308 results about "Wave soldering" patented technology

The invention relates to the technical field of automatic assembly, and discloses automatic circuit board welding equipment which comprises a welding mechanism, a clamping mechanism and a driving mechanism, the welding mechanism is provided with a wave soldering station, and the wave soldering station is used for conducting wave soldering on a passing circuit board; the driving mechanism comprises a driving belt, a guide rail, a driving part and a fixing frame, at least part of the fixing frame is located above the wave soldering station, the driving belt is arranged on the outer surface of the fixing frame in a sleeving mode, and the driving part is arranged on the guide rail. According to the automatic welding equipment for the circuit board, the driving belt and the guide rail are adopted for cooperative transmission, the guide rail and the driving belt are rigidly connected through the fixing frame, and a closed conveying groove is formed; the inner surface part of the guide rail and the outer surface of the driving belt form a guide space for the clamping mechanism to move along with the driving belt inside, and meanwhile rigid support is formed by means of the guide rail.

The invention discloses wave-soldering equipment based on visual inspection, and relates to the technical field of wave-soldering equipment, the wave-soldering equipment comprises a case, a clamping unit, a spraying unit, a preheating unit, a welding unit and an adjusting unit, the case is used for installing and fixing the clamping unit, the spraying unit, the preheating unit, the welding unit and the adjusting unit, the clamping unit is used for clamping a PCB, and the adjusting unit is used for adjusting the spraying unit. The spraying unit is used for coating soldering flux, the preheating unit is used for evaporating moisture in the soldering flux, the welding unit is used for welding pins of the PCB, the adjusting unit is used for adjusting wave crests, the PCB is clamped through the clamping unit in the transportation process of the PCB, and after the soldering flux is sprayed to the PCB through the spraying unit, the PCB is conveyed to the welding unit through the adjusting unit. The preheating unit evaporates moisture in the soldering flux, the PCB is welded through the welding unit, and the wave crest height is adjusted through the adjusting unit during welding, so that the welding quality is improved.

A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

The invention relates to the field of wave soldering, in particular to a PCB welding quality detection method and time control method based on infrared imaging, and the method comprises the steps: obtaining an infrared image of a non-welding surface of a PCB; processing and analyzing the infrared image to obtain a PCB non-welding surface space temperature distribution signal and a pin edge gray scale gradient function; a feedback signal is generated according to the temperature signal of the non-welding surface of the PCB and transmitted to the central controller to adjust the transmission speed of the transmission guide rail driven by the motor to transmit the PCB; and identifying a potential defect area existing in the PCB pin welding spot according to the pin edge gray scale gradient function. According to the method, control over the tin immersion time of wave soldering and defect identification are both considered, and the soldering quality of PCB wave soldering is improved.

The utility model relates to the technical field of welding jigs, and discloses a wave-soldering jig which comprises a jig body, the upper surface of the jig body is rotationally connected with two swing plates, the other ends of the two swing plates are fixedly connected with a heat dissipation plate, clamping grooves are formed between the two swing plates, a clamping column is clamped between the two clamping grooves, and the clamping column is fixedly connected with the heat dissipation plate. Two sliding grooves are formed in the inner bottom wall of the jig body. According to the wave-soldering jig, the welding effect of equipment can be improved through the cooperation of the installation tin dragging pins and external flux paste, the tin connection phenomenon is avoided, the one-time qualification rate is improved, the circuit board body can be conveniently disassembled through the cooperation of the installation supporting plate and the spring, the circuit board can be actively popped out after welding of the circuit board is completed, and the welding efficiency is improved. And through cooperation of the swing plate and the heat dissipation plate, the heat dissipation plate can make close contact with the circuit board, meanwhile, heat dissipation can be conducted on the circuit board body, and deformation of the circuit board due to high temperature is avoided.

The invention relates to the technical field of wave soldering, and discloses a wave soldering wave crest height correction method which comprises the following steps: S1, simulation model establishment: determining preset welding process parameters; s2, preparation before correction is conducted, wherein fault-free operation and normal wave-soldering operation of welding equipment are guaranteed; s3, wave soldering debugging: determining the depth of the PCB simulation board immersed in the soldering flux wave crest; s4, wave-soldering test welding: correcting the height of the wave crest of the welding flux; s5, formal wave-soldering: correcting the wave crest of the soldering flux; and S6, welding quality monitoring and evaluation. The method comprises the following steps: determining preset welding process parameters; determining the depth of the soldering flux wave crest immersed in the PCB analog board; the preheating temperature is continuously adjusted for adjustment, so that the height of the wave crest of the correction solder is corrected; the height, the width and the outline shape of the soldering flux wave crest are monitored in real time, and the soldering flux wave crest is corrected in real time; the wave-soldering quality can be greatly improved, and the reliable and stable soldering quality is ensured.

