Leadless solder

A lead-free solder, containing technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problems of affecting solder cost, affecting solder joint quality, expensive price, etc., and achieve good mechanical properties and solderability performance, good oxidation resistance, and the effect of reducing the cost of raw materials

Inactive Publication Date: 2003-12-10
广州特铜电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the high soldering temperature, the currently used electronic components and circuit board materials will be damaged and deformed during the soldering process. At the same time, a large amount of tin slag will inevitably be produced in the process of wave soldering and dip soldering, which will affect the quality of solder joints. , and increases the loss of tin
In addition, the price of Ag is the highest among the raw materials of lead-free solder alloys, so the content of Ag directly affects the cost of solder. When the content of Ag reaches 3-4wt%, the price of solder is very expensive
For Sn-0.7wt% Cu solder alloy, in addition to high melting point, there are also disadvantages of poor solderability

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Sn 93.45%, Ag 1%, Bi 5%, Cu 0.5%, P 0.0008%, RE 0.05%.

Embodiment 2

[0019] Sn 91.8%, Ag 0.8%, Bi 7%, Cu 0.3%, P 0.0005%, RE 0.1%.

Embodiment 3

[0021] Sn 92.12%, Ag 1.1%, Bi 6%, Cu 0.7%, P 0.0007%, RE 0.08%.

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PUM

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Abstract

The composition of the leadless solder includes (wt%) 0.05-1.2% of Ag, 0.5-10% of Bi, 0.01-1.5% of Cu, 0.001-0.0009% of P, 0.002-0.8% of RE and the rest is Sn. It features low melting point, excellent resistance to oxidation and weldability, and is applicable of wave soldering, solder-dipping and reflow soldering of plug-in cards.

Description

technical field [0001] The invention relates to a solder material, in particular to a lead-free solder alloy with Sn as the matrix. Background technique [0002] Several lead-free solder alloys commonly used at present, such as Sn-3.5wt%Ag, Sn-3.5(4.8)wt%Ag-0.7wt%Cu, Sn-0.7wt%Cu, have melting points of 221°C, 217~ 218°C and 227°C, so that the soldering process temperature must be increased to 250-270°C during wave soldering or reflow soldering of plug-ins. Due to the high soldering temperature, the currently used electronic components and circuit board materials will be damaged and deformed during the soldering process. At the same time, a large amount of tin slag will inevitably be produced in the process of wave soldering and dip soldering, which will affect the quality of solder joints. , and increased tin loss. In addition, the price of Ag is the highest among the raw materials of the lead-free solder alloy, so the content of Ag directly affects the cost of the solder,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 蔡烈松谷兆彭
Owner 广州特铜电子材料有限公司
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