1725 results about "Electroless nickel plating" patented technology

An organic thin film forming apparatus that can easily remove an organic thin film adhered to a surface of a deposition preventive plate. The apparatus forms an organic thin film on a substrate disposed on a surface of a substrate stage from an organic gas. An electroless nickel film containing fluorine resin is formed on the surface of a deposition preventive plate. The electroless nickel film containing fluorine resin has mold release characteristics for an organic thin film. Even if the organic thin film adheres, the organic thin film can be easily removed by a method (such as, high pressure cleaning).

An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.

The invention discloses a superficial treatment method of printed wiring board, which is dedicated to solving the technical problem of preventing black pad in the process of plating ENIG by chemical means, ensuring reliability of welding and routing process. The method comprises the following steps: chemical Immersion of nickel, chemical immersion of palladium and chemical gilding. Compared with the prior art, chemical immersion of nickel, chemical immersion of palladium and chemical gilding are carried out on the printed wiring board to obtain Ni/Pd gold plating, thus effectively preventing long-term oxidization of palladium surface in the air and ensuring reliability of welding combination and routing combination.

The invention discloses a method of plating Nickel with magnalium alloy without cyanogen and the plating technique. The direction for the plating solution is: 20 to 80g.dm-3 of copper charred phosphate; one or several of the 60 to 320g.dm-3 of sodium charred phosphate or Potassium charred phosphate or 60 to 250g.dm-3 of sodium citric acid, 5 to 20g.dm-3 of Potassium sodium tartaric acid, 60 to 250g.dm-3 of HEDP and 60 to 250g.dm-3 of amine ethylene; one or several of the 5 to 20g.dm-3 of hydrogen amine di-fluorin or 5 to20 g.dm-3 sodium fluoride or 5 to 20g.dm-3 of Potassium fluoride or 5 to 20g.dm-3 of lithium fluoride. The plating solution chooses the nickel sulfate or alkali type nickel carbonate or nickel acetic acid as the main salt and adds the reducing agent, combination agent and stabilization agent. The plating technique adopts the acid plating copper-plating three nickel-plating chromium. The invention has little pollution to the environment, high binding power and erosion-proof property.

A food processing appliance, such as a food slicing or a food dicing machine, that includes aluminum components, such as cutting discs that include knives and/or food dicing gratings, and feeders that come into contact with the food being processed, wherein the aluminum components being made in die cast aluminum. After being cast, cleaned and possibly treated, an aluminum component is tumbled so as to obtain a dense surface. The tumbled component is coated with the aid of a chemical nickel plating process, wherein the chemically applied coating has a thickness exceeding 5 mum.

Disclosed herein are a method for plating a printed circuit board and the printed circuit board manufactured therefrom. In the method, a bare soldering or wire bonding portion of a copper (Cu)- or copper alloy layer, is plated with palladium (Pd) or a palladium alloy, and then gold (Au) or a gold alloy is deposited over the palladium or palladium alloy plated layer by an electroless substitution plating process based on ionization tendency. Having superior hardness, ductility and corrosion resistance, palladium is suitable for use between a connector and a substrate and meets requirements for the printed circuit board even when applied to a low thickness, greatly reducing the process time. Accordingly, the problem of black pad, which frequently occur on electroless nickel and electroless gold finish upon surface mount technology, can be perfectly solved. Particularly, fatal bending cracks can be prevented from occurring in the rigid-flexible or flexible printed circuit boards.

This invention discloses a surface treatment method for Mg-based material. The method comprises: (1) performing micro-arc oxidation treatment on Mg or Mg alloy work piece as the anode in a Cl--free alkaline micro-arc oxidation electrolyte; (2) activating; (3) performing preliminary chemical plating of Ni; (4) performing chemical plating of Ni; (5) performing thermal treatment. The micro-arc oxidation treatment comprises: (1) applying a positive pulse with an average current density of 5-20 A/dm2 until the voltage is automatically elevated to a critical value, and applying a constant working voltage of 50-80 V (total time = 5-30 min); (2) applying a positive pulse of 30-300 V and a negative pulse of 0-200 V with an average current density of 0.5-15 A/dm2 (total time = 10-60 min). The activation comprises: (1) performing anode alkaline coarsening treatment for 3-10 min; (2) performing surface activation treatment; (3) performing cathode alkaline electrification reduction activation treatment; (4) performing cathode acidic electrification dispergation activation treatment. The treated Mg alloy work piece has high corrosion resistance of ceramic materials and the properties and touch sense of metal materials.

