1190 results about "Soldering process" patented technology

The invention provides a back contact battery and a photovoltaic module, and relates to the field of photovoltaic technology. The back contact battery provided by the invention comprises a battery body, a plurality of first fine grids and a plurality of second fine grids, wherein the first fine grids and the second fine grids extend along a first direction; the plurality of first fine grids and the plurality of second fine grids are sequentially and alternately arranged on the first surface of the battery body at intervals in the second direction; the first surface comprises a first area and comprises a first edge and a second edge which are oppositely arranged in the second direction; in the first region, the first fine grid and the second fine grid are provided with a plurality of first sub-bonding pads and a plurality of second sub-bonding pads; the area of the first sub-pad is smaller than that of the second sub-pad. According to the back contact battery provided by the invention, the stability of the welding strip in the welding process can be improved, and the current collection reliability is ensured.

The invention provides a preparation method of a photovoltaic module with a hidden bus bar. The preparation method comprises the following steps: S1, arranging battery pieces on a module substrate according to a module model; s2, arranging a first welding strip on the battery piece according to the module model; s3, arranging a bus bar and a second welding strip which are fixedly connected on the battery piece according to the module model; s4, covering the assembly substrate with a flexible film, vacuumizing the covering area of the flexible film to enable the flexible film to tightly press the welding strip and the battery piece, and enabling laser to penetrate through the flexible film to weld the welding strip and the battery piece; the first welding strip is a welding strip which is not directly connected and welded with the bus bar, and the second welding strip is a welding strip which is directly connected and welded with the bus bar; wherein before or at the same time of the step S3, the step of arranging an insulating strip at the to-be-arranged position of the bus bar is further included, and the insulating strip covers the first welding strip at the to-be-arranged position of the bus bar. According to the method, the front light receiving area of the photovoltaic module can be increased, so that the module power is improved, the technological process is simplified, deformation of the bus bar in the welding process can be avoided, and subfissure of the battery piece caused by deformation is avoided.

The invention discloses a visual inspection method and device for reflow soldering quality and computer equipment. The method comprises the steps of obtaining a to-be-detected product image entering a detection area; preprocessing the to-be-detected product image and extracting a welding spot ROI region; the welding spot ROI is put into a defect classification model for welding defect identification and classification, and a classification result is obtained; and determining an equipment parameter adjustment scheme according to the classification result in combination with a preset adjustment rule, and adjusting the reflow soldering equipment according to the equipment parameter adjustment scheme. By implementing the method, the welding spot quality can be automatically recognized in the welding process, the production parameters are automatically adjusted according to the detection result, the welding quality is effectively improved, potential quality problems are avoided, the production efficiency can be improved, manual intervention is reduced, and the labor cost is saved.

According to the device and method for controlling the connection void rate of the large-area thermal interface of the power electronic device provided by the invention, the device part ensures that an organic solvent and water vapor in a soldering paste layer can be smoothly discharged by optimizing the grid structure shape design of a steel mesh printing module, so that the void rate in the welding process is effectively reduced; according to the method, through optimization of the reflow soldering technology, temperature control and vacuum degree optimization of all stages such as the heating process, the heat preservation process, the pre-reflow process and the reflow process are included, the gas escape time is properly prolonged, the voidage is controlled to be 1% or below, the interface thermal resistance is reduced, and the heat dissipation performance is improved. Through optimization design and process, the production process is simplified, the operation is more convenient, the cost is low, and the method is suitable for large-scale production; and meanwhile, the voidage is effectively controlled, so that the product quality consistency in the production process is guaranteed, the heat dissipation efficiency of the power electronic device is improved, and the service life of the power electronic device is prolonged.

The present application relates to the technical field of lead-free solder paste, and more specifically, to a lead-free solder paste with low voiding rate and precision welding and a preparation method thereof, which is prepared from the following raw materials in parts by weight: 70-90 parts of tin, 1-2 parts of silver, 3-6 parts of copper, 2-5 parts of magnesium fluorosilicate, 3-6 parts of nano-carbon powder, 4-5 parts of rare earth oxide and 20-30 parts of flux. The above formula can reduce the voiding rate in the welding process, improve the wettability of the lead-free solder paste, and improve the quality and reliability of the welding points.