A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.

The utility model provides a wave soldering jig capable of being used for various magnetic cores with different heights, which comprises a magnetic core jig plate, a plurality of magnetic core products are arranged on the magnetic core jig plate, a plurality of magnetic core pressing plates are used for positioning and pressing the magnetic core products on the magnetic core jig plate through spring positioning pins, and the magnetic core products are arranged on the magnetic core jig plate. Each magnetic core pressing plate is fixedly provided with two balancing weights in a mirror symmetry mode, and each magnetic core pressing plate is provided with four positioning columns which are inserted into positioning holes formed in the magnetic core jig plate in a penetrating mode. According to the utility model, rapid and accurate positioning and stable fixation of the magnetic core are realized. The device is simple in structure and convenient to manufacture, install and operate, and the labor intensity of workers is remarkably reduced. The synergistic effect of the spring positioning pin and the positioning column ensures that the magnetic core does not displace in wave soldering, and the soldering quality and the product reliability are improved. The design of the spring positioning pin endows the magnetic core with buffering and self-adaptive capabilities, and the balancing weight enhances the stability and adapts to various magnetic core products.

The application relates to a device suitable for small printed board production and processing, which comprises a clamp plate, components and devices to be welded on the printed board, a plurality of printed boards spliced into one and arranged in a matrix along a first direction and a second direction; the clamp plate clamps the side edges of all the printed boards extending along the first direction; the clamp plate is provided with component and device positioning holes, the components and devices to be welded pass through the component and device positioning holes and the printed board, and the components and devices to be welded face the same direction; the clamp plate and the printed boards clamped by the clamp plate are put into a wave soldering furnace for component and device welding. Compared with the prior art, the device has the advantages that the printed boards after splicing are clamped by the clamp plate, the components and devices to be welded on the printed boards are fixed through the component and device positioning holes on the clamp plate, especially the components and devices with requirements on the welding direction, the component and device positioning holes can fix the installation direction of the components and devices, the direction is consistent after wave soldering, a plurality of printed boards can be welded at one time, and the production efficiency is improved.

The invention relates to the technical field of circuit board welding equipment, and discloses a PCB welding device which comprises a conveying mechanism, a wave soldering mechanism and a fixing mechanism, the conveying mechanism comprises a conveying assembly and a bearing part, and the fixing mechanism comprises a pin fixing assembly and a board fixing assembly; the plate fixing assembly comprises a downward pressing piece and a downward pressing driving piece, the downward pressing piece is arranged on the bearing piece in an up-down moving mode, and the downward pressing driving piece can drive the downward pressing piece to move downwards; the pin fixing assembly comprises an extrusion air bag, the extrusion air bag is arranged above the wave-soldering mechanism, when the PCB is conveyed to the position above the wave-soldering mechanism, the extrusion air bag is located above the PCB, and the extrusion air bag can downwards extrude components inserted in the PCB. When the welding device for the PCB is used, components and the PCB are fixed through the pin fixing assembly and the board fixing assembly, the pins and the PCB can be prevented from moving when being impacted upwards by the wave crest of welding fluid, and poor welding is prevented.

The utility model relates to the technical field of welding equipment, and provides an anti-oxidation structure and a wave soldering device. The anti-oxidation structure is suitable for being installed on the wave soldering device and comprises an anti-oxidation cover and a fixing piece, the fixing piece is detachably connected with the anti-oxidation cover, and an anti-oxidation cavity is formed in the anti-oxidation cover so that a transmission assembly of the wave soldering device can be located in the anti-oxidation cavity. According to the anti-oxidation structure and the wave soldering device provided by the utility model, the anti-oxidation cover and the fixing piece are detachably connected, so that after tin slag is generated in the anti-oxidation cover, the anti-oxidation cover and the fixing piece which are connected with each other can be detached, and the interior of the anti-oxidation cover can be conveniently cleaned.

