338 results about "Electroless nickel plating" patented technology

The invention provides a lead-free high-phosphorus chemical nickel plating solution, and relates to the technical field of chemical nickel plating, and the lead-free high-phosphorus chemical nickel plating solution comprises the following components: 4-10 g / L of nickel salt, 6-12 g / L of a complexing agent, 0.1-0.8 g / L of a brightener, 8-12 g / L of a reducing agent, 0.4-0.8 g / L of a stabilizer, 1-5 g / L of a plating starting agent, 0.1-0.6 g / L of an anti-cracking agent, 0.5-1.5 g / L of an accelerator and 0.1-0.5 g / L of a wetting agent. The excellent chemical nickel-plating process of the circuit board and the carrier plate can be realized, and the chemical nickel-plating solution has the characteristics of high deposition rate, excellent stability, brightness, smoothness, no skip plating or diffusion plating, excellent binding force and the like.

A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

The invention provides a chemical nickel-plating solution based on microcapsules and a method for preparing a coating. The chemical nickel-plating solution based on the microcapsules comprises the following components: 20-30g / L of nickel sulfate hexahydrate; 15-20 g / L of sodium hypophosphite; 10 to 15g / L of trisodium citrate; 2-5 g / L of microcapsules; 10-15 g / L of a stabilizer; the pH regulator is used for regulating the pH value to 4.5 to 5.0; and the balance of deionized water. According to the invention, the microcapsules containing the same components as the chemical nickel plating solution are introduced, so that the automatic repairing function of the coating after being damaged is realized. The coating has high mechanical strength and excellent self-repairing characteristic, and is suitable for surface protection of industrial equipment needing long service life and corrosion resistance.

The invention relates to the technical field of corrosion-resistant coatings, in particular to a post-treatment method for improving the corrosion resistance of a chemical nickel-plated layer in a plasma environment. Comprising the following steps: preparing composite sol, coating a workpiece, carrying out plasma-assisted curing, and then carrying out heat treatment on an inorganic-organic hybrid coating framework; an inorganic-organic hybrid coating framework firmly combined with a nickel-plated layer is formed on the surface of a chemical nickel-plated workpiece under a low-temperature condition by preparing composite sol and matching with plasma-assisted curing, and rare earth elements are immobilized in situ; the inorganic-organic hybrid coating framework is further condensed through subsequent heat treatment, pore collapse and structural densification are achieved, and therefore the final compact corrosion-resistant coating is formed, and rare earth elements are fixed in the compact corrosion-resistant coating in a chemical bonding mode; therefore, thermal stress and interface stripping risks caused by a thermocuring process are eliminated, and long-acting, stable and reliable protection on a matrix under extremely harsh working conditions is realized.

The invention discloses a lead-free phosphorus chemical nickel plating solution, and relates to the field of chemical nickel plating, and the lead-free phosphorus chemical nickel plating solution comprises the following components: 6-10 g / L of nickel salt, 5-10 g / L of a complexing agent, 1-5 g / L of a brightener, 5-12 g / L of a reducing agent, 0.6-0.9 g / L of a composite stabilizer, 2-10 g / L of a plating starting agent, 0.1-0.6 g / L of a hydrogen evolution preventing agent and 30-60 mg / L of a surfactant. The adopted plating starting agent is high in decomposition capacity, after the service cycle is increased to 4 MTO, the problem that decomposition products are accumulatively increased to a certain degree to cause blackening of a plating layer can be relieved, 5-6 MTO can be achieved, meanwhile, the adopted composite stabilizer is a composition composed of an aminopyrrole carboxylic ester compound and an aminothiazole carboxylic ester compound, and the composite stabilizer has the beneficial effects of being environmentally friendly and free of pollution. The stability of traditional elements such as lead and cadmium can be improved, and the problem that the service cycle of stabilizers such as benzotriazole or sodium thiosulfate is short can be solved.