The invention provides a welding method and device, electronic equipment and a storage medium, and belongs to the technical field of intelligent manufacturing. A target wire feeding speed corresponding to the actual average current value is determined according to the target compensation relation; the actual wire feeding speed is adjusted to the target wire feeding speed; the target compensation relation is determined from the compensation relation set based on the target average current value, and the target compensation relation comprises the corresponding relation between the actual average current value and the target wire feeding speed. Through the pre-established compensation relation, the wire feeding speed can be actively adjusted in the welding process according to the deviation of the monitored actual average current value so as to compensate the deviation in real time, and therefore it is guaranteed that the heat input amount in the whole welding process is constant, and the welding quality is improved. The technical problems of welding current fluctuation and inconsistent welding seam forming caused by dry elongation change due to factors such as out-of-roundness of workpieces are solved, and the quality and reliability of welding seams are remarkably improved.

The invention relates to the technical field of chip mounting, in particular to an automatic adjusting method and system for a chip clamp, and the method comprises the following steps: monitoring and automatically calibrating the pressure applied by the clamp in real time to ensure that the pressure meets the chip mounting standard, analyzing a to-be-mounted chip by using a camera, optimizing the shape recognition, and adjusting the track of the clamp to correct the offset. And analyzing the correlation between the pressure and the mounting quality according to the data after mounting, and establishing an optimized control closed loop. According to the invention, through real-time monitoring and automatic adjustment of pressure parameters, the dependence on manual adjustment is reduced, the automation level of the production process is improved, through detailed pressure adjustment, each chip is ensured to be accurately processed in the mounting process, the product quality is improved, the rejection rate is reduced, and the production efficiency is improved. The application of the image analysis technology allows the chip to be accurately evaluated before mounting, and the distance between the clamps is automatically adjusted, so that the mounting precision is improved, and the requirements of various chip shapes and sizes are met.

The invention discloses a large-size power chip no-pressure low-void-ratio welding method, which comprises the following steps of: determining proper thickness and size of a soldering lug according to the size of a chip and the material of a substrate; then cutting and carrying out plasma cleaning on the soldering lug to remove dirt on the surface of the soldering lug; welding sample assembly is completed through an automatic chip mounter; setting a vacuum welding curve according to the material characteristics of the welding sheet, determining key welding parameters such as formic acid pressure, formic acid reduction temperature, formic acid reduction time, peak temperature, peak temperature holding time, furnace chamber pressure and holding time and the like, and completing chip welding according to the set curve; and finally, measuring the internal void ratio of the welding seam by adopting an X-ray detector. On the basis of the vacuum eutectic welding technology, under the non-pressure welding condition, the air holes in the welding flux layer are discharged by regulating and controlling the environment pressure change in the welding process, and low-void-ratio welding of the large-size chip is achieved.

The invention discloses a missing welding detection system and method. The missing welding detection system comprises a data acquisition assembly, an anomaly detection assembly, a time sequence analysis assembly, a welding quality detection assembly and a welding control assembly. The data acquisition assembly acquires parameters in the welding process and transmits data to the anomaly detection assembly. The anomaly detection assembly performs preliminary analysis on the received data, identifies potential solder skips and sends the information to the time sequence analysis assembly. And after the time sequence analysis assembly receives the potential solder skips, abnormal trend analysis is carried out in combination with historical welding data. And the welding quality detection assembly further evaluates the quality of the welding points, if it is confirmed that welding skips or quality problems exist, an abnormal signal is sent to the welding control assembly, and the welding control assembly adjusts welding parameters or actions according to the abnormal signal so as to achieve welding correction. According to the invention, the structure is simple, solder skips can be rapidly identified, complex solder skips which are influenced by various factors can be identified through trend judgment, and the detection reliability is obviously improved.

The invention relates to the technical field of heat sink materials, in particular to a modified gold tin-hard gold plated heat sink material and a preparation method and application thereof. Comprising a first heat sink layer, a nickel plating layer, a gold plating layer, a gold-tin solder layer, a gold plating layer, a nickel plating layer, a second heat sink layer, a nickel plating layer, a hard gold plating layer and a modified gold-tin-silicon solder layer which are sequentially connected from bottom to top. The first heat sink layer is made of oxygen-free copper, the second heat sink layer is made of molybdenum copper or tungsten copper, and the hard gold plating layer comprises a nickel plating layer and a tungsten titanium gold plating layer which are sequentially connected from bottom to top. Tungsten and titanium are introduced into the gold-plated layer on the surface of the heat sink material, so that the hardness and corrosion resistance of the gold-plated layer are remarkably enhanced; a small amount of silicon is doped into the gold-tin solder, so that the shaping processing performance of the gold-tin brittle solder is improved; one-time forming of the solder-heat sink composite material is achieved in a vacuum thermocompression welding mode, and the problem of cavities or overflow caused by solder size errors in the welding process is solved.

