121 results about "Electroless nickel plating" patented technology

The invention relates to the technical field of corrosion-resistant coatings, in particular to a post-treatment method for improving the corrosion resistance of a chemical nickel-plated layer in a plasma environment. Comprising the following steps: preparing composite sol, coating a workpiece, carrying out plasma-assisted curing, and then carrying out heat treatment on an inorganic-organic hybrid coating framework; an inorganic-organic hybrid coating framework firmly combined with a nickel-plated layer is formed on the surface of a chemical nickel-plated workpiece under a low-temperature condition by preparing composite sol and matching with plasma-assisted curing, and rare earth elements are immobilized in situ; the inorganic-organic hybrid coating framework is further condensed through subsequent heat treatment, pore collapse and structural densification are achieved, and therefore the final compact corrosion-resistant coating is formed, and rare earth elements are fixed in the compact corrosion-resistant coating in a chemical bonding mode; therefore, thermal stress and interface stripping risks caused by a thermocuring process are eliminated, and long-acting, stable and reliable protection on a matrix under extremely harsh working conditions is realized.

The invention discloses a cooling fin chemical nickel plating automatic welding production device, and relates to the technical field of cooling fin welding. Comprising cooling fins, a feeding gripper, a discharging gripper, a rotating table and a welding machine, a plurality of positioning units are arranged on the rotating table in the circumferential direction, each positioning unit comprises a base and a lifting plate, a mounting groove is formed in the upper surface of each base, and a cooling air opening is formed in the inner side wall of each mounting groove; a positioning pin and a plurality of clamping blocks are fixedly arranged on the upper surface of the lifting plate, pressure sensors are embedded in the outer surfaces of the positioning pin and the clamping blocks, and an electromagnetic assembly is arranged in the positioning pin and used for controlling the diameter change of the positioning pin; the clamping block is connected with an adjusting assembly used for adjusting the position of the clamping block. The contact pressure of the cooling fin is detected in real time, self-adaptive clamping and positioning are achieved, and a chemical nickel plating layer is prevented from being scratched; the arranged cooling air openings blow air towards gaps of the fins, internal cooling media circulate, the temperature of a welding area is effectively reduced, and fin softening and substrate warping are restrained.

The invention relates to the technical field of image processing, in particular to a method for identifying surface defects of a precision part treated by an aluminum alloy chemical nickel plating process, which comprises the following steps: acquiring a grayscale image of a nickel-plated part to be detected, uniformly dividing the grayscale image into nickel-plated areas with preset sizes, performing pyramid down-sampling on any nickel-plated area, and calculating the surface defects of the nickel-plated part to be detected; a first preset number of scale images are obtained, the total texture feature value of any nickel plating area is obtained according to the texture distribution feature of each scale image, and whether a suspected skip plating area exists in the grayscale image or not is judged according to the total texture feature value of each nickel plating area; if the suspected skip plating areas exist in the gray level image, obtaining a defect judgment result of each suspected skip plating area according to the texture directivity feature and the texture periodic feature of each suspected skip plating area; the defect judgment result of each suspected skip plating area in the gray level image is utilized to perform defect identification on the to-be-detected nickel plating part, so that the accuracy and reliability of skip plating defect detection are improved.

The invention provides a repairing method suitable for an engine case connecting bolt. The method comprises the following steps that S1, chemical stripping and fine treatment are conducted on the connecting bolt, an old plating layer on the surface of the connecting bolt is removed, and the surface of the connecting bolt is evenly coarsened; s2, a nitric acid-phosphoric acid binary acid system is adopted to conduct soaking treatment on the connecting bolt treated in the step S1 at the normal temperature, and a passive film on the surface of the connecting bolt is removed; s3, the connecting bolt treated in the step S2 is subjected to chemical nickel plating; and S4, the connecting bolt treated in the step S3 is subjected to hot water stabilization and dehydrogenation treatment, and the repaired connecting bolt is obtained. The invention provides a set of process from old plating layer removal, passive film removal and chemical nickel plating to hydrogen brittleness avoidance, so that the whole repair process is highly controllable, the product quality is stable and repeatable, and the problem of batch scrapping caused by batch difference and process uncontrollability in the prior art is solved.