A flux contains resin having film forming ability, activator, solvent, and at least one complex selected from silver complex and copper complex. The flux is used when soldering is performed onto a circuit having electroless nickel plating or further having gold plating on the electroless nickel plating. Allowing a barrier layer of silver or copper to deposit on the surfaces of lands suppresses the diffusion of nickel into the melted solder alloy during soldering, and also prevents phosphorous concentration. This improves the bonding strength of soldering and suppresses the reduction deposition of silver and/or copper to portions other than circuit patterns.

The present invention discloses new activating process and activating solution with non-noble metal for chemical plating of metal onto the surface of non-metal base material. The activating solution is alkaline organic metal complex solution comprising water soluble salt of bivalent Ni, Cu or Co ion, organic alkane complexing agent and pH regulator. The new activating process and activating solution of the present invention may be used to replace available process and solution with noble metal for wide use in the chemical plating of metal material onto the surface of non-metal base material, such as chemically plating nickel, chemically plating copper, chemically plating cobalt, etc. The activating solution of the present invention is stable, simple in technological process and low in cost, and the present invention makes it possible to save noble metal resource effectively and is ideal technology to replace available one.

A direct displacement plating process provides a uniform, adherent coating of a relatively stable metal (e.g., nickel) on a highly reactive metal (e.g., aluminum) that is normally covered with a recalcitrant oxide layer. The displacement reaction proceeds, preferably in a nonaqueous solvent, as the oxide layer is dissolved by a fluoride activator. Halide anions are used to provide high solubility, to serve as an anhydrous source of stable metal ions, and to control the rate of the displacement reaction. A low concentration of activator species and little or no solution agitation are used to cause depletion of the activator species within pores in the surface oxide so that attack of the reactive metal substrate is minimized. Used in conjunction with electroless nickel deposition to thicken the displacement coating, this process can be used to render aluminum pads on IC chips solderable without the need for expensive masks and vacuum deposition operations. Such coatings can also be used to preserve or restore wire bondability, or for corrosion protection of aluminum and other reactive structural metals and alloys. A thin layer of immersion gold can be used to protect the thickened coating from oxidation. The solderable aluminum IC chip pads provide the basis for a maskless bumping process for flip chip attachment.

The invention relates to a preparation method of nickel-plated and silver-plated aromatic polyamide conductive fibers, which comprises the following concrete steps of: a. washing and oil removal; b. coarsening: increasing the surface roughness and the surface wettability of fibers; c. sensitizing: soaking the fibers by adopting an aqueous solution formed by stannous chloride and hydrochloric acid; d. activation: soaking the fibers by adopting an aqueous solution formed by palladium chloride and hydrochloric acid; e. chemical nickel plating; f. sensitizing; g. activation; h. chemical silver plating; and i. coating protection. The prepared high performance nickel-plated and silver-plated aromatic polyamide conductive fibers have good electric conductivity, characteristics of heat resistance, flame retardance, light weight and high strength and functions of eliminating static electricity, conducting electricity and transmitting electrical signals. Therefore, the prepared nickel-plated and silver-plated aromatic polyamide conductive fibers can be widely applied to special departments of aviation, space flight, war industry, communication and the like and can also satisfy the clothing and equipment requirements of staffs engaging radars, television relaying and the like.

The invention discloses a chemical nickel-plating method for carbon fiber, which is designed for overcoming the disadvantages of high cost, a large number of process steps and poor operability existing in the prior art. In the method, a chemical plating process is adopted; and a pre-treatment is performed on a raw material and chemical plating solution is prepared before the chemical plating. The pre-treatment process comprises the steps of: calcining by using a muffle furnace to remove glue; soaking in solution of absolute ethanol to remove oil; performing surface roughening and activating treatment by using solution of sodium hydroxide and solution of silver ammonia; sensitizing by using a sensitizer, namely stannous chloride; and performing surface reduction by using solution of sodium hypophosphite. The chemical plating solution consists of nickel sulfate hexahydrate, sodium hypophosphite, sodium pyrophosphate and sodium citrate. The chemical nickel-plating on the carbon fiber is finished by placing a pre-treatment product of the chemical plating into the chemical plating solution, and reacting, standing, filtering and drying under a chemical plating condition. The method has the characteristics that: the product has a uniform surface, a compact plating layer and uniform particles.