The invention relates to the field of antenna welding devices, in particular to an RFID antenna tail end pin welding device which comprises a bottom plate, a welding gun arranged on the upper side of the bottom plate, a center column fixedly installed in the center of the upper side of the bottom plate, a transposition mechanism used for rapidly switching welding point positions and a correcting mechanism used for correcting the tail end of an antenna. The rotating base plate, the discharging base and the pushing assembly in the transposition mechanism are matched, circumferential rotation of the rotating base plate is matched with radial sliding of the discharging base, the discharging base drives a circuit board on the discharging base to slide once every time the rotating base plate rotates by a circle, and therefore automatic switching of welding point positions is achieved; the clamping plate, the pressing wheel and the wedge-shaped piece in the correcting mechanism are adopted, the wedge-shaped piece triggers the moving assembly to drive the clamping plate to clamp and straighten the tail end of the antenna, meanwhile, the pressing wheel downwards presses the tail end of the antenna, the problem of insufficient soldering or poor contact caused by antenna bending in the welding process is effectively solved, and the welding quality is ensured.

The invention provides a PCBA welding quality prediction method and system based on time sequence data, and relates to the field of circuit board welding, and the method comprises the steps: obtaining the time sequence data and detection data information of a technological process, and carrying out the missing value completion and data normalization processing; quantifying the correlation degree between each piece of feature data and the thickness of the intermetallic compound; constructing an MPSO-LSTM prediction model and carrying out model training to obtain an initial model; and evaluating the precision of the initial model to adjust hyper-parameters of the initial model to obtain a quality prediction model so as to analyze real-time process data in the welding process and realize prediction of the IMC thickness. According to the method, the quality online prediction capability in the welding process is effectively improved by constructing the MPSO-LSTM prediction model, the quality prediction model is obtained through model training and hyper-parameter adjustment, process data in the welding process can be analyzed in real time, the thickness of intermetallic compounds can be predicted, and technicians are assisted in quantitatively identifying quality causes of welding spot defects.

The utility model relates to the technical field of batteries, and provides a battery which comprises a shell structure, the pole structure is arranged on the shell structure; the battery cell is arranged in the shell structure, the battery cell comprises a battery cell main body and a pole lug, the pole lug extends out of the battery cell main body, and the pole lug is directly contacted and electrically connected with the pole column structure; the connecting piece is arranged on the side, deviating from the pole structure, of the pole lug, the connecting piece is arranged in a protruding mode towards the pole lug so that a pit can be formed in the side, deviating from the pole lug, of the connecting piece, the pole structure, the pole lug and the connecting piece are welded so that a welding mark can be formed in the pit, and therefore positioning of a welding head in the welding process can be facilitated; therefore, the welding efficiency of the pole structures, the tabs and the connecting pieces is improved, stress release can be formed through the connecting pieces, the risk of welding failure is reduced, and the safe use performance of the battery is improved.

The invention provides a steel pipe welding seam regulation and control method and system, electronic equipment and a storage medium, relates to the technical field of steel pipe welding, and continuously obtains multi-modal data, including visual image data, laser contour data, arc sensing data and infrared thermal image data, of the welding surface of a steel pipe in the welding process. And carrying out space-time alignment on the data to obtain a standardized fusion data set. And inputting the fusion data set into a double-branch deep learning model, extracting visual image edge features, laser contour geometric features and infrared thermal image temperature distribution features through CNN branches, and extracting arc time sequence fluctuation features through LSTM branches. And carrying out weighted fusion calculation on the characteristics to obtain the real-time coordinates of the groove center of the welding surface of the steel pipe and the temperature state parameter of the welding seam. And according to the real-time coordinates of the groove center and a preset reference, a welding seam temperature state parameter is combined, and a welding seam control strategy of the steel pipe welding surface is generated. According to the invention, high-precision welding seam regulation and control are realized, and the welding efficiency is improved.

