12267 results about "Metallic Nickel" patented technology

A method of forming a metal cap over a conductive interconnect in a chalcogenide-based memory device is provided and includes, forming a layer of a first conductive material over a substrate, depositing an insulating layer over the first conductive material and the substrate, forming an opening in the insulating layer to expose at least a portion of the first conductive material, depositing a second conductive material over the insulating layer and within the opening, removing portions of the second conductive material to form a conductive area within the opening, recessing the conductive area within the opening to a level below an upper surface of the insulating layer, forming a cap of a third conductive material over the recessed conductive area within the opening, the third conductive material selected from the group consisting of cobalt, silver, gold, copper, nickel, palladium, platinum, and alloys thereof, depositing a stack of a chalcogenide based memory cell material over the cap, and depositing a conductive material over the chalcogenide stack.

An improved wire bonding process for copper-metallized integrated circuits is provided by a nickel layer that acts as a barrier against up-diffusing copper. In accordance with the present invention the nickel bath is placed and remains in hydrogen saturation by providing a piece of metal that remains in the nickel plating tank before and during the plating process.

An anode structure for lithium batteries includes nanofeatured silicon particulates dispersed in a conductive network. The particulates are preferably made from metallurgical grade silicon powder via HF/HNO₃ acid treatment, yielding crystallite sizes from about 1 to 20 nm and pore sizes from about 1 to 100 nm. Surfaces of the particles may be terminated with selected chemical species to further modify the anode performance characteristics. The conductive network is preferably a carbonaceous material or composite, but it may alternatively contain conductive ceramics such as TiN or B₄C. The anode structure may further contain a current collector of copper or nickel mesh or foil.

Embodiments as described herein provide methods for depositing a material on a substrate during electroless deposition processes, as well as compositions of the electroless deposition solutions. In one embodiment, the substrate contains a contact aperture having an exposed silicon contact surface. In another embodiment, the substrate contains a contact aperture having an exposed silicide contact surface. The apertures are filled with a metal contact material by exposing the substrate to an electroless deposition process. The metal contact material may contain a cobalt material, a nickel material, or alloys thereof. Prior to filling the apertures, the substrate may be exposed to a variety of pretreatment processes, such as preclean processes and activations processes. A preclean process may remove organic residues, native oxides, and other contaminants during a wet clean process or a plasma etch process. Embodiments of the process also provide the deposition of additional layers, such as a capping layer.

The invention includes processes for combined polymer surface treatment and metal deposition. Processes of the invention include forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be suitably oxidized to a higher oxidation state electrochemically. Exposing a part to be plated (such as an organic resin, e.g. a printed circuit board substrate) to the solution enables reactive hydroxyl species (e.g. hydroxyl radicals) to be generated and to texture the polymer surface. Such texturing facilitates good plated metal adhesion. As part of this contacting process sufficient time is allowed for both surface texturing to take place and for the oxidized metal activator to adsorb onto said part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form, or a lower oxidation state. That reduction can result in the formation of metallic catalytic material over the surface of the part. The reduced metal activator can then function to catalyze the electroless deposition of metal such as copper from solution by contacting the part with the plating solution.

A frangible projectile with a specific gravity similar to a lead projectile. The projectile comprises 34-94%, by weight, binder. The binder comprises poly ether block amide resin. The projectile further comprises 6-66%, by weight, ballast. The ballast comprises at least one member selected from a group consisting of tungsten, tungsten carbide, molybdenum, tantalum, ferro-tungsten, copper, bismuth, iron, steel, brass, aluminum bronze, beryllium copper, tin, aluminum, titanium, zinc, nickel silver alloy, cupronickel and nickel. The projectile can be prepared with a particularly preferred specific gravity of 5-14 and more preferably 11-11.5.

Implementations described herein protect a chamber components from corrosive cleaning gases used at high temperatures. In one embodiment, a chamber component includes at least a bellows that includes a top mounting flange coupled to a bottom mounting flange by a tubular accordion structure. A coating is disposed on an exterior surface of at least the tubular accordion structure. The coating includes of at least one of polytetrafluoroethylene, parylene C, parylene D, diamond-like carbon (DLC), yttria stabilized zirconia, nickel, alumina, or aluminum silicon magnesium yttrium oxygen compound. In one embodiment, the chamber component is a valve having an internal bellows.

