432 results about "Soldering process" patented technology

The invention provides a steel pipe welding seam regulation and control method and system, electronic equipment and a storage medium, relates to the technical field of steel pipe welding, and continuously obtains multi-modal data, including visual image data, laser contour data, arc sensing data and infrared thermal image data, of the welding surface of a steel pipe in the welding process. And carrying out space-time alignment on the data to obtain a standardized fusion data set. And inputting the fusion data set into a double-branch deep learning model, extracting visual image edge features, laser contour geometric features and infrared thermal image temperature distribution features through CNN branches, and extracting arc time sequence fluctuation features through LSTM branches. And carrying out weighted fusion calculation on the characteristics to obtain the real-time coordinates of the groove center of the welding surface of the steel pipe and the temperature state parameter of the welding seam. And according to the real-time coordinates of the groove center and a preset reference, a welding seam temperature state parameter is combined, and a welding seam control strategy of the steel pipe welding surface is generated. According to the invention, high-precision welding seam regulation and control are realized, and the welding efficiency is improved.

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor chip and the electrically conductive pad. The device further includes a pair of complementary positioning formations formed by a cavity in the electrically conductive clip and a protrusion (such as a stud bump or a stack of stud bumps) formed in the electrically conductive pad. The complementary positioning formations are mutually engaged to retain the electrically conductive clip in the bridge-like position to avoid displacement during soldering.

The invention relates to the field of photovoltaic module production, in particular to a bus bar welding method and welding equipment. According to the bus bar welding method, the bus bar is welded to the back contact battery pack, the back contact battery string group is placed on the glass plate, the bus bar is in lap joint with the welding strip exposed in the insulation area, welding is carried out, the back contact battery string group is located on the glass plate in the welding process, and the back contact battery string group does not need to be lifted in the welding process; relative friction between the welded battery piece and the glass plate is avoided, the welding quality is guaranteed, and the welding process is more simplified. The bus bar welding equipment provided by the invention is used for realizing the bus bar welding method, comprises a transmission positioning device, a bar manufacturing device and a welding device, and is simple in structure.

The invention relates to the technical field of semiconductor packaging, and discloses a bonding wire welding method based on bare chip interconnection, and the method comprises the steps: collecting and fusing acoustic response and optical reflection signals of a bonding interface in real time through a multi-mode in-situ sensing mechanism integrating acoustic resonance and surface plasmon resonance; dynamically calculating the thickness, the mechanical coupling deformation and the energy dissipation state of the intermetallic compound layer; and the ultrasonic power and the bonding force are subjected to closed-loop adjustment in combination with a model prediction control algorithm, so that the welding process is evolved along a preset optimal physical path all the time. The system comprises a multi-mode sensing welding head, a synchronous data acquisition module, a state resolving module and a self-adaptive control module. The transparent and intelligent welding process is realized, and the bonding consistency, reliability and yield of high-density interconnection are remarkably improved.

The invention relates to the technical field of infrared temperature measurement, provides a soldering tin temperature closed-loop control method and system based on infrared temperature measurement feedback, and solves the problems that a temperature measurement result of a phase change critical region seriously deviates from a true value, and temperature measurement is not accurate due to the fact that material state changes are not considered. According to the method, the environment temperature of a welding area and the initial temperature measurement value of soldering tin in the welding process are detected, and soldering tin phase change emissivity data are obtained; the real-time state of soldering tin is determined, and the soldering tin temperature after calibration is obtained by combining the soldering tin phase change emissivity data and the environment temperature; comparing the calibrated soldering tin temperature with the phase change temperature interval to obtain a temperature comparison result, and combining the temperature comparison result with the calibrated soldering tin temperature to obtain an adjusted heating power parameter; and the soldering tin heating device is controlled to heat soldering tin according to the adjusted heating power parameters until the calibrated soldering tin temperature within the preset target temperature range is obtained, high-precision real-time calibration and dynamic closed-loop regulation and control over the soldering tin temperature are achieved, and it is ensured that the welding process is stably within the target temperature range.