The utility model discloses a patch welding device for circuit board processing, which comprises a bearing plate, a mechanical arm is fixedly arranged on the top of the left side of the bearing plate, and a placing plate is arranged on the upper side of the middle part of the bearing plate. The circuit board is accurately clamped and moved through the mechanical arm, the circuit board can be effectively fixed through the fixing mechanism composed of the driving motor, the lead screw, the movable block, the sliding block, the fixing plate and the like, the problem of welding dislocation caused by movement of the circuit board in the circuit board patch welding process is solved, and the circuit board patch welding efficiency is improved. Therefore, the welding precision and reliability are obviously improved; a double-end motor drives a threaded rod, a sliding rod, a second movable plate, a connecting rod, a rotating frame and other mechanisms, so that a containing plate can incline forwards or backwards, qualified circuit boards and unqualified circuit boards slide to different conveying belts correspondingly, automatic classification treatment of the welding quality of the circuit boards is achieved, the production process is optimized, and efficiency is improved.

The invention discloses a water-based flux cleaning agent for integration, and belongs to the field of semiconductor cleaning agents. The water-based flux cleaning agent is prepared from the following raw materials in percentage by weight: 30-50% of alcohol ether solvent, 1-5% of organic amine, 3-5% of gemini imidazoline corrosion inhibitor and 40-70% of deionized water, wherein the sum of the weight percentages of the raw materials is 100%. According to the water-based flux cleaning agent, the imidazoline corrosion inhibitor is adopted, so that a remarkable cleaning effect on flux residues, soldering paste and fine particles on a semiconductor electronic device is achieved, meanwhile, the brightness of welding spots can be maintained, the surface insulation performance is good, the metal surface of an IPM module can be effectively prevented from being oxidized, and the service life of the IPM module is prolonged. The cleaning agent is especially suitable for cleaning pollutants in the welding process of semiconductor chips, chip type capacitors and circuit substrates.

A method of producing a semiconductor device includes providing a semiconductor die, providing a metal joining partner, forming a diffusion solderable region by an inkjet metal printing process, forming an assembly to include the diffusion solderable region in between the metal joining partner and the semiconductor die, and performing a diffusion soldering process that forms a soldered joint from the diffusion solderable region in between the semiconductor die and the metal joining partner.

The invention discloses a circuit board semi-automatic welding system, and relates to the technical field of circuit board production and processing, the circuit board semi-automatic welding system comprises a processing table, the top end of the processing table is rotatably connected with a welding table driven by a stepping motor to rotate, the top end of the welding table is symmetrically provided with circuit board adsorption grooves, and the welding table is internally provided with an air suction positioning mechanism matched with the circuit board adsorption grooves; through cooperative operation of the multi-station rotary welding table and the double clamping boxes at the bottom end of the cross beam, a high-precision stepping motor and a transverse movement adjusting mechanism are integrated, a feeding, welding and discharging full-process automatic linkage mechanism is achieved, the automation degree is improved, and the production efficiency is improved. A multi-sensor fusion control structure comprising a smoke measurement purification mechanism and a temperature measurement regulation and control mechanism is adopted, meanwhile, through visual monitoring of a high-definition camera, the welding process can be monitored in real time, welding smoke is sucked away in time, a welded circuit board is rapidly cooled, and multi-dimensional monitoring and intelligent emergency response in the welding process of the circuit board are achieved.

The invention relates to the technical field of chip production equipment, in particular to a welding device for chip production packaging and a control method of the welding device. The interference area between the abnormal moisture migration area and the maximum susceptibility range is obtained, the welding loss probability that the moisture invasion sensitive chip is damaged due to the abnormal moisture migration area is calculated based on the interference area and the vulnerability index of the moisture sensitive chip, and the chip conveying mechanism is controlled to preheat the moisture invasion sensitive chip according to the welding loss probability; and distributing a steady-state control voltage of each circuit component in the accurate circuit control topological graph based on the expected control logic effect to obtain a steady-state drift difference value of each chip control node, and according to the steady-state drift difference value, deciding a welding process of a packaging type and planning welding scheduling of subordinate welding equipment. According to the invention, precise element preheating control can be carried out on the chip affected by air humidity in the chip packaging and welding process, and the accuracy, efficiency and qualified rate of chip packaging and welding are improved.