This provides an improvement to the rewiring line structure of die packaging. [Solution] This invention provides an improvement to the redistribution line structure of die packaging, which mainly consists of one die, multiple redistribution lines, and multiple nickel-gold layers. Each redistribution line is formed on the surface of the die by being stretched horizontally using a redistribution layer (RDL) process. Each nickel-gold layer is formed on the surface of each redistribution line by being plated using a chemical nickel-gold (ENIG) process. Each nickel-gold layer consists of a nickel (Ni) layer and a gold (Au) layer, with the gold layer positioned on top of the nickel layer. This structure effectively solves the problems of uneven thickness and process complexity that occur in conventional die packaging when nickel-gold layers are formed using an electroplating process, and the RDL process can improve the design space and reliability of the die packaging.

The application discloses a method for recovering nickel and phosphorus from electroless nickel plating waste liquid, and the method comprises the following steps: preparing nickel sulfate through extraction and stripping, and preparing iron phosphate through Fenton oxidation and precipitation; compared with the prior art, the method is characterized in that the waste liquid is pretreated, insoluble solid particles in the waste liquid are removed, emulsification of an extractant caused by particles in a subsequent extraction process is prevented, damage to extraction oil is avoided, and the extraction efficiency is ensured; in addition, the extractant used in the method can be recycled, secondary pollution is avoided, and the method is economical and practical; in the method, main pollutants in waste water are all converted into important chemical raw materials, recycling is realized, sulfuric acid and Fenton reagents used are all converted into terminal products, difficulty of end waste water treatment is not increased, clean production is met, the treatment cost is low, the product has high added value, and the method has strong practicability.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

The application discloses an intermediate processing liquid for an electroless nickel immersion gold (ENIG) production line and a chemical gold preparation method. The intermediate processing liquid is applied between the electroless nickel plating and immersion gold processes, and comprises (a) a pH buffer and a metal ion complexing agent: a total concentration of 50-150 g / L; (b) an adsorptive corrosion inhibitor: a concentration of 0.5-5.0 g / L; (c) a low-foam non-ionic surfactant: a concentration of 0.01-10 g / L; (d) an auxiliary antioxidant: a concentration of 0.5-30 g / L; (e) a dissolving agent: a concentration of 1-50 ml / L; (f) a pH regulator: an appropriate amount, which is added to maintain the pH value of the intermediate processing liquid at 4.0-6.5; and (g) deionized water: a balance, so that the concentrations of the above components reach the set target values; and the intermediate processing liquid has a design use temperature of 20-45 DEG C. The intermediate processing liquid removes residual nickel ions on the board surface and in micropores through strong complex cleaning, and blocks the pollution to the subsequent gold tank; meanwhile, the preferential adsorption of the corrosion inhibitor molecules at the nickel layer grain boundaries forms a controllable molecular-level protective film, effectively adjusts the immersion gold replacement reaction kinetics, and prevents the occurrence of intergranular corrosion (black plate).

The application discloses an aluminum nitride film circuit substrate and a preparation method thereof, and relates to the technical field of aluminum nitride substrates.The application is characterized by the following steps: a titanium film is plated on the surface of an aluminum nitride ceramic substrate by magnetron sputtering, and then a copper film is plated on the surface of the titanium film by magnetron sputtering; and a nickel film is plated on the surface of the copper film by a chemical plating method to prepare the aluminum nitride film circuit substrate.Through the titanium-copper gradient dynamic transition technology, a gradient alloy layer is formed to reduce the interface stress; the titanium and the surface of the aluminum nitride are combined through a chemical bond to form a dense transition layer, thereby relieving the difference in the thermal expansion coefficient; the copper enhances the conductive performance of the surface of the aluminum nitride ceramic substrate; the titanium compensates for the interface defects of the mismatch between the copper and the aluminum nitride ceramic lattice; the chemical nickel plating enhances the hardness and corrosion resistance of the aluminum nitride ceramic substrate, and the aluminum nitride film substrate is endowed with weldability and bondability.

The invention belongs to the technical field of plating processes, and particularly relates to a high-binding-force diamond aluminum plating process. The method comprises the following specific steps: S1, composite nickel plating: carrying out composite nickel plating on a pretreated diamond aluminum composite material; s2, palladium activation, wherein the diamond-aluminum composite material obtained after composite nickel plating is put into palladium salt to be soaked, and then the diamond-aluminum composite material is taken out to be cleaned; s3, chemical nickel plating; s4, sensitization is carried out; s5, palladium activation; and S6, chemical nickel plating, nickel electroplating, annealing treatment and drying are sequentially conducted on the diamond aluminum composite material, and the plating process is completed. According to the plated diamond aluminum, a plating layer does not peel, swell and discolor under the gold-tin soldering condition, diamond particles do not fall off, the overall wettability is good, the stability is high, the cost is low, operation is easy, and the condition of batch production can be met.