The invention discloses an oxidation improvement method for an FPC bonding pad with an electronic connector. The oxidation improvement method comprises the steps that S1, an SMT bonding pad heat insulation jig is prepared; s2, the SMT bonding pad heat insulation jig is installed on an SMT carrier plate provided with an FPC; s3, high-temperature procedures of SMT reflow soldering, FR4 / PI press fit and FR4 press fit baking are executed; s4, the SMT bonding pad heat insulation jig is removed; and S5, carrying out a wave soldering process. Before the FPC is subjected to the high-temperature working procedure, the SMT bonding pad heat insulation jig is installed at the bonding pad position of the FPC connector, and the oxidation risk of the FPC and the connector bonding pad in the high-temperature working procedure is remarkably reduced through the synergistic effect of multi-stage heat insulation and rapid positioning of the SMT bonding pad heat insulation jig. The problems that in the prior art, due to high-temperature oxidation of a bonding pad and manual wiping with an eraser, the labor cost is high, and chippings are left can be solved.

The utility model discloses a wave soldering furnace jig for fixing a circuit board, which comprises a bottom plate, at least one mounting groove for mounting the circuit board is arranged on the bottom plate, and element pin via holes are arranged at the bottom of the mounting groove; the mounting groove is formed in the bottom plate, the at least two first fixing assemblies are arranged on the peripheral area of the mounting groove, one end of each first fixing assembly is rotationally connected with the bottom plate, and the other end of each first fixing assembly is used for abutting against a circuit board mounted in the mounting groove when the circuit board is mounted in the mounting groove of the bottom plate. According to the technical scheme, the circuit board is limited in the horizontal direction and the vertical direction through the mounting groove and the first fixing assembly, welding flux can only pass through the element pin via holes in wave soldering, the surface-mounted component cannot be pulled, and the surface-mounted component is prevented from falling off in the wave soldering process.

The utility model relates to the field of circuit board welding production, and discloses a wave crest jig which comprises a carrier plate, a pressing plate and a leveling piece, and the carrier plate is provided with a containing groove used for containing and positioning a circuit board; the pressing plate is detachably connected with the carrier plate and is provided with an elastic abutting assembly, and the elastic abutting assembly is used for being pressed on an electronic component of the circuit board; and the flattening piece is connected with the carrier plate and / or the pressing plate and comprises a flattening surface, the flattening surface is positioned between the pressing plate and the groove bottom of the accommodating groove, and the flattening piece is used for limiting the substrate of the circuit board between the flattening surface and the groove bottom surface of the accommodating groove in the thickness direction. The wave crest jig provided by the utility model can solve the problem of how to improve the smoothness of the circuit board in the wave crest welding process.

The invention relates to the technical field of electronic assembly, and provides a welding stud structure, a circuit board assembly method and a circuit board assembly.The welding stud structure comprises a stud body, the stud body is provided with a first end and a second end which are oppositely arranged, a preset length is formed between the first end and the second end, and the first end and the second end face each other in the direction from the end face of the first end to the second end; a threaded hole is formed in the stud body in the axial direction, a closed end for closing the threaded hole is formed at the second end of the stud body, the end face of the closed end is an arc face, and a welding part is formed on the cylindrical face close to the second end. The closed end for closing the threaded hole is formed at the second end of the stud body, so that the end face of the closed end is the cambered surface. When the stud body is assembled on the circuit board, a wave-soldering process can be used in an overlapping manner after an SMT (surface mount technology) process, so that tin waves can effectively fill tin in a welding cavity position of the SMT process, 100% tin penetration between the stud body and the hole wall of a welding hole of the circuit board is realized, the connection strength is improved, and a large current can pass through the stud body and the hole wall of the welding hole of the circuit board.

The invention discloses a structure for preventing a PCB wave-soldering short circuit, which comprises a wave-soldering jig, a movable groove is arranged in the wave-soldering jig, a plurality of solder resisting pieces are arranged in the movable groove, and the interval of the solder resisting pieces is matched with the interval of a circuit needing to be soldered; and a plurality of limiting members, wherein the limiting members pass through the wave soldering jig and abut against the solder resist member. According to the invention, neat electronic components are inserted into the PCB, the wave-soldering jig is installed at the pin end of the PCB, each pin is isolated by using the solder mask, the limiting piece is screwed, and the solder mask is positioned, so that when the PCB is conveyed to a welding position by the conveyor belt, the isolated pins are directly welded, and the welding efficiency is improved. The solder mask solidification problem and the solder mask thickness non-uniformity problem do not need to be considered, the welding quality is improved, and short circuit is avoided.