The utility model discloses a photovoltaic module, which relates to the field of photovoltaic technology and is used for solving the problem of complicated insulation process in the welding process of a welding strip. The photovoltaic module comprises a battery, a first surface of the battery is provided with first electrodes and second electrodes which are alternately arranged, the first electrodes are provided with first contact parts, the second electrodes are provided with second contact parts, and the first electrodes and the second electrodes are different in conductive polarity; the insulating mask comprises an insulating bonding layer, the insulating bonding layer is bonded on the first surface, the insulating mask is provided with an opening for exposing the first contact part and the second contact part, and a non-opening area of the insulating mask at least covers an area, close to the first contact part, of the second electrode and an area, close to the second contact part, of the first electrode; the first welding strip is welded with the first contact part; and the second welding strip is welded with the second contact part. Insulation welding protection can be achieved only by pasting the insulation mask, and compared with use of existing insulation paste, the steps of printing, curing and the like are not needed, and the technology is simplified.

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

The invention relates to the technical field of semiconductor packaging materials, and particularly discloses a water-soluble solder paste for a semiconductor chip, and the solder paste comprises the following components by taking the total mass of the solder paste as 100%: 60-70% of alloy powder, the mass content of tin powder is not less than 37.8%, and the alloy powder contains metal elements for improving the heat-conducting property; the conductive adhesive is used for enhancing the conductivity and the bonding strength of the solder paste; the solder paste comprises the following components in percentage by weight: 20%-30% of soldering flux which comprises an organic acid chelating agent, a surfactant, a corrosion inhibitor, an organic solvent and deionized water and is used for promoting the welding process and reducing residues after welding, and 0%-5% of other additives which comprise an antioxidant, a thixotropic agent and a flatting agent and are used for improving the storage stability and construction performance of the solder paste. According to the water-soluble solder paste, the high-purity alloy powder is adopted, the mass content of the tin powder is not lower than 37.8%, metal elements for improving the heat conduction performance are introduced, and high heat conduction performance and low resistivity of a welding material are guaranteed.

A semiconductor device semiconductor chip mounted to a leadframe that includes an electrically conductive pad. An electrically conductive clip is arranged in a bridge-like position between the semiconductor chip and the electrically conductive pad. The electrically conductive clip is soldered to the semiconductor chip and to the electrically conductive pad via soldering material applied at coupling surfaces facing towards the semiconductor chip and the electrically conductive pad. The device further includes a pair of complementary positioning formations formed by a cavity in the electrically conductive clip and a protrusion (such as a stud bump or a stack of stud bumps) formed in the electrically conductive pad. The complementary positioning formations are mutually engaged to retain the electrically conductive clip in the bridge-like position to avoid displacement during soldering.

The utility model discloses a chip inductor winding welding mechanism, which relates to the chip inductor welding field, and comprises an operation table and a chip inductor, the surface of the operation table is provided with a welding base, the surface of the welding base is provided with a circuit board in a sliding manner, the welding base is provided with an auxiliary welding assembly for welding the chip inductor, and the circuit board is provided with an auxiliary welding assembly for welding the chip inductor. The auxiliary welding assembly comprises a tray, and the tray is arranged on the surface of the welding base in a sliding mode. The arranged auxiliary welding assembly can wrap the chip inductor to provide protection in the welding process of the chip inductor, only pins of the chip inductor are reserved for welding, and therefore the direct influence of thermal stress generated by a welding gun on an inductor body is remarkably reduced, in addition, the assembly further has a limiting function, and the welding efficiency is improved. The chip inductor can be kept at a fixed position in the welding process and is prevented from moving or deforming, a welding gun can be effectively prevented from being in direct contact with a chip inductor body, and additional safety protection is provided for the inductor.

The utility model relates to the technical field of unmanned aerial vehicle manufacturing, in particular to a teaching unmanned aerial vehicle circuit board tin soldering tool which comprises a circuit board and a supporting disc, a clamping assembly is arranged on the supporting disc, and an inner disc, an inner ring and an outer ring which are sequentially in threaded connection from inside to outside are arranged below the supporting disc; the inner disc, the inner ring and the outer ring are in threaded connection to adjust the horizontal height of the supporting disc, and the supporting disc is rotationally connected with the inner disc. According to the scheme, the positioning holes are evenly formed in the supporting disc, the clamping blocks are inserted into the positioning holes, so that the clamping blocks can be matched with circuit boards of different sizes, the clamping blocks are divided into the movable blocks and the limiting blocks, the clamping blocks have certain adjustable space, the clamping stability is guaranteed, the steps on the movable blocks are not prone to deformation, and the clamping effect is good. The circuit board can be placed positively and negatively, and the stability and flatness of the circuit board in the welding process are improved.