The invention discloses a corrosion-resistant oil seal and a surface treatment process thereof, and relates to the technical field of sealing elements. The invention comprises the following components: an outer corrosion-resistant layer: fluororubber or hydrogenated nitrile rubber, the total content of which is 40-60%; the total content of the polytetrafluoroethylene nano-particles is 10 to 20 percent; the total content of silicon carbide or aluminum oxide micro powder is 5-15%; and a graphene dispersion liquid. Through a multi-protection system of the fluororubber (FKM) and polytetrafluoroethylene (PTFE) nano-particle composite outer layer, the chemical nickel-phosphorus plating (Ni-P) alloy plating layer and the silicon dioxide / titanium dioxide nano-coating, super-strong corrosion resistance is achieved, corrosion medium permeation is blocked by the chemical inertness of PTFE, the Ni-P plating layer forms a passive film in an acid environment to inhibit electrochemical corrosion, and the corrosion resistance is good. The compact structure of the silicon dioxide / titanium dioxide coating further blocks erosion, compared with a traditional oil seal (swelling fracture), the corrosion resistance is remarkably improved, the surface coating can be self-repaired through the silicon dioxide reaction when being slightly scratched, and the service life under the harsh working condition is prolonged.

The invention discloses a method for chemically plating silver on the surface of a nickel-plated ceramic copper-clad substrate, and relates to the technical field of metal surface treatment. The preparation method comprises the following steps: S1, sequentially adding nitric acid, imidazole and a surfactant into deionized water, and uniformly mixing to obtain an activating agent; s2, after the ceramic copper-clad substrate is pretreated, chemical nickel plating treatment is carried out, cleaning and drying are carried out, and a nickel-plated ceramic substrate is obtained; and S3, the nickel-plated ceramic substrate is immersed in an activating agent for activating treatment, chemical silver plating treatment and post-treatment are conducted, and a product is obtained. According to the method provided by the invention, the problem of copper ion migration in the later silver welding process of chemical silver plating on the surface of the ceramic copper-clad substrate can be solved, and the performance of the packaging module is improved.

The invention belongs to the technical field of electromagnetic shielding materials and conductive polymer-based composite materials, and particularly relates to a flexible aramid nanofiber conductive film and a preparation method and application thereof. The preparation method comprises the following steps: firstly, preparing an aramid nanofiber membrane through vacuum-assisted filtration, and then immersing the aramid nanofiber membrane into a nickel ion-containing solution for ultrasonic pretreatment and activation treatment by a sodium borohydride solution to obtain a modified aramid nanofiber membrane; and mixing with a chemical nickel plating solution under an external magnetic field, drying, and dip-coating with a polydimethylsiloxane packaging solution to obtain the flexible aramid nanofiber membrane. The finally obtained flexible aramid nanofiber conductive film has excellent flexibility, heat resistance and corrosion resistance. The method is easy to operate, economical and environmentally friendly, the material has excellent electromagnetic shielding performance due to the porous layered structure of the formed nanofiber membrane and the nickel coating on the surface, and the problem of mutual interference between electronic elements can be solved.

The invention provides a continuous high-phosphorus chemical nickel plating method, which comprises the following steps: preparing a chemical plating solution containing nickel salt, a complexing agent and an additive, adding a first reducing agent and a second reducing agent into the plating solution according to a mass ratio of (3-5): (1-2), the second reducing agent is one or more of lithium aluminum hydride, sodium borohydride, propionic acid or succinic acid; and the PH value of the plating solution needs to be adjusted to 4.5-5.5, the temperature of the plating solution is controlled to be 80-90 DEG C, and then continuous plating operation is conducted. The first reducing agent can stably release active phosphorus atoms at a low temperature, a rich phosphorus source is provided for the plating layer, and it is guaranteed that the plating layer reaches the high phosphorus content; the second reducing agent can effectively promote the reduction deposition process of nickel ions, and the deposition rate is increased. The two reducing agent components cooperate with each other, so that the plating solution keeps high stability, fluctuation of the plating solution components is effectively inhibited, and the consistency and stability of the plating layer quality are obviously improved.

The invention belongs to the technical field of chemical nickel equipment, and particularly relates to a three-dimensional swinging chemical nickel device for semiconductor parts, which comprises an outer groove, an inner groove, a support, a driving mechanism, a lifting mechanism, a transverse moving mechanism, a longitudinal moving mechanism, a swinging frame and a workpiece suspension frame, and the driving mechanism comprises a driving motor, a driving eccentric wheel, an adjusting rod, a linkage rocker and a driving shaft. The lifting mechanism comprises a lifting belt clamping plate assembly, a lifting rod, a lifting guide assembly, a vertical driving frame and a riding wheel assembly. When the driving shaft rotates, the lifting rod drives the swing frame to move up and down. The transverse moving mechanism comprises a linkage eccentric wheel, a linkage driving lever and a transverse cam groove plate, and the linkage driving lever drives the swing frame to move left and right when ascending and descending. The longitudinal moving mechanism comprises a longitudinal cam groove plate, a V seat fixing plate, a longitudinal moving guide rail and a guide rail support, and the V seat fixing plate longitudinally moves relative to the guide rail support. According to the invention, three-dimensional swinging of the workpiece can be realized, and the chemical nickel plating quality of semiconductor parts is improved.