The invention discloses an ammonia-free chemical nickel plating bath which adopts an ammonia-free pH modifying agent to regulate the pH value of the bath. Each liter of the bath contains the components that nickel salt is 24 to 30g, reducing agent is 24 to 33g, buffering agent is 10 to 18g, complexing agent is 20 to 30g, stabilizing agent is 0.5 to 1.5mL, brightener is 1.5 to 3.0mL, and others are water. In the ammonia-free chemical nickel plating bath, the ammonia-free pH modifying agent is selected from one or the mixture of sodium hydroxide, and potassium hydroxide or potassium carbonate. All materials in the ammonia-free chemical nickel plating bath do not contain heavy metal, ammonia water is not utilized to regulate the pH value, the problems of environment pollution, invalidation caused by overlong storing time of the bath, etc. are not caused, and the obtained chemical plating bath is friendly to the environment, in addition, the luminance brightness of the made plating layer can be full-bright. The bath has wide application prospect.

The invention relates to a gold-plating method of a high silicon-aluminum composite material. According to a second zinc immersion treatment method of conventional aluminum alloy electroplating, pre-treatment of the method comprises the following six steps: cleaning and oil removing; alkaline etching; bright dipping; primary zinc immersion; zinc annealing; secondary zinc immersion. The gold-plating method subsequently comprises the following steps: I, preplating chemical nickel in a chemical nickel-plating liquid; II, plating nickel for the first time according to a conventional nickel-plating method, wherein the nickel layer is 2-3 microns thick; III, performing aging treatment; IV, performing activating treatment; V, plating nickel for the second time according to a conventional nickel-plating method, wherein the nickel layer is 2-3 microns thick; VI, taking a pure gold plate or a platinum titanium mesh as an anode and the high silicon-aluminum composite material as a cathode according to a conventional pure gold-plating method, wherein the gold layer is 2-3 microns thick; VII, detecting the binding force of the plating layer. The plating layer observed under tenfold amplifying glass is free from peeling and bubbling phenomena and good in binding force. The binding force of the gold-plating plating layer and a high silicon-aluminum base material adopted by the method provided by the invention is firm and reaches the standard of appendix A of GJB1420 General Specification of Semiconductor Integrated Circuit Shell.

The invention discloses a method for classifying, treating and recycling plating washing water on line, which comprises the following steps of: removing oil, coarsening, reducing, activating, peptizing, chemically plating nickel, preplating nickel, plating copper, plating nickel and plating chromium in a plating process; and treating water and washing water during production and cleaning. The method specifically comprises the following steps of: preparing pure plating water, circularly processing acid and alkaline waste water, coarsening, circularly treating chromium-plating washing water, circularly treating chemically nickel-plating washing water, circularly treating copper-plating washing water and circularly treating nickel-plating washing water. Waste water in each procedure is directly used beside a tank edge in a closed cycle by an economical and effective means after being treated, no wastewater is discharged, and the cross contamination of different water qualities among the procedures is avoided. The method is a technological innovation for realizing zero emission of plating waste water and plating cleaner production.

The invention provides a plastic product and a preparation method thereof. The method comprises the following steps: 1) forming a plastic base, wherein the plastic base contains chemically plated catalysts which are compounds shown in the formula I, II or III; 2) removing the plastics in the selected area on the surface of the plastic base and exposing the chemically plated catalysts in the corresponding area; and 3) chemically plating copper or nickel and continuing chemical plating and/or electroplating at least once to form a metal layer on the surface of the plastic base. The preparation method provided by the invention has the advantages of simple process, low requirement for energy and low cost. In addition, the chemically plated catalysts are distributed in the plastic base, so the plating layer formed after chemical plating and the plastic base have very high adhesion.

The invention discloses a method for degrading organic pollutant and recycling phosphate in chemical nickel-plating waste liquid, which belongs to the technical field of environment-friendly waste water treatment and resource recycle. The method conducts oxidation degradation of organic pollutant in waste water through the oxidation technology, simultaneously oxidizes hypophosphorous acid radical and phosphorous acid radical in waste water into orthophosphate radical and recycles phosphate and nickel by enabling the orthophosphate radical and nonmetal or metal ions to be precipitated. The method achieves resource recycle while treating waste water and has good environment benefits and economical benefits and wide application prospect.

