36 results about "Wave soldering" patented technology

The application relates to a device suitable for small printed board production and processing, which comprises a clamp plate, components and devices to be welded on the printed board, a plurality of printed boards spliced into one and arranged in a matrix along a first direction and a second direction; the clamp plate clamps the side edges of all the printed boards extending along the first direction; the clamp plate is provided with component and device positioning holes, the components and devices to be welded pass through the component and device positioning holes and the printed board, and the components and devices to be welded face the same direction; the clamp plate and the printed boards clamped by the clamp plate are put into a wave soldering furnace for component and device welding. Compared with the prior art, the device has the advantages that the printed boards after splicing are clamped by the clamp plate, the components and devices to be welded on the printed boards are fixed through the component and device positioning holes on the clamp plate, especially the components and devices with requirements on the welding direction, the component and device positioning holes can fix the installation direction of the components and devices, the direction is consistent after wave soldering, a plurality of printed boards can be welded at one time, and the production efficiency is improved.

A fixing carrier unit for selective wave soldering and a fixing carrier assembled therefrom are disclosed, belonging to the technical field of soldering carriers in the electronics manufacturing industry. The unit includes a wave soldering substrate, an FPCA device mounted on the substrate, a connector inserted into the FPCA device, and a pressure block covering the FPCA device and connector. The pressure block includes a working surface in contact with the FPCA device and connector, and an upper surface opposite to the working surface. A cavity is formed on the working surface, the cavity having a through portion and a sealing portion. The through portion accommodates the protrusion of the connector, and a resilient pin is disposed on the pressure block of the sealing portion. This provides a novel selective wave soldering fixing carrier solution that uses the pressure block to limit the misalignment of the pins and FPC pads.

The utility model discloses a kind of sinking type PCBA circuit board carrier devices of avoiding wave-soldering conveying chain to be attached tin, including carrier, be equipped with soldering tin furnace below the carrier, be equipped with conveying device in the soldering tin furnace top, the carrier left and right sides, the conveying device includes chain, connecting frame, recess is equipped on the connecting frame, the carrier left and right sides are equipped with support shaft, the support shaft is matched with the recess.The utility model has the beneficial effect that: carrier is sinking type design, avoids wave-soldering machine chain contact welding furnace welding surface, PCBA can keep stable, reduce the generation of tin slag, improve the first pass rate of welding, to reduce production cost, improve welding quality, avoid soldering waste, it is both economic and environmental protection.

Providing a wave soldering machine, a method for adjusting the flow of solder waves, and a wave soldering station. [Solution] The wave soldering station of a wave soldering machine comprises a core frame supported by a flow conduit positioned within a solder pot reservoir, first and second pumps for delivering solder material to first and second chambers, and a wave soldering nozzle assembly supported by the core frame. The nozzle assembly comprises a solder distribution baffle for generating a solder wave, and an outlet vane coupled to the core frame and configured to move from a lowered position that can increase the solder flow and an elevated position that can decrease the flow of solder material. The first pump, the second pump, and the outlet vane are configured to control the flow of solder through the solder distribution baffle so as to vary the contact length of the solder wave.

A wave soldering machine includes a housing, a conveyor that is movable with respect to the housing, a preheat module positioned along the conveyor, and a curtain module positioned at an entrance of the housing, the curtain module including at least one curtain and a heating element. A curtain module for a wave soldering machine or a reflow oven includes at least one curtain and a heating element. A method of containing an inert gas around a conveyor in a tunnel of a wave soldering machine or a reflow oven. In some embodiments, the method includes providing a curtain module at an end of the tunnel, the curtain module including at least one curtain and at least one heating element; and controlling a temperature of the heating element.

The utility model relates to peak welding equipment technical field, concretely relates to a kind of energy-saving cooling structure of peak welding equipment.It includes mobile mounting bracket, and peak welding equipment ontology is installed in mobile mounting bracket inside, recess is opened in mobile mounting bracket side wall, and air cooling component is installed in recess inside, and air cooling component is used for cooling cooling after welding completion;Filter screen is installed in recess inside, filter screen is set to be close to contact outside, and detachable cleaning assembly is arranged in one side of filter screen, and cleaning assembly is used for cleaning dust adsorbed after long time use of air cooling component and filter screen.The utility model rotates by cleaning assembly in the process of fan rotation, and dust and sundries on air cooling component and filter screen are cleaned, avoid the influence of heat dissipation effect due to dust accumulation, ensure the stable operation of cooling system, reduce the downtime due to equipment failure, help to maintain the continuity of production process, indirectly improve production efficiency.

