator is particularly suitable for manufacturing a high-density interconnected PCB (Printed Circuit Board).

The application provides a cationic photocuring composition for ink and application thereof. The composition comprises a cationic polymerizable compound, a cationic initiator and a pigment, the cationic polymerizable compound comprises compound A-1 and compound A-2; wherein the structural formula of compound A-1 is R1 represents methyl or ethyl; compound A-2 is a polymerizable monomer without vinyl, the molecular weight of which is less than 300, and the molecular weight of oxygen in the molecule accounts for 12-30% of the molecular weight of the compound; the sum of the content of compound A-1 and compound A-2 accounts for 40wt%-90wt% of the total content of the composition; and the weight ratio of compound A-1 and compound A-2 is 8:1-1:5. The above-mentioned composition as the main component of the ink can effectively improve the problem that the cationic polymerization type ink is easy to block the nozzle, especially for high-precision nozzles, the effect is particularly significant, the pattern formed after curing is clear and uniform, and the appearance performance is excellent.

The invention relates to a technical scheme for preventing metal corrosion caused by a cationic polymerization initiator containing fluorine atoms. A cationic polymerization initiator composition which contains a fluorine atom-containing cationic polymerization initiator (A) and a hydrophilic ether solvent (B) that does not have an acetal structure or an active hydroxyl group, and wherein the content of the hydrophilic ether solvent (B) is 2.5 mass% or more with respect to the total mass of the cationic polymerization initiator composition.

The present disclosure relates to a composition comprising: (a) a cationic polymerization initiator; and (b) an indene based or cyclopentadiene based resin; wherein the cationic polymerization initiator is selected from the group consisting of (i) an aromatic sulfonium salt-based cationic polymerization initiator; (ii) a phosphonium salt-based cationic polymerization initiator; (iii) a quaternary ammonium salt-based cationic polymerization initiator; (iv) an aluminum complex-based cationic polymerization initiator; (v) an aromatic iodonium salt-based cationic polymerization initiator; (vi) an aromatic diazonium salt-based cationic polymerization initiator; (vii) a pyridinium-based cationic polymerization initiator and (viii) a mixture thereof. Also described are varnishes and coatings formed from said composition.

Provided are: a negative photosensitive composition which is capable of forming a pattern having a good shape and which is capable of improving adhesiveness to a side wall of a hollow structure; a photosensitive resist film which is provided with a photosensitive film that is formed using the negative photosensitive composition; a method for producing a hollow structure using the negative photosensitive composition; and a method for forming a pattern. The negative photosensitive composition contains a trifunctional or higher polyfunctional epoxy compound, a cationic polymerization initiator, and a bifunctional aromatic epoxy compound having a molecular weight of 800 or less. In the negative photosensitive composition, the ratio of the content of the difunctional aromatic epoxy compound to the total content (100% by mass) of the polyfunctional epoxy compound and the difunctional aromatic epoxy compound is 0.6-10% by mass.

A photosensitive resin composition film, containing (A) a resin, (B) an epoxy compound and / or an oxetane compound, and (C) a photo-cationic polymerization initiator, wherein a transmittance Tα (%) per unit film thickness at a wavelength of 405 nm on one surface thereof and a transmittance Tβ (%) per unit film thickness at a wavelength of 405 nm on the other surface thereof satisfy formula (1), which is Tα > Tβ, and with respect to the thickness of the photosensitive resin composition film, a content C10 (mass%) of the photo-cationic polymerization initiator (C) at a depth of 10% from the surface on the side where the transmittance per unit film thickness at a wavelength of 405 nm is Tα (%) and a content C90 (mass%) of the photo-cationic polymerization initiator (C) at a depth of 90% from said surface satisfy formula (2) below. Provided is a photosensitive resin composition film capable of forming a high aspect ratio pattern. (2): 0.050 ≤ C10 / C90 ≤ 0.85

The disclosure provides an active cationic polymerization initiator composition for synthesizing a ternary diblock copolymer, a diisopropenylbenzene copolymer and a terpene polymer. The disclosure further provides a flame-retardant resin composition, which includes: (a) a hydrocarbon resin; and (b) a reactive flame-retardant, and may optionally include a modified polyphenylene ether. A flame-retardant resin cured product formed from the flame-retardant resin composition may have high heat resistance, low dielectric constant, low dissipation factor, flame retardancy and / or film-forming properties, and is suitable for uses in fabrication of a semiconductor packaging material, a substrate and the like for the high-speed and high-frequency field.

The present disclosure provides a cationically polymerizable composition having a high degree of flame retardancy in the cured state. The cationically polymerizable composition is liquid at room temperature and includes: (A) at least one cationically polymerizable component in a proportion of 15 to 80% by weight; (B) at least one initiator for cationic polymerization; (C) at least one flame retardant, with the flame retardant comprising at least 10% by weight of an organophosphinate, based on the total weight of the composition; and (D) 0 to 60% by weight of a filler, wherein the solids content from components (C) and (D) is at most 70% by weight, each based on the total weight of the composition.