The utility model relates to an anti-tin-climbing PIN bonding pad power module substrate, which comprises a substrate body and a Pin assembly, the Pin assembly is welded on the substrate body, each Pin comprises a pin seat and a pin body, the pin seat is provided with a through hole, the pin body is matched with the through hole and is inserted in the through hole, the pin seat comprises a column body, a solder resisting ring is formed on the circumferential surface of the upper end of the column body, and the solder resisting ring is connected with the pin body. The solder mask ring is arranged at the upper end of the needle seat, so that tin liquid can be blocked by the solder mask ring when moving from the bottom of the needle seat to the needle body in the tin soldering process, tin is prevented from climbing onto the needle body, the needle body is prevented from being free of tin, and a power module and a PCB (printed circuit board) can be assembled smoothly at a client.

A circulating vapor phase soldering device, which comprises: a liquid storage tank (10), the liquid storage tank (10) being used for storing a vapor phase liquid; a preheating apparatus (20), the preheating apparatus (20) being connected to the liquid storage tank (10) and heating the vapor phase liquid to a first temperature; a heating cavity (30), the heating cavity (30) being connected to the preheating apparatus (20) and being used for heating the vapor phase liquid until same evaporates, so as to heat a workpiece; a recovery apparatus (40), the recovery apparatus (40) being connected to the heating cavity (30) and the liquid storage tank (10), and being used for recovering the vapor phase liquid from the heating cavity (30) into the liquid storage tank (10); and a piping system (50), the piping system (50) being used for driving the vapor phase liquid to sequentially enter, from the liquid storage tank (10), the preheating apparatus (20), the heating cavity (30) and the recovery apparatus (40), and for driving the vapor phase liquid to enter the liquid storage tank (10) from the recovery apparatus (40). The liquid storage tank (10), the preheating apparatus (20), the heating cavity (30) and the recovery apparatus (40) are connected into a loop by means of the piping system, such that after soldering is completed, the vapor phase liquid can flow back into the liquid storage tank (10) for storage, thereby realizing full cyclic utilization of the vapor phase liquid during a soldering process, improving the utilization efficiency of the vapor phase liquid, reducing resource consumption, and lowering production and processing costs.

The present invention relates to a fluid-permeable cooler (100) for cooling a power module (208) that comprises a power substrate. The fluid-permeable cooler (101) comprises a first metal part (101), a second metal part (102) and a cooling structure (1). The first metal part (101) and the second metal part (102) are interconnected by means of a soldering process and define a cooling channel (111) which is permeable by a fluid and in which the cooling structure (1) is located.The first metal part (101) comprises a receiving region (109) to which the power module (208) can be attached. The first metal part (101) is made from a metal material which has an expansion coefficient that is greater than the expansion coefficient of the power substrate (208). The invention also relates to a power electronics assembly (1000) having a cooler (100) of this kind and a power module (200).

The invention relates to the field of blind slot laminated modules, in particular to a blind slot laminated module based on a multistage vertical interconnection device and a process method. A mother board module; the copper pin part is vertically connected with the copper pin part; the fixed supporting part is provided with a first tooth groove and a through hole; the adjusting support part is provided with a second tooth groove and a first threaded hole, the second tooth groove and the first tooth groove are embedded in a staggered mode, the copper pin part is clamped and fixed in an embedding gap of the second tooth groove and the first tooth groove, and the first threaded hole is aligned to the through hole and is perpendicular to the extending plane of the stepped teeth of the second tooth groove; and the clamping force of the second tooth groove on the copper pin part is controlled by the second screw arranged in a penetrating manner. The problem that high-reliability welding quality is affected due to the fact that the ultrahigh-density copper pins of the laminated module are skewed due to uneven temperature loads and inconsistent thermal deformation degrees of materials in the multiple welding processes of the vertical interconnection technology is solved, and the requirements of remote sensing satellites are met.

