698 results about "Soldering process" patented technology

The invention provides a welding method and device, electronic equipment and a storage medium, and belongs to the technical field of intelligent manufacturing. A target wire feeding speed corresponding to the actual average current value is determined according to the target compensation relation; the actual wire feeding speed is adjusted to the target wire feeding speed; the target compensation relation is determined from the compensation relation set based on the target average current value, and the target compensation relation comprises the corresponding relation between the actual average current value and the target wire feeding speed. Through the pre-established compensation relation, the wire feeding speed can be actively adjusted in the welding process according to the deviation of the monitored actual average current value so as to compensate the deviation in real time, and therefore it is guaranteed that the heat input amount in the whole welding process is constant, and the welding quality is improved. The technical problems of welding current fluctuation and inconsistent welding seam forming caused by dry elongation change due to factors such as out-of-roundness of workpieces are solved, and the quality and reliability of welding seams are remarkably improved.

The invention provides a steel pipe welding seam regulation and control method and system, electronic equipment and a storage medium, relates to the technical field of steel pipe welding, and continuously obtains multi-modal data, including visual image data, laser contour data, arc sensing data and infrared thermal image data, of the welding surface of a steel pipe in the welding process. And carrying out space-time alignment on the data to obtain a standardized fusion data set. And inputting the fusion data set into a double-branch deep learning model, extracting visual image edge features, laser contour geometric features and infrared thermal image temperature distribution features through CNN branches, and extracting arc time sequence fluctuation features through LSTM branches. And carrying out weighted fusion calculation on the characteristics to obtain the real-time coordinates of the groove center of the welding surface of the steel pipe and the temperature state parameter of the welding seam. And according to the real-time coordinates of the groove center and a preset reference, a welding seam temperature state parameter is combined, and a welding seam control strategy of the steel pipe welding surface is generated. According to the invention, high-precision welding seam regulation and control are realized, and the welding efficiency is improved.

A method of producing a semiconductor device includes providing a semiconductor die, providing a metal joining partner, forming a diffusion solderable region by an inkjet metal printing process, forming an assembly to include the diffusion solderable region in between the metal joining partner and the semiconductor die, and performing a diffusion soldering process that forms a soldered joint from the diffusion solderable region in between the semiconductor die and the metal joining partner.

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor chip and the electrically conductive pad. The device further includes a pair of complementary positioning formations formed by a cavity in the electrically conductive clip and a protrusion (such as a stud bump or a stack of stud bumps) formed in the electrically conductive pad. The complementary positioning formations are mutually engaged to retain the electrically conductive clip in the bridge-like position to avoid displacement during soldering.

The invention relates to the field of photovoltaic module production, in particular to a bus bar welding method and welding equipment. According to the bus bar welding method, the bus bar is welded to the back contact battery pack, the back contact battery string group is placed on the glass plate, the bus bar is in lap joint with the welding strip exposed in the insulation area, welding is carried out, the back contact battery string group is located on the glass plate in the welding process, and the back contact battery string group does not need to be lifted in the welding process; relative friction between the welded battery piece and the glass plate is avoided, the welding quality is guaranteed, and the welding process is more simplified. The bus bar welding equipment provided by the invention is used for realizing the bus bar welding method, comprises a transmission positioning device, a bar manufacturing device and a welding device, and is simple in structure.

The invention discloses a packaging structure with a heat dissipation structure and a packaging method, through the connection cooperation of a first metal carrier plate, a second metal carrier plate, a first heat conduction insulating film, a second heat conduction insulating film, a first rewiring layer and a second rewiring layer, and the subsequent circulation of a cooling liquid in a cooling pipeline, the heat resistance is greatly reduced, the heat dissipation is enhanced, and the heat dissipation efficiency is improved. Power consumption is reduced; according to the invention, the first metal carrier plate and the second metal carrier plate are directly bonded, the first metal carrier plate and the second metal carrier plate are provided with grooves and holes, and finally, the first metal carrier plate and the second metal carrier plate are matched with the first heat-conducting insulating film and the second heat-conducting insulating film to form the cooling pipeline, so that the stress problem caused by the welding process of a water-cooling plate in the traditional technology is improved, and a packaging body is prevented from being damaged; wiring can be conducted on the two faces of the base material, and multi-dimensional packaging is achieved; according to the invention, the metal substrate is used as the substrate, panel warping is reduced, and the stress problem caused by multi-dimensional packaging is solved.