The present invention provides a precursor solution for a gel electrolyte and its application. The precursor solution comprises a solvent and a monomer having multiple nitrile and epoxy groups. The precursor solution for the gel electrolyte provided by the present invention can be prepared into a polymeric form and then dissolved in an electrolyte. The monomers in the precursor solution undergo cationic polymerization, forming the electrolyte material into a gel state, thereby preventing battery leakage. Furthermore, the gel electrolyte material contains safety groups, which can enhance the safety performance of the battery.

The present invention addresses the problem of providing a photosensitive resin composition which has high micromachining properties and can yield a cured product having a low dielectric loss tangent. The main purpose of the present invention is to obtain a photosensitive resin composition which contains a polyimide resin, a cationic polymerizable compound and a cationic polymerization initiator and which is characterized in that the polyimide resin has a structure represented by formula (1) as a tetracarboxylic acid residue in all or some tetracarboxylic acid residues. (X moieties are each independently a single bond or a divalent linking group (in which the total number of carbon atoms is 10 or fewer). Y is a phenylene group, a naphthylene group, a group represented by formula (2) or a group represented by formula (4). ＊ denotes a bond to an amide group or a carbonyl group in an imide ring) (In formula (2) and formula (4), R1 and R2 each independently denote a monovalent hydrocarbon group having 1-10 carbon atoms, in which some hydrogen atoms may be substituted by halogen atoms, Z denotes a single bond or a divalent organic group having 1-20 carbon atoms, p and q each independently denote an integer between 0 and 4, and s denotes an integer that is 0 or 1. ＊ denotes a bond to X.)

The purpose of the present invention is to provide a negative photosensitive resin composition capable of obtaining a cured product having excellent low stress and low water absorption. The present invention is a negative photosensitive resin composition containing (A) a polyimide resin containing one or more skeletons selected from the group consisting of an alkylene oxy skeleton, a siloxane skeleton, and an aliphatic hydrocarbon skeleton having a linear structure, (B) a cationically polymerizable compound, and (C) a cationic polymerization initiator.

The invention relates to a reactively curable adhesive, to a reactively curable adhesive tape comprising the reactively curable adhesive, and to the use of corresponding adhesives and adhesive tapes for bonding of two or more components. The reactively curable adhesive comprises: (a) one or more (co)polymers; and (b) at least one epoxy compound; and (c) at least one photoinitiator for initiation of a cationic polymerization; and (d) at least one chemical compound comprising at least one phenyl group or a benzene ring-substituted derivative of a phenyl group.

Provided is a curable epoxy composition which can be cured in a short time in the presence of oxygen and which has excellent filling properties. A curable epoxy composition containing an epoxy compound having an epoxy group in the molecule and a photo-cationic polymerization initiator, the curable epoxy composition being used for use in a rotary electric machine and / or a semiconductor. It is preferable that the curable epoxy composition substantially does not contain a curing agent other than a photo-cationic polymerization initiator. The curable epoxy composition may also include a polyol.

This method for manufacturing a wiring board with a protective material includes a step for applying a curable composition to a space between conductors on a wiring board, which has a substrate and the conductors that are arranged in a pattern on the substrate, and then irradiating with an active energy ray so as to cure the curable composition. The curable composition includes a ring-opening polymerizable compound and a photo-cationic polymerization initiator.

To provide a thermosetting resin composition which is thermoset by irradiation with microwaves in a short time, and can bond much precise / small-sized members having low heat resistance once, and a method for manufacturing a composite structure which is composed of a precise / small-sized member using the thermosetting resin composition.SOLUTION: (1) A thermosetting resin composition for microwave irradiation contains a cyclic ether compound and a polymerization initiator, wherein the polymerization initiator is a thermal cationic polymerization initiator, and one or more members selected from the group consisting of a circuit connection member, an electronic / electric member, an optical member, a construction member, and an automobile member are bonded between the members or to other member under irradiation with microwaves. (2) A thermosetting resin composition for microwave irradiation contains a cyclic ether compound and a polymerization initiator, wherein the polymerization initiator is an iodonium-based photocationic polymerization initiator and a radical polymerization initiator.SELECTED DRAWING: None

