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90results about How to "Increase plate thickness" patented technology

Heat dissipation substrate for mounting electric component

To provide a heat dissipation substrate for mounting an electric component, said substrate making it possible, even in the case of a circuit using a power semiconductor, etc. in which a large current flows, to achieve an improvement in heat dissipation and a reduction in wiring resistance due to high power operation. This heat dissipation substrate 100(d) for mounting an electric component is formed such that: the substrate is composed of lead frames that are formed into a wiring pattern shape from a conductor plate, and an insulating material 130 that is provided between the lead frames 110; the lead frames have at least two types of thicknesses that are different from each other, wherein a thick lead frame 110H is used for a large current signal and a thin lead frame 110L is used for a small current signal; a component disposition surface plate surface of the lead frames 110 and a component disposition surface-side plate surface of the insulating material 130 form one continuous surface; and the plate surface of the lead frames on the rear surface of the component disposition surface and the plate surface of the insulating material on the rear surface side of the component disposition surface side are formed on the same plane so as to match the plate surface on the rear surface of the component disposition surface of the thickest lead frame from among the lead frames.
Owner:NSK LTD
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