The invention relates to the technical field of semiconductor packaging, and discloses a bonding wire welding method based on bare chip interconnection, and the method comprises the steps: collecting and fusing acoustic response and optical reflection signals of a bonding interface in real time through a multi-mode in-situ sensing mechanism integrating acoustic resonance and surface plasmon resonance; dynamically calculating the thickness, the mechanical coupling deformation and the energy dissipation state of the intermetallic compound layer; and the ultrasonic power and the bonding force are subjected to closed-loop adjustment in combination with a model prediction control algorithm, so that the welding process is evolved along a preset optimal physical path all the time. The system comprises a multi-mode sensing welding head, a synchronous data acquisition module, a state resolving module and a self-adaptive control module. The transparent and intelligent welding process is realized, and the bonding consistency, reliability and yield of high-density interconnection are remarkably improved.

The invention relates to the technical field of infrared temperature measurement, provides a soldering tin temperature closed-loop control method and system based on infrared temperature measurement feedback, and solves the problems that a temperature measurement result of a phase change critical region seriously deviates from a true value, and temperature measurement is not accurate due to the fact that material state changes are not considered. According to the method, the environment temperature of a welding area and the initial temperature measurement value of soldering tin in the welding process are detected, and soldering tin phase change emissivity data are obtained; the real-time state of soldering tin is determined, and the soldering tin temperature after calibration is obtained by combining the soldering tin phase change emissivity data and the environment temperature; comparing the calibrated soldering tin temperature with the phase change temperature interval to obtain a temperature comparison result, and combining the temperature comparison result with the calibrated soldering tin temperature to obtain an adjusted heating power parameter; and the soldering tin heating device is controlled to heat soldering tin according to the adjusted heating power parameters until the calibrated soldering tin temperature within the preset target temperature range is obtained, high-precision real-time calibration and dynamic closed-loop regulation and control over the soldering tin temperature are achieved, and it is ensured that the welding process is stably within the target temperature range.

The IBC solar cell piece comprises a silicon wafer, a plurality of doping layers and a plurality of fine grid lines, the doping layers and the fine grid lines are located on the backlight face of the silicon wafer, the doping layers comprise the first doping layer and the second doping layer, and the doping types of the first doping layer and the second doping layer are opposite. The first doped layers and the second doped layers are parallel and are distributed at intervals in a staggered mode in the width direction, the multiple first doped layers in the length direction are distributed at intervals, the multiple second doped layers in the length direction are distributed at intervals, and the fine grid lines comprise first fine grid lines located on the first doped layers and second fine grid lines located on the second doped layers. The intervals of the first doping layers and the intervals of the second doping layers are distributed in a staggered mode in the length direction. According to the main-grid-free IBC solar cell piece, the back face structure is designed, the electron collection efficiency can be improved through the discontinuous doping layer and the thin grid lines distributed at intervals, the power loss of an assembly is reduced, and meanwhile the short circuit problem caused in the welding process can be avoided.

The invention discloses an automatic tin soldering machine for electronic component production, and belongs to the technical field of tin soldering machines, the automatic tin soldering machine comprises a cabinet, an adjusting mechanism is arranged in the cabinet, a tin soldering head is mounted on the adjusting mechanism, a fixing mechanism is arranged on one side of the adjusting mechanism, and the fixing mechanism comprises a group of upper clamping plate and lower clamping plate which are symmetrically arranged; component bodies to be welded are fixed in the upper clamping plate and the lower clamping plate. Through cooperation of an electric sliding block and a second electric push rod, a tin soldering head can be accurately moved to the position, needing to be welded, of an electronic component body, automatic welding is achieved, the upper portion and the lower portion of the component body are clamped through an upper clamping plate and a lower clamping plate correspondingly, and compared with traditional single-clamping-plate clamping, the clamping efficiency is greatly improved. According to the arrangement, the stability of the component body with the non-planar side face in the welding process can be remarkably improved, and then the welding quality is improved.

The utility model relates to an anti-tin-climbing PIN bonding pad power module substrate, which comprises a substrate body and a Pin assembly, the Pin assembly is welded on the substrate body, each Pin comprises a pin seat and a pin body, the pin seat is provided with a through hole, the pin body is matched with the through hole and is inserted in the through hole, the pin seat comprises a column body, a solder resisting ring is formed on the circumferential surface of the upper end of the column body, and the solder resisting ring is connected with the pin body. The solder mask ring is arranged at the upper end of the needle seat, so that tin liquid can be blocked by the solder mask ring when moving from the bottom of the needle seat to the needle body in the tin soldering process, tin is prevented from climbing onto the needle body, the needle body is prevented from being free of tin, and a power module and a PCB (printed circuit board) can be assembled smoothly at a client.