The invention relates to the field of photovoltaic module production, in particular to a bus bar welding method and welding equipment. According to the bus bar welding method, the bus bar is welded to the back contact battery pack, the back contact battery string group is placed on the glass plate, the bus bar is in lap joint with the welding strip exposed in the insulation area, welding is carried out, the back contact battery string group is located on the glass plate in the welding process, and the back contact battery string group does not need to be lifted in the welding process; relative friction between the welded battery piece and the glass plate is avoided, the welding quality is guaranteed, and the welding process is more simplified. The bus bar welding equipment provided by the invention is used for realizing the bus bar welding method, comprises a transmission positioning device, a bar manufacturing device and a welding device, and is simple in structure.

The invention relates to the field of electronic packaging materials, in particular to efficient heat-conducting lead-free solder paste and a preparation method thereof. The tin alloy is composed of tin alloy and scaling powder, and the weight of the scaling powder accounts for 15-25% of the weight of the tin alloy. The soldering flux is prepared from the following raw materials in percentage by weight: 42 to 60 percent of rosin derivative, 5 to 10 percent of active agent, 5 to 10 percent of liquid polyisobutene, 2.5 to 5.5 percent of maleic anhydride-containing copolymer, 1 to 3 percent of ethylene bisstearamide, 1 to 3 percent of hydrogenated castor oil and the balance of solvent. The rosin derivative, the liquid polyisobutene, the maleic anhydride-containing copolymer and other raw materials play a synergistic role, so that the obtained soldering paste has better flowability, wettability, film-forming property and the like, the dispersion uniformity of a soldering flux and tin alloy powder is improved, a small amount of the soldering flux volatilizes in a welding spot in the welding process, the possibility of holes is avoided, and the service life of the soldering paste is prolonged. And the heat conduction efficiency and the stability of a welding spot after welding are improved.

The invention discloses a packaging structure with a heat dissipation structure and a packaging method, through the connection cooperation of a first metal carrier plate, a second metal carrier plate, a first heat conduction insulating film, a second heat conduction insulating film, a first rewiring layer and a second rewiring layer, and the subsequent circulation of a cooling liquid in a cooling pipeline, the heat resistance is greatly reduced, the heat dissipation is enhanced, and the heat dissipation efficiency is improved. Power consumption is reduced; according to the invention, the first metal carrier plate and the second metal carrier plate are directly bonded, the first metal carrier plate and the second metal carrier plate are provided with grooves and holes, and finally, the first metal carrier plate and the second metal carrier plate are matched with the first heat-conducting insulating film and the second heat-conducting insulating film to form the cooling pipeline, so that the stress problem caused by the welding process of a water-cooling plate in the traditional technology is improved, and a packaging body is prevented from being damaged; wiring can be conducted on the two faces of the base material, and multi-dimensional packaging is achieved; according to the invention, the metal substrate is used as the substrate, panel warping is reduced, and the stress problem caused by multi-dimensional packaging is solved.

The utility model discloses a Kovar frame and a sensor packaging structure, which are applied to the technical field of semiconductor device packaging and comprise a bottom frame, a solder area is arranged on the surface of one side of the bottom frame, a retaining wall is arranged on one side, facing the center of the Kovar frame, of the solder area, and a protruding part is arranged on one side, facing the solder area, of the retaining wall. A gap is formed between the protrusion and the bottom surface of the solder region. The blocking wall can prevent welding flux arranged in the welding flux area from splashing towards the center of the kovar frame, and therefore the situation that the welding flux splashes to the pixel area in the eutectic welding process is reduced. And the protruding part is used for increasing a solder climbing path when the solder climbs towards the top end of the retaining wall, preventing the solder from infiltrating towards a position close to the chip, further reducing the sputtering risk, and ensuring the yield of the device.

The invention relates to the technical field of semiconductor packaging, and discloses a bonding wire welding method based on bare chip interconnection, and the method comprises the steps: collecting and fusing acoustic response and optical reflection signals of a bonding interface in real time through a multi-mode in-situ sensing mechanism integrating acoustic resonance and surface plasmon resonance; dynamically calculating the thickness, the mechanical coupling deformation and the energy dissipation state of the intermetallic compound layer; and the ultrasonic power and the bonding force are subjected to closed-loop adjustment in combination with a model prediction control algorithm, so that the welding process is evolved along a preset optimal physical path all the time. The system comprises a multi-mode sensing welding head, a synchronous data acquisition module, a state resolving module and a self-adaptive control module. The transparent and intelligent welding process is realized, and the bonding consistency, reliability and yield of high-density interconnection are remarkably improved.