2results about How to "Reduce connection resistance" patented technology

Provided is a method for manufacturing a circuit connection structure, including the steps of: interposing a circuit connection adhesive film containing conductive particles between a first circuit component having a first electrode and a second circuit component having a second electrode, and thermally compressing the first circuit component and the second circuit component to electrically connect the first electrode and the second electrode to each other, the circuit connection adhesive film including a first adhesive layer containing conductive particles and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component, the circuit connection adhesive film having a difference (Tmax-T1) between a reaction start temperature T1 and a reaction peak temperature Tmax obtained from a differential scanning calorimetry curve of 20°C or less.

This invention discloses a single-tube power chip with self-protection function and its connection structure, belonging to the field of power electronics technology. Addressing the failure risk of power modules exploding or catching fire under short-circuit conditions, the chip includes a chip body, electrodes, and a copper strip. The electrodes are positioned above the chip body, and the copper strip has a fusible aperture for melting and cutting off the circuit when overheated by short-circuit current. The copper strip and the electrodes are fixed together by a conductive connection layer. This invention employs a dual protection mechanism of software and hardware protection. The software protection responds rapidly within 0.1ms at the initial stage of a short circuit, while the hardware protection forcibly disconnects the circuit within 10ms via the copper strip's fusible aperture. Even if the software protection fails, the hardware protection still ensures system safety, achieving absolute safety protection against short-circuit interruption under 1000V high voltage. This completely avoids failures such as continuous arcing, explosion, and fire. The use of copper strip instead of traditional binding wire, combined with nano-silver sintering technology, significantly reduces the thermal resistance of the connection structure.