The invention relates to the technical field of lens module AA assembly design, in particular to a lens AA assembly test device based on laser soldering and a use method thereof.The lens AA assembly test device based on laser soldering is characterized in that a square tube frame is fixed to a bottom plate through four stand columns, and three-axis soldering head assemblies are arranged at the four corners of the inner side of the square tube frame; the testing assembly comprises a six-dimensional force sensor, a square seat used for installing a lens is fixed to the top of the six-dimensional force sensor, a plurality of pins are arranged on the top of the square seat, a circuit board is connected to the pins in an inserted mode, and the circuit board is fixed to the testing table through a clamping mechanism and keeps electrically connected with the electric connector female head in the welding process. Through a cooperative measurement mechanism integrating the six-dimensional force sensor and the three-axis micrometer, the three-dimensional stress and deformation quantity of the circuit board in the laser soldering process can be accurately obtained in real time, and the problem that traditional AA soldering equipment design depends on experience debugging is solved; and reliable data support is provided for clamping force and positioning compensation design of mass production equipment.

The utility model discloses a welding device with an upper fixture, which relates to the field of circuit board welding and comprises a workbench, a welding platform is arranged on the upper surface of the workbench, a connecting platform is arranged below the welding platform, and a transverse moving module used for driving the welding platform to move left and right is arranged on the upper surface of the connecting platform. The welding platform can be driven to move front and back through a threaded rod, the welding platform can be driven to move left and right through a transmission belt, a connecting arm can be driven to reciprocate along a specific track through rotation of a third servo motor and cooperation of an inverted-U-shaped sliding groove (the wire can be grabbed in a reciprocating mode in a PPU mechanical arm mode), and a welding head is driven to move downwards. Meanwhile, the heating wire supply welding table is controlled to supply a proper amount of solder wires, the solder wires extend out of the end of the wire outlet pipe and move downwards, the lower end of the welding head makes contact with the welding position of the solder wires and the wires, the solder wires are melted through heat of the welding head to fix the wires and the circuit board, the whole welding process is high in automation degree, and work efficiency is improved.

The invention discloses a packaging and welding device suitable for semiconductor materials, and relates to the technical field of semiconductor material packaging and welding, the packaging and welding device comprises a supporting plate frame and a spindle box, the spindle box is fixed to the top of the supporting plate frame through bolts, and a transmission frame is fixedly connected to the top of the supporting plate frame; the independent driving assembly controls two circuits to alternately coincide a welding plate and a metal wire in different moving modes, high-speed hot-pressing welding can be completed in cooperation with the welding clamping mechanism installed at the air cylinder end, meanwhile, the movable locking column is matched to abut against and rotate in the fixing barrel, and the welding clamping mechanism is matched with the movable locking column. According to the clamping and discharging device, the rubber blocks on the clamping plates are meshed with welded plates in the pressing process, clamping and discharging operation after welding is finally achieved through cooperation of lifting of the air cylinders and interception of the bearing plates, the automation degree is high, locking and discharging are achieved by means of the plates completed in the welding process, and operation is easy.

The invention relates to the technical field of connector pin welding, and discloses multi-specification connector welding equipment capable of adjusting a pin positioning clamp, the multi-specification connector welding equipment comprises a supporting table, a lifting table is slidably connected to the upper end of the supporting table, and clamping seats are symmetrically slidably connected to the lifting table; the lower end of the lifting table is connected with a linkage part for driving the two clamping seats to approach synchronously, the two clamping seats are connected with an isolation part for preventing soldering tin from overflowing, and the isolation part comprises a moving plate. The multi-specification connector welding equipment capable of adjusting the pin positioning clamp can effectively solve the problems that in the prior art, in the welding process, if pressing force is too large, a bonding pad on a circuit board is likely to deform, tilt and even be separated from a substrate, and due to the fact that soldering paste is too large, a temperature curve is unreasonable, a Pin coating is poor or the bonding pad is improperly designed, the bonding pad is prone to deformation, upwarp and even be separated from the substrate. And fused soldering tin is easy to connect adjacent pins to cause short circuit, which may cause equipment failure or burning of components.

