The embodiment of the invention provides a stack packaging structure and a preparation method of the stack packaging structure, and relates to the technical field of
chip packaging, the stack packaging structure comprises a wiring substrate, a structural
chip, an adapter plate, a double-layer
solder ball and a plastic
package body, the double-layer
solder ball is adopted, and a plurality of first supporting wire arcs are additionally arranged on a first bonding pad, so that the structure
chip is not damaged; the first support wire arc is embedded into the outer
coating layer, so that the
bonding strength of the outer
coating layer and the first bonding pad is greatly improved, the
welding strength is effectively improved, and the bridging or pseudo
soldering risk caused by substrate warping is reduced. And the solder of the outer
coating layer is distributed more uniformly, and bridge connection caused by excessive overflow is avoided. Meanwhile, due to the supporting effect of the first supporting line arc, the inner core ball can be supported, the collapse phenomenon of the
welding ball in the conventional technology is effectively relieved, the plastic
package space is increased, and the plastic
package hole phenomenon is relieved.