896 results about "Soldering process" patented technology

The invention provides a back contact battery and a photovoltaic module, and relates to the field of photovoltaic technology. The back contact battery provided by the invention comprises a battery body, a plurality of first fine grids and a plurality of second fine grids, wherein the first fine grids and the second fine grids extend along a first direction; the plurality of first fine grids and the plurality of second fine grids are sequentially and alternately arranged on the first surface of the battery body at intervals in the second direction; the first surface comprises a first area and comprises a first edge and a second edge which are oppositely arranged in the second direction; in the first region, the first fine grid and the second fine grid are provided with a plurality of first sub-bonding pads and a plurality of second sub-bonding pads; the area of the first sub-pad is smaller than that of the second sub-pad. According to the back contact battery provided by the invention, the stability of the welding strip in the welding process can be improved, and the current collection reliability is ensured.

The invention discloses a visual inspection method and device for reflow soldering quality and computer equipment. The method comprises the steps of obtaining a to-be-detected product image entering a detection area; preprocessing the to-be-detected product image and extracting a welding spot ROI region; the welding spot ROI is put into a defect classification model for welding defect identification and classification, and a classification result is obtained; and determining an equipment parameter adjustment scheme according to the classification result in combination with a preset adjustment rule, and adjusting the reflow soldering equipment according to the equipment parameter adjustment scheme. By implementing the method, the welding spot quality can be automatically recognized in the welding process, the production parameters are automatically adjusted according to the detection result, the welding quality is effectively improved, potential quality problems are avoided, the production efficiency can be improved, manual intervention is reduced, and the labor cost is saved.

The invention provides a welding method and device, electronic equipment and a storage medium, and belongs to the technical field of intelligent manufacturing. A target wire feeding speed corresponding to the actual average current value is determined according to the target compensation relation; the actual wire feeding speed is adjusted to the target wire feeding speed; the target compensation relation is determined from the compensation relation set based on the target average current value, and the target compensation relation comprises the corresponding relation between the actual average current value and the target wire feeding speed. Through the pre-established compensation relation, the wire feeding speed can be actively adjusted in the welding process according to the deviation of the monitored actual average current value so as to compensate the deviation in real time, and therefore it is guaranteed that the heat input amount in the whole welding process is constant, and the welding quality is improved. The technical problems of welding current fluctuation and inconsistent welding seam forming caused by dry elongation change due to factors such as out-of-roundness of workpieces are solved, and the quality and reliability of welding seams are remarkably improved.

The invention relates to the technical field of chip mounting, in particular to an automatic adjusting method and system for a chip clamp, and the method comprises the following steps: monitoring and automatically calibrating the pressure applied by the clamp in real time to ensure that the pressure meets the chip mounting standard, analyzing a to-be-mounted chip by using a camera, optimizing the shape recognition, and adjusting the track of the clamp to correct the offset. And analyzing the correlation between the pressure and the mounting quality according to the data after mounting, and establishing an optimized control closed loop. According to the invention, through real-time monitoring and automatic adjustment of pressure parameters, the dependence on manual adjustment is reduced, the automation level of the production process is improved, through detailed pressure adjustment, each chip is ensured to be accurately processed in the mounting process, the product quality is improved, the rejection rate is reduced, and the production efficiency is improved. The application of the image analysis technology allows the chip to be accurately evaluated before mounting, and the distance between the clamps is automatically adjusted, so that the mounting precision is improved, and the requirements of various chip shapes and sizes are met.

The invention relates to the field of antenna welding devices, in particular to an RFID antenna tail end pin welding device which comprises a bottom plate, a welding gun arranged on the upper side of the bottom plate, a center column fixedly installed in the center of the upper side of the bottom plate, a transposition mechanism used for rapidly switching welding point positions and a correcting mechanism used for correcting the tail end of an antenna. The rotating base plate, the discharging base and the pushing assembly in the transposition mechanism are matched, circumferential rotation of the rotating base plate is matched with radial sliding of the discharging base, the discharging base drives a circuit board on the discharging base to slide once every time the rotating base plate rotates by a circle, and therefore automatic switching of welding point positions is achieved; the clamping plate, the pressing wheel and the wedge-shaped piece in the correcting mechanism are adopted, the wedge-shaped piece triggers the moving assembly to drive the clamping plate to clamp and straighten the tail end of the antenna, meanwhile, the pressing wheel downwards presses the tail end of the antenna, the problem of insufficient soldering or poor contact caused by antenna bending in the welding process is effectively solved, and the welding quality is ensured.

