212 results about "Wave soldering" patented technology

The invention relates to the technical field of automatic assembly, and discloses automatic circuit board welding equipment which comprises a welding mechanism, a clamping mechanism and a driving mechanism, the welding mechanism is provided with a wave soldering station, and the wave soldering station is used for conducting wave soldering on a passing circuit board; the driving mechanism comprises a driving belt, a guide rail, a driving part and a fixing frame, at least part of the fixing frame is located above the wave soldering station, the driving belt is arranged on the outer surface of the fixing frame in a sleeving mode, and the driving part is arranged on the guide rail. According to the automatic welding equipment for the circuit board, the driving belt and the guide rail are adopted for cooperative transmission, the guide rail and the driving belt are rigidly connected through the fixing frame, and a closed conveying groove is formed; the inner surface part of the guide rail and the outer surface of the driving belt form a guide space for the clamping mechanism to move along with the driving belt inside, and meanwhile rigid support is formed by means of the guide rail.

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

The invention relates to the field of wave soldering, in particular to a PCB welding quality detection method and time control method based on infrared imaging, and the method comprises the steps: obtaining an infrared image of a non-welding surface of a PCB; processing and analyzing the infrared image to obtain a PCB non-welding surface space temperature distribution signal and a pin edge gray scale gradient function; a feedback signal is generated according to the temperature signal of the non-welding surface of the PCB and transmitted to the central controller to adjust the transmission speed of the transmission guide rail driven by the motor to transmit the PCB; and identifying a potential defect area existing in the PCB pin welding spot according to the pin edge gray scale gradient function. According to the method, control over the tin immersion time of wave soldering and defect identification are both considered, and the soldering quality of PCB wave soldering is improved.

A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

The utility model provides a wave soldering jig capable of being used for various magnetic cores with different heights, which comprises a magnetic core jig plate, a plurality of magnetic core products are arranged on the magnetic core jig plate, a plurality of magnetic core pressing plates are used for positioning and pressing the magnetic core products on the magnetic core jig plate through spring positioning pins, and the magnetic core products are arranged on the magnetic core jig plate. Each magnetic core pressing plate is fixedly provided with two balancing weights in a mirror symmetry mode, and each magnetic core pressing plate is provided with four positioning columns which are inserted into positioning holes formed in the magnetic core jig plate in a penetrating mode. According to the utility model, rapid and accurate positioning and stable fixation of the magnetic core are realized. The device is simple in structure and convenient to manufacture, install and operate, and the labor intensity of workers is remarkably reduced. The synergistic effect of the spring positioning pin and the positioning column ensures that the magnetic core does not displace in wave soldering, and the soldering quality and the product reliability are improved. The design of the spring positioning pin endows the magnetic core with buffering and self-adaptive capabilities, and the balancing weight enhances the stability and adapts to various magnetic core products.

The application relates to a device suitable for small printed board production and processing, which comprises a clamp plate, components and devices to be welded on the printed board, a plurality of printed boards spliced into one and arranged in a matrix along a first direction and a second direction; the clamp plate clamps the side edges of all the printed boards extending along the first direction; the clamp plate is provided with component and device positioning holes, the components and devices to be welded pass through the component and device positioning holes and the printed board, and the components and devices to be welded face the same direction; the clamp plate and the printed boards clamped by the clamp plate are put into a wave soldering furnace for component and device welding. Compared with the prior art, the device has the advantages that the printed boards after splicing are clamped by the clamp plate, the components and devices to be welded on the printed boards are fixed through the component and device positioning holes on the clamp plate, especially the components and devices with requirements on the welding direction, the component and device positioning holes can fix the installation direction of the components and devices, the direction is consistent after wave soldering, a plurality of printed boards can be welded at one time, and the production efficiency is improved.

The invention discloses an oxidation improvement method for an FPC bonding pad with an electronic connector. The oxidation improvement method comprises the steps that S1, an SMT bonding pad heat insulation jig is prepared; s2, the SMT bonding pad heat insulation jig is installed on an SMT carrier plate provided with an FPC; s3, high-temperature procedures of SMT reflow soldering, FR4 / PI press fit and FR4 press fit baking are executed; s4, the SMT bonding pad heat insulation jig is removed; and S5, carrying out a wave soldering process. Before the FPC is subjected to the high-temperature working procedure, the SMT bonding pad heat insulation jig is installed at the bonding pad position of the FPC connector, and the oxidation risk of the FPC and the connector bonding pad in the high-temperature working procedure is remarkably reduced through the synergistic effect of multi-stage heat insulation and rapid positioning of the SMT bonding pad heat insulation jig. The problems that in the prior art, due to high-temperature oxidation of a bonding pad and manual wiping with an eraser, the labor cost is high, and chippings are left can be solved.