This utility model discloses an aviation connector female, including a shell, terminals, PCB clips, sealing rings, shell sleeve clips, and nuts. This utility model eliminates the injection molding sealing and fixing process after the metal terminals are inserted into the shell slots in the traditional technology, simplifying the production process. At the same time, the method of directly soldering the terminals to the PCB eliminates the cost of wire harnesses and soldering processes, reducing production costs and improving signal transmission stability. The PCB clips on both sides of the connector can stably fix the PCB board, the nut has a built-in sealing ring and the design of multiple sealing rings enhances the waterproof and dustproof performance, and the shell sleeve clip design makes it easy to open the shell sleeve at any time, which is convenient for later maintenance and repair. The overall structural design effectively solves the problems of complex production process, high cost, inconvenient maintenance and insufficient sealing performance in the prior art.

This application discloses a contact-type chip soldering process, relating to the field of chip soldering technology. The process includes the following steps: printing solder paste dots at the contacts within the soldering area of ​​a circuit board; heating the solder paste dots to melt them; cooling the molten solder paste dots on the circuit board to form solder dots at the contacts; printing a solder paste layer at the contacts within the solder paste layer; attaching a chip to the soldering area of ​​the circuit board, such that the chip's contacts are in contact with the solder paste layer; heating the solder paste layer and solder dots to melt them; cooling the soldering area of ​​the circuit board to solidify the molten solder paste layer and solder dots, forming solder joints, and soldering the chip onto the circuit board. This application effectively reduces air bubbles generated within the solder joints and improves the quality of the solder joints.

The invention provides a lead welding method for a semiconductor chip, and belongs to the technical field of semiconductor packaging. The method comprises the following steps: processing a metal capillary tube into a through-hole-shaped female end with a preset length, and carrying out functional coating treatment on the inner surface and the outer surface of the through-hole-shaped female end; positioning the plated female end in a manner that the through hole is axially parallel to a chip bonding pad, and fixing the plated female end by reflow soldering of a first solder; carrying out pre-tinning treatment on the welding end of the metal lead; inserting a lead welding end into the female end through hole; and low-temperature reflow soldering with the peak temperature lower than the melting point of the first solder is carried out, so that the tin coating is molten and metallurgically bonded with the inner surface coating of the female end. By introducing the capillary tube female end which is low in cost and easy to process and a step-by-step low-temperature welding process, the heat damage risk of the heat-sensitive semiconductor chip is remarkably reduced while the connection reliability is ensured, the production efficiency and the process compatibility are improved, and the method is particularly suitable for wire bonding of thermoelectric refrigeration chips.

The utility model discloses a clamp device and battery production equipment. The clamp device comprises a driving mechanism, a clamping piece, a clamping table and a suction pipeline, the clamping piece and the clamping table form a clamping space, the driving mechanism is connected with at least one of the clamping piece and the clamping table, and the driving mechanism can drive at least one of the clamping piece and the clamping table to be close to or far away from the other one of the clamping piece and the clamping table; at least one of the clamping piece and the clamping table is provided with a smoke suction hole, and the smoke suction hole is communicated with the suction pipeline. According to the clamp device, smoke dust and particulate matter generated in the welding process can be adsorbed and collected, so that diffusion of the smoke dust and the particulate matter in the environment is avoided, the production and working environment of operators is optimized, harm to the bodies of the operators is reduced, and the safety of the operators is guaranteed.

1. Name of the designed product: molten pool camera. 2. Use of the designed product: industrial camera, used for monitoring welding process, detecting welding quality defects. 3. Design points of the designed product: in the front view. 4. Pictures or photos that best show the design points: front view.

This invention discloses a method for pre-fabricating porosity defects in nickel-based alloy welds, comprising: S1.1, applying a bottom weld bead structure to the surface of a metal test plate, the bottom weld bead structure comprising N consecutive adjacent weld beads, where N is an integer greater than 1; controlling the welding position of adjacent weld beads to form a gap between each pair of adjacent weld beads; S1.2, applying grease into each of the gaps as a gas source to induce porosity; S1.3, applying a second weld bead structure on the bottom weld bead structure, using the second weld bead structure to completely cover each of the gaps, encapsulating the grease, and forming one or more first closed chambers containing grease. This invention organically combines the porosity generation law of nickel-based welds with welding process control, successfully pre-fabricating porosity defects, and laying the foundation for the study of the porosity generation mechanism of nickel-based welds and subsequent process improvement.

