2270 results about "Soldering process" patented technology

A packaging substrate (310) includes a semiconductor interposer (120) and at least one other intermediate substrate (110), e.g. a BT substrate. The semiconductor interposer has first contact pads (136C) attachable to dies (124) above the interposer, and second contact pads (340) attachable to circuitry below the interposer. Through vias (330) are made in the semiconductor substrate (140) of the interposer (120). Conductive paths going through the through vias connect the first contact pads (136C) to the second contact pads (340). The dies (124) are attached to the interposer after the attachment of the interposer to the BT substrate. In sequential soldering operations, the solder hierarchy is maintained by dissolving some material (e.g. copper) in the solder during soldering to raise the solder's melting temperature. For example, all of the solders may initially have the same melting temperature, but each solder's melting temperature is increased during soldering to prevent the solder from melting in the subsequent soldering operations.

An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.

An electronic component is mounted on a substrate such as a circuit board by means of a soldering process such as reflow soldering. The circuit board has a thermal via hole therethrough to provide a heat dissipation path from the top surface to the bottom surface of the circuit board, for dissipating heat from the electronic component. To prevent molten solder from penetrating through the via hole during the soldering process, the via hole is sealed prior to the soldering process. The via hole is sealed from the bottom surface of the substrate by carrying out a screen printing process including at least two printing passes to print a sealing material into the open hole of the thermal via.

The present invention relates to an electrical connector with grounding effect, which mainly has grounding part inserted inside the insulating body contacted with the jacket layer enclosed over the signal transmitting units with fixing and contacting effect for generating electrical characteristics, such that the cable assembly of the electrical connector has grounding effect without any grounding line positioned inside cable assembly; wherein, the grounding part has contacting part for providing the jacket layer to contact with, besides it further comprise predetermined grounding terminals extended directly from the grounding part for inserting into the insulating body; such that the cable assembly of the electrical connector of the present invention has grounding effect without any grounding line positioned inside the cable assembly; furthermore, it also can lessen the soldering process and prevent the mistaken probability of the soldering process generated such that the entire assembly process and the relative cost can be reduced.

A welding operation is performed by moving or rotating an arc in a welding torch, and feeding a metal cored wire through the torch in a direct current, electrode negative welding process. The electrode may include one or more arc stabilizers. The welding process may be pulsed or non-pulsed. Moreover, the process may be used with a number of different base metals intended to be welded, such as thin plate, galvanized metals, painted metals, coated metals, and so forth.

The invention discloses an electromagnetic current coupling field assisted hybrid melting-brazing method for a laser-TIG arc and equipment. In addition to the use of the welding zone, an alternating magnetic field is added to control properties of plasma formed through ionization of laser, arc and a raw material metal, thereby improving the laser utilization rate. Under the electric field assisted comprehensive effect, the weld melting depth is increased, and the assistant effect on the melting bath of the liquid-state brazing filler metal for laser-arc melting-brazing is realized through electromagnetic stirring and excitation and enhancement, thereby promoting the orderly flow of the liquid-state brazing filler metal and the rupture, wetting, spreading and proliferation of the liquid-state brazing filler metal on the surface of the high metal material, improving the full mixing of the liquid-state brazing filler metal and the base metal formed by melting the low-melting-point metal material, improving the uniformity of the components of the brazed weld, stabilizing the welding process, reducing welding defects, increasing the welding speed, improving the weld formation, optimizing the structure and performance of the brazed weld, and improving the quality of the brazed joint. Moreover, the equipment has the advantages of simple structure, flexible application, low cost, good effect and easy realization.

The invention discloses a method for the assembly and the reflow soldering of a PCB and an FPC and a special positioning fixture thereof, which mainly solve the problems of inaccurate positioning, low efficiency of welding efficiency, difficulty for ensuring product quality and the like of manual assembly in the processes of assembling and soldering the PCB and the FPC. The method comprises the following steps: firstly, supporting, positioning and fixing the PCB by using a magnetic carrier board; secondly, carrying the FPC; next, preliminarily positioning the PCB and the FPC with a bonding agent; thirdly, printing a solder paster on a solder pad at the junction of the FPC and the PCB; and finally, pressing a magnetic cover board on the magnetic carrier board, fixing the positions of the FPC and the PCB, and performing the reflow soldering on the FPC and the PCB through a reflow oven. The method for the assembly and the reflow soldering of the PCB and the FPC and the special positioning fixture thereof have the advantages of simple operation, good reliability, great improvement on the production efficiency and the production quality of the FPC and the PCB in the processes of assembling and soldering, and processing cost reduction.

An automatic soldering machine adapted for soldering cables with electronic products includes a main frame module, a man-machine control interface, a sliding tray located in front of the man-machine control interface, a loading tool slidably disposed in the sliding tray, a feeding module close to a bottom of the sliding tray, a removing module located between the man-machine control interface and a reforming module, a container, a loading tool combination module located above the sliding tray, a spraying module located in rear of the sliding tray, and a loading tool reflow module mounted on a rear of the main frame module. The man-machine control interface is connected with and controls the loading tool, the feeding module, the removing module, the reforming module, the loading tool combination module, the spraying module and the loading tool reflow module for realizing an automatic soldering process of the electronic products and the cables.

