Heat dissipation substrate for mounting electric component

Abstract

To provide a heat dissipation substrate for mounting an electric component, said substrate making it possible, even in the case of a circuit using a power semiconductor, etc. in which a large current flows, to achieve an improvement in heat dissipation and a reduction in wiring resistance due to high power operation. This heat dissipation substrate 100(d) for mounting an electric component is formed such that: the substrate is composed of lead frames that are formed into a wiring pattern shape from a conductor plate, and an insulating material 130 that is provided between the lead frames 110; the lead frames have at least two types of thicknesses that are different from each other, wherein a thick lead frame 110H is used for a large current signal and a thin lead frame 110L is used for a small current signal; a component disposition surface plate surface of the lead frames 110 and a component disposition surface-side plate surface of the insulating material 130 form one continuous surface; and the plate surface of the lead frames on the rear surface of the component disposition surface and the plate surface of the insulating material on the rear surface side of the component disposition surface side are formed on the same plane so as to match the plate surface on the rear surface of the component disposition surface of the thickest lead frame from among the lead frames.

Description

technical field [0001] The present invention relates to a substrate for mounting or mounting electronic components capable of reducing wiring resistance and improving heat dissipation. In particular, the present invention relates to a heat dissipating substrate for mounting electronic components, which is filled with an insulator between the lead frames formed by punching or the like into a conductor plate of a lead frame in a circuit pattern shape for mounting the above-mentioned electronic components, and serves as The whole is formed into a planar shape. Background technique [0002] In recent years, for example, in electronic equipment such as electric power steering devices for vehicles, electronic circuits for handling large electric power such as power supply circuits using so-called power semiconductors, inverter circuits, etc. In order to be used in a power substrate that integrates these power semiconductors and the like so as to meet the miniaturization requireme...

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Problems solved by technology

[0010] In addition, the object of the invention described in the above-mentioned Patent Document 3 is to solve the problem that, when realizing miniaturization of a package case of a power device (power device) using a silicon carbide device (silicon carbide device), etc., If the size of the power module is reduced, the distance between the terminals will be narrowed, which increases the possibility of a discharge phenomenon between the terminals

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