The invention relates to the technical field of electronic assembly, and provides a welding stud structure, a circuit board assembly method and a circuit board assembly.The welding stud structure comprises a stud body, the stud body is provided with a first end and a second end which are oppositely arranged, a preset length is formed between the first end and the second end, and the first end and the second end face each other in the direction from the end face of the first end to the second end; a threaded hole is formed in the stud body in the axial direction, a closed end for closing the threaded hole is formed at the second end of the stud body, the end face of the closed end is an arc face, and a welding part is formed on the cylindrical face close to the second end. The closed end for closing the threaded hole is formed at the second end of the stud body, so that the end face of the closed end is the cambered surface. When the stud body is assembled on the circuit board, a wave-soldering process can be used in an overlapping manner after an SMT (surface mount technology) process, so that tin waves can effectively fill tin in a welding cavity position of the SMT process, 100% tin penetration between the stud body and the hole wall of a welding hole of the circuit board is realized, the connection strength is improved, and a large current can pass through the stud body and the hole wall of the welding hole of the circuit board.

Embodiments of the present application provide a selective wave solder path planning method and system, and a storage medium. The method comprises: dividing all welding points into a first number of welding point groups according to a preset grouping rule; generating an initial path after distributing each welding point group to a corresponding tin furnace based on constraint conditions and load balancing, wherein the constraint conditions include continuous traversal within the welding point group, traversal of each welding point once, fixed starting point, and tin furnace assignment; and obtaining a target path after iteratively optimizing the initial path according to a preset decision variable and optimization target. The initial path of each tin furnace is automatically generated by setting the constraint conditions and load balancing, and the initial path is optimized by the decision variable and the optimization target, so as to obtain the target path of the tin furnace for selective wave soldering. The generation efficiency is high, and the rationality of the optimized path is high.

This invention discloses a membrane heater and its assembly method, including a heating film, a PCB board assembly, a package housing, and an insulating insertion module. The insulating body of the insulating insertion module has multiple bent copper leads and multiple straight copper leads at both ends. The heating film has multiple solder pads, the PCB board assembly has multiple copper ring solder holes, and the package housing has positioning insertion holes penetrating the front and back. The ends of the bent copper leads protruding from the insulating body are bent towards the solder pads. This invention, through the setting of the insulating insertion module, not only improves welding accuracy but also creates conditions for subsequent reflow soldering and wave soldering, thereby improving the overall assembly efficiency of the membrane heater and simplifying the assembly equipment, achieving cost reduction and efficiency improvement. Furthermore, it avoids the problem of short circuits caused by the difficulty in controlling the distance between adjacent solder points in existing welding methods that involve pressing wires together with welding equipment, thus improving the insulation and pressure resistance performance of the membrane heater.

The application discloses a multi-section selective wave-soldering device, which comprises at least two conveying devices, at least two blocking devices, at least two soldering devices and driving devices for driving the soldering devices to move, the conveying devices are arranged in sequence to form a conveying channel of a conveying plate, and the blocking devices are arranged at the ends of the conveying devices respectively; the soldering devices are arranged below the conveying channel, and the driving devices drive the soldering devices to move respectively. The multi-section selective wave-soldering device is small in size and high in production efficiency.

This invention provides a selective wave soldering tin spraying device, belonging to the field of wave soldering technology. It includes a solder storage tank, an outlet tank, an air inlet assembly, an air duct assembly, a first air outlet assembly, and a lifting assembly. The outlet tank is fixedly installed on the top of the solder storage tank, with an open top. A return port is provided on the top wall of the solder storage tank, located on the outer side of the outlet tank. The lifting assembly is disposed on the side wall of the solder storage tank. Compared to existing technologies, this invention allows for rapid cooling of the solder joints during wave soldering of PCB components, enabling rapid solidification. Furthermore, the heat from the molten solder inside the solder storage tank heats the returning molten solder, preventing a drop in temperature during reflow and ensuring optimal reflow performance.