A circulating vapor phase soldering device, which comprises: a liquid storage tank (10), the liquid storage tank (10) being used for storing a vapor phase liquid; a preheating apparatus (20), the preheating apparatus (20) being connected to the liquid storage tank (10) and heating the vapor phase liquid to a first temperature; a heating cavity (30), the heating cavity (30) being connected to the preheating apparatus (20) and being used for heating the vapor phase liquid until same evaporates, so as to heat a workpiece; a recovery apparatus (40), the recovery apparatus (40) being connected to the heating cavity (30) and the liquid storage tank (10), and being used for recovering the vapor phase liquid from the heating cavity (30) into the liquid storage tank (10); and a piping system (50), the piping system (50) being used for driving the vapor phase liquid to sequentially enter, from the liquid storage tank (10), the preheating apparatus (20), the heating cavity (30) and the recovery apparatus (40), and for driving the vapor phase liquid to enter the liquid storage tank (10) from the recovery apparatus (40). The liquid storage tank (10), the preheating apparatus (20), the heating cavity (30) and the recovery apparatus (40) are connected into a loop by means of the piping system, such that after soldering is completed, the vapor phase liquid can flow back into the liquid storage tank (10) for storage, thereby realizing full cyclic utilization of the vapor phase liquid during a soldering process, improving the utilization efficiency of the vapor phase liquid, reducing resource consumption, and lowering production and processing costs.

The invention provides a reverse printing ink system based on a positive photosensitive mechanism and application thereof. The printing ink system comprises three types of products, namely black matte printing ink, high-reflectivity white printing ink and green printing ink, the production process of the ink system comprises the following steps: 1) synthesizing the film-forming resin; (2) sharing the film-forming resin with a pigment system, a dispersion medium and a functional additive; and 3) applying the reverse ink system to PCB manufacturing. According to the method, the characteristic of'dissolution in an exposure area 'is realized through positive light sensing, and the problems of scanning splicing printing, color difference and insufficient reflectivity in a traditional solder mask process are solved by matching with a special developing solution and a DI exposure light spot shaping technology; compared with the prior art, the reverse printing ink system has the advantages that the yellowing index, the resolution ratio, the heat resistance and the like are remarkably improved, and the reverse printing ink system is suitable for manufacturing a high-end mini LED / micro LED PCB (Printed Circuit Board).

The utility model relates to the technical field of welding furnaces, in particular to a vacuum welding furnace for chip welding. The vacuum welding furnace comprises an upper cavity, a lower cavity, a hollow structure jig, a plurality of upper heating pipes and a plurality of lower heating pipes, the upper cavity is arranged above the lower cavity, the upper cavity and the lower cavity form a sealed vacuum cavity, the upper heating pipe is arranged in the upper cavity, the lower heating pipe is arranged in the lower cavity, and the hollow structure jig is arranged in the vacuum cavity. And the condition of local overheating or non-uniform temperature in the welding process of the vacuum welding furnace is avoided.

The present invention relates to a fluid-permeable cooler (100) for cooling a power module (208) that comprises a power substrate. The fluid-permeable cooler (101) comprises a first metal part (101), a second metal part (102) and a cooling structure (1). The first metal part (101) and the second metal part (102) are interconnected by means of a soldering process and define a cooling channel (111) which is permeable by a fluid and in which the cooling structure (1) is located.The first metal part (101) comprises a receiving region (109) to which the power module (208) can be attached. The first metal part (101) is made from a metal material which has an expansion coefficient that is greater than the expansion coefficient of the power substrate (208). The invention also relates to a power electronics assembly (1000) having a cooler (100) of this kind and a power module (200).

The invention discloses a SnSb8 soldering lug welding process which is characterized in that a preformed hexagonal soldering lug is adopted as a soldering lug, the preformed soldering lug and a welded substrate are directly welded in a local vacuum reflow soldering mode, and the welding process mainly comprises the steps of vacuumizing, nitrogen filling, vacuumizing, formic acid filling, air blowing, first heating, second heating, cooling, vacuumizing and nitrogen filling. A multi-stage gas environment control process is innovatively introduced, a low-oxygen environment is constructed through a double-vacuumizing-double-inflating process (nitrogen and formic acid), and formic acid gas is decomposed at high temperature to generate reducing substances to replace traditional scaling powder; the composite process of gradient temperature control and gas purging is developed, formic acid purging is implemented in a specific temperature window, the oxide removal and solder wetting processes are synchronously completed, scaling powder does not need to be additionally added during welding, the technological process is simplified, and cavities are reduced.