The utility model discloses an anti-corrosion and wear-resistant bearing, and relates to the technical field of bearings. The bearing comprises an outer ring, an inner ring assembly is arranged in an inner cavity of the outer ring, a retainer is arranged between the inner ring assembly and the outer ring, and a rolling body is arranged in an inner cavity of the retainer; the inner ring assembly comprises a first connecting sleeve, and a second connecting sleeve is clamped in an inner cavity of the first connecting sleeve. According to the sealing design of the inner ring assembly, through the first connecting sleeve, the second connecting sleeve, the sealing ring and the sealing plate which are connected in a clamped mode, external impurities are effectively prevented from invading, a good working environment is built for the interior of the bearing, and a strength foundation is laid for base-layer high-carbon-chromium bearing steel; the carburized bearing steel and martensitic stainless steel of the reinforcing layer are combined to improve the strength and hardness, the chemical nickel-plated phosphorus alloy and the diamond-like carbon coating of the functional layer endow the bearing with excellent corrosion resistance and wear resistance respectively, and the adaptive capacity of the bearing under complex and severe working conditions is comprehensively improved.

The invention discloses a water electroplating process for a PC / ABS (polycarbonate / acrylonitrile-butadiene-styrene) material thin decorative part. The water electroplating process comprises the following treatment steps: pretreatment; activating treatment: after the surface of the thin decorative part made of the PC / ABS material is roughened, the rough surface of the thin decorative part made of the PC / ABS material is activated, so that the rough surface of the thin decorative part made of the PC / ABS material can accept deposition of plating metal; chemical plating treatment: carrying out chemical nickel plating treatment on the to-be-plated surface of the PC / ABS material thin decorative part; electroplating treatment: carrying out copper plating treatment, nickel plating treatment and chromium plating treatment on the chemical nickel surface of the PC / ABS material thin decorative part; wherein the thickness range of the plated copper is 24-28 [mu] m, the thickness range of the plated nickel is 1-3 [mu] m, and the thickness range of the plated chromium is 0.01-0.04 [mu] m; and post-treatment: carrying out cleaning treatment and drying treatment on the electroplated PC / ABS material thin decorative part to obtain the PC / ABS material thin decorative part. By means of the water electroplating process, the problem that the strength of the PC / ABS material decorating part is poor after water electroplating can be solved.

The invention discloses a high-strength, high-conductivity and high-wear-resistance nickel-plated short carbon fiber reinforced copper-based composite material and a preparation method thereof, and belongs to the technical field of metal-based composite materials. The preparation method comprises the following steps: carrying out surface roughening, sensitization and activation pretreatment on short carbon fibers, and then carrying out chemical nickel plating to form a nickel layer; mixing the nickel-plated short carbon fiber with oxygen-free copper zirconium CuZr0. 1 alloy powder, and carrying out cold press molding; and the copper-based composite material is subjected to rapid vacuum hot pressing sintering for 30-60 min at the temperature of 800-900 DEG C and the axial pressure of 30-50 MPa, the obtained copper-based composite material has high strength, high conductivity (80% IACS or above) and excellent wear resistance (the wear rate is smaller than or equal to 1.1 * 10 <-5 > mm < 3 > / m), and the technical problems that a traditional carbon fiber / copper-based composite material is poor in interface bonding and low in conductivity are solved. The method is suitable for high-performance conductive wear-resistant parts in the fields of aerospace, traffic rails and the like.

The application relates to a high-radiation shielding particle material and a preparation method thereof, and belongs to the technical field of shielding materials. The application aims to solve the problems that the existing radiation shielding materials cannot have the shielding performance of gamma rays, good flexibility and convenient construction performance and the like, and the particle material is composed of glass microspheres, a chemical nickel plating layer, an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer. The thickness of each layer is controlled to be 20 mu m. The method is that nickel is deposited on the surface of the glass microspheres by a chemical nickel plating method, and then an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer are sequentially deposited by an electroplating method. The glass microspheres are pretreated, and nickel is deposited on the surface of the glass microspheres by a chemical nickel plating method, so that other electroplated layers can be more easily deposited on the surface; the electroplated lead layer and the electroplated tungsten layer have the characteristics of good combined shielding performance of gamma rays and neutrons; and the metal tantalum layer has good gamma ray shielding performance and excellent mechanical performance.

