11results about How to "Reduce connection resistance" patented technology

The utility model discloses a short circuit piece, a motor and a household electrical appliance, the short circuit piece is used for the motor, the motor is provided with a first connection point and a second connection point, the short circuit piece comprises a first terminal and a second terminal, the first terminal is electrically connected with the first connection point, and the second terminal is electrically connected with the second connection point; the short circuit piece further comprises an electric conductor which is arranged between the first terminal and the second terminal and is integrally connected with the first terminal and the second terminal. According to the utility model, the long-strip-shaped metal conductor is arranged, the circular first terminal and the circular second terminal are arranged on the conductor, and the bending part is matched to be attached to the connecting point of the motor, so that the purposes of attractive and neat wiring, reliable short-circuit connection and economical and practical price are achieved.

An IGBT bidirectional switch module disclosed by the present invention comprises a heat dissipation plate, a conductive sheet, one or more chip sets, a CLIP structure, signal terminals and power supply terminals, the signal terminals comprise first to fourth signal terminals, the power supply terminals comprise first to third power supply terminals, the chip sets are welded on the conductive sheet and comprise first and second IGBT chips, first and second diode chips, and the first and second diode chips are welded on the conductive sheet. The CLIP structure is a copper conducting strip and is welded on the electrode, the power supply terminal, the signal terminal and the conducting strip of the chipset through solder paste, the first diode chip, the second diode chip and the corresponding IGBT chips form a follow current loop, the first signal terminal and the second signal terminal are electrically connected with the G poles of the first IGBT chip and the second IGBT chip, the third signal terminal and the fourth signal terminal are electrically connected with the E poles of the first IGBT chip and the second IGBT chip, and the third signal terminal and the fourth signal terminal are electrically connected with the E poles of the first IGBT chip and the second IGBT chip. The first power supply terminal and the second power supply terminal are electrically connected with C poles of the first IGBT chip and the second IGBT chip, and the third power supply terminal is electrically connected with E poles of the first IGBT chip and the second IGBT chip. Compared with the prior art, the LED lamp has a good heat dissipation effect and can bear higher current.

The invention discloses an application and method of Tween 80 combined immobilization technology enhanced microorganisms in degradation of naphthalene pollution in water, the main body of the combined immobilization technology is SA / CS at Tween 80 hydrogel microspheres loaded with NM-1 flora, and the NM-1 flora is halotolerant bacteria obtained by enrichment and domestication from deep-sea sediments of a certain sea ditch. The SA / CS at Tween 80 microspheres are formed by crosslinking sodium alginate (SA), chitosan (CS) and Tween 80, hydroxyl functional groups of the Tween 80 and SA / CS are crosslinked to enhance the mechanical strength of the microspheres and regulate and control the pore structure to improve the mass transfer efficiency, hydrophobic-CH functional groups at the end positions of the Tween 80 strengthen the adsorption capacity to naphthalene, meanwhile, a co-crosslinking structure at the interface of the SA / CS at Tween 80 hydrogel microspheres forms a biochemical metabolic reaction buffer area, and the adsorption capacity to naphthalene is improved. The direct toxicity stress of the high-concentration naphthalene on the flora is effectively avoided, and the effective biological removal of the high-concentration naphthalene is realized. The SA / CS-coated Tween 80 hydrogel microspheres prepared by the invention can effectively maintain the efficient metabolic activity and degradation efficiency of the loaded NM-1 flora, and show excellent cycle stability and good engineering application potential.

The utility model provides a contact device, a relay and electric equipment. Relates to the technical field of electronic devices. The contact device comprises a contact body, a contact piece and a connecting piece. The contact element is connected with an external circuit; one of the contact piece and the contact body is a copper piece, and the other one of the contact piece and the contact body is an aluminum piece; the connecting piece is arranged between the contact body and the contact piece. The contact body and the contact piece are connected into a whole through the connecting piece, so that the problems of corrosion of a primary battery and difficult combination caused by direct contact of the contact piece and the contact body are avoided, the conductivity between the contact piece and the contact body is ensured, the connection strength of the contact piece and the contact body is improved, the service life of the contact device is prolonged, and the service life of the contact device is prolonged. The connection resistance between the contact device and the busbar is reduced, and the use performance of the contact device is improved.

The invention discloses a manufacturing method of an HBT (Heterojunction Bipolar Transistor) device, which comprises the following steps of: providing a substrate, forming an isolating layer in the substrate, forming a first dielectric layer on the substrate and the isolating layer, forming a first polycrystalline silicon layer on the first dielectric layer, forming a second dielectric layer on the first polycrystalline silicon layer, and forming a third dielectric layer on the second dielectric layer, a fourth dielectric layer is formed on the third dielectric layer; the first polycrystalline silicon layer, the second dielectric layer, the third dielectric layer and the fourth dielectric layer of the first target region form a first groove in the first target region; forming a fifth dielectric layer on the side wall of the first groove; the fourth dielectric layer and the first dielectric layer below the first groove are removed, a second groove is formed below the first groove, the substrate at the bottom of the second groove is exposed, and the width of the second groove is larger than that of the first groove; growing a monocrystalline silicon layer in the second groove; removing the fifth dielectric layer on the side wall of the first groove; and filling a germanium-silicon layer in the first groove and the second groove.