The application belongs to the technical field of chemical production, and particularly relates to a chemical nickel plating wastewater treatment equipment. In the treatment process, repeated precipitation and filtration are needed, which leads to slow treatment efficiency. The following scheme is proposed, which comprises a treatment cylinder, the lower side of the treatment cylinder is fixedly connected with a cylinder seat, a water inlet is formed in the treatment cylinder, a water inlet pipe is fixedly connected in the water inlet, a water outlet is formed in the bottom of the treatment cylinder, a drain pipe is fixedly connected in the water outlet, valves are arranged on the water inlet pipe and the drain pipe, and a top plate is arranged above the treatment cylinder. The disclosed chemical nickel plating wastewater treatment equipment utilizes the magnetism of nickel to adsorb solid nickel in wastewater, so that the solid nickel in wastewater can be conveniently adsorbed and removed. The electromagnetic iron is electrified to generate magnetic properties, so that the solid nickel can be quickly adsorbed and subsequently separated and separated. The solid nickel does not need to be repeatedly filtered, and the recovery efficiency of the solid nickel in wastewater is improved.

The invention discloses a surface nickel plating process for quartz glass, and aims to improve the adhesive force, uniformity and functional performance of a nickel plating layer, simplify the process flow and meet the environmental protection requirement. The process comprises the following steps: firstly, cleaning and roughening the surface of quartz glass, removing surface impurities through a 2% sodium hydroxide solution and a 10% hydrofluoric acid solution, and forming a microscopic rough structure; then treating in a sensitizing solution composed of stannous chloride and hydrochloric acid to enable the surface to adsorb stannous ions; then treating in an activating solution composed of palladium chloride and hydrochloric acid to form a catalytic active layer; then carrying out nickel plating reaction in a chemical nickel plating solution with the temperature of 85 DEG C and the pH value of 4.5, wherein the thickness of a plating layer is 5-10 microns; and finally, the waste liquid is neutralized and flocculated to realize environment-friendly discharge. The process is simple and convenient to operate, and the generated nickel coating is uniform and compact, has excellent conductivity and corrosion resistance, and can be widely applied to the fields of electronics, optics and chemistry.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.

The invention discloses a Kovar alloy electroplating method. The method comprises the steps that a Kovar alloy base material is pretreated; the pretreated kovar alloy base material is immersed in an acidic copper sulfate plating solution for electrolytic copper plating, so that a copper plating layer is formed on the surface of the kovar alloy base material; immersing the kovar alloy on which the copper plating layer is formed into a chemical nickel plating solution so as to form a nickel plating layer on the surface of the copper plating layer; and immersing the kovar alloy base material on which the nickel plating layer is formed into a nanogold seed crystal solution so as to form a soft gold plating layer on the surface of the nickel plating layer. The coating quality of the kovar alloy can be improved.

The invention discloses a macro preparation method of a microtube-based electromagnetic shielding material. The method comprises the following steps: performing surface treatment on carbon fibers, performing chemical nickel plating, performing high-temperature heat treatment to oxidize a plating layer to form a nickel oxide shell layer, and performing oxygenolysis on an internal carbon fiber core to form a one-dimensional hollow nickel oxide microtube structure; continuous enhanced conductivity of the inner and outer surfaces of the one-dimensional hollow microtube is formed through surface chemical copper plating, and a second nickel layer is formed through contact electroplating, so that the magnetic loss and oxidation resistance of the one-dimensional structure are improved, and the one-dimensional oxide microtube-based electromagnetic shielding material is obtained. The material has good extreme environment resistance and electromagnetic shielding performance and can be applied to plastic-based functional parts or functional paint scenes based on injection molding, and a composite material prepared based on the material has excellent electromagnetic shielding effectiveness in a broadband range and meanwhile has good machinability and oxidation resistance.