A method for treating electronic components made of copper, nickel or alloys thereof or with materials such as brass or plated therewith and includes the steps of arranging the components in a treatment chamber, generating a vacuum in the treatment chamber, introducing oxygen into the treatment chamber, providing a pressure ranging between 10⁻¹ and 50 mbar in the treatment chamber and exciting a plasma in the chamber, allowing the oxygen radicals to act on the components, generating a vacuum in the treatment chamber, introducing hydrogen into the treatment chamber, providing a pressure ranging between 10⁻¹ and 50 mbar in the treatment chamber and exciting a plasma in the chamber and allowing the hydrogen radicals to act on the components.

The present invention relates to compositions and methods for forming a bit body for an earth-boring bit. The bit body may comprise hard particles, wherein the hard particles comprise at least one carbide, nitride, boride, and oxide and solid solutions thereof, and a binder binding together the hard particles. The binder may comprise at least one metal selected from cobalt, nickel, and iron, and at least one melting point reducing constituent selected from a transition metal carbide in the range of 30 to 60 weight percent, boron up to 10 weight percent, silicon up to 20 weight percent, chromium up to 20 weight percent, and manganese up to 25 weight percent, wherein the weight percentages are based on the total weight of the binder. In addition, the hard particles may comprise at least one of (i) cast carbide (WC+W2C) particles, (ii) transition metal carbide particles selected from the carbides of titanium, chromium, vanadium, zirconium, hafnium, tantalum, molybdenum, niobium, and tungsten, and (iii) sintered cemented carbide particles.

Various techniques for the fabrication of highly accurate master molds with precisely defined microstructures for use in plastic replication using injection molding, hot embossing, or casting techniques are disclosed herein. Three different fabrication processes used for master mold fabrication are disclosed wherein one of the processes is a combination of the other two processes. In an embodiment of the first process, a two-step electroplating approach is used wherein one of the metals forms the microstructures and the second metal is used as a sacrificial support layer. Following electroplating, the exact height of the microstructures is defined using a chemical mechanical polishing process. In an embodiment of the second process, a modified electroforming process is used for master mold fabrication. The specific modifications include the use of Nickel-Iron (80:20) as a structural component of the master mold, and the use of a higher saccharin concentration in the electroplating bath to reduce tensile stress during plating and electroforming on the top as well as sides of the dummy substrate to prevent peel off of the electroform. The electroforming process is also well suited towards the fabrication of microstructures with non-rectangular cross sectional profiles. Also disclosed is an embodiment of a simple fabrication process using direct deposition of a curable liquid molding material combined with the electroforming process. Finally, an embodiment of a third fabrication process combines the meritorious features of the first two approaches and is used to fabricate a master mold using a combination of the two-step electroplating plus chemical mechanical polishing approach and the electroforming approach to fabricate highly accurate master molds with precisely defined microstructures. The microstructures are an integral part of the master mold and hence the master mold is more robust and well suited for high volume production of plastic MEMS devices through replication techniques such as injection molding.

A rod for interconnecting at least two pedicle screws implanted in adjacent vertebrae of a spine and/or the rod itself includes a metal or metal alloy of substantial nickel content; and an outer layer of ceramic coating the metal such that exposure of the nickel to a patient is inhibited.

A 3D Printing Rapid Prototyping process using Al/Mg particles coated with a metal (i.e. copper, nickel, zinc, or tin) that (1) prevents oxidation of the Al/Mg particles, and (2) either alone, or when alloyed with the aluminum or magnesium core metal, melts below the liquidus temperature of the core.

An electrode substrate is formed by mechanically processing a nickel foil so as to be made three dimensional through the creation of concave and convex parts, and then, this substrate is filled with active material or the like so that an electrode is manufactured, wherein the above described concave and convex parts are rolling pressed so as to incline in one direction. Furthermore, an electrode for secondary battery is formed by using the above described method.

Certain example embodiments relate to a coated article including at least one infrared (IR) reflecting layer of a material such as silver or the like in a low-E coating, and methods of making the same. In certain cases, at least one layer of the coating is of or includes nickel and/or titanium (e.g., NixTiyOz). The provision of a layer including nickel titanium and/or an oxide thereof may permit a layer to be used that has good adhesion to the IR reflecting layer, and reduced absorption of visible light (resulting in a coated article with a higher visible transmission). When a layer including nickel titanium oxide is provided directly over and/or under the IR reflecting layer (e.g., as a barrier layer), this may result in improved chemical and mechanical durability. Thus, visible transmission may be improved if desired, without compromising durability; or, durability may simply be increased.