The invention provides a PCBA welding quality prediction method and system based on time sequence data, and relates to the field of circuit board welding, and the method comprises the steps: obtaining the time sequence data and detection data information of a technological process, and carrying out the missing value completion and data normalization processing; quantifying the correlation degree between each piece of feature data and the thickness of the intermetallic compound; constructing an MPSO-LSTM prediction model and carrying out model training to obtain an initial model; and evaluating the precision of the initial model to adjust hyper-parameters of the initial model to obtain a quality prediction model so as to analyze real-time process data in the welding process and realize prediction of the IMC thickness. According to the method, the quality online prediction capability in the welding process is effectively improved by constructing the MPSO-LSTM prediction model, the quality prediction model is obtained through model training and hyper-parameter adjustment, process data in the welding process can be analyzed in real time, the thickness of intermetallic compounds can be predicted, and technicians are assisted in quantitatively identifying quality causes of welding spot defects.

The invention provides a steel pipe welding seam regulation and control method and system, electronic equipment and a storage medium, relates to the technical field of steel pipe welding, and continuously obtains multi-modal data, including visual image data, laser contour data, arc sensing data and infrared thermal image data, of the welding surface of a steel pipe in the welding process. And carrying out space-time alignment on the data to obtain a standardized fusion data set. And inputting the fusion data set into a double-branch deep learning model, extracting visual image edge features, laser contour geometric features and infrared thermal image temperature distribution features through CNN branches, and extracting arc time sequence fluctuation features through LSTM branches. And carrying out weighted fusion calculation on the characteristics to obtain the real-time coordinates of the groove center of the welding surface of the steel pipe and the temperature state parameter of the welding seam. And according to the real-time coordinates of the groove center and a preset reference, a welding seam temperature state parameter is combined, and a welding seam control strategy of the steel pipe welding surface is generated. According to the invention, high-precision welding seam regulation and control are realized, and the welding efficiency is improved.

A method of producing a semiconductor device includes providing a semiconductor die, providing a metal joining partner, forming a diffusion solderable region by an inkjet metal printing process, forming an assembly to include the diffusion solderable region in between the metal joining partner and the semiconductor die, and performing a diffusion soldering process that forms a soldered joint from the diffusion solderable region in between the semiconductor die and the metal joining partner.

The invention discloses a circuit board semi-automatic welding system, and relates to the technical field of circuit board production and processing, the circuit board semi-automatic welding system comprises a processing table, the top end of the processing table is rotatably connected with a welding table driven by a stepping motor to rotate, the top end of the welding table is symmetrically provided with circuit board adsorption grooves, and the welding table is internally provided with an air suction positioning mechanism matched with the circuit board adsorption grooves; through cooperative operation of the multi-station rotary welding table and the double clamping boxes at the bottom end of the cross beam, a high-precision stepping motor and a transverse movement adjusting mechanism are integrated, a feeding, welding and discharging full-process automatic linkage mechanism is achieved, the automation degree is improved, and the production efficiency is improved. A multi-sensor fusion control structure comprising a smoke measurement purification mechanism and a temperature measurement regulation and control mechanism is adopted, meanwhile, through visual monitoring of a high-definition camera, the welding process can be monitored in real time, welding smoke is sucked away in time, a welded circuit board is rapidly cooled, and multi-dimensional monitoring and intelligent emergency response in the welding process of the circuit board are achieved.

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor chip and the electrically conductive pad. The device further includes a pair of complementary positioning formations formed by a cavity in the electrically conductive clip and a protrusion (such as a stud bump or a stack of stud bumps) formed in the electrically conductive pad. The complementary positioning formations are mutually engaged to retain the electrically conductive clip in the bridge-like position to avoid displacement during soldering.

The invention relates to the field of photovoltaic module production, in particular to a bus bar welding method and welding equipment. According to the bus bar welding method, the bus bar is welded to the back contact battery pack, the back contact battery string group is placed on the glass plate, the bus bar is in lap joint with the welding strip exposed in the insulation area, welding is carried out, the back contact battery string group is located on the glass plate in the welding process, and the back contact battery string group does not need to be lifted in the welding process; relative friction between the welded battery piece and the glass plate is avoided, the welding quality is guaranteed, and the welding process is more simplified. The bus bar welding equipment provided by the invention is used for realizing the bus bar welding method, comprises a transmission positioning device, a bar manufacturing device and a welding device, and is simple in structure.