The utility model discloses an electrolytic capacitor insulation sealing device for an air-cooled power supply module, which comprises an electrolytic capacitor, and the bottom of the electrolytic capacitor is coated with insulation white glue. A printed circuit board on which the electrolytic capacitor is mounted; wherein the insulating white glue is used for carrying out insulating treatment on the bottom of the capacitor before the electrolytic capacitor is inserted, so that the sealing performance of the electrolytic capacitor in a severe environment is enhanced. According to the utility model, the insulating white glue is coated at the bottom of the electrolytic capacitor before the electrolytic capacitor is inserted, and then the capacitor is installed on the printed circuit board (PCB) and is fixed through wave soldering. The periphery of the capacitor is subjected to insulation sealing treatment, so that dust is effectively prevented from entering and accumulating among capacitor pins, and the phenomena of short circuit and burning are avoided.

The application discloses a wave-soldering dynamic parameter fine adjustment method fusing infrared thermal imaging monitoring and simulation model comparison, and particularly relates to the technical field of wave-soldering dynamic parameter fine adjustment. The method converts factors such as the thermal decomposition evolution of a flux and the radiation characteristic difference of different material regions into quantifiable emissivity disturbance characteristics, introduces a simulation model to perform partition correction on ideal heat distribution, makes the simulation result closer to the infrared observation condition, effectively reduces systematic deviation caused by inconsistent temperature measurement mechanisms between simulation and measurement, constructs and distinguishes the thermal behavior residual error between the equivalent simulation heat distribution and the infrared measured heat distribution, realizes effective distinction of real welding process abnormalities and apparent measurement uncertainty, avoids false adjustment caused by temperature measurement noise, and dynamically fine adjusts process parameters according to real heat deviation.

This utility model discloses a tunnel-type nitrogen-filled lead-free wave soldering machine, comprising: a soldering machine assembly, which includes a machine body, a fixed plate, and a transmission chain; and an anti-drop assembly, which includes a guide rail, a slider, a fixed rod, a support rod, a placement plate, and a sensor. The guide rail is fixed to both sides below the input port of the machine body and located below the fixed plate. The slider is slidably connected to the surface of the guide rail. The fixed rod is fixed between opposite ends of the slider. The support rod is fixed to both sides of the top of the fixed rod. The placement plate is inserted into the top of the support rod, and the sensor is embedded in the center of the top of the placement plate. This utility model, by setting up the anti-drop assembly, can provide auxiliary protection for the electronic board during transmission. Furthermore, because the placement plate is larger than the electronic board, when the electronic board is impacted, it will rotate on the placement plate, thereby preventing the electronic board from falling through the gaps in the transmission chain and avoiding damage to the electronic board.

The utility model discloses a kind of prevent the shared tool of welding, it is related to wave-soldering jig technical field, including drag tin sheet, the drag tin sheet is double-layer structure, the drag tin sheet includes copper base and composite layer, the copper base is located in the lower layer of drag tin sheet, and the upper surface of copper base is plated with composite layer, the composite layer includes nickel layer, silver layer and Teflon layer in turn, the nickel layer is located in the upper layer of copper base close to composite layer below, and silver layer is located in the middle of composite layer, and Teflon layer is located in the upper of composite layer. The utility model in use, by making drag tin sheet setting in element pin relative to the rear of furnace direction, and half-enclosing in element pin side end by drag tin sheet edge notch, by the three depth gradient setting on notch, can layer guide solder flow, drag tin when PCB board tin, avoid the bridging of element pin, increase the straight-through rate of product, greatly reduce artificial cost.

This invention belongs to the field of PCB board testing technology, specifically relating to a testing method for PTH (Polymerization Thermoplastic Hole) controlled-depth stepped copper foil. The method includes multiple PCB boards to be tested, all of which undergo drilling, controlled-depth step drilling, and stepped hole drilling. A baking board is used to support and heat the PCB boards. The heated PCB boards undergo copper plating, thickening, and full-board electroplating. The electroplated PCB boards are then rolled into SET boards and reflow soldered. This invention tests different types of substrates using different copper plating processes to identify the causes of PCB delamination after reflow soldering and wave soldering. Based on this, the copper plating solution is improved by adding polyethylene glycol and a mixture of polyethylene glycol and ethylenediaminetetraacetic acid (EDTA) to the solution in stages and adjusting the pH value to find a pH environment suitable for tensile testing. This ensures that the copper layer adhesion strength is maintained after copper plating and addition, reducing the generation of defective boards.