The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure and a packaging method for correcting a vertical routing exposed position. The packaging structure for correcting the exposed position of the vertical wire bonding comprises a substrate, and is characterized in that a plurality of packaging units are arranged on the substrate, each packaging unit comprises a step-type stacked chip group, and each chip group is bonded with the substrate through a vertical lead; and one end, close to the substrate, of the vertical lead is connected with the salient point. Compared with the prior art, the packaging structure and the packaging method for correcting the exposed position of the vertical wire bonding have the advantages that interconnected salient points are grown in situ at the exposed position of the wire bonding metal, the size of the salient points can be flexibly adjusted through a photomask on the basis of a one-time patterning process, and the abnormal bridging short circuit in the subsequent welding process can be effectively improved.

The application discloses a semiconductor automatic packaging machine with integrated intelligent positioning function, which comprises an openable and closable shell, a conveying belt arranged longitudinally in the shell, a tray for placing a substrate continuously conveyed on the conveying belt, a transverse servo guide rail erected above the conveying belt, a longitudinal servo guide rail slidingly arranged on the transverse servo guide rail, a suction nozzle arranged in the longitudinal servo guide rail, three-dimensional positioning realized through the cooperative movement of the transverse servo guide rail and the longitudinal servo guide rail, a plurality of flying feeder linearly arranged along one side of the conveying belt and used for supplying different specifications of chips, and an alignment assembly comprising supports symmetrically arranged on both sides of the conveying belt, each of the supports being provided with a side plate slidingly connected through a slide rod on one side of the support towards the center of the conveying belt. Compared with the prior art, the application introduces a layered support structure, which can compensate for pressure and stabilize the interlayer gap in real time during the welding process.

The invention discloses a D2PAK packaging-based driver, a thermal management system and a control method. A PCB (Printed Circuit Board) is connected to a controller bottom plate; the D2PAK packaging type power device module and the heat dissipation ceramic chip module are respectively mounted on a first preset bonding pad area on the first surface of the PCB and a second preset bonding pad area on the second surface of the PCB through a preset welding process, and are vertically and oppositely arranged; the first surface of the heat conduction interface material layer is attached to the radiator area of the controller bottom plate; the controller bottom plate is connected with the controller cover plate, and the second surface of the heat conduction interface material layer is aligned with the first preset bonding pad area; the D2PAK packaging type power device module is connected with a compressor and a PTC heating module in the thermal management system. According to the embodiment of the invention, the D2PAK packaging type power device module can serve as a power device of a compressor and a power device of a PTC heating module at the same time, a core module in a heat management system can be shared, an integrated wiring harness design is adopted, and the space utilization rate is improved.

The invention provides an industrial welding defect detection method, device and equipment and a medium. The method comprises the following steps: acquiring a smoke image, an air distortion image, an arc light spectrum image and average temperature data; processing according to the smoke image, the air distortion image and the arc light spectrum image to obtain an air distortion deviation index, a smoke deviation index and a spectrum deviation index; training the initial welding defect detection model through the marked welding image; and adding the obtained spectrum deviation index, the smoke deviation index and the air distortion deviation index to obtain a comprehensive deviation index, taking the comprehensive deviation index as a network model feature weight parameter to obtain a second welding defect detection model, and inputting an image collected in the welding process into the second welding defect detection model to obtain a second welding defect detection result. And whether the workpiece causes the welding defect in the welding process or not is detected and determined in real time, so that the technical problems that the welding defect result recognized by an existing recognition model for the welding image in the related technology is not accurate enough and the precision is not high enough are solved.

The utility model discloses a kind of exempt from welding light source module including light source fixed subassembly and the light source rotating subassembly rotatable relative thereto, light source fixed subassembly includes radiator, rotating base and contact type PCB board, light source rotating subassembly includes light source base, light source, insulating partition, interconnection PCB board and rotating shell;The application is through rotating locking structure and pressure contact conduction design, completely abandon traditional soldering process, can realize the tool-free quick disassembly and multi-channel synchronous connection of light source, light source rotating subassembly is coaxially assembled with light source fixed subassembly through center positioning column, through rotating lock and rotating lock groove clamping, realize quick disassembly, avoid the cumbersome procedure of traditional screw disassembly;The first contact contact pin of interconnection PCB board bottom, second contact contact pin is directly conducted through pressure PCB terminal and the electrode of light source, save the soldering and disassembly and soldering procedure of wire, eliminate the risk of soldering point failure, reduce the difficulty of disassembly and soldering rework when maintaining;Modular design of each component can significantly improve assembly efficiency.

