18results about How to "Reduce signal delay" patented technology

The invention provides a thin film transistor and a preparation method thereof, an array substrate, a display panel and a display device. The thin film transistor comprises a substrate, a first electrode, a first insulating layer, a second electrode, an active layer, a second insulating layer and a control electrode. The first pole is arranged on one side of the substrate, the first insulating layer is arranged on one side, away from the substrate, of the first pole and comprises a first hole, the first pole is at least partially exposed in the first hole, and the second pole is arranged on one side, away from the substrate, of the first insulating layer. The active layer is arranged on the sides, away from the substrate, of the first electrode and the second electrode and connected between the first electrode and the second electrode, the active layer is partially attached to the side wall of the first hole in the circumferential direction of the first hole, and the second insulating layer is arranged on the side, away from the substrate, of the active layer and partially attached to the side wall of the first hole. The control electrode is arranged on the side, away from the substrate, of the second insulating layer. And the orthographic projection part of the second pole on the substrate surrounds the orthographic projection of the first hole on the substrate.

According to the signal transmission system and method in the isolation driving circuit, a fully differential structure is adopted to transmit signals, the high common-mode transient suppression capability is achieved, the signal frequency spectrum is expanded through the jitter frequency oscillation circuit on the coding side, and the EMI problem of the circuit is optimized. The dual band-pass characteristics of rough frequency selection and accurate frequency selection on the decoding side optimize noise suppression, common-mode control, signal shaping and a positive feedback full-wave comparator greatly improve the decoding rate and reliability, and signal delay is reduced. The clutter filtering module and the dead time generation module ensure the correctness and integrity of the signals, the safety coefficient of the circuit is improved, and compared with the prior art, the circuit provided by the embodiment of the invention has higher common-mode transient suppression and noise suppression capability, lower signal delay and more enough reliability and safety.

The utility model relates to the technical field of float, specifically disclose a kind of plug-in float integrated fiber connection structure, comprising: float body, the hollow structure inside the float body, the float body top end and bottom end are all provided with jack; Float body and located in hollow structure inside are equipped with steel pipe, the steel pipe is vertically symmetrical and respectively inserted with glass fiber and carbon rod in it;The end of glass fiber and carbon rod away from each other is all extended to the outside of float body through adjacent jack;The utility model solves the situation that the cost of traditional float glass fiber and carbon rod needs to be cut in half at each adjacent end and then bonded together, which leads to high cost, not durable, so that it has the effect of low cost, high efficiency and durability, facilitates personnel operation connection, improves its practicality.

The invention discloses an OFPGA chip packaging structure, which comprises an OFPGA silicon chip main body and a glass substrate, TGV through holes, fine pitch waveguides and coupling gratings are arranged on the glass substrate, and the OFPGA silicon chip main body and the glass substrate are bonded through micro salient points and covalent bonds to realize mechanical fixation and signal interconnection; the glass substrate realizes vertical electrical interconnection through high-density TGV through holes, optical signal transmission is realized through fine-pitch waveguides and coupling gratings, and the micro convex points are metal convex structures formed on the glass substrate. The space utilization rate is greatly increased; ultra-short-distance electric signal transmission in the vertical direction is achieved through the high-density TGV through holes, and signal delay is greatly reduced; the thermal stress after bonding is effectively reduced by means of the similar thermal expansion coefficient characteristic of the glass substrate and the silicon chip, and the stability of photoelectric signal separation transmission is ensured by combining high-precision matching interconnection of the TGV through holes and the micro convex points.