The invention discloses an electromagnetic double-gradient composite material containing Ni and CFC and a preparation method and application thereof, and relates to the technical field of electromagnetic shielding materials. The preparation method comprises the following steps: (1) cutting carbon fiber cloth into small blocks, polishing carbon fibers through abrasive paper, immersing a sample into a sensitizing solution at room temperature for 15 minutes, and soaking the sample into an activating solution for 90 seconds; a sensitizer used in the chemical nickel plating process comprises nickel sulfate hexahydrate and diluted hydrochloric acid; and (2) ammonia water is added to adjust the pH of the chemical nickel plating solution, chemical nickel plating treatment is carried out at the temperature of 60 DEG C, nickel deposition is carried out for 1-4 times and 20 min each time, after the reaction is completed, deionized water is used for washing for 2 min, then pressing is carried out for 48 h, and finally drying is carried out in a drying oven, so that the electromagnetic double-gradient composite material is obtained. By depositing Ni on the CFC substrate, the dielectric loss, magnetic loss and heterogeneous interface loss performances are remarkably improved.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuit module die. In some embodiments, the SF may be electroless nickel plating and electroless palladium immersion gold (ENEPIG). In other embodiments, SF may be gold leaching electroless palladium leaching (IGEPIG). In other embodiments, the SF may include an electrolytic palladium gold layer on the indium layer or on the ferrocobalt layer.

The present disclosure relates to a nickel plated steel sheet for a battery case having excellent corrosion resistance and a method for manufacturing the same. In one embodiment, the nickel plated steel sheet comprises: a base steel sheet; a nickel plating layer formed on one or more surfaces of the base steel sheet; and a nickel-iron (Ni—Fe) diffusion layer formed between the base steel sheet and the nickel plating layer; wherein the nickel plating layer and the nickel-iron (Ni—Fe) diffusion layer are formed by forming an electro-nickel plating layer on the base steel sheet and an electroless nickel plating layer on at least a portion of the surface of the electro-nickel plating layer, followed by heat treatment, and the nickel plating layer includes one or more co-deposited elements selected from phosphorus (P), boron (B), tungsten (W), cobalt (Co), molybdenum (Mo), and copper (Cu) on its surface.

A wheel includes a hub portion configured to rotate about a rotational axis. A plurality of blades extends radially outward from the hub portion. Each blade of the plurality of blades includes a leading edge and a trailing edge. The hub portion and the plurality of blades include a substrate metal. The substrate metal of the plurality of blades has coated directly thereon a coating layer that has a hardness of about 800 HV or greater and that includes electroless nickel-phosphorous having a phosphorous content of from about 2 to about 4 wt. %.

The invention discloses a brazing method for a sapphire-ceramic vacuum arc-extinguishing chamber window and application of the brazing method. The brazing method comprises the steps that an activation layer, a barrier layer and a brazing layer are sequentially deposited on a sapphire brazing face, and a molybdenum-manganese method is used for sintering and chemical nickel plating is carried out on an annular trepanning area of a ceramic shell; the oxygen-free copper metal foil, the kovar alloy metal foil and the nickel metal foil are compounded into a whole, the oxygen-free copper side of the obtained annular composite transition ring is aligned with the sapphire brazing layer, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, the nickel side of the composite transition ring is aligned with the nickel-plated layer at the opening of the ceramic shell, the copper brazing filler metal ring is placed in the middle of the annular composite transition ring, and the obtained assembly is subjected to vacuum brazing. Two high-strength and high-airtightness brazed joints are formed at a time, and therefore the sapphire window is connected to the ceramic shell in a sealed mode through the composite transition ring. By introducing a multi-layer composite transition layer structure, the thermal stress matching problem is effectively solved, so that a sealing interface with ultrahigh air tightness, high mechanical strength and excellent long-term reliability is realized.