The utility model provides a precise circuit board paster high-speed welding tool, which relates to the technical field of electronic processing, and comprises a welding base, a high-speed welding assembly is arranged on the outer side of the welding base, a longitudinal electric lead screw is arranged on the inner side of a left guide frame, a driven supporting rod is welded on the inner side of a right guide frame, and the driven supporting rod is arranged on the outer side of the welding base. A longitudinal sliding rod is connected between the longitudinal electric lead screw and the driven supporting rod, a transverse support is welded to the lower side of the longitudinal sliding rod, a transverse electric lead screw is installed on the lower side of the transverse support, and a transverse sliding block penetrates through the middle of the transverse electric lead screw. The high-speed welding assembly and the electric control hydraulic rod drive the temperature controller and the welding needle to ascend and descend, so that the welding height can be automatically adjusted through an external computer, accurate temperature control and accurate positioning of a welding point are achieved, high efficiency and quality of the welding process are guaranteed, and the laser pointing device points to the welding point of the welding needle all the time.

This utility model discloses a high-precision FPC cable positioning device, relating to the field of FPC cables. It includes a main frame and a first adjusting rod penetrating the main frame. A first slider is sleeved on the first adjusting rod, and a movable groove is fixedly connected to the first slider. A second adjusting rod is penetrating the movable groove, and two sets of second sliders are sleeved on the second adjusting rod. A clamping seat is fixedly connected to the second slider, and a third adjusting rod is penetrating the upper side of the clamping seat. A pressure plate is fixedly connected to the bottom end of the third adjusting rod. A horizontal groove is clamped to the upper side of the main frame, and a movable groove is provided on the upper side of the horizontal groove. The advantages of this utility model are: it can avoid relative positional misalignment between the FPC cable and the circuit board, achieving high-precision positioning of the FPC cable and the circuit board, significantly improving the stability of the FPC cable during the soldering process, and enabling precise soldering of the FPC cable to different positions on the circuit board, making it highly applicable.

The utility model provides a connecting piece and a battery. The connecting piece comprises a pole connecting area and a connecting area, the tab connecting area is located on one side of the pole connecting area, and a transition structure is arranged at the edge of the tab connecting area and used for being in contact with a tab. By applying the technical scheme of the utility model, the technical problem that the tab is easy to damage in the welding process can be improved.

The present application provides a solder lug structure, a glass assembly, and a vehicle. The solder lug structure comprises a soldering portion, solder, and a limiting protrusion. The soldering portion is provided with a soldering surface configured to be proximate to glass and has a first thermal conductivity, and the solder is fixed to the soldering surface. The limiting protrusion is at least partially fixed to the soldering surface, and the limiting protrusion and the soldering portion are separate structures. The limiting protrusion has a second thermal conductivity, the second thermal conductivity being less than the first thermal conductivity. The solder lug structure provided in the present application is additionally provided with the limiting protrusion, thereby ensuring the distance between the soldering surface and the glass during soldering so as to ensure that the soldering portion does not directly contact the glass during soldering, while ensuring the thickness of the solder and improving soldering strength. In addition, by selecting a limiting protrusion having a low thermal conductivity, the impact of sudden temperature changes on the glass is reduced, thereby mitigating the problem of glass cracking caused by soldering.

The invention relates to a semiconductor metal target automatic welding line which comprises a truss mechanical arm, a feeding platform, a heating platform, a welding platform, a pressure maintaining platform, a dislocation mechanism platform and a material carrying platform. The robot is used for coating welding flux on a target material and a back plate, cleaning the welding surfaces of the target material and the back plate and assembling the target material and the back plate, and a truss manipulator is arranged to replace a worker, so that the target material, the back plate and a target material and back plate assembly are automatically transferred among the platforms; the robot is arranged to realize automatic cleaning and welding of the target material and the back plate; the heating platform is arranged to accurately control the temperature of the target material and the back plate; the pressure maintaining platform is arranged to accurately control the magnitude and time of pressure applied to the target material back plate assembly; by means of the structure, automatic welding of the target material and the back plate can be achieved, meanwhile, various parameters in the welding process are accurately controlled, manual operation is reduced, and the stability of product quality is improved.