The invention belongs to the technical field of composite material casting, and relates to an aluminum / iron double-metal composite material based on a chemical nickel-plating layer and a preparation method of the aluminum / iron double-metal composite material based on the chemical nickel-plating layer, a nickel layer with uniform thickness is preset on the surface of an iron base material in advance in a chemical plating mode, and the effect of thoroughly isolating direct contact between an aluminum material melt and the solid iron base material is achieved. The interface phase composition regulation and control of the aluminum / iron bimetallic composite material can be realized, the interface defects are greatly reduced, and the interface bonding strength is improved.

The invention discloses a device and a method for electrochemically treating chemical nickel plating waste liquid. The device comprises a pH regulating tank, an electrolytic tank, a reaction tank, a sedimentation tank and a clean water tank which are sequentially connected through pipelines, stirring devices are arranged in the pH adjusting tank and the reaction tank; an electrode mechanism and an air stirring coil pipe are arranged in the electrolytic tank, and the air stirring coil pipe is arranged below the electrode mechanism and is connected with the air compressor through a pipeline; the electrode mechanism is electrically connected with the direct-current power supply; an inclined tube filler is arranged in the sedimentation tank; a water flow control valve and a water pump are arranged on a pipeline between every two adjacent pool bodies; the method comprises the steps that under the action of a direct-current electric field, organic pollutants are removed through anode electrooxidation, nickel ions are recycled through cathode electroreduction deposition, and clear water reaching the standard is obtained after chemical treatment and precipitation separation. Under the electrolysis condition of 2-5 h, the nickel ion removal rate reaches 99.9%, the concentration is reduced to be smaller than 1 ppm, COD is remarkably reduced, and efficient purification and resource utilization of the chemical nickel plating waste liquid are achieved.

The invention discloses a cooling fin chemical nickel plating automatic welding production device, and relates to the technical field of cooling fin welding. Comprising cooling fins, a feeding gripper, a discharging gripper, a rotating table and a welding machine, a plurality of positioning units are arranged on the rotating table in the circumferential direction, each positioning unit comprises a base and a lifting plate, a mounting groove is formed in the upper surface of each base, and a cooling air opening is formed in the inner side wall of each mounting groove; a positioning pin and a plurality of clamping blocks are fixedly arranged on the upper surface of the lifting plate, pressure sensors are embedded in the outer surfaces of the positioning pin and the clamping blocks, and an electromagnetic assembly is arranged in the positioning pin and used for controlling the diameter change of the positioning pin; the clamping block is connected with an adjusting assembly used for adjusting the position of the clamping block. The contact pressure of the cooling fin is detected in real time, self-adaptive clamping and positioning are achieved, and a chemical nickel plating layer is prevented from being scratched; the arranged cooling air openings blow air towards gaps of the fins, internal cooling media circulate, the temperature of a welding area is effectively reduced, and fin softening and substrate warping are restrained.

A sleeve includes a first surface treated portion treated with electroless nickel plating at least on both ends in an axial direction, in an inner circumferential surface thereof. The first surface treated portion has an inner diameter smaller than other portions of the inner circumferential surface by a film thickness of first plating, and slidably supports a spool valve element.

The invention relates to the technical field of image processing, in particular to a method for identifying surface defects of a precision part treated by an aluminum alloy chemical nickel plating process, which comprises the following steps: acquiring a grayscale image of a nickel-plated part to be detected, uniformly dividing the grayscale image into nickel-plated areas with preset sizes, performing pyramid down-sampling on any nickel-plated area, and calculating the surface defects of the nickel-plated part to be detected; a first preset number of scale images are obtained, the total texture feature value of any nickel plating area is obtained according to the texture distribution feature of each scale image, and whether a suspected skip plating area exists in the grayscale image or not is judged according to the total texture feature value of each nickel plating area; if the suspected skip plating areas exist in the gray level image, obtaining a defect judgment result of each suspected skip plating area according to the texture directivity feature and the texture periodic feature of each suspected skip plating area; the defect judgment result of each suspected skip plating area in the gray level image is utilized to perform defect identification on the to-be-detected nickel plating part, so that the accuracy and reliability of skip plating defect detection are improved.