The invention discloses a treatment method of chemical nickel-plating wastewater. The method comprises the following steps: (1) treating nickel-plating wastewater with strongly basic anion-exchange resin so as to destabilize nickel complex; (2) adsorbing nickel ions contained in the nickel-plating wastewater with strongly acidic cation-exchange resin; (3) adding a strong oxidant in the nickel-plating wastewater so that hypophosphite, phosphite and macromolecular organic acid complexing agent which are contained in the wastewater are oxidized so as to form phosphate and organic micromolecules;(4) carrying out pulse electrocoagulation on the nickel-plating wastewater so that the phosphate forms iron phosphate to be precipitated and residual nickel ions are oxidized to form oxidized scale precipitate at the same time; and (5) regulating the wastewater to alkalinity so that iron ions in the wastewater are precipitated, successively adding a deironing agent and a flocculant to remove ferrous ions and suspended matters in the wastewater, and directly discharging supernate. According to the invention, the content of the nickel ions in the wastewater treated by the process is far less than 0.1ppm and meets a national primary standard, the recycle of nickel resources can be realized, and the economic benefits of wastewater treatment are improved.

The invention discloses a plating solution of magnalium alloy Nickel sulfate and its chemical plating technique. The plating solution is made up of: (1) 5 to 40g.dm-3 of Nickel sulfate, (2) 10 to 50g.dm-3 of reducing agent of hypo-phosphite sodium; (3) one or several of the 2.5 to 30g.dm-3of the citric acid or tri-sodium citric acid, 2.5 to 30g.dm-3of the lactic acid, 2.5 to 30g.dm-3of the acetic acid, 2.5 to 30g.dm-3of the malic acid, 2.5 to 30g.dm-3 of the third acid and 2.5 to 30g.dm-3of the buta-acid; (4) one or several of the 5 to 30g.dm-3of Potassium fluoride, 5 to 30g.dm-3of sodium fluoride, 5 to 30g.dm-3of lithium fluoride and 5 to 30g.dm-3of NH4HF2; (5) 0.1 to 3g.dm-3of sulphur carbamide. The plating steps include: washing with ultrasonic->washing with alkali->washing with acid->activation->dipping it in the zinc solution->getting rid of the activation solution->secondary dipping it in the zinc solution->chemical plating->passivation and sealing the holes. The invention is featured by little pollution to the environment, low cost, uniform film and simpel technique.

The invention relates to a chemical palladium plating solution, in particular to a chemical palladium plating solution which can directly form a palladium film with good adhesive force on a chemical nickel plating film formed on a printed circuit board (PCB) and does not affect the chemical nickel plating film serving as a base film. The chemical palladium plating solution contains a soluble palladium salt, a first complexing agent, a second complexing agent and a stabilizing agent, wherein the first complexing agent is one out of ammonia and diamine compounds, and the second complexing agent is one or more out of alcohol amine compounds with 2-7 carbon atoms, amine compounds with less than 7 carbon atoms and aminocarboxylic acid compounds. The palladium plating solution has stable pH, stable deposition rate, long bath service life and excellent bath stability, does not generate cracks, and can obtain the palladium plating film with very low phosphorus content and excellent corrosion resistance, solder connectivity and lead weldability.

The invention discloses a method for performing neutral electronickelling following magnesium alloy chemical nickeling, which comprises the technical steps as follows: (1) surface treatment of magnesium alloy material: performing surface treatment to the magnesium alloy material by adopting the prior art; (2) acid membrane removal: removing the membrane by using fluoride-containing acid solution; (3) alkaline erosion: performing surface erosion by using fluoride-excluding alkaline solution; (4) activation: performing surface activation by using fluoride-containing solution; (5) chemical nickeling; (6) thermal treatment; (7) subsequent neutral nickeling; and (8) regular nickeling. According to the method, neutral electronickelling is performed following magnesium alloy chemical nickeling so that double-layer nickel is covered on the magnesium alloy base material. The method has the advantages of high bonding force, good uniformity and dense property, strong wearing resistance and corrosion resistance, and simple technical process and convenient operation. In the whole process, alkaline-copper electroplating and chromium are not needed, thus reducing harm to environment and human.