The invention relates to a manufacturing method of a selective chemical nickel ceramic-based printed circuit board for a power module, and aims to solve the technical problems that a chemical nickel layer is easy to yellow and a copper surface is easy to oxidize in a subsequent process in the prior art. The method comprises the following steps: pasting a protective film and performing laser windowing on a ceramic-based copper-clad plate with a manufactured circuit for the first time, exposing an area needing chemical nickel plating, and performing chemical nickel plating; after the film is torn off, the second time of protection film pasting and laser windowing are carried out, the copper surface area needing to be treated is accurately exposed, and meanwhile the plated nickel layer is tightly covered with the protection film; and finally, carrying out anti-oxidation treatment on the exposed copper surface. The core of the invention lies in a collaborative process of two-time film pasting and laser windowing, and a film is pasted again after chemical nickel plating to protect a nickel layer, so that the nickel layer is completely isolated from acid and alkali liquid medicine in the subsequent copper surface treatment, the yellowing phenomenon of the nickel layer is fundamentally avoided, and the cleanness and weldability of the copper surface are ensured.

[Problem] To provide: a nickel plating film that has suitable bath stability, pattern deposition properties, and plating deposition properties in a fine pad part, and excellent in solder connection reliability and surface smoothness; and an electroless nickel plating solution useful for forming the plating film. [Solution] A nickel plating film is formed on an object to be plated by subjecting the object to be plated to surface treatment using an electroless nickel plating solution that contains at least S2+ and a Co metal and in which the Co metal is included in the form of Co2+ and Co3+.

A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel phosphorus plating solution comprising (i) a source of nickel ions; (ii) a source of hypophosphite ions; (iii) at least one complexing agent; and (iv) an organic flex additive. The nickel phosphorus plating layer deposited on the substrate exhibits a columnar grain structure.

This invention relates to the field of materials science and technology, and discloses a method for optimizing the composition of a chemical nickel plating solution for ceramic substrates. The method includes: analyzing target ratio combinations of key variables to establish an initial nickel plating solution; plating a preset ceramic substrate using the initial nickel plating solution, and recording the current pH value during the initial nickel plating process; analyzing the pH adjustment parameters of the initial nickel plating solution, marking the comprehensive lifetime score of the initial nickel plating solution under the pH adjustment parameters to determine the failure point of the initial nickel plating solution; performing nickel plating on the ceramic substrate using the initial nickel plating solution to obtain a nickel-plated ceramic substrate; identifying the critical load for plating peeling off the nickel-plated ceramic substrate to determine the adhesion of the nickel-plated ceramic substrate; analyzing the conductivity and corrosion resistance of the nickel-plated ceramic substrate; outputting the composition optimization parameters of the initial nickel plating solution; and performing composition optimization of the nickel plating solution based on the composition optimization parameters. This invention can improve the optimization effect of the nickel plating solution composition.

The invention relates to the technical field of alloy raw material mixing, and discloses a NiB binary alloy raw material mixing device, the raw material mixing device comprises a reaction kettle, a stirrer and a filler port, the stirrer is installed at the bottom of the reaction kettle, stirring and mixing are generated in the reaction kettle, the filler port is formed in the side wall of the reaction kettle, and the filler port is communicated with the stirrer. A temperature control assembly capable of switching heating and cooling is arranged on the outer side of the reaction kettle, a temperature control system capable of switching a circulating medium is constructed on the outer side of the reaction kettle on the basis of the jacket, and compared with a single temperature control medium in conventional equipment, a very stable effect can be achieved during temperature control; the chemical nickel plating process requiring accurate temperature change is more friendly, in addition, the setting form that the jacket wraps the medium for temperature conduction is adopted, so that the acting part is very uniform during temperature control, more accurate temperature control can be provided, and good product production is ensured.

The present application relates to the technical field of multi-stage cleaning of IGBT heat dissipation substrates, and solves the technical problem of black spot defects after chemical nickel plating caused by insufficient cleaning of oil stains in the pin fin microstructure of the heat dissipation substrate, especially a multi-stage cleaning method for inhibiting black spot defects of IGBT heat dissipation substrates. In the rough cleaning stage, the key parameters of the ultrasonic generator and the transducer are optimized, the heat dissipation substrate is subjected to rough cleaning, and the surface cleanliness is detected in real time. In the fine cleaning stage, the posture of the hyperspectral camera is accurately controlled for omnidirectional detection of the pin fin, the nozzle posture is adjusted based on the key information of the oil-stained pin fin, the nozzle output flow and pressure are controlled as the optimization target of the micro-flow column jet impact force, and the oil-stained pin fin is subjected to accurate cleaning. The present application realizes multi-angle omnidirectional oil stain cleaning and real-time cleanliness detection of each area on the surface of the heat dissipation substrate, thereby improving product quality to meet the requirements of downstream customers and effectively improving the core competitiveness in the industry.