The utility model provides a heating cavity for off-line gas phase welding. The heating cavity for off-line gas phase welding comprises a placing frame, a cavity body, a cavity cover and a lifting mechanism, the top of the cavity is open, the bottom of the cavity cover is open and corresponds to the cavity, and the placing frame is connected to the bottom of the cavity cover in a sliding mode; and the lifting mechanism is used for driving the cavity cover to execute a lifting action so as to be far away from or close to the cavity. The placing frame moving along with the cavity cover is used for containing workpieces, operation is easy and convenient, the workpieces can be rapidly taken and placed when the cavity cover is lifted, and the workpiece feeding and discharging efficiency is improved; when the workpieces are manually taken and placed, the workpieces do not need to stretch into the cavity, the operation risk is reduced, and the feeding and discharging operation safety is guaranteed; and meanwhile, the workpiece is located in the upper space in the heating cavity through the arrangement of the containing frame, the workpiece is prevented from making direct contact with high-temperature gas-phase liquid at the bottom of the cavity or liquefied gas-phase liquid obtained after heat absorption and condensation, the phenomenon that the workpiece is heated unevenly in the welding process is effectively prevented, and the welding quality of the workpiece is guaranteed.

The invention discloses a liquid cooling heat dissipation assembly brazing filler metal filling analysis method based on multi-physics field coupling simulation, and the method comprises the steps: obtaining a three-dimensional CAD model of a liquid cooling heat dissipation assembly, and simplifying the three-dimensional CAD model; establishing a physical field coupling simulation model, setting simulation initial conditions and boundary conditions for simulating brazing filler metal flow, and setting simulated brazing process parameters; running the simulation model in Fluent software to obtain a flow path parameter, a filling speed parameter, a brazing filler metal temperature cloud picture and a second-phase brazing filler metal volume fraction cloud picture of the brazing filler metal in the simplified model, judging whether a simulation result is incomplete filling or blockage or not, performing verification through actual operation, and confirming the consistency of the simulation result and actual verification; and optimizing the process parameters, and outputting a simulation result as the completely filled process parameters. According to the method, the simulation model is established, brazing filler metal filling analysis can be achieved, verification of actual experiments is conducted, the accuracy of the model is guaranteed, then technological parameters are optimized, and brazing filling is complete.

The invention discloses a towel rack welding flux quantitative automatic supply method and system based on AI visual identification, and relates to the technical field of intelligent welding, and the method comprises the steps: based on image data of a to-be-welded point of a towel rack, positioning the position of a welding point, extracting surface features, and generating a welding point feature vector set; according to the welding point feature vector set, the basic theoretical demand quantity of the welding flux and the welding flux dosage correction value are determined, and a quantitative supply instruction set is established by calculating the predicted welding flux dosage; based on the quantitative supply instruction set, the opening time and the rotating speed of a screw valve are controlled; and a welding result image is collected through the industrial camera, and the material characteristic correction coefficient is adjusted according to the welding result image so as to optimize the predicted amount of the welding flux in the next welding process. The welding flux consumption can be automatically adjusted according to the actual requirements of different welding positions, and the problem that according to traditional welding equipment, welding flux in some areas is too much, and other areas are insufficient is effectively solved.

The invention relates to the photovoltaic field, and discloses a back contact photovoltaic module and a manufacturing method thereof, and the method comprises the steps: arranging back contact solar cells on a first substrate on which a first adhesive film layer is laid; placing a low-temperature welding strip and a carrier film on the back contact solar cell, and fixing the low-temperature welding strip on the back contact solar cell by using the carrier film; the carrier film fixes the low-temperature welding strip from the upper side of the low-temperature welding strip; laying a second adhesive film layer and a second substrate on the back contact solar cell to form an assembly to be laminated; and laminating the to-be-laminated assembly so that the low-temperature solder strip is electrically connected with the adjacent back contact solar cells. The back contact solar cells are firstly arranged on the first adhesive film layer, then the low-temperature welding strips are placed on the back contact solar cells, low-temperature interconnection is completed during lamination, a series welding process is not needed, welding thermal stress and cell warping generated during high-temperature welding are reduced, and therefore the yield and efficiency are improved. The carrier film can fix the low-temperature welding strip, and deviation of the low-temperature welding strip is avoided.