A lead fixing structure and method adopting wave soldering relates to the field of electronic installation and comprises a printed board, one surface of the printed board is a lead preparation soldering surface, the other surface of the printed board is a back surface, the back surface of the printed board is connected with at least two combined layers through a connecting structure, and preset distances are reserved between the combined layers and the printed board and between the adjacent combined layers; the combined layer comprises a soft pad and a hard plate which are in contact, and the hard plate is located on the side, away from the printed board, of the soft pad; the printed board is provided with wire bonding pad holes, the soft pad is provided with soft pad wire holes, the positions and the number of the soft pad wire holes correspond to the positions and the number of the wire bonding pad holes, the diameter d2 of the soft pad wire holes is smaller than the outer diameter d1 of the wire containing the wire insulating layer, and the hard board is provided with hard board wire holes. The positions and the number of the hard board wire holes correspond to the positions and the number of the printed board wire bonding pad holes, and the diameter d3 of the hard board wire holes is larger than the outer diameter d1 of the wires containing the wire insulating layers. The problem that a wire is difficult to fix before being welded by wave soldering equipment is solved.

Embodiments of the present application provide a selective wave solder path planning method and system, and a storage medium. The method comprises: dividing all welding points into a first number of welding point groups according to a preset grouping rule; generating an initial path after distributing each welding point group to a corresponding tin furnace based on constraint conditions and load balancing, wherein the constraint conditions include continuous traversal within the welding point group, traversal of each welding point once, fixed starting point, and tin furnace assignment; and obtaining a target path after iteratively optimizing the initial path according to a preset decision variable and optimization target. The initial path of each tin furnace is automatically generated by setting the constraint conditions and load balancing, and the initial path is optimized by the decision variable and the optimization target, so as to obtain the target path of the tin furnace for selective wave soldering. The generation efficiency is high, and the rationality of the optimized path is high.

This invention discloses a membrane heater and its assembly method, including a heating film, a PCB board assembly, a package housing, and an insulating insertion module. The insulating body of the insulating insertion module has multiple bent copper leads and multiple straight copper leads at both ends. The heating film has multiple solder pads, the PCB board assembly has multiple copper ring solder holes, and the package housing has positioning insertion holes penetrating the front and back. The ends of the bent copper leads protruding from the insulating body are bent towards the solder pads. This invention, through the setting of the insulating insertion module, not only improves welding accuracy but also creates conditions for subsequent reflow soldering and wave soldering, thereby improving the overall assembly efficiency of the membrane heater and simplifying the assembly equipment, achieving cost reduction and efficiency improvement. Furthermore, it avoids the problem of short circuits caused by the difficulty in controlling the distance between adjacent solder points in existing welding methods that involve pressing wires together with welding equipment, thus improving the insulation and pressure resistance performance of the membrane heater.

The application discloses a multi-section selective wave-soldering device, which comprises at least two conveying devices, at least two blocking devices, at least two soldering devices and driving devices for driving the soldering devices to move, the conveying devices are arranged in sequence to form a conveying channel of a conveying plate, and the blocking devices are arranged at the ends of the conveying devices respectively; the soldering devices are arranged below the conveying channel, and the driving devices drive the soldering devices to move respectively. The multi-section selective wave-soldering device is small in size and high in production efficiency.

This invention provides a selective wave soldering tin spraying device, belonging to the field of wave soldering technology. It includes a solder storage tank, an outlet tank, an air inlet assembly, an air duct assembly, a first air outlet assembly, and a lifting assembly. The outlet tank is fixedly installed on the top of the solder storage tank, with an open top. A return port is provided on the top wall of the solder storage tank, located on the outer side of the outlet tank. The lifting assembly is disposed on the side wall of the solder storage tank. Compared to existing technologies, this invention allows for rapid cooling of the solder joints during wave soldering of PCB components, enabling rapid solidification. Furthermore, the heat from the molten solder inside the solder storage tank heats the returning molten solder, preventing a drop in temperature during reflow and ensuring optimal reflow performance.

1. Name of the Design Product: Selective Wave Soldering Machine (Four-station - Rotary Table Type). 2. Use of the Design Product: Used for selective wave soldering of electronic circuit boards. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photograph that Best Illustrates the Design Key Points: Perspective View 1.