The invention discloses a packaging structure with a heat dissipation structure and a packaging method, through the connection cooperation of a first metal carrier plate, a second metal carrier plate, a first heat conduction insulating film, a second heat conduction insulating film, a first rewiring layer and a second rewiring layer, and the subsequent circulation of a cooling liquid in a cooling pipeline, the heat resistance is greatly reduced, the heat dissipation is enhanced, and the heat dissipation efficiency is improved. Power consumption is reduced; according to the invention, the first metal carrier plate and the second metal carrier plate are directly bonded, the first metal carrier plate and the second metal carrier plate are provided with grooves and holes, and finally, the first metal carrier plate and the second metal carrier plate are matched with the first heat-conducting insulating film and the second heat-conducting insulating film to form the cooling pipeline, so that the stress problem caused by the welding process of a water-cooling plate in the traditional technology is improved, and a packaging body is prevented from being damaged; wiring can be conducted on the two faces of the base material, and multi-dimensional packaging is achieved; according to the invention, the metal substrate is used as the substrate, panel warping is reduced, and the stress problem caused by multi-dimensional packaging is solved.

The utility model discloses a Kovar frame and a sensor packaging structure, which are applied to the technical field of semiconductor device packaging and comprise a bottom frame, a solder area is arranged on the surface of one side of the bottom frame, a retaining wall is arranged on one side, facing the center of the Kovar frame, of the solder area, and a protruding part is arranged on one side, facing the solder area, of the retaining wall. A gap is formed between the protrusion and the bottom surface of the solder region. The blocking wall can prevent welding flux arranged in the welding flux area from splashing towards the center of the kovar frame, and therefore the situation that the welding flux splashes to the pixel area in the eutectic welding process is reduced. And the protruding part is used for increasing a solder climbing path when the solder climbs towards the top end of the retaining wall, preventing the solder from infiltrating towards a position close to the chip, further reducing the sputtering risk, and ensuring the yield of the device.

The invention relates to the technical field of semiconductor packaging, and discloses a bonding wire welding method based on bare chip interconnection, and the method comprises the steps: collecting and fusing acoustic response and optical reflection signals of a bonding interface in real time through a multi-mode in-situ sensing mechanism integrating acoustic resonance and surface plasmon resonance; dynamically calculating the thickness, the mechanical coupling deformation and the energy dissipation state of the intermetallic compound layer; and the ultrasonic power and the bonding force are subjected to closed-loop adjustment in combination with a model prediction control algorithm, so that the welding process is evolved along a preset optimal physical path all the time. The system comprises a multi-mode sensing welding head, a synchronous data acquisition module, a state resolving module and a self-adaptive control module. The transparent and intelligent welding process is realized, and the bonding consistency, reliability and yield of high-density interconnection are remarkably improved.

The invention relates to the technical field of infrared temperature measurement, provides a soldering tin temperature closed-loop control method and system based on infrared temperature measurement feedback, and solves the problems that a temperature measurement result of a phase change critical region seriously deviates from a true value, and temperature measurement is not accurate due to the fact that material state changes are not considered. According to the method, the environment temperature of a welding area and the initial temperature measurement value of soldering tin in the welding process are detected, and soldering tin phase change emissivity data are obtained; the real-time state of soldering tin is determined, and the soldering tin temperature after calibration is obtained by combining the soldering tin phase change emissivity data and the environment temperature; comparing the calibrated soldering tin temperature with the phase change temperature interval to obtain a temperature comparison result, and combining the temperature comparison result with the calibrated soldering tin temperature to obtain an adjusted heating power parameter; and the soldering tin heating device is controlled to heat soldering tin according to the adjusted heating power parameters until the calibrated soldering tin temperature within the preset target temperature range is obtained, high-precision real-time calibration and dynamic closed-loop regulation and control over the soldering tin temperature are achieved, and it is ensured that the welding process is stably within the target temperature range.

The IBC solar cell piece comprises a silicon wafer, a plurality of doping layers and a plurality of fine grid lines, the doping layers and the fine grid lines are located on the backlight face of the silicon wafer, the doping layers comprise the first doping layer and the second doping layer, and the doping types of the first doping layer and the second doping layer are opposite. The first doped layers and the second doped layers are parallel and are distributed at intervals in a staggered mode in the width direction, the multiple first doped layers in the length direction are distributed at intervals, the multiple second doped layers in the length direction are distributed at intervals, and the fine grid lines comprise first fine grid lines located on the first doped layers and second fine grid lines located on the second doped layers. The intervals of the first doping layers and the intervals of the second doping layers are distributed in a staggered mode in the length direction. According to the main-grid-free IBC solar cell piece, the back face structure is designed, the electron collection efficiency can be improved through the discontinuous doping layer and the thin grid lines distributed at intervals, the power loss of an assembly is reduced, and meanwhile the short circuit problem caused in the welding process can be avoided.