This invention discloses a high-power pulsed radiation source based on low-dimensional nanomaterials, belonging to the field of pulsed radiation sources. It includes an integrated base, a lamp head, and internal core functional units. The lamp head has an emission window, a fan-shaped lamp cover, and a cleaning rod. Through an operating ring linked to a gear ring, gears, and a worm gear structure, the opening and closing of the lamp cover and the cleaning of the window can be achieved synchronously. The sealed emission window can isolate dust and moisture. The power supply unit, pulse drive unit, low-dimensional nanomaterial emission module, and radiation control unit within the integrated base work collaboratively. The power supply unit provides dual-path power, the pulse drive unit transmits excitation signals and receives feedback, the emission module generates pulsed radiation, and the control unit achieves timing matching through a synchronization signal. This invention is easy to operate and maintain, ensuring both the cleanliness of the emission window and the safety of internal components, while also improving the stability and power of the pulsed radiation output, solving the problems of cumbersome maintenance and insufficient coordination in existing technologies.

This disclosure provides an intelligent system and its antenna gain enhancement device. The antenna gain enhancement device includes several metal components and an insulating housing. Each metal component comprises an insulating main body and a metal layer and an insulating layer sequentially arranged from the inside out on the outer surface of the main body. Several independent metal components are arranged within the housing in a predetermined manner. The antenna gain enhancement device is matched with the antenna in the intelligent system. The metal components are used to generate polarization under the influence of an applied electromagnetic field to improve antenna gain. In this disclosure, by designing the antenna gain enhancement device to include several metal components and an insulating housing, these metal components do not require assembly and are directly installed into the housing in an ordered or disordered manner. This achieves polarization under the influence of an applied electromagnetic field, forming an enhanced electric field in the direction of electromagnetic wave propagation, thereby enhancing antenna gain and enabling wider communication range, smoother network speeds, and lower signal latency.

The utility model discloses a VR (Virtual Reality) dynamic swing device, which comprises a support frame, a first swing arm, a second swing arm, a first swing arm, a second swing arm, a first swing arm and a second swing arm, and is characterized in that the support frame comprises a first support and a second support, the driving mechanism is hinged to the connecting rod through a lead screw and drives the connecting rod to rotate, and the connecting rod is fixedly connected with the rotating shaft; the rotating frame is provided with a seat and comprises a left swing arm and a right swing arm, a connecting and fixing piece is arranged between the left swing arm and the right swing arm, and the seat is fixed to the connecting and fixing piece; the left swing arm and the right swing arm are provided with opposite first fixing sites, and the first fixing sites are fixedly connected to the rotating shaft. The VR dynamic swing device provided by the utility model can quickly respond, reduce the delay influence, can realize large-amplitude swing to adapt to the complicated action content of VR, and is convenient to maintain and few in quick-wear parts.

The invention discloses a household energy storage system, and the system comprises an energy storage module which is used for storing electric energy or outputting the electric energy to the outside; the grid-connected circuit comprises a first switch; the first end of the first switch is connected with commercial power, and the second end of the first switch is connected with an electricity load; the energy storage module is electrically connected with the second end of the first switch; the current detection module is used for detecting current flowing through the first switch; the voltage detection module is used for detecting the voltage of the first end of the first switch; and the control module is electrically connected with the voltage detection module and the current detection module, and the control module is configured to control the conduction state of the first switch according to the voltage detection result of the voltage detection module and control the output of the energy storage module according to the current detection result of the current detection module. Therefore, the problem of insufficient mains supply power can be solved, installation is simple, and the improvement cost is low.

This utility model discloses a low-power touchpad key wake-up circuit for a keyboard, comprising: a touch unit and a key unit. The key unit includes a main control chip, and the touch unit includes a touch chip and several touch keys. The touch chip is electrically connected to the main control chip, and has a circuit that allows the touch keys to be electrically connected to the main control chip without passing through the touch chip. This utility model reduces the sleep power consumption of the touch chip, thereby reducing the overall sleep power consumption of the keyboard.

The utility model discloses a novel MEMS and MCU joint seal structure relates to joint seal technical field, including from left to right setting substrate, MCU chip, RDL layer, iron cover, filling adhesive, iron cover air inlet hole, oil film, gold wire, MEMS chip and fixed crystal insulating adhesive, wherein, MCU chip set up on the substrate, the iron cover sets up on the substrate, and this iron cover inside is provided with MCU chip and RDL layer, the iron cover is filled with filling adhesive between substrate, MCU chip