The invention discloses a halogen-free high-impedance water-based washing-free scaling powder as well as a preparation method and application thereof. The scaling powder disclosed by the invention comprises the following components in percentage by weight: 1.50-6.00% of activating agent, 0.10-0.45% of nonionic surfactant, 0.05-2.00% of film forming agent, 0.15-0.40% of corrosion inhibitor, 4.00-25.00% of cosolvent and the balance of deionized water. The scaling powder disclosed by the invention does not contain halogen and uses the deionized water as the main component of a scaling powder solvent, thus the scaling powder is safe and environment-friendly. In the invention, the coordination mode and dosage of each component of the scaling powder are accurately computed; the scaling powder has the advantages of good stability and excellent soldering performance; and the obtained soldered dots are full, thereby effectively reducing the occurrence of defects such as continuous soldering or missing soldering and the like. The composition materials of the scaling powder disclosed by the invention can be periodically volatilized in the soldering process; the residuals after the soldering are less; the electric insulating property is excellent; the surface insulating resistance after the soldering is larger than 1.0*108; and the washing is not needed.

The invention belongs to a micro-electronic encapsulation technology and specifically relates to a vacuum eutectic welding method. The method comprises the following steps: reducing gas formic acid vapor or hydrogen is introduced during a vacuum eutectic welding process, so as to reduce an oxidized welding material on a surface layer of a preformed welding material sheet and reduce the oxidized dreg of a welded surface; during a heating process, nitrogen is introduced and the heating rate is increased, so as to shorten the eutectic time and avoid the efficacy loss caused by chip over-welding or high-temperature accelerated ageing; and vacuumizing is carried out during an eutectic process, so as to reduce and even avoid voidage of the welded surface, increase the penetration rate of the chip and reduce the contact resistance and thermal resistance. According to the invention, the problem of the oxidized dreg on the welded surface caused by the oxidation of the surface layer of the welding material sheet in the prior art is overcome; the demand on storage conditions of the welding material sheet is reduced; the eutectic time is shortened; the efficacy loss caused by chip over-welding or high-temperature accelerated ageing is avoided; the void ratio is reduced; and the vacuum eutectic welding method has the characteristics of high reliability, high yield and low cost.

A fused loop of an elongated material, such as a surgical suture, and apparatus for making the loop. Portions of one or more segments to be joined together are fused in a welding process to form a welded joint. The shear area of the fused portion of the joint determines the strength of the joint and is thus preferably relatively large. Various configurations for the welding apparatus facilitate the creation of relatively large fused portions of the joint by maximizing contact between at least one of the welding members of the apparatus and at least one of the segments to be joined.

The invention discloses a friction welding method of a titanium-aluminum alloy turbine and a 42CrMo quenched and tempered steel shaft, which aims to solve the technical problem that when the titanium-aluminum alloy turbine rotor and the quenched and tempered steel shaft are connected by the current method, the tensile strength of a joint is low. The invention has the technical scheme that an embedded groove in a shape of a solid of revolution is processed at one side of the titanium-aluminum alloy turbine; in the welding process, the welding end surface of the turbine shaft has friction with the welding surface of the embedded groove of the titanium-aluminum alloy turbine; and by controlling the friction shortening amount, the casting fins formed at the turbine shaft side are fully filled into the embedded groove. Thus dual effects of metallurgical bonding and mechanical connection of the welding surface are achieved, and the tensile strength of the joint of connecting pieces at room temperature is increased from 390MPa in the background art to 480-537MPa.

The invention relates to a novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste, belonging to the field of unleaded solder soldering flux. The invention aims at providing a soldering flux suitable for the low-silver SnAgCu unleaded soldering paste. The soldering flux comprises the following components: 5.0-13.0% of activator, 32.0-41.0% of solvent, 0.8-5.0% of corrosion inhibitors, 1.0-6.0% of thixotropic agent, 2.0 -9.0% of paste forming agent, 0.3-2.5% of stabilizer, 0.5-5.0% of surfactant and 35.0-48.0% of modified rosin. The activator is the compound of a plurality of organic acids, has wide boiling point distribution space, can achieve good activation effect in the whole soldering process, can be mostly volatilized, sublimated or decomposed at the brazing temperature and ensures no corrosion after the soldering. The soldering flux has the advantages of no halogen content, good soldering aiding property, few and hard-film-shaped residuals after the soldering, high insulation resistance, and the like.

The present invention provides an assistant coating TIG fusing-brazing method suitable for aluminum/steel dissimilar alloy butting. In the assistant coating TIG fusing-brazing method, a TIG electric arc is used as a heat source, and an assistant coating and joint groove design and a welding technology are used. In a welding process, electric arc heat firstly enables an assistant coating to fuse to form a liquid film at a steel groove surface; the TIG electric arc is covered on welding wires to directly heat the welding wires and a fused bath, while not to directly heat steel plates, so a fused phenomenon is avoided to be generated on steel surfaces; the welding wires are fused rapidly to moisten and spread rapidly on the steel groove surface under the function of the assistant coating; the welding wires are fed continuously to be fused to fill welding seams gradually; and meanwhile the electric arc walks rapidly, and brazing alloy spreading is stopped when the heat source is moved away. The welding process is stable, and butting joints of aluminum/steel dissimilar alloy TIG fusing-brazing with good formation are obtained.