The utility model belongs to the technical field of electric equipment, and discloses a mounting bracket and a signal lamp. The mounting support is used in the signal lamp, a circuit board is arranged in the signal lamp, the mounting support comprises a positioning part and a mounting space, the positioning part is located below the circuit board, a first opening and a second opening are formed in the positioning part, and the first opening and the second opening correspond to a first welding hole and a second welding hole in the circuit board respectively; the mounting space is used for accommodating a first electronic element and a second electronic element led out of the circuit board, one pin of the first electronic element extends out of the mounting space and penetrates through the first opening to be fixed to the first welding hole, and one pin of the second electronic element extends out of the mounting space and penetrates through the second opening to be fixed to the second welding hole. The circuit board and the electronic component are fixed by the mounting bracket, so that the problem of shaking of the pins of the electronic component in the welding process with the circuit board is solved, and the welding quality between the electronic component and the circuit board is improved.

The invention discloses a TOPCon-0BB assembly multi-stage welding method based on a low-temperature welding strip, relates to the technical field of photovoltaic assembly manufacturing, and effectively prevents a packaging adhesive film from permeating into a contact interface in the main welding process through partition scanning preheating and generation of a controllable adhesive film pre-wetting state. A clean initial condition is created for forming high-quality metallurgical bonding; in combination with closed-loop monitoring and regulation of the growth state of the IMC layer, it is ensured that a welding spot has enough mechanical strength, meanwhile, the brittleness problem caused by the too thick IMC layer is avoided, and therefore a welding interface has excellent conductivity and toughness, multiple physical fields are innovatively introduced to intervene and optimize the welding process, and the welding quality is improved. The structural stability and the anti-fatigue performance of the assembly are greatly enhanced; according to the method, the self-adaptive calibration parameters for different packaging material systems are dynamically generated by acquiring and identifying the welding process route identifier of the assembly, so that the process window is greatly widened, and the compatibility of different materials is enhanced.

This invention discloses a welding path generation method, apparatus, device, and storage medium, comprising: establishing a welding finite element simulation model for the part to be welded, and obtaining parameter information for each analysis step from the simulation results of the model; obtaining the planned point cloud cluster and the active point cloud cluster of the activated units in each analysis step based on the parameter information; obtaining the offset rotation matrix for each analysis step based on the planned point cloud cluster and the active point cloud cluster; and generating the welding path for the part to be welded based on the offset rotation matrix. By collecting the planned coordinates, active coordinates, and activation temperature of the active units in each analysis step, and obtaining the offset rotation matrix for each analysis step based on the activation temperature, the planned path in the welding process is adjusted according to the offset rotation matrix, thereby taking into account the temperature-induced deformation during the welding process, making the generated welding path more consistent with the actual production scenario and improving the accuracy of part welding.

According to the positioning assembly for the photovoltaic welding device, a positioning frame is configured to be an annular frame, a frame inner space is formed by the inner ring of the positioning frame, a positioning frame body is located in a non-welding space area in the frame inner space, the positioning frame body is provided with a plurality of positioning elements, and the positioning elements are configured to be used for positioning and contacting battery pieces; the driving device is in driving connection with the positioning frame, and the driving device is configured to be used for driving the positioning frame to reciprocate along the linear motion trail. When the welding assembly carries out welding treatment on the plurality of battery pieces, even if the plurality of battery pieces are collided in the welding process to cause position deviation, or the plurality of battery pieces are subjected to position deviation due to heating expansion of tin soldering in the welding process; due to the fact that the positioning assembly controls the battery pieces to be kept in the preset distribution mode at the welding station, the battery pieces cannot be inclined, it is guaranteed that the battery pieces can be subjected to the whole welding process based on the preset distribution mode, and an expected battery array is formed.