The utility model discloses a wave soldering jig, relates to electronic welding auxiliary equipment technical field, the wave soldering jig has a first side and a second side opposite to each other, the first side is used for connecting a PCBA, the wave soldering jig forms a welding hole arranged along the thickness direction in a penetrating manner, the welding hole is used for exposing a welding spot on the PCBA, and the first side is used for connecting the PCBA with the second side. The wave soldering jig is provided with an inlet end and an outlet end in the wave soldering moving direction, the inlet end and the outlet end are oppositely arranged, a first flow guide groove and a second flow guide groove are formed in the positions, corresponding to the inlet end and the outlet end, of the second side of the wave soldering jig respectively, and the first flow guide groove and the second flow guide groove communicate with the welding hole.

The utility model is applicable to the technical field of photovoltaic inverters, and provides a PV terminal temperature detection device and a photovoltaic inverter.The PV terminal temperature detection device comprises a thermistor arranged on a wave soldering side of a core pin of a metal core in a PV terminal; and the surface of the thermistor, the wave-soldering side of the core pin and the copper sheet of the core pin are coated with heat-conducting glue. As the thermistor is placed on one side of the wave-soldering pin, the thermistor is closer to the core pin, and the heat transfer effect is better. Meanwhile, the thermistor, the core pin and the copper sheet are coated with heat-conducting glue, and most of heat generated by the metal core and the copper sheet is transferred to the thermistor, so that the master control chip can judge the state of the current PV terminal more quickly and accurately.

The utility model discloses a material receiving device for PCB wave soldering, and belongs to the technical field of PCB soldering, the material receiving device comprises a support frame, four groups of support legs are arranged at the bottom of the support frame, moving grooves are formed in the four groups of support legs, an adjusting plate is arranged above the support frame, sliding blocks are arranged on two sides of the adjusting plate, the sliding blocks are slidably connected to the interiors of the moving grooves, and the moving grooves are arranged in the moving grooves. Two sets of telescopic rods and two sets of rear supporting plates are arranged above the adjusting plate, a front supporting plate is arranged above the adjusting plate, a rolling shaft and an adjusting shaft are arranged in the front supporting plate, and the tops of the two sets of telescopic rods are rotationally connected with the adjusting shaft; when the device is used, the effect of adjusting the height and angle of the adjusting plate can be achieved in two modes, the device is simple in structure and quite convenient to use and maintain, the device can be almost used for production workshops of any scale due to the powerful self-adaptive adjusting function, and the universality and economic benefits are greatly improved.

The present application relates to the technical field of test fixture, and discloses a selective wave-soldering flux spraying performance test fixture, which comprises a substrate, a first cover plate, a second cover plate and a third cover plate, the substrate is provided with a first test groove, a second test groove and a third test groove, the first cover plate is arranged in the first test groove to complete the linearity test of the flux, the second cover plate is arranged in the second test groove to complete the penetration ability test and the fixed-point precision test of the flux, and the third cover plate is arranged in the third test groove to complete the linearity test of the flux. Compared with the prior art, the application realizes the integration of multi-dimensional test, can complete the full-dimension evaluation of the flux spraying amount stability, uniformity, spraying penetration of different thickness PCBs and different aperture via holes, spraying fixed-point precision and spraying linearity at one time, and greatly improves the test efficiency and data reliability. The application also provides a test method, and realizes the collaborative innovation of the test fixture and the test method.

The utility model provides a wave-soldering preheating device and a wave-soldering device using the wave-soldering preheating device, and belongs to the technical field of electronic manufacturing equipment.The wave-soldering preheating device comprises a rack, a heating device, a first driving assembly and a second driving assembly, and the heating device, the first driving assembly and the second driving assembly are arranged on the rack; the driving assembly can drive the circuit board to move in multiple directions, an avoiding space is formed between moving tracks, the heating device comprises a fan heater, an air uniformizing plate and a heating light pipe, and the circuit board clamp is provided with a temperature detection device; the wave-soldering device comprises a soldering tin spraying device, a soldering flux spraying device and the like, the connection efficiency among the working procedures is greatly improved, and many convenience and advantages are brought to circuit board welding production.

A fixing carrier unit for selective wave soldering and a fixing carrier assembled therefrom are disclosed, belonging to the technical field of soldering carriers in the electronics manufacturing industry. The unit includes a wave soldering substrate, an FPCA device mounted on the substrate, a connector inserted into the FPCA device, and a pressure block covering the FPCA device and connector. The pressure block includes a working surface in contact with the FPCA device and connector, and an upper surface opposite to the working surface. A cavity is formed on the working surface, the cavity having a through portion and a sealing portion. The through portion accommodates the protrusion of the connector, and a resilient pin is disposed on the pressure block of the sealing portion. This provides a novel selective wave soldering fixing carrier solution that uses the pressure block to limit the misalignment of the pins and FPC pads.