A multilayer electronic component includes a plurality of dielectric layers interleaved with a plurality of internal electrodes. Internal and/or external anchor tabs may also be selectively interleaved with the dielectric layers. Portions of the internal electrodes and anchor tabs are exposed along the periphery of the electronic component in respective groups. Each exposed portion is within a predetermined distance from other exposed portions in a given group such that termination structures may be formed by deposition and controlled bridging of a thin-film plated material among selected of the exposed internal conductive elements. Electrolytic plating may be employed in conjunction with optional cleaning and annealing steps to form directly plated portions of copper, nickel or other conductive material. Once an initial thin-film metal is directly plated to a component periphery, additional portions of different materials may be plated thereon.

Interconnection elements for electronic components, exhibiting desirable mechanical characteristic (such as resiliency, for making pressure contacts) are formed by using a shaping tool (512) to shape an elongate core element (502) of a soft material (such as gold or soft copper wire) to have a springable shape (including cantilever beam, S-shape, U-shape), and overcoating the shaped core element with a hard material (such as nickel and its alloys), to impart to desired spring (resilient) characteristic to the resulting composite interconnection element. A final overcoat of a material having superior electrical qualities (e.g., electrical conductivity and/or solderability) may be applied to the composite interconnection element. The resulting interconnection elements may be mounted to a variety of electronic components, including directly to semiconductor dies and wafers (in which case the overcoat material anchors the composite interconnection element to a terminal (or the like) on the electronic component), may be mounted to support substrates for use as interposers and may be mounted to substrates for use as probe cards or probe card inserts. The shaping tool may be an anvil (622) and a die (624), and may nick or sever successive shaped portions of the elongate elements, and the elongate element may be of an inherently hard (springy) material. Methods of fabricating interconnection elements on sacrificial substrates are described. Methods of fabricating tip structures (258) and contact tips at the end of interconnection elements are also described.

This invention relates to cutting inserts for earth boring bits comprising a cutting zone, wherein the cutting zone comprises first cemented hard particles and a body zone, wherein the body zone comprises second cemented hard particles. The first cemented hard particles may differ in at least one property from the second cemented hard particles. As used herein, the cemented hard particles means a material comprising hard particles in a binder. The hard particles may be at least one of a carbide, a nitride, a boride, a silicide, an oxide, and solid solutions thereof and the binder may be at least one metal selected from cobalt, nickel, iron and alloys of cobalt, nickel or iron.

The invention discloses a catalyst for preparing alcohol by acetic ester hydrogenation as well as a preparation method and an application thereof, which is characterized in that the main catalyst of the catalyst is copper or copper oxide or a mixture of the copper and the copper oxide, and the cocatalyst can be also added, wherein the cocatalyst is one or more of oxides of zinc, manganese, chromium, calcium, barium, iron, nickel and magnesium; and the carrier is alumina or silica sol. The catalyst has high activity and high selectivity under the condition of low temperature and low pressure, thus greatly reducing the investment cost of permanent plants, lowering production energy consumption, being extremely beneficial for the industrial production, and having good stability and long service life. The catalyst of the invention is used to cause percent conversion of a reaction of converting the acetic ester into the alcohol is more than or equal to 80% and the selectivity of the alcohol is more than or equal to 95%.

An embolization device for occluding a body cavity includes one or more elongated, expansible, hydrophilic embolizing elements non-releasably carried along the length of an elongated filamentous carrier that is preferably made of a very thin, highly flexible filament or microcoil of nickel/titanium alloy. At least one expansile embolizing element is non-releasably attached to the carrier. A first embodiment includes a plurality of embolizing elements fixed to the carrier at spaced-apart intervals along its length. In second, third and fourth embodiments, an elongate, continuous, coaxial embolizing element is non-releasably fixed to the exterior surface of the carrier, extending along a substantial portion of the length of the carrier proximally from a distal tip, and optionally includes a lumenal reservoir for delivery of therapeutic agents. Exemplary methods for making these devices include skewering and molding the embolizing elements. In any of the embodiments, the embolizing elements may be made of a hydrophilic, macro-porous, polymeric, hydrogel foam material. In the second, third and fourth embodiments, the elongate embolizing element is preferably made of a porous, environmentally-sensitive, expansile hydrogel, which can optionally be made biodegradable and/or bioresorbable, having a rate of expansion that changes in response to a change in an environmental parameter, such as the pH or temperature of the environment.