The invention discloses an automatic tin soldering machine for electronic component production, and belongs to the technical field of tin soldering machines, the automatic tin soldering machine comprises a cabinet, an adjusting mechanism is arranged in the cabinet, a tin soldering head is mounted on the adjusting mechanism, a fixing mechanism is arranged on one side of the adjusting mechanism, and the fixing mechanism comprises a group of upper clamping plate and lower clamping plate which are symmetrically arranged; component bodies to be welded are fixed in the upper clamping plate and the lower clamping plate. Through cooperation of an electric sliding block and a second electric push rod, a tin soldering head can be accurately moved to the position, needing to be welded, of an electronic component body, automatic welding is achieved, the upper portion and the lower portion of the component body are clamped through an upper clamping plate and a lower clamping plate correspondingly, and compared with traditional single-clamping-plate clamping, the clamping efficiency is greatly improved. According to the arrangement, the stability of the component body with the non-planar side face in the welding process can be remarkably improved, and then the welding quality is improved.

The utility model relates to an anti-tin-climbing PIN bonding pad power module substrate, which comprises a substrate body and a Pin assembly, the Pin assembly is welded on the substrate body, each Pin comprises a pin seat and a pin body, the pin seat is provided with a through hole, the pin body is matched with the through hole and is inserted in the through hole, the pin seat comprises a column body, a solder resisting ring is formed on the circumferential surface of the upper end of the column body, and the solder resisting ring is connected with the pin body. The solder mask ring is arranged at the upper end of the needle seat, so that tin liquid can be blocked by the solder mask ring when moving from the bottom of the needle seat to the needle body in the tin soldering process, tin is prevented from climbing onto the needle body, the needle body is prevented from being free of tin, and a power module and a PCB (printed circuit board) can be assembled smoothly at a client.

The invention discloses a wear-resistant alloy composition and application. The wear-resistant alloy composition comprises 0.9 wt% to 2.65 wt% of C, 0.58 wt% to 1.35 wt% of Si, 0.31 wt% to 0.45 wt% of Mn, 6.5 wt% to 11.35 wt% of Cr, 0.25 wt% to 1.25 wt% of Mo, 7.15 wt% to 12.65 wt% of V and the balance Fe and inevitable impurities. Powder metallurgy is not needed, direct forming can be achieved through 3D printing, the heat treatment requirement is lower, operation is easy, a harsh heat treatment process is not needed, the obtained alloy has HRC63 or higher hardness, and the average friction coefficient at the normal temperature is only about 0.37. Moreover, the wear-resistant alloy composition is good in welding performance, and the problem that interlayer cracking occurs in the 3D printing or welding process or after the high-C-content alloy is solved.

The invention relates to the technical field of lens module AA assembly design, in particular to a lens AA assembly test device based on laser soldering and a use method thereof.The lens AA assembly test device based on laser soldering is characterized in that a square tube frame is fixed to a bottom plate through four stand columns, and three-axis soldering head assemblies are arranged at the four corners of the inner side of the square tube frame; the testing assembly comprises a six-dimensional force sensor, a square seat used for installing a lens is fixed to the top of the six-dimensional force sensor, a plurality of pins are arranged on the top of the square seat, a circuit board is connected to the pins in an inserted mode, and the circuit board is fixed to the testing table through a clamping mechanism and keeps electrically connected with the electric connector female head in the welding process. Through a cooperative measurement mechanism integrating the six-dimensional force sensor and the three-axis micrometer, the three-dimensional stress and deformation quantity of the circuit board in the laser soldering process can be accurately obtained in real time, and the problem that traditional AA soldering equipment design depends on experience debugging is solved; and reliable data support is provided for clamping force and positioning compensation design of mass production equipment.

