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4results about How to "Machinable" patented technology

A method for preparing a composite vibration damper of high-pressure metal fiber sintered body and metal plate

This invention discloses a method for preparing a composite vibration damper consisting of a high-pressure-bearing sintered metal fiber body and a metal plate, belonging to the technical field of composite vibration dampers. By controlling factors such as the diameter, porosity, and thickness of stainless steel fibers, and through high-temperature sintering and pressure forming, this invention obtains a stable, high-compressive-strength stainless steel felt sintered body (SFB). The metal plate is then combined with the SFB to fully utilize the vibration damping energy of the SFB, resulting in a high-pressure-bearing metal fiber vibration damper. This vibration damper exhibits high compressive strength and excellent vibration damping performance, and also possesses characteristics such as corrosion resistance, high-temperature resistance, machinability, and strong environmental adaptability.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Polyamic acid film, rod-shaped silver powder / polyimide composite film and preparation methods thereof

ActiveCN118852696BEven settlementmachinablePolymer scienceComposite film
The present invention provides a polyamic acid film, a rod-shaped silver powder / polyimide composite film and a preparation method thereof, and relates to the field of antistatic materials. The preparation method first prepares a polyamic acid solution and a first silver powder, and then successively coats the first silver powder with vinyl triacetoxysilane and 12-hydroxystearic acid to obtain a second silver powder; finally, the second silver powder is added to the aforementioned polyamic acid solution, a film is formed by a casting method, and then heat-treated to obtain a polyamic acid film with processability. The film is treated in a vacuum environment of 280-300°C for 4-5h to obtain a rod-shaped silver powder / polyimide composite film, the bottom of the composite film is uniformly precipitated and enriched with rod-shaped silver powder, and the silver powders overlap each other to form a three-dimensional mesh conductive structure, so that the upper and lower surfaces of the film have different surface resistances, and the composite film can be applied to electrostatic dissipation or electrostatic conduction according to the surface resistance of the silver powder enriched surface.
Owner:CHANGCHUN GOLD RES INST

A hot work steel cemented carbide material and a method for producing the same

This invention belongs to the technical field of steel-bonded cemented carbide, specifically relating to a hot-work steel-bonded cemented carbide material and its preparation method. The hot-work steel-bonded cemented carbide provided by this invention has tungsten carbide as its hard phase, with a weight percentage of 25-45 wt%. The remainder is a steel matrix binder phase, with the following components and weight percentages: chromium (2.0-5.5) wt%, molybdenum (3.0-6.0) wt%, nickel (0.8-2.8) wt%, carbon (0.3-0.6) wt%, and the balance being iron. The preparation method and steps include batching and ball milling, slurry treatment, pressing, sintering, forging and annealing, machining, and heat treatment. The hot-work steel-bonded cemented carbide obtained by this invention possesses excellent thermal stability, hardness, and wear resistance, and can replace traditional hot-work die materials, thus improving service life.
Owner:SHANDONG MACHINERY DESIGN INST

Privacy film and film forming equipment

This application discloses a privacy film and a film-forming device, belonging to the field of display technology. The privacy film includes: a first transparent layer, a second transparent layer, and multiple light-shielding strips; the first and second transparent layers are stacked, and multiple carrier cavities are formed between the first and second transparent layers, with each light-shielding strip corresponding to one of the carrier cavities, and the light-shielding strips located within their respective carrier cavities; wherein, the modulus of the light-shielding strips is greater than the modulus of the first transparent layer, and the modulus of the light-shielding strips is greater than the modulus of the second transparent layer. This application allows for a thinner privacy film, which is beneficial for the miniaturization of display devices.
Owner:BOE TECHNOLOGY GROUP CO LTD +1