The invention discloses a high-irradiation shielding granular material and a preparation method thereof, and belongs to the technical field of shielding materials. The invention aims to solve the problems that the existing radiation shielding material cannot have the gamma ray shielding performance, good flexibility, convenient constructability and the like. The particle material is composed of glass microspheres, a chemical nickel-plating layer, an electroplated lead layer, an electroplated tungsten layer and an electroplated tantalum layer. And the thickness of each layer is controlled to be 20 microns. According to the method, nickel is deposited on the surfaces of glass microspheres through a chemical nickel plating method, and then an electroplating lead layer, an electroplating tungsten layer and an electroplating tantalum layer are sequentially deposited through an electroplating method. The glass microspheres are pretreated, and nickel is deposited on the surfaces of the glass microspheres by using a chemical nickel plating method, so that other electroplated layers can be deposited on the surfaces of the glass microspheres more easily; wherein the electroplated lead layer and the electroplated tungsten layer have the characteristic of good gamma ray and neutron composite shielding performance; the metal tantalum layer has good gamma ray shielding performance and excellent mechanical property.

The invention provides a repairing method suitable for an engine case connecting bolt. The method comprises the following steps that S1, chemical stripping and fine treatment are conducted on the connecting bolt, an old plating layer on the surface of the connecting bolt is removed, and the surface of the connecting bolt is evenly coarsened; s2, a nitric acid-phosphoric acid binary acid system is adopted to conduct soaking treatment on the connecting bolt treated in the step S1 at the normal temperature, and a passive film on the surface of the connecting bolt is removed; s3, the connecting bolt treated in the step S2 is subjected to chemical nickel plating; and S4, the connecting bolt treated in the step S3 is subjected to hot water stabilization and dehydrogenation treatment, and the repaired connecting bolt is obtained. The invention provides a set of process from old plating layer removal, passive film removal and chemical nickel plating to hydrogen brittleness avoidance, so that the whole repair process is highly controllable, the product quality is stable and repeatable, and the problem of batch scrapping caused by batch difference and process uncontrollability in the prior art is solved.

This provides an improvement to the rewiring line structure of die packaging. [Solution] This invention provides an improvement to the redistribution line structure of die packaging, which mainly consists of one die, multiple redistribution lines, and multiple nickel-gold layers. Each redistribution line is formed on the surface of the die by being stretched horizontally using a redistribution layer (RDL) process. Each nickel-gold layer is formed on the surface of each redistribution line by being plated using a chemical nickel-gold (ENIG) process. Each nickel-gold layer consists of a nickel (Ni) layer and a gold (Au) layer, with the gold layer positioned on top of the nickel layer. This structure effectively solves the problems of uneven thickness and process complexity that occur in conventional die packaging when nickel-gold layers are formed using an electroplating process, and the RDL process can improve the design space and reliability of the die packaging.

The invention belongs to the technical field of chemical plating, and particularly relates to a copper-based chemical nickel plating method. A copper substrate is placed in a preimpregnation agent to be subjected to preimpregnation treatment, a preimpregnated copper substrate is obtained, and the preimpregnation agent comprises an amino silane coupling agent; the copper substrate subjected to presoaking treatment is placed in a palladium activating agent to be subjected to activating treatment, an activated copper substrate is obtained, and the palladium activating agent comprises palladium salt; and the activated copper substrate is placed in a chemical nickel plating solution to be subjected to chemical nickel plating, and a nickel-containing plating layer is obtained through deposition on the surface of the copper substrate. According to the method, the copper substrate is sequentially subjected to presoaking treatment and activating treatment, the traditional skip plating and diffusion plating problems are solved, the nickel-containing plating layer on the surface of the copper substrate grows faster, the flatness of the nickel-containing plating layer is more compact, and the method has good industrial application prospects.

The application discloses a method for recovering nickel and phosphorus from electroless nickel plating waste liquid, and the method comprises the following steps: preparing nickel sulfate through extraction and stripping, and preparing iron phosphate through Fenton oxidation and precipitation; compared with the prior art, the method is characterized in that the waste liquid is pretreated, insoluble solid particles in the waste liquid are removed, emulsification of an extractant caused by particles in a subsequent extraction process is prevented, damage to extraction oil is avoided, and the extraction efficiency is ensured; in addition, the extractant used in the method can be recycled, secondary pollution is avoided, and the method is economical and practical; in the method, main pollutants in waste water are all converted into important chemical raw materials, recycling is realized, sulfuric acid and Fenton reagents used are all converted into terminal products, difficulty of end waste water treatment is not increased, clean production is met, the treatment cost is low, the product has high added value, and the method has strong practicability.