The invention belongs to the technical field of resistance reduction, and discloses a fluorinated graphene composite nickel-phosphorus plating layer and a preparation method and application thereof.The preparation method of the fluorinated graphene composite nickel-phosphorus plating layer comprises the following steps that fluorinated graphene is dispersed in water and then evenly mixed with an acidic medium-phosphorus nickel plating solution, and a mixed nickel plating solution is obtained; and the substrate is immersed in an alkaline medium phosphorus nickel plating solution for first chemical plating and then immersed in a mixed nickel plating solution for second chemical plating, and the fluorinated graphene composite nickel-phosphorus plating layer is obtained. The low surface energy characteristic of fluorinated graphene and the excellent coating performance of chemical nickel-phosphorus plating are combined for fluid drag reduction application, and a complete technical scheme from fluorinated graphene composite nickel-phosphorus coating preparation and surface characteristic to function application is formed.

The application discloses a kind of color resistant plating packaging paste and its preparation method and application, belong to electronic packaging technical field, the color resistant plating packaging paste includes glass powder and organic carrier;The glass powder includes the following components: bismuth oxide, silicon oxide, zinc oxide, additive, zirconium oxide, titanium oxide, aluminum oxide, calcium carbonate;The organic carrier includes resin, and the resin includes that the mass ratio of ethyl cellulose, acrylic resin and polyvinyl butyral resin is 1: (0.4~1.6) : (0.4~1.6);The additive includes that the mass ratio of boric acid and sodium carbonate is (7~10) : (0.5~3).The packaging paste is less than 1% to silver wire resistivity influence, the resistance value influence of thick film resistance is 100Ω / m and 1kΩ / m is less than 1.5%, after chemical nickel-palladium-gold plating, glass glaze surface gloss has no loss, thickness has no loss, with wide application prospect.

The present application relates to the technical field of corrosion-resistant coating, in particular to a post-treatment method for improving corrosion resistance of electroless nickel coating in plasma environment. The method comprises composite sol preparation, workpiece coating, plasma-assisted curing and subsequent heat treatment of inorganic-organic hybrid coating framework. The method makes the surface of electroless nickel workpiece form a firm inorganic-organic hybrid coating framework combined with the electroless nickel coating at low temperature by preparing composite sol and plasma-assisted curing, and in-situ immobilizes rare earth elements. The subsequent heat treatment promotes the further condensation of the inorganic-organic hybrid coating framework, realizes pore collapse and structure densification, thereby forming a final dense corrosion-resistant coating, and fixes the rare earth elements in the dense corrosion-resistant coating by chemical bonding. Thus, the risk of thermal stress and interface peeling caused by heat curing process is eliminated, and long-term, stable and reliable protection of the substrate under extremely harsh working conditions is realized.

The present application belongs to the technical field of surface treatment, and in particular to a surface treatment process for diamond / aluminum composite material. The present application comprises the following steps: degreasing, drying, sand blasting, degreasing, pickling, sensitization, activation, electroless nickel plating, low-temperature annealing, degreasing, pickling, impact nickel plating, electroplating nickel, pre-plating gold, electroplating gold, and low-temperature annealing. The present application reduces the stress between the surface of the composite material and the plating layer through a stepwise heating mode, thereby improving the bonding force and meeting the welding technical requirements of the diamond / aluminum composite material.

The invention relates to the technical field of composite material surface treatment, in particular to a carbon fiber surface high-binding-force nickel plating method and a special activating solution thereof. The method provided by the invention comprises the following steps: firstly, carrying out desizing and coarsening pretreatment on carbon fibers, then activating by adopting a novel environment-friendly activating solution taking cobalt salt, a coordination agent and a reducing agent as cores, and finally, carrying out chemical nickel plating and optional electroplating thickening. According to the method, an expensive palladium catalyst is completely abandoned, a high-activity catalytic center is generated on the surface of the carbon fiber in situ through the activating solution, and the ultrahigh binding force of a plating layer and a carbon fiber matrix is achieved. The process is simple, environment-friendly and suitable for continuous production, and the prepared nickel-plated carbon fibers perfectly have light weight, high strength and excellent conductive / electromagnetic shielding functions and have wide application prospects in the high-end industrial fields of aerospace, new energy automobiles and the like.