1. The name of the design product: desktop selective wave soldering machine (SEL330A). 2. The use of the design product: the design product is used for selective wave soldering machine. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.

The application relates to a wave-soldering clamping-plate reminding method and device, electronic equipment and a storage medium. The wave-soldering clamping-plate reminding method comprises the following steps: acquiring a first signal, analyzing the first signal, and outputting PCB confirmation information; acquiring a second signal according to the PCB confirmation information, analyzing the second signal, and outputting PCB movement information; and driving a signal light to flash according to the PCB movement information. The scheme provided by the application can detect whether the PCB is clamped in time.

The utility model provides a wave soldering general carrier, comprising an installation frame used for placing a PCBA board and a plurality of positioning support rods arranged in the installation frame and used for positioning the PCBA board, and the positioning support rods are arranged along the extension direction of the installation frame. A transverse positioning frame and a longitudinal positioning frame which are used for positioning the PCBA board are further arranged on the installation frame in a sliding mode, and the universal carrier can overcome the defect that in the prior art, PCBA boards to be welded are different in size and cannot be fixed to the carrier, and consequently welding fails in the welding process due to movement of the PCBA boards.

The utility model discloses a kind of sinking type PCBA circuit board carrier devices of avoiding wave-soldering conveying chain to be attached tin, including carrier, be equipped with soldering tin furnace below the carrier, be equipped with conveying device in the soldering tin furnace top, the carrier left and right sides, the conveying device includes chain, connecting frame, recess is equipped on the connecting frame, the carrier left and right sides are equipped with support shaft, the support shaft is matched with the recess.The utility model has the beneficial effect that: carrier is sinking type design, avoids wave-soldering machine chain contact welding furnace welding surface, PCBA can keep stable, reduce the generation of tin slag, improve the first pass rate of welding, to reduce production cost, improve welding quality, avoid soldering waste, it is both economic and environmental protection.

The embodiment of the invention provides a path planning method and system for selective wave soldering and a storage medium. The method comprises the steps that all welding spots are divided into a first number of welding spot groups according to a preset grouping rule; on the basis of constraint conditions and load balance, each welding spot group is distributed to a corresponding tin furnace, and then an initial path is generated, wherein the constraint conditions comprise continuous traversal in the welding spot group, traversal of each welding spot once, fixed starting point and tin furnace assignment; and performing iterative optimization on the initial path according to a preset decision variable and an optimization target to obtain a target path. According to the method, the initial path of each tin furnace is automatically generated by setting the constraint condition and the load balance, and the initial path is optimized through the decision variable and the optimization target, so that the target path for selective wave soldering of the tin furnace is obtained, the generation efficiency is high, and the rationality after path optimization is high.

The application relates to a method for tin plating on through holes of a connector, comprising the following steps: installing a tin plating mold into a tin plating carrier plate, installing a steel net above the tin plating mold, filling tin paste into a tin storage groove of the tin plating mold, removing the steel net, picking up the tin plating mold, installing the connector on a printed board, installing the tin plating mold at a welding through hole position of the connector, assembling a product to be welded, feeding the product to be welded, which is assembled with the tin plating mold, the printed board and the connector, into a reflow furnace, melting the solder in the tin plating mold by heat, and flowing the melted solder into the through hole under the action of capillary and gravity, so as to realize tin plating on the through hole part, removing the tin plating mold after the product to be welded is taken out of the reflow furnace, and completing the reflow soldering. In a word, the application has the advantages of low processing cost, short processing period, high tin plating efficiency, wide application range and high welding qualification rate.

The utility model discloses a wave-soldering double-layer heating wire structure and a wave-soldering device. The wave-soldering double-layer heating wire structure comprises a framework, a heating wire and a heating wire, the heating wire frameworks are arranged on the framework, and the number of the heating wire frameworks is at least two; and the two groups of heating wires are respectively arranged on the two groups of heating wire frameworks. According to the wave-soldering double-layer heating wire structure and the wave-soldering equipment, under the condition that the length, the heating power and the wire diameter of the heating wire are not changed, the heating wire is arranged to be of a double-layer structure, the installation length of the heating wire is increased, the heat dissipation area of the heating wire is increased, the heat dissipation efficiency is improved, and the temperature of a heating body is reduced; and under the condition that the length and the heating power of the heating wire are not changed, the mounting length of the heating wire, the wire diameter of the heating wire, the surface area of the heating wire and the lower surface load of the heating wire are increased through the double-layer structure, so that the service life is prolonged.