The utility model discloses a welding mechanism used on an assembly line, relates to the welding technology field, and comprises a base plate and a crest welder, the top surface of the base plate is fixedly provided with a first support frame, the side wall of the first support frame is fixedly provided with a side position dimension detection camera, the top surface of the base plate is provided with a movable platform, and the top surface of the base plate is provided with a crest welder. A second electric push rod is fixedly installed on the top face of the bottom plate, one end of the second electric push rod is fixedly connected with a movable platform, the crest welder is fixedly installed on the top face of the movable platform, a terminal containing disc is arranged above the bottom plate, and the position of the terminal containing disc corresponds to the position of the side size detection camera. According to the utility model, through automatic introduction, detection and welding processes, the welding efficiency can be obviously improved. Compared with a traditional manual welding mode, manual intervention can be reduced through automatic welding, so that the welding period is shortened, and the production efficiency is improved.

This invention discloses a power battery BDU module, including a housing, a copper busbar, multiple relays, a current sensor, a pre-charge resistor, a pre-charge relay, and a BMS mainboard. The BMS mainboard is integrated with the housing, replacing the separate BMS housing and achieving an integrated BMS and BDU design. Multiple relays are horizontally mounted within the housing. The pre-charge relay and pre-charge resistor are directly mounted on the BMS mainboard, with their communication connectors penetrating the mainboard pads and then soldered in place. The copper busbar and housing are integrally injection molded. The communication contacts between the relays and the BMS mainboard are selectively wave soldered. This design, through BMS and BDU integration, integral copper busbar injection molding, lateral insertion and bonding of relays, and wireless pre-charge circuit, significantly reduces the number of components and assembly wiring harnesses, lightens the module weight, improves electrical integration and space utilization, and lowers manufacturing costs. This invention also discloses a method for manufacturing a power battery BDU module and a vehicle thereof.

The application discloses a jig for improving the skew and floating of components in a wave-soldering process, which comprises a PCB, a carrier plate, elastic elements, electronic components, a gland, a clamping mechanism and a limiting mechanism; the PCB is provided with positioning holes; the carrier plate is provided with positioning grooves matched with the PCB; the elastic elements are inserted into the PCB through the pins at the bottom ends of the elastic elements; the electronic components are also inserted into the PCB through the pins at the bottom ends of the electronic components; the gland is located directly above the carrier plate; the clamping mechanism is used for detachably connecting the gland and the carrier plate together; the elastic elements are pressed by the pressing strips installed on the lower surface of the gland, and the electronic components are pressed by the bottom ends of the pressing rods, so that the elastic elements and the electronic components will not be skewed or floated during the wave-soldering process; and thus the jig solves the problems of the skew and floating of the elastic elements and the electronic components in the wave-soldering process.

A wave soldering station of a wave soldering machine includes a flow duct positioned in a reservoir of a solder pot, and a core frame supported by the flow duct. The wave soldering station further includes a first pump to deliver solder material to a first chamber, a second pump to deliver solder material to a second chamber, and a wave soldering nozzle assembly supported by the core frame. The wave soldering nozzle assembly includes a solder distribution baffle to create a solder wave, and an exit wing coupled to the core frame and configured to move from a lowered position to enable increased solder flow and a raised position to decrease flow of solder material. The first pump, the second pump and the exit wing are configured to control the flow of solder through the solder distribution baffle to vary a contact length of the solder wave.

The application provides a method for improving the anti-oxidation performance of Sn-Cu lead-free solder, and belongs to the technical field of electronic packaging lead-free solder. The application improves the anti-oxidation performance and interface reliability of Sn-Cu lead-free solder through raw material selection and process cooperation. First, Ni and / or Co are added to Sn-Cu alloy for micro-alloying treatment to form intermetallic compound nucleation cores; then CeO2 particles are added and ultrasonic cavitation treatment is carried out to uniformly disperse the particles and induce heterogeneous nucleation; subsequently, rapid solidification process is used for casting forming, so that Ni / Co is preferentially solid-solved into Cu6Sn5 intermetallic compound to form refined (Cu,Ni,Co)6Sn5 structure, and CeO2 particles are driven to segregate to the interface region to form an oxygen diffusion inhibition layer; the interface cooperative structure can stabilize the intermetallic compound interface and inhibit oxygen diffusion. The Sn-Cu lead-free solder prepared by the method has excellent weldability, high-temperature oxidation resistance and mechanical stability, and is suitable for electronic packaging processes such as wave soldering and reflow soldering.