Poly(oxazoline)- and poly(oxazine)-based lipids, process for the preparation thereof, and use thereofDisclosed are polymers of formulae (I) or (II)or polymers containing, based on all structural units, 10 to 95 mol % of structural units of the formula (III), 5 to 90 mol % of structural units of the formula (IV) and 0 to 20 mol % of structural units of the formula (V)or containing 10 to 95 mol % of structural units of the formula (VI), 5 to 90 mol % of structural units of the formula (VII) and 0 to 20 mol % of structural units of the formula (VIII)wherein at least one of the structural units of formula (III), (IV) or (V) or of formula (VI), (VII) or (VIII) with the grouping —CHR4—, —CHR5— or CHR7— or with the grouping —CHR5—, —CHR7— or —CHR10— is covalently bonded to a radical R2, whereinIni is a radical derived from an initiator of the cationic polymerization,R1 is selected from the group consisting of hydrogen or C1-C4 alkyl,R2 is selected from the group consisting of —OR11, —OCO—R11, —OCO—R14—CO—OR11, —OCO—R14—CO—NR12R13, —NR12—R14—CO—NR13R15, —O—R16—(O—OC—R18)m andR3, R4, R5, R6, R7, R8, R9 and R10 independentlky of one another are hydrogen, methyl, ethyl, propyl or butyl,R11 is C6-C20 alkyl,R12 and R15 independently of one another are hydrogen or alkyl,R13 is C6-C20 alkyl,R14 is alkylene, cycloalkylene, arylene or aralkylene,R16 is an m+1-valent aliphatic hydrocarbon radical,m is an integer from 1 to 5,R18 is C6-C20 alkyl, with the proviso, that several residues R18 of a residue R16 may be different within the scope of the given definitions,R17 is a trivalent bicyclic residue, andw is an integer in the range from 1 to 5000.These polymers are amphiphilic and can be used as a replacement for polyethylene glykols, for example in formulations comprising active ingredients.

The application discloses a UV and moisture dual-cured high-temperature-resistant hot-melt acrylate pressure-sensitive adhesive tape and a preparation process thereof, and belongs to the technical field of high polymer materials. The pressure-sensitive adhesive tape comprises a base material and an adhesive layer. Raw materials of the adhesive layer comprise acrylate prepolymer containing a side chain containing a vinyl ether group, modified terpene resin containing a phenolic hydroxyl group, alicyclic epoxy functional silane, a cationic photoinitiator and an antioxidant. By controlling the molar ratio of the phenolic hydroxyl group and the vinyl ether, the tackifying resin is chemically grafted into the polymer network by using the cationic chain transfer reaction, and the double mechanism of the light-induced cationic polymerization and the acid-catalyzed moisture curing is combined, so that the problems of poor temperature resistance and oxygen inhibition of the traditional hot-melt adhesive are solved. The tape has excellent high-temperature shear resistance, high initial adhesion and deep curing characteristics, and the preparation process has good hot-melt processing stability.

The present invention uses a negative-type photosensitive resin composition comprising a bisphenol novolak-type epoxy resin and a cationic polymerization initiator. The bisphenol novolak-type epoxy resin has a weight-average molecular weight of 4,000 or more. Such a negative-type photosensitive resin composition is suitable as a photosensitive material used for forming an upper plate portion of a hollow structure (100) comprising a support (10), a first cover layer (30), and a second cover layer (40) (upper plate portion), wherein a hollow portion (50) is provided between the support (10) and the first cover layer (30), and a plurality of holes (35) penetrating from the hollow portion (50) to the upper plate portion are formed in the first cover layer (30).According to such a negative-type photosensitive resin composition, it is possible to stably form a resin film on the first cover layer (30) provided with the holes (35) without the negative-type photosensitive resin composition flowing through the holes (35) of the first cover layer (30) and falling into the hollow portion (50), regardless of the conditions of a manufacturing process.

The hard coating composition includes a solvent and a hard coating solid matter. The hard coating solid substance comprises a silsesquioxane compound, a free radical polymerization initiator and a cationic polymerization initiator, the silsesquioxane compound comprises a free radical polymerizable functional group and a cationic polymerizable functional group, the free radical polymerizable functional group comprises a (meth) acrylate group, and the cationic polymerizable functional group comprises a (meth) acrylate group. The cationically polymerizable functional group includes an oxetane group. A method of manufacturing a window includes applying a hard coating composition on a base layer to form a preliminary hard coating; drying the preliminary hard coating to remove the solvent; and curing the dried preliminary hard coating layer to form the hard coating layer. The electronic device comprises a window manufactured by the method and a power module for supplying power.

The application discloses a kind of metallocene catalyst system, polyisobutylene and preparation method thereof.The metallocene catalyst system includes A, B, C, D four components;Component A is metallocene complex;Component B is borate;Component C is alkyl aluminum;Component D is selected from alkyl ether of carbon atom number 2~8.The metallocene catalyst system used in the application has high catalytic activity and raw materials are cheap and easy to obtain, which can greatly reduce production cost.Compared with BF3 catalyst system, the catalyst system provided by the application is non-toxic, harmless, non-polluting, non-corrosive, which can effectively solve the technical problems of toxic, harmful, corrosion and pollution existing in traditional technical route, thereby improving the operating environment, and ensuring personal health.The application can synthesize narrow distribution, medium molecular weight polyisobutylene under mild conditions of 0~80 DEG C, i.e., using conventional cooling water to remove heat, which solves the low temperature reaction problem existing in traditional cationic polymerization.

The present invention provides a hard coat layer-forming composition from which it is possible to form a hard coat layer that exhibits excellent adhesiveness. A hard coat layer-forming composition according to the present invention comprises: at least one selected from the group consisting of hydrolyzable silicon compounds, hydrolysates thereof, and hydrolysis condensates thereof; a silsesquioxane compound having an oxetanyl group; a cationic polymerization initiator; and two or more hydroxybenzophenone compounds having different numbers of hydroxy groups.