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3603 results about "Machinability" patented technology

Machinability is the ease with which a metal can be cut (machined) permitting the removal of the material with a satisfactory finish at low cost. Materials with good machinability (free machining materials) require little power to cut, can be cut quickly, easily obtain a good finish, and do not wear the tooling much. The factors that typically improve a material's performance often degrade its machinability. Therefore, to manufacture components economically, engineers are challenged to find ways to improve machinability without harming performance.

Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same

A method to achieve a very low effective dielectric constant in high performance back end of the line chip interconnect wiring and the resulting multilayer structure are disclosed. The process involves fabricating the multilayer interconnect wiring structure by methods and materials currently known in the state of the art of semiconductor processing; removing the intralevel dielectric between the adjacent metal features by a suitable etching process; applying a thin passivation coating over the exposed etched structure; annealing the etched structure to remove plasma damage; laminating an insulating cover layer to the top surface of the passivated metal features; optionally depositing an insulating environmental barrier layer on top of the cover layer; etching vias in the environmental barrier layer, cover layer and the thin passivation layer for terminal pad contacts; and completing the device by fabricating terminal input/output pads. The method obviates issues such as processability and thermal stability associated with low dielectric constant materials by avoiding their use. Since air, which has the lowest dielectric constant, is used as the intralevel dielectric the structure created by this method would possess a very low capacitance and hence fast propagation speeds. Such structure is ideally suitable for high density interconnects required in high performance microelectronic device chips.
Owner:GLOBALFOUNDRIES INC

Circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate

[Problem to be Solved] There are provided a circuit substrate, an electronic device arrangement and a manufacturing process for the circuit substrate which enable to directly implement the surface mounting and so on of electronic components on the conductive wiring without forming solder resist, and also which enable to enhance high speed transmission characteristics and to enlarge wiring rule for the electrode terminal of the function element to be contained therein, and to implement with excellent workability and reliability when connecting the electronic device.
[Solution] A circuit substrate comprising
    • a function element 1 with an electrode terminal 5
    • a base member containing the function element 1 therein and having at least one layer of a conductive wiring formed on its front side face and rear side face respectively, and
    • a via 6 connecting the electrode terminal 5 with the conductive wiring 3 formed on the base member, wherein the conductive wiring formed on either one of the front side face and the rear side face of the base member is arranged such that a surface exposed outside from the base member is in the same plane with or inside a surface of the base member on which the conductive wiring is formed.
Owner:NEC CORP

Preparation method of negative electrode slurry capable of reducing expansion of lithium ion battery

The invention discloses a preparation method of negative electrode slurry capable of reducing the expansion of a lithium ion battery. The preparation method comprises the following steps of: carrying out dry blending on a negative electrode active substance and a conducting agent in advance; dissolving sodium carboxymethyl cellulose into de-ionized water to obtain a CMC (Carboxyl Methyl Cellulose) gel solution with the concentration of 1.0%-2.0%; adding one part of the CMC gel solution into a mixture of the negative electrode active substance and the conducting agent and stirring at a high speed for 0.5-1h; adding the balance of CMC gel solution and stirring at a high speed for 1-3h; adding a modified SBR (Styrene Butadiene Rubber) binding agent and stirring at a middle speed for 0.3-1h; and adjusting the viscosity. By adopting the method of carrying out the dry blending on artificial graphite and the conducting agent in advance, adding the glue solution by two times and utilizing modified SBR as the binding agent, a bridge phenomenon of the artificial graphite is reduced, a pole piece structure is changed, the binding force between grains is improved and the expansion of a negative electrode is reduced; meanwhile, the slurry sedimentation of the artificial graphite is inhibited. The preparation method of the negative electrode slurry capable of reducing the expansion of the lithium ion battery has important meanings on ternary lithium ion batteries and improvement of machinability, capacity and safety of high-capacity power batteries.
Owner:南京国轩新能源有限公司

Three-dimensional elliptical vibration cutting device

The invention relates to a three-dimensional elliptical vibration cutting device, belonging to the field of cutting and ultra-precision cutting machining of materials which are difficult to machine. A diamond cutter is guided through flexible hinge mechanisms respectively along an X direction, a Y direction and a Z direction, and further, is driven by three piezoelectric stacks respectively alongthe X direction, the Y direction and the Z direction; the piezoelectric stacks of the X direction and the Z direction are preloaded by preloading screw bolts along respective axial direction; the piezoelectric stack of the Y direction is preloaded through a screw bolt screwing wedge; the preloading processes of the three directions are mutually independent; through regulating and matching the initial phase position and the amplitude of a driving signal for each of the three piezoelectric stacks, the projections of the cutter location point movements of the diamond cutter in an X-Y plane and aY-Z plane are elliptical motions, and the projection of the cutter location point movements of the diamond cutter in an X-Z plane is reciprocating elliptical motion or linear motion. The three-dimensional elliptical vibration cutting device has a novel and simple structure, is easy to implement, and is beneficial to obtaining the best cutting machinability of the diamond cutter.
Owner:HUAWEI TEHCHNOLOGIES CO LTD
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