Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof

A flux and high-impedance technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve problems such as component pin short circuit, component failure, etc., and achieve good matching, safe use, and excellent electrical insulation performance.

Active Publication Date: 2012-02-15
SOUTH CHINA UNIV OF TECH +1
View PDF4 Cites 45 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of narrow pin spacing, the ionic residues on the PCB surface move directional in the electric f

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof
  • Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof
  • Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023]

[0024]

[0025] Preparation method: add deionized water into a clean reaction kettle with a stirring device at room temperature, start stirring after the co-solvent is added, add active agent and non-ionic surfactant, stir for 20 minutes, then add film-forming agent and stir for 20 minutes, Then add other raw materials, continue to stir until the solid raw materials are completely dissolved, then stop stirring, let stand and filter to obtain the product.

[0026] The method of using the halogen-free high-impedance water-based no-cleaning flux of the present invention: the flux can be evenly coated on the PCB board by spraying, foaming, dipping and other methods, and the PCB board is preheated, and the preheating temperature is 95 ℃-120℃ (measured on the top of the board), the deionized water in the flux is completely evaporated, and then soldered in a single-wave or double-wave soldering solder tank. The solder temperature depends on the type of lead-free solder,...

Embodiment 2

[0028]

[0029] The preparation and use methods are the same as in Example 1.

Embodiment 3

[0031]

[0032]

[0033] The preparation and use methods are the same as in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a halogen-free high-impedance water-based washing-free scaling powder as well as a preparation method and application thereof. The scaling powder disclosed by the invention comprises the following components in percentage by weight: 1.50-6.00% of activating agent, 0.10-0.45% of nonionic surfactant, 0.05-2.00% of film forming agent, 0.15-0.40% of corrosion inhibitor, 4.00-25.00% of cosolvent and the balance of deionized water. The scaling powder disclosed by the invention does not contain halogen and uses the deionized water as the main component of a scaling powder solvent, thus the scaling powder is safe and environment-friendly. In the invention, the coordination mode and dosage of each component of the scaling powder are accurately computed; the scaling powder has the advantages of good stability and excellent soldering performance; and the obtained soldered dots are full, thereby effectively reducing the occurrence of defects such as continuous soldering or missing soldering and the like. The composition materials of the scaling powder disclosed by the invention can be periodically volatilized in the soldering process; the residuals after the soldering are less; the electric insulating property is excellent; the surface insulating resistance after the soldering is larger than 1.0*108; and the washing is not needed.

Description

technical field [0001] The invention relates to a soldering flux used for electronic package assembly brazing, in particular to a halogen-free high-impedance water-based no-cleaning flux applied in the wave soldering process of lead-free solder. technical background [0002] Halogen is the general term for Group VIIA elements of the periodic table, including five elements: fluorine (F), chlorine (Cl), bromine (Br), iodine (I), and astatine (At). Organic halides are often used as high-efficiency flame retardants in polymer material components such as cables and printed circuit boards. Some flux active ingredients also contain halogens. The presence of halogens helps to quickly remove the oxide layer on the surface of the pad, speed up the solder wetting speed, and improve the hole filling ability of the solder. However, halogens have adverse effects on the reliability of electronic products and the ecological environment. For example, the ionic halogens remaining on the surf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): B23K35/363B23K35/40
Inventor 张新平何杰马骁叶桥生黄守友
Owner SOUTH CHINA UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products