The utility model discloses a welding device with an upper fixture, which relates to the field of circuit board welding and comprises a workbench, a welding platform is arranged on the upper surface of the workbench, a connecting platform is arranged below the welding platform, and a transverse moving module used for driving the welding platform to move left and right is arranged on the upper surface of the connecting platform. The welding platform can be driven to move front and back through a threaded rod, the welding platform can be driven to move left and right through a transmission belt, a connecting arm can be driven to reciprocate along a specific track through rotation of a third servo motor and cooperation of an inverted-U-shaped sliding groove (the wire can be grabbed in a reciprocating mode in a PPU mechanical arm mode), and a welding head is driven to move downwards. Meanwhile, the heating wire supply welding table is controlled to supply a proper amount of solder wires, the solder wires extend out of the end of the wire outlet pipe and move downwards, the lower end of the welding head makes contact with the welding position of the solder wires and the wires, the solder wires are melted through heat of the welding head to fix the wires and the circuit board, the whole welding process is high in automation degree, and work efficiency is improved.

The invention discloses a packaging and welding device suitable for semiconductor materials, and relates to the technical field of semiconductor material packaging and welding, the packaging and welding device comprises a supporting plate frame and a spindle box, the spindle box is fixed to the top of the supporting plate frame through bolts, and a transmission frame is fixedly connected to the top of the supporting plate frame; the independent driving assembly controls two circuits to alternately coincide a welding plate and a metal wire in different moving modes, high-speed hot-pressing welding can be completed in cooperation with the welding clamping mechanism installed at the air cylinder end, meanwhile, the movable locking column is matched to abut against and rotate in the fixing barrel, and the welding clamping mechanism is matched with the movable locking column. According to the clamping and discharging device, the rubber blocks on the clamping plates are meshed with welded plates in the pressing process, clamping and discharging operation after welding is finally achieved through cooperation of lifting of the air cylinders and interception of the bearing plates, the automation degree is high, locking and discharging are achieved by means of the plates completed in the welding process, and operation is easy.

The invention relates to the technical field of connector pin welding, and discloses multi-specification connector welding equipment capable of adjusting a pin positioning clamp, the multi-specification connector welding equipment comprises a supporting table, a lifting table is slidably connected to the upper end of the supporting table, and clamping seats are symmetrically slidably connected to the lifting table; the lower end of the lifting table is connected with a linkage part for driving the two clamping seats to approach synchronously, the two clamping seats are connected with an isolation part for preventing soldering tin from overflowing, and the isolation part comprises a moving plate. The multi-specification connector welding equipment capable of adjusting the pin positioning clamp can effectively solve the problems that in the prior art, in the welding process, if pressing force is too large, a bonding pad on a circuit board is likely to deform, tilt and even be separated from a substrate, and due to the fact that soldering paste is too large, a temperature curve is unreasonable, a Pin coating is poor or the bonding pad is improperly designed, the bonding pad is prone to deformation, upwarp and even be separated from the substrate. And fused soldering tin is easy to connect adjacent pins to cause short circuit, which may cause equipment failure or burning of components.

The invention provides a coal mine hydraulic support submerged arc welding wire considering high strength and toughness of a welding seam and a preparation method. The submerged arc welding wire comprises the following chemical components in percentage by mass: 0.09-0.15% of C, 0.05-0.10% of Si, 1.81-2.30% of Mn, less than or equal to 0.010% of P, less than or equal to 0.005% of S, 0.20-0.45% of Cr, 2.30-2.49% of Ni, 0-0.09% of Cu, 0.51-0.90% of Mo, less than or equal to 0.020% of Ti, less than or equal to 0.015% of Ca, less than or equal to 0.025% of V, less than or equal to 0.015% of Zr, less than or equal to 0.004% of O, less than or equal to 0.006% of N and the balance of Fe and other inevitable impurities The invention has the following beneficial effects: (1) through reasonable design of chemical components, under the heat input process condition of 20-40 kJ / cm, the yield strength of weld metal is greater than or equal to 700 Mpa, the tensile strength is 810-910 MPa, the ductility is greater than or equal to 22%, and the low-temperature impact toughness at-40 DEG C is greater than or equal to 100 J; and (2) the preparation process of the welding wire is simple, annealing treatment is not needed, the welding wire is matched with sintered flux commonly used in engineering, electric arcs are stable in the welding process, weld metal obtained after welding has excellent obdurability, the welding requirement of the Q690M hydraulic support steel is met, and large-scale development and application of the high-strength hydraulic support steel can be promoted.

