269results about How to "Reduce connection resistance" patented technology

A semiconductor device includes a semiconductor chip and a printed circuit board. Metal electrodes of the semiconductor chip and the internal connection terminals of the printed circuit board are electrically connected through the metallic joining via precious metal bumps. A melting point of a metal material constituting each of the metallic joining parts is equal to or higher than 275 degrees, and a space defined between the chip and the board is filled with resin (under fill) containing 50 vol % or more inorganic fillers.

A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

An inter-battery connection device for connecting terminals of two batteries (1a, 1b) arranged with their axes parallel to each other. The inter-battery connection device includes an inter-battery connection plate (11) that connects the battery case bottom (2) and the sealing plate (3) of the two batteries. The inter-battery connection plate (11) includes welding portions (4) at the ends of its base plate (6) for welding to the case bottom (2) and the sealing plate (3), respectively. An intermediate metal plate (7) is joined to the middle part of the base plate (6) between the welding portions (4, 4) to form an intermediate portion (5) having a greater thickness than each welding portion (4). The inter-battery connection device has reduced electric resistance while achieving improved weldability.

A battery pack (10) includes: a battery (1); a circuit substrate (5) having a charge/discharge safety circuit and arranged on one end face (3) of the battery; and an end case (6) in which an external connection terminal (7) is set. In this battery pack, the circuit substrate (5) is arranged inside the end case (6), and the end case (6) is secured to the battery by screws (12) with a screw head (12a) extending through and engaging with the end case (6) at both ends and tips of the screw (12) being engaged into the end face (3) at both ends of the battery (1). This achieves a compact battery pack with a reduced connection resistance, while achieving both high reliability and productivity.

In a secondary battery, a positive metal foil having a laminated portion in which parts of the metal foil are laminated in close contact with each other, and a positive electrode current collector terminal member has a contact portion placed in close contact with at least one side of the positive foil laminated portion in a lamination direction thereof The secondary battery is manufactured by welding the parts of the positive metal foil to each other and the positive foil laminated portion and the contact portion to each other by irradiation of an energy beam emitted to travel in the lamination direction while an irradiation site is moved.

A connecting bus bar 12 is formed from a negative opposing section 27 which is smaller in thickness than a closed end of a bottomed cylinder 13, partially has a negative weld plate section 27a to be welded to the closed end of a bottomed cylinder 13, and opposes the closed end of the bottomed cylinder 13; a positive opposing section 28 which is smaller in thickness than a seal plate 14, partially has a positive weld plate section 28a to be welded to the seal plate 14, and opposes the seal plates 14; and the coupling section 29 for connecting together the negative opposing section 27 and the positive opposing section 28. The connecting bus bar 12 is formed such that the connecting bus bar 12, which excludes the negative weld plate section 27a and the positive weld plate section 28a, becomes lower in thickness than a thinner one of the closed end of the bottomed cylinder 13 and the seal plate 14.

The present invention is a circuit connecting material used for the mutual connection of a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, and a circuit member in which electrodes and insulating layers are formed adjacent to each other on the surface of a board, with the edge parts and of the insulating layers being formed with a greater thickness than the electrodes on the basis of the main surfaces, wherein this circuit connecting material contains a bonding agent composition and conductive particles that have a mean particle size of 1 μm or greater but less than 10 μm and a hardness of 1.961 to 6.865 GPa, and this circuit connecting material exhibits a storage elastic modulus of 0.5 to 3 GPa at 40° C. and a mean coefficient of thermal expansion of 30 to 200 ppm/° C. at from 25° C. to 100° C. when subjected to the curing treatment.

Electronic component mounting structure (1) comprising electronic component (10) provided with a plurality of electrode terminals (10a), mounting substrate (12) provided with connector terminals (12a) in positions corresponding to electrode terminals (10a), wherein electrode terminal (10a) is connected to connector terminal (12a) via protrusion electrode (13) disposed on electrode terminal (10a) or connector terminal (12a), and protrusion electrode (13) includes at least conductive filler (13a) and photosensitive resin (13b), and varies in resin component crosslink density of photosensitive resin (13b) in the height direction of protrusion electrode (13).