The utility model discloses selective wave soldering equipment which comprises a shell, a rack arranged in the shell, a transportation track partially arranged in the shell and erected on the rack, and a spraying module, a preheating module and a welding module which are arranged in the shell and sequentially arranged in the transportation direction of the transportation track. The conveying rail comprises a first conveying rail body and a second conveying rail body which are arranged side by side, and an adjusting assembly connected to the first conveying rail body and the second conveying rail body and arranged on the first conveying rail body and the second conveying rail body and used for adjusting the first conveying rail body and the second conveying rail body to achieve reciprocating motion. By the aid of the conveying rail, a worker can directly prepare for assembling the circuit board on another conveying rail after placing the assembled circuit board on the conveying rail in the welding production process, and the conveying rail conveys the circuit board back to the position where the assembled circuit board is initially placed after welding is completed, so that the selective wave-soldering efficiency is improved.

The utility model discloses a wave soldering jig, relates to electronic welding auxiliary equipment technical field, the wave soldering jig has a first side and a second side opposite to each other, the first side is used for connecting a PCBA, the wave soldering jig forms a welding hole arranged along the thickness direction in a penetrating manner, the welding hole is used for exposing a welding spot on the PCBA, and the first side is used for connecting the PCBA with the second side. The wave soldering jig is provided with an inlet end and an outlet end in the wave soldering moving direction, the inlet end and the outlet end are oppositely arranged, a first flow guide groove and a second flow guide groove are formed in the positions, corresponding to the inlet end and the outlet end, of the second side of the wave soldering jig respectively, and the first flow guide groove and the second flow guide groove communicate with the welding hole.

The utility model is applicable to the technical field of photovoltaic inverters, and provides a PV terminal temperature detection device and a photovoltaic inverter.The PV terminal temperature detection device comprises a thermistor arranged on a wave soldering side of a core pin of a metal core in a PV terminal; and the surface of the thermistor, the wave-soldering side of the core pin and the copper sheet of the core pin are coated with heat-conducting glue. As the thermistor is placed on one side of the wave-soldering pin, the thermistor is closer to the core pin, and the heat transfer effect is better. Meanwhile, the thermistor, the core pin and the copper sheet are coated with heat-conducting glue, and most of heat generated by the metal core and the copper sheet is transferred to the thermistor, so that the master control chip can judge the state of the current PV terminal more quickly and accurately.

A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.

The utility model discloses a material receiving device for PCB wave soldering, and belongs to the technical field of PCB soldering, the material receiving device comprises a support frame, four groups of support legs are arranged at the bottom of the support frame, moving grooves are formed in the four groups of support legs, an adjusting plate is arranged above the support frame, sliding blocks are arranged on two sides of the adjusting plate, the sliding blocks are slidably connected to the interiors of the moving grooves, and the moving grooves are arranged in the moving grooves. Two sets of telescopic rods and two sets of rear supporting plates are arranged above the adjusting plate, a front supporting plate is arranged above the adjusting plate, a rolling shaft and an adjusting shaft are arranged in the front supporting plate, and the tops of the two sets of telescopic rods are rotationally connected with the adjusting shaft; when the device is used, the effect of adjusting the height and angle of the adjusting plate can be achieved in two modes, the device is simple in structure and quite convenient to use and maintain, the device can be almost used for production workshops of any scale due to the powerful self-adaptive adjusting function, and the universality and economic benefits are greatly improved.

The present invention relates to the technical field of welding equipment, and in particular to an automated electronic component welding equipment. The equipment comprises: a wave soldering machine, with square holes on both sides; a controller, mounted on the side of the wave soldering machine; a support cylinder, connected to the side of the wave soldering machine away from the controller; a rotating ring, rotatably connected to the support cylinder; a placement frame, connected to the outside of the rotating ring at even circumferential intervals; a mounting plate, connected to the outside of the rotating ring at even circumferential intervals, and the mounting plate and the placement frame are staggered; a multi-stage cylinder, mounted on the top of the mounting plate; a mounting frame, connected to the telescopic rod of the multi-stage cylinder, the mounting frame is located directly above the placement frame, and a groove adapted to the electronic components on the PCB is provided at the bottom of the mounting frame. The present invention can effectively absorb and dissipate the heat generated during the welding process by providing a groove adapted to the electronic components on the PCB at the bottom of the mounting frame, and combining the first heat sink, the semiconductor cooling plate and the coolant in the cavity.