The invention relates to the technical field of automobile sheet metal part welding, and discloses an automobile C column inner plate assembly multi-station welding forming device which comprises a welding spot grouping and path optimizing module used for grouping input welding spot data information and calculating and outputting optimal welding path coordinate data; the PLC system is used for receiving the optimal welding path coordinate data, calculating the optimal welding path coordinate data, temporarily storing the optimal welding path coordinate data into the PLC system, and outputting a welding instruction through the Profibus-DP communication bus when the PLC system is called; and the welding module is used for responding to the welding instruction and executing a welding action. According to the welding spot grouping and path optimization module developed on the basis of a Matlab platform, the problem that residual stress distribution is uneven in the welding process is solved, the problem that a thermal field is unbalanced is also solved, the welding efficiency is improved, and the welding quality is improved. And the piezoelectric ceramic sensors arranged in the clamping areas of the feeding clamp trigger the PLC system to dynamically adjust the clamping pressure of the corresponding clamping areas of the feeding clamp so as to compensate thermal deformation displacement and restrain deformation.

A circulating vapor phase soldering device, which comprises: a liquid storage tank (10), the liquid storage tank (10) being used for storing a vapor phase liquid; a preheating apparatus (20), the preheating apparatus (20) being connected to the liquid storage tank (10) and heating the vapor phase liquid to a first temperature; a heating cavity (30), the heating cavity (30) being connected to the preheating apparatus (20) and being used for heating the vapor phase liquid until same evaporates, so as to heat a workpiece; a recovery apparatus (40), the recovery apparatus (40) being connected to the heating cavity (30) and the liquid storage tank (10), and being used for recovering the vapor phase liquid from the heating cavity (30) into the liquid storage tank (10); and a piping system (50), the piping system (50) being used for driving the vapor phase liquid to sequentially enter, from the liquid storage tank (10), the preheating apparatus (20), the heating cavity (30) and the recovery apparatus (40), and for driving the vapor phase liquid to enter the liquid storage tank (10) from the recovery apparatus (40). The liquid storage tank (10), the preheating apparatus (20), the heating cavity (30) and the recovery apparatus (40) are connected into a loop by means of the piping system, such that after soldering is completed, the vapor phase liquid can flow back into the liquid storage tank (10) for storage, thereby realizing full cyclic utilization of the vapor phase liquid during a soldering process, improving the utilization efficiency of the vapor phase liquid, reducing resource consumption, and lowering production and processing costs.

The invention provides a reverse printing ink system based on a positive photosensitive mechanism and application thereof. The printing ink system comprises three types of products, namely black matte printing ink, high-reflectivity white printing ink and green printing ink, the production process of the ink system comprises the following steps: 1) synthesizing the film-forming resin; (2) sharing the film-forming resin with a pigment system, a dispersion medium and a functional additive; and 3) applying the reverse ink system to PCB manufacturing. According to the method, the characteristic of'dissolution in an exposure area 'is realized through positive light sensing, and the problems of scanning splicing printing, color difference and insufficient reflectivity in a traditional solder mask process are solved by matching with a special developing solution and a DI exposure light spot shaping technology; compared with the prior art, the reverse printing ink system has the advantages that the yellowing index, the resolution ratio, the heat resistance and the like are remarkably improved, and the reverse printing ink system is suitable for manufacturing a high-end mini LED / micro LED PCB (Printed Circuit Board).

The utility model relates to the technical field of welding furnaces, in particular to a vacuum welding furnace for chip welding. The vacuum welding furnace comprises an upper cavity, a lower cavity, a hollow structure jig, a plurality of upper heating pipes and a plurality of lower heating pipes, the upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating pipe is arranged in the upper cavity, the lower heating pipe is arranged in the lower cavity, and the hollow structure jig is arranged in the vacuum cavity. And the condition of local overheating or non-uniform temperature in the welding process of the vacuum welding furnace is avoided.

The invention discloses spraying equipment for a cylindrical battery cell collector plate, and belongs to the technical field of spraying equipment. The spraying equipment for the cylindrical battery cell collector plate comprises a workbench and further comprises a containing groove and a collector plate body, and the collector plate body is arranged on the containing groove; the welding area is arranged on the collector plate body; the square plate is arranged above the workbench, and a printing ink spraying nozzle is arranged at the bottom of the square plate; the guide ring is used for guiding the ink spraying nozzle to spray the welding area; the pressing rod is used for fixing the collector plate body; the blowing head is used for cleaning the collector plate body; the spraying device is good in spraying effect and high in spraying efficiency, the laser absorption rate of materials in the welding process can be increased, and the risk of cold solder joint of the collector plate is avoided.