Providing a wave soldering machine, a method for adjusting the flow of solder waves, and a wave soldering station. [Solution] The wave soldering station of a wave soldering machine comprises a core frame supported by a flow conduit positioned within a solder pot reservoir, first and second pumps for delivering solder material to first and second chambers, and a wave soldering nozzle assembly supported by the core frame. The nozzle assembly comprises a solder distribution baffle for generating a solder wave, and an outlet vane coupled to the core frame and configured to move from a lowered position that can increase the solder flow and an elevated position that can decrease the flow of solder material. The first pump, the second pump, and the outlet vane are configured to control the flow of solder through the solder distribution baffle so as to vary the contact length of the solder wave.

The embodiment of the utility model belongs to the technical field of wave soldering. The utility model further relates to a wave soldering jig which comprises a jig body, a plurality of soldering windows are arranged at the top of the jig body, a plurality of sinking protection grooves are arranged at the bottoms of inner cavities of the soldering windows, the bottoms of the inner cavities of the soldering windows are arranged in an inclined mode, and tinplate tin dragging pieces are installed at the bottoms of the inner cavities of the soldering windows. According to the welding device, the welding device is adopted as an accessory, efficient and stable welding can be achieved in a narrow space, the complexity and low efficiency of manual welding are reduced, the bottom of the inner cavity is chamfered by more than 30 degrees, and the welding device is designed as a tin dragging piece, so that tin can be effectively guided to flow, the phenomenon of tin connection is reduced, and the welding quality is improved. And the welding reliability and stability are improved.

The application discloses an automatic welding and carrying work station of an inverter, a soldering and surface locking cover process method, and belongs to the technical field of inverter manufacturing. The automatic welding and carrying work station of the inverter comprises a conveying speed chain, a welding circulating conveying line and a carrying robot, and the conveying speed chain is sequentially provided with a positioning tool and a gantry overturning mechanical hand. The welding circulating conveying line comprises a wave-soldering line, a conveying speed chain, two lifting speed chains and a discharging speed chain. The lower ends of the two lifting speed chains are respectively connected with the two ends of the conveying speed chain. The two ends of the wave-soldering line are respectively connected with the upper ends of the two lifting speed chains. The end of the discharging speed chain, which is away from the wave-soldering line, is connected with the upper end of one of the two lifting speed chains. The carrying robot is used for carrying the inverter to be soldered on the positioning tool to the discharging speed chain and carrying the inverter, which has been soldered, on the discharging speed chain to the conveying speed chain. The soldering process and the surface locking cover process of the inverter are combined together, the safety accidents are reduced, the labor intensity of workers is reduced, the occurrence of occupational diseases is prevented, and the processing efficiency is improved.

The invention discloses a wave soldering furnace with an adjustable nozzle, which comprises a tin furnace, a wave disturbance device, a wave smoothing device and a heating assembly for heating the wave disturbance device and the wave smoothing device, the wave disturbance device and the wave smoothing device both comprise a tin channel chamber, an impeller, a motor for driving the impeller to operate and a top plate arranged at the top of the tin channel chamber, the top plate is provided with a plurality of nozzles, the disturbance wave device is provided with a first adjusting structure used for adjusting the width of disturbance waves, and the smoothing device is provided with a second adjusting structure used for adjusting the width of smoothing waves. The wave soldering furnace solves the problem that traditional wave soldering furnace equipment lacks an adjusting structure for adjusting the disturbance wave width and the flat wave width.

The utility model relates to the technical field of furnace-passing jigs, and discloses an SMT wave soldering furnace-passing jig which comprises a base and a cover plate. Through grooves are evenly formed in the base, supporting plates are evenly arranged at the bottom of the base and arranged among the through grooves, side folded plates are arranged at the four corners of the base and are of a right-angle structure, fixing studs are arranged at the four corners of the base, the bottoms of the fixing studs are arranged to be stud bottoms, and the stud bottoms penetrate out of the bottom of the base. Mounting columns are arranged at the four corners of the bottom of the cover plate, the mounting columns are arranged in the side folded plates, column holes are formed in the mounting columns, screw grooves are formed in the fixing studs, the screw grooves correspond to the column holes in position, side baffles are arranged on the base, and clamping plates are arranged on the side baffles. According to the SMT wave-soldering furnace-passing jig provided by the utility model, the furnace-passing jig which is convenient to position, install, clamp and fix is realized.