This invention belongs to the field of solder paste technology and discloses a formulation and preparation method of low-melting-point SMT solder paste, comprising solder alloy powder, a mixed substrate, and flux, wherein the ratio of each component of the solder alloy powder, mixed substrate, and flux is 60:30:10. This invention avoids reducing the mechanical strength of the solder joints, ensures the completion of low-melting-point soldering, and improves the wettability of the solder paste. Simultaneously, by utilizing type A and type B viscosity modifiers to control the viscosity of the mixed substrate and flux respectively, it ensures viscosity quality control during comprehensive mixing. This allows the solder paste to adapt to different process requirements in different application scenarios, improves solder adhesion performance, and provides better flow control, enabling the solder to better adhere to the pad apertures or solder joints during vertical printing or wave soldering. Overall, it improves the soldering performance of low-melting-point SMT solder paste, resulting in good soldering effect and long lifespan.

The application relates to a welding nozzle technical field, in particular to a nozzle and a selective wave peak welding device which can be applied to blind area welding. The nozzle has a main body section and a biasing part which protrudes from the side wall of the top end of the main body section. The top end of the nozzle has an upward opening ejection cavity. One side of the inside of the ejection cavity is a working area located at the top end of the biasing part, and the other side is a reflow area located at the top end of the main body section. The biasing part can enter the blind area, and the molten solder is ejected from the working area of the biasing part to perform welding operation on the welding area above the blind area, so that the interference of the blind area structure on welding is overcome, and selective wave peak welding of the blind area is realized. The gap of the reflow area forms a layout staggered with the working area, ensures that the molten solder of the reflow does not fall on the shielding surface of the blind area, avoids the pollution of the workpiece, reduces the contact opportunity of the molten solder with oxygen, prolongs the cleaning period of the nozzle, and saves the cost.

This invention relates to the field of surge protector manufacturing technology and discloses a surge protector manufacturing process, comprising the following steps: 1) Stripping the insulation sheaths at both ends of the cable using a wire stripping device to expose the parts to be soldered, and applying solder paste to the outer sides of the parts to be soldered at both ends of the cable to form a solder layer; 2) Inserting electronic components and cables into the corresponding holes on the PCB circuit board using an insertion device; 3) Conveying the inserted PCB circuit board into a wave soldering device for soldering, and then conveying the soldered PCB circuit board to a cutting device for pin cutting. This surge protector manufacturing process allows for the direct conveying of the PCB circuit board after wave soldering to the cutting station for pin cutting, eliminating the need for workers to repeatedly handle the PCB circuit board before pin cutting, thus reducing labor intensity and saving manpower.

This application relates to the field of circuit board technology, and more particularly to a circuit board wave soldering fixture. To address the problem of inconvenient adjustment of the positioning mechanism according to the size of the circuit board, it includes a base plate. A first positioning component is located on the left side of the base plate, and a second positioning component is located above the base plate, mounted on the first positioning component. A control component is located above the base plate, mounted above the first positioning component. This application utilizes the cooperation of a tension spring, a sliding plate, and an L-shaped plate to allow the L-shaped plate to push a clamping plate to move. The clamping plate and the first spring work together to position circuit boards of different sizes. The second spring pushes a pressure block to reposition the circuit board, effectively improving the positioning effect and preventing electronic components from falling off. This allows for easy adjustment of the positioning mechanism's position according to the size of the circuit board, improving the wave soldering effect.

A wave solder machine performs a wave solder operation on an electronic substrate. The wave solder machine includes a wave solder station having a solder tank with a reservoir of solder, a flow conduit disposed in the reservoir of the solder tank, and a wave solder nozzle assembly coupled to the flow conduit. The nozzle assembly is configured to generate a solder wave. The wave solder machine further includes a conveyor configured to transport the electronic substrate to the wave solder station, at least one first gas diffuser configured to supply a gas to flow over the solder wave on each side of the solder wave and provide a layer of the gas above the solder wave, and at least one second gas diffuser configured to supply a gas under the solder wave on each side of the solder wave and provide a layer of the gas under the solder wave.

This utility model discloses a mixed-flow production lead-free wave soldering machine, including a soldering machine body, with a conveyor frame fixedly installed at the bottom inner end of the machine body; and a material storage box, the back of which is attached to one side of the conveyor frame. This utility model, by incorporating a motor, a pusher plate, and a material storage box, allows for automatic and continuous feeding of materials onto the soldering machine body. When the machine body is fed, the motor is turned on, and the motor drives a first connecting rod to rotate via a shaft. As the first connecting rod rotates 180 degrees, it drives the pusher plate to move to the left via a second connecting rod, causing the electronic substrate located above the pusher plate to fall. As the first connecting rod continues to rotate 360 ​​degrees, it drives the pusher plate to move to the right via the second connecting rod, pushing the electronic substrate at the bottom of the material storage box out through the discharge port. This process is repeated continuously, automatically feeding materials onto the soldering machine body. The entire feeding process is time-saving and labor-saving, significantly reducing the workload of workers.