The invention relates to the field of blind slot laminated modules, in particular to a blind slot laminated module based on a multistage vertical interconnection device and a process method. A mother board module; the copper pin part is vertically connected with the copper pin part; the fixed supporting part is provided with a first tooth groove and a through hole; the adjusting support part is provided with a second tooth groove and a first threaded hole, the second tooth groove and the first tooth groove are embedded in a staggered mode, the copper pin part is clamped and fixed in an embedding gap of the second tooth groove and the first tooth groove, and the first threaded hole is aligned to the through hole and is perpendicular to the extending plane of the stepped teeth of the second tooth groove; and the clamping force of the second tooth groove on the copper pin part is controlled by the second screw arranged in a penetrating manner. The problem that high-reliability welding quality is affected due to the fact that the ultrahigh-density copper pins of the laminated module are skewed due to uneven temperature loads and inconsistent thermal deformation degrees of materials in the multiple welding processes of the vertical interconnection technology is solved, and the requirements of remote sensing satellites are met.

This utility model discloses an aviation connector female, including a shell, terminals, PCB clips, sealing rings, shell sleeve clips, and nuts. This utility model eliminates the injection molding sealing and fixing process after the metal terminals are inserted into the shell slots in the traditional technology, simplifying the production process. At the same time, the method of directly soldering the terminals to the PCB eliminates the cost of wire harnesses and soldering processes, reducing production costs and improving signal transmission stability. The PCB clips on both sides of the connector can stably fix the PCB board, the nut has a built-in sealing ring and the design of multiple sealing rings enhances the waterproof and dustproof performance, and the shell sleeve clip design makes it easy to open the shell sleeve at any time, which is convenient for later maintenance and repair. The overall structural design effectively solves the problems of complex production process, high cost, inconvenient maintenance and insufficient sealing performance in the prior art.

The application discloses a processing device and a processing method of an intelligent card, and belongs to the technical field of intelligent card welding devices. The processing device of the intelligent card comprises two chains arranged oppositely and a plurality of object carrying plates installed between the two chains. A groove for placing an intelligent card body is formed on the outer side of the object carrying plate. The outer side of the chain is provided with a side plate, and a supporting plate is fixedly arranged between the two side plates. In actual use, the positioning plate is clamped on the top of the object carrying plate, so that the chip adsorbed by the suction plate can be placed on one side of the lead wire. The chip and the lead wire can be more accurately attached by using the structure, thereby facilitating the welding of the two, and after the welding is completed, the suction plate can be flattened during the process that the object carrying plate leaves the welding station, so that the chip is turned over into the card slot. The whole welding process is more continuous by using the structure.

The invention discloses a chip mounting device for circuit board processing, and relates to the technical field of circuit board processing, and the chip mounting device comprises a conveying device, the bottom of the conveying device is fixedly provided with supporting legs, the front part of the conveying device is provided with a motor, the top of the conveying device is fixedly provided with a fixing frame, and the bottom of the fixing frame is provided with a lifting device. The bottom of the lifting device is provided with a chip mounting device, the top of the conveying device is provided with a clamping device, a protection device and a pushing device, clamping plates move to make contact with and clamp a circuit board, the circuit board is fixed to a workbench of the chip mounting device, and the circuit board is prevented from moving or deforming in the chip mounting or welding process; according to the invention, components can be accurately mounted at specified positions, errors are reduced, the circuit board is effectively prevented from warping due to temperature change or mechanical pressure, the circuit board is kept flat, and the mounting problem caused by warping is avoided.

This application discloses a contact-type chip soldering process, relating to the field of chip soldering technology. The process includes the following steps: printing solder paste dots at the contacts within the soldering area of ​​a circuit board; heating the solder paste dots to melt them; cooling the molten solder paste dots on the circuit board to form solder dots at the contacts; printing a solder paste layer at the contacts within the solder paste layer; attaching a chip to the soldering area of ​​the circuit board, such that the chip's contacts are in contact with the solder paste layer; heating the solder paste layer and solder dots to melt them; cooling the soldering area of ​​the circuit board to solidify the molten solder paste layer and solder dots, forming solder joints, and soldering the chip onto the circuit board. This application effectively reduces air bubbles generated within the solder joints and improves the quality of the solder joints.