The invention relates to a
wafer-level film
stress regulation and control method, module and device. The method comprises the following steps: constructing a
stress regulation and control module according to set parameters and a structure, and integrating the constructed
stress regulation and control module at a set position of a
semiconductor device; wherein the stress regulation and control module comprises a stress regulation and
control layer, and the stress regulation and
control layer adopts a
metal / medium composite laminated structure; in the
wafer manufacturing process, a target net stress value needed by a current
wafer is obtained through a
manufacturing execution system, the optimal thickness proportion needed by a stress regulation and
control layer for achieving the target net stress value is calculated through an
internal stress prediction model, and the
manufacturing execution system generates a technological formula according to the optimal thickness proportion; and the deposition equipment is driven to deposit the stress regulation and control layer under the optimal thickness ratio. By designing the independent stress regulation and control module, it can be ensured that the
crystallization quality, the stoichiometric ratio and the electrical / piezoelectric performance of the functional film are not sacrificed, and linear, accurate and predictable
stress control over the wafer is achieved.