The utility model discloses a kind of unpowered transfer devices of wave-soldering processing, including frame trolley, the top of frame trolley is obliquely arranged slide table;The middle part of slide table is fixed with multiple guide channel steel extended from slide table high position to slide table low position and the section is U-shaped structure, and the both sides of slide table conveying direction are fixed with vertically arranged baffle;The top of guide channel steel is opened and is rotationally connected multiple guide wheels along slide table conveying direction, and multiple guide channel steel is spaced parallel arrangement;The baffle on slide table low position end is fixedly hung with elastic blocking net. The transfer device uses "slide" principle to transfer carrier / template on slide table by its gravity, without consuming power, and conveying total length and conveying gradient can be low-cost adjusted with use, and the effect of cost reduction and efficiency improvement is remarkable.

The application discloses a self-adaptive process control method and system of a press point shielding composite wave peak soldering jig, which is applied to a wave peak soldering device. The method first identifies the jig and the board card identification information, calls corresponding layout data, and establishes a process benchmark. Then, the pressing force and shielding sealing amount of the press point shielding composite component are set, and parameters such as wave peak height, board card temperature, conveying speed, pressing force and sealing amount are collected in real time during the soldering process. When any risk index exceeds the threshold value, the wave peak soldering device process parameters and jig parameters are adjusted in linkage, so that the risk index returns to the preset range. After soldering, the quality detection result and the process data are stored and updated in association, and the risk index calculation parameters are used for subsequent adaptive control. The application can simultaneously inhibit the floating high and the tin leakage and tin connection defects, improve the wave peak soldering process stability and the first-time pass rate, and reduce the manual adjustment and line change cost.

The utility model discloses a wave -soldering fixture not easy to be soldering adhesion, related to wave -soldering technical field, including jig body and carrier plate, jig body includes cooling mechanism. The utility model discloses the setting of cooling mechanism can reach the effect of preventing soldering adhesion to the cooling of jig body, in the use, through the starting water pump and make the pipeline cooling to carrier plate with the cooling liquid of water tank input to square pipeline, and the carrier plate cools the jig body, makes it not easy to be soldering adhesion, plus the inside of jig body is containing titanium alloy, and titanium alloy can be repeatedly used, not easy to be soldering adhesion, can avoid because soldering adhesion is difficult to prevent, and lead to soldering adhesion fixture, possibly change the wave -soldering wave -peak shape and height, make the element pin and soldering contact badly when welding, appear the defect such as virtual welding, and the soldering of adhesion still possibly forms tin slag on the fixture, and the flowability and wettability of soldering appear the situation of influence.

This application relates to the field of wave soldering carrier technology, and provides a wave soldering carrier and wave soldering equipment. The wave soldering carrier includes: a carrier body, the carrier body having an upper carrier surface and a lower carrier surface disposed opposite to each other, the upper carrier surface having a first bearing area and a second bearing area, the first bearing area being used to support the main body section, and the second bearing area being used to support the reinforcing section; the second bearing area having a reinforcing limiting groove, the reinforcing limiting groove being used to limit at least a portion of the reinforcing section having a reinforcing plate, the bottom wall of the reinforcing limiting groove having a first clearance opening communicating with the lower carrier surface, when the flexible circuit board is loaded on the carrier body, the pins of the device to be soldered extend into the first clearance opening through the reinforcing plate and the flexible circuit board, and the bottom end of the pin is flush with the lower carrier surface, or the bottom end of the pin protrudes from the lower carrier surface.

The application provides a selective wave-soldering device, which comprises a rotating soldering mechanism and a conveying mechanism for conveying a PCB to a soldering station, and the rotating soldering mechanism comprises a base, a soldering assembly, a rotating assembly, a lifting assembly and an adjusting assembly; the soldering assembly comprises a total fixed plate and two soldering furnaces movably arranged on the total fixed plate, the soldering furnaces spray tin peaks to implement soldering from the bottom of the PCB, and the soldering furnaces move up and down relative to the total fixed plate; the rotating assembly is arranged on the base and can drive the soldering assembly to rotate; the lifting assembly can drive the soldering assembly to lift; and the adjusting assembly can form a height difference between the two soldering furnaces. Thus, different soldering process requirements can be met at the same time, the structure is compact, and the soldering efficiency is high; the rotation of the two soldering furnaces and the formation of the height difference of the soldering position prevent the soldering nozzle from colliding with electronic components on the PCB during soldering, thereby preventing the product from being damaged.