This invention relates to the field of electroless plating technology, and more particularly to a low-phosphorus electroless nickel plating solution and a method for nickel plating on an aluminum alloy substrate. The low-phosphorus electroless nickel plating solution comprises the following components by mass concentration: a nickel ion source in the form of Ni... 2+ Calculated as 1.0~5.0 g / L; hypophosphite as H2PO2 ‑ The concentrations are calculated as follows: 20–45 g / L; glycine 5–40 g / L, gluconate 5–60 g / L; polyaspartic acid and / or its salts 0.2–5.0 g / L; pH buffer 2–25 g / L; alkyl glycosides 0.05–1.0 g / L; iodate stabilizer, in IO3... ‑ The concentration is calculated to be 0.2~5.0 mg / L. This invention maintains a high deposition rate and significantly improves the tolerance of by-products in the bath solution under low nickel ion concentration conditions. It is also free of heavy metals and sulfur-containing organic stabilizers, reducing the metal load and environmental risk of the waste liquid. It is suitable for various aluminum alloy matrices treated with double zinc replacement.

The invention discloses a machining method for nickel plating of aviation titanium alloy parts, and belongs to the technical field of part machining. The method comprises the following steps: roughly machining a titanium alloy part raw material; the stress of the part is eliminated through vacuum heat treatment or natural aging; the titanium alloy part is subjected to semi-finish machining; the stress of the part is eliminated through vacuum heat treatment or natural aging; the titanium alloy part is machined to a state required by a drawing; performing corresponding flaw detection on the titanium alloy part according to drawing requirements; the titanium alloy part is subjected to chemical nickel plating according to drawing requirements; the titanium alloy part is manually polished and repaired; the titanium alloy part is subjected to size inspection, and it is guaranteed that the titanium alloy part meets the drawing requirement. Under the condition that the material performance of the part is guaranteed, internal stress generated by machining is eliminated, stress deformation in the nickel plating process is reduced, and it is guaranteed that the size is qualified after nickel plating; and the machining mode of polishing and repairing the nickel plating layer is defined, and the dimensional precision and performance requirements of the part after nickel plating are ensured.

The invention discloses an anti-corrosion process for chemically plating nickel and gold on a gold-silver alloy or pure silver bump, which is characterized by comprising the following steps of: forming a metal bump structure on the surface of a substrate; performing patterning processing on the metal bump structure to form a metal bump of a target pattern; performing pretreatment on the metal bump, wherein the pretreatment comprises acid pickling, micro-etching, dilute nitric acid cleaning and deionized water rinsing; performing zinc replacement treatment on the pretreated metal bump for at least two times to activate the surface; the activated metal bump is placed in a chemical nickel plating solution for reaction, so that a continuous nickel metal layer is formed on the surface of the metal bump; after the nickel layer is formed, the nickel layer is further placed in a chemical gold plating solution for reaction, and a continuous metal gold layer is formed on the surface of the nickel layer; and rinsing and drying the gold-plated structure to obtain the metal bump structure with the anti-corrosion performance.

The utility model provides a chemical nickel plating wastewater treatment and nickel and phosphorus resourceful treatment device which is characterized by comprising an oxidation unit, a phosphorus recovery unit and a nickel recovery unit, the oxidation unit comprises a reaction tank; the phosphorus recovery unit consists of a first reaction tank, a second reaction tank and a first sedimentation tank; and the nickel recovery unit consists of a third reaction tank, a fourth reaction tank and a second sedimentation tank. A water inlet pipe is arranged at the lower part of the reaction tank; a first dosing pipe and a second dosing pipe are arranged at the top of the reaction tank; a blow-down pipe is arranged at the bottom of the reaction tank; and baffle plates are sequentially and alternately arranged up and down in the reaction tank. According to the utility model, resource utilization of phosphorus and nickel can be realized on the basis of realizing that all indexes of treated effluent reach the standard.

In embodiments herein, a surface finish (SF) is formed on conductive contacts of a package substrate for connection to an embedded interconnect bridge circuitry die. In some embodiments, the SF may be electroless nickel-electroless palladium-immersion gold (ENEPIG). In other embodiments, the SF may be immersion gold-electroless palladium-immersion gold (IGEPIG). In other embodiments, the SF may include a layer of electrolytic palladium-gold on a layer of indium or on a layer of cobalt-iron.