An organic EL device includes an element region having a plurality of light-emitting elements, each including a first electrode disposed on a substrate body, a functional layer disposed above the first electrode, and a second electrode disposed above the functional layer; an enclosing member which surrounds the element region, covers the peripheral sides of the functional layers contained at least in the light-emitting elements located closest to the outer periphery of the substrate body among the plurality of light-emitting elements, and is disposed on the substrate body; a conductive member placed outside the enclosing member; and a connecting conductive member which is connected to the conductive member, extends from outside of the enclosing member over the enclosing member, and is connected to the second electrode. The connecting conductive member has a thickness larger than the thickness of the second electrode.

External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.

The invention relates to a power cell module connecting structure method. A power cell module is composed of a plurality of single cell groups, the adjacent power cell modules are connected through a connecting structure, the connecting structure comprises a PCB (printed circuit board), and the PCB plate is provided with more than one connector; the connector comprises a metal shell the two ends of which are communicated, the shell is internally provided with a spring piece, and a support ring is arranged between the spring piece and the inner wall of the shell and is used for fixing the spring piece and the shell; the PCB plate is provided with through holes, the shell of the connector is electrically connected with the PCB plate, and connecting holes are formed in the connector; and the contact pins of each single cell in a power cell module on the two sides of the PCB are inserted into the connecting holes of the corresponding connector, the contact pins are kept to be electrically connected with a spring piece in the connector, and the monomer cells in the adjacent power cell modules are electrically connected through the connector. According to the invention, the connector is used for replacing a bolted connection, the contact pins and the connector are elastically connected, and the structure can not generate a loose phenomenon because of vibration.

A ground terminal capable of being downsized and having good electrical connectability with a chassis. The ground terminal includes a ground terminal body formed into an annular shape as viewed in plan, and at least one connection portion formed integrally with the ground terminal body, the connection portion being bendable and extending from an inner circumference of the ground terminal body toward the center of the ground terminal. When a mounting screw used to mount a printed board mounted with the ground terminal to a chassis is inserted into the annular ground terminal body and a mounting hole of the printed board, the connection portion of the ground terminal is bent in the mounting hole to be brought in contact with the chassis.

A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.

A touch panel according to the embodiment includes a substrate; a first electrode formed on the substrate in a first direction and including a plurality of sensor parts and connection parts connecting the sensor parts with each other; and a second electrode formed in a second direction crossing the first direction while being insulated from the first electrode and including a plurality of sensor parts and connection parts connecting the sensor parts with each other. The sensor parts and the connection parts include transparent conductive materials, and the connection parts have resistance lower than resistance of the sensor parts in at least one of the first and second electrodes.

In a preferred embodiment of the present invention, first MOS transistors connected to first source electrodes and second MOS transistors connected to second source electrodes are arranged alternately next to each other on one chip. Different potentials are applied respectively to the first source electrodes and to the second source electrodes, and both of the MOS transistors are controlled with respect to an ON or OFF state by one gate terminal. Currents flow along surroundings of trenches, whereby on-resistance is reduced.

An organic electroluminescent device includes a pixel region in which a plurality of pixels is disposed on a support substrate, each pixel having an electroluminescent element in which at least a first electrode layer, a light-emitting layer, and a second electrode layer are laminated in that order at an upper layer side of an insulating film; a first conductive pattern portion provided at a lower layer side of the insulating film for applying a potential to the second electrode layer; and a second conductive pattern portion which is composed of a conductive film having a sheet resistance lower than that of the second electrode layer and which is provided at the upper layer side of the insulating film to connect the second electrode layer to the first conductive pattern portion. In this organic EL device, the second conductive pattern portion has a third conductive pattern portion which is provided on an upper surface of the first conductive pattern portion at a contact portion composed of a non-forming region of the insulating film and which is in contact with the first pattern portion.

A flexible solar cell is achieved which has a high photoelectric conversion efficiency and no aged deterioration. A cell 10 (unit cell) is formed as a unit, comprising: a lower electrode layer 2 (Mo electrode layer) formed on a flexible mica sheet substrate 1 (substrate); a light absorber layer 3 (CIGS light absorber layer) which contains copper indium gallium selenide; a highly resistant buffer layer thin film 4 formed of InS, ZnS, CdS, or the like on the light absorber layer 3; and an upper electrode layer 5 (TCO) formed of ZuOAl or the like, and furthermore, a contact electrode section 6 for connecting between the upper electrode layer 5 and the lower electrode layer 2 is formed in order to connect a plurality of unit cells 10 in series. The contact electrode section 6 has a Cu/In ratio higher than that of the light absorber layer 3, and in other words, has less In contained therein to have a property of p+ (plus) type or a conductor relative to the light absorber layer 3 which is a p-type semiconductor.