Provided is a method for manufacturing a circuit connection structure, including the steps of: interposing a circuit connection adhesive film containing conductive particles between a first circuit component having a first electrode and a second circuit component having a second electrode, and thermally compressing the first circuit component and the second circuit component to electrically connect the first electrode and the second electrode to each other, the circuit connection adhesive film including a first adhesive layer containing conductive particles and a first thermosetting resin component, and a second adhesive layer provided on the first adhesive layer and containing a second thermosetting resin component, the circuit connection adhesive film having a difference (Tmax-T1) between a reaction start temperature T1 and a reaction peak temperature Tmax obtained from a differential scanning calorimetry curve of 20°C or less.

The utility model provides a cover plate assembly, a battery cell and a battery pack, and the cover plate assembly comprises a cover main body, insulating plastic and two insulating brackets, the connecting part extends in the first direction and is connected to the first face of the cover body, the first abutting part is arranged on the surface, away from the first face, of the connecting part and protrudes in the direction away from the first face, and the insulating support is arranged on the side edge, in the second direction, of the insulating plastic and is connected with the first face of the cover body. The insulating support is provided with a second abutting portion connected with the first abutting portion in the second direction, and the first direction is perpendicular to the second direction. According to the cover plate assembly provided by the embodiment of the invention, the size of the connecting sheet in the second direction can be reduced, the connecting resistance is reduced, the heat production power of the battery cell is reduced, the energy utilization rate is improved, the charging duration of the battery cell is shortened, and the discharging duration of the battery cell is prolonged, so that the size of the second stopping part in the second direction is increased; the supporting effect on the roll core body is improved, and the reliability of the battery core is improved.

The utility model provides a power module and an electric drive assembly. The power module comprises a plurality of chips, a plurality of copper bars, a first substrate and a vapor chamber. The plurality of chips are fixed with the first substrate in a silver sintering manner, so that excellent electric conduction and heat conduction properties are achieved, the fatigue effect is avoided, and the power cycle index and the reliability of the electric drive assembly are improved; the plurality of chips are arranged on the first substrate in pairs, and the plurality of copper bars are electrically connected with the two chips in one group respectively, so that the connection resistance between the chips is reduced, higher current magnitude and better heat-conducting property are synchronously obtained, and the power cycle index of the electric drive assembly and the heat distribution of the chips are improved. The vapor chamber is in heat conduction with the first substrate, so that heat generated by the chip is conducted to the vapor chamber through the first substrate, the heat conductivity coefficient is increased, and the heat conduction capability is improved. According to the power module and the electric drive assembly, the current output capacity under the same parallel chip condition is improved, the power density and reliability of the power module are improved, and the service life of the power module is prolonged.

This invention discloses a single-tube power chip with self-protection function and its connection structure, belonging to the field of power electronics technology. Addressing the failure risk of power modules exploding or catching fire under short-circuit conditions, the chip includes a chip body, electrodes, and a copper strip. The electrodes are positioned above the chip body, and the copper strip has a fusible aperture for melting and cutting off the circuit when overheated by short-circuit current. The copper strip and the electrodes are fixed together by a conductive connection layer. This invention employs a dual protection mechanism of software and hardware protection. The software protection responds rapidly within 0.1ms at the initial stage of a short circuit, while the hardware protection forcibly disconnects the circuit within 10ms via the copper strip's fusible aperture. Even if the software protection fails, the hardware protection still ensures system safety, achieving absolute safety protection against short-circuit interruption under 1000V high voltage. This completely avoids failures such as continuous arcing, explosion, and fire. The use of copper strip instead of traditional binding wire, combined with nano-silver sintering technology, significantly reduces the thermal resistance of the connection structure.

The present application provides a display panel and a display device. The auxiliary electrode is arranged in the same layer as the anode and is arranged opposite to the auxiliary electrode. The conductive isolation structure includes a conductive structure arranged in contact with the cathode. The conductive structure is connected to the auxiliary electrode via a pixel definition layer. The present application arranges an auxiliary electrode arranged opposite to the conductive isolation structure so as to connect the conductive structure to the auxiliary electrode via a pixel definition layer, and realize electrical connection between the cathode, the conductive structure and the auxiliary electrode, so that the auxiliary electrode, the conductive structure and the cathode cooperate to form a whole-surface cathode; further, due to the via connection between the conductive structure and the auxiliary electrode, the surface of the conductive structure and the thickness of the conductive structure are increased while the overlap area between the cathode and the conductive structure remains unchanged, thereby reducing the resistance at the conductive structure, and then reducing the connection resistance between adjacent cathodes, thereby effectively reducing the whole-surface resistance of the cathode and improving the whole-surface uniformity of the cathode.

The invention relates to a display panel, a preparation method thereof and a display device. The display panel includes: a substrate; the auxiliary electrode is arranged on one side of the substrate; the undercut structure is arranged on one side of the substrate; the undercut structure comprises a first sub-part and a second sub-part which are stacked in the direction away from the substrate; the end part of the second sub-part protrudes out of the side surface of the first sub-part, and the protruding end part of the second sub-part and the side surface of the first sub-part are encircled to form a bottom notch; the auxiliary structure is arranged at the bottom notch of the partial bottom cutting structure; the light-emitting functional layer is arranged on one side of the substrate; part of the light-emitting functional layer covers part of the auxiliary electrode and exposes part of the auxiliary electrode; and the first electrode is arranged on one side, far away from the substrate, of the light-emitting functional layer and extends to the exposed auxiliary electrode by means of the auxiliary structure so as to be electrically connected with the auxiliary electrode. The electric connection performance of the first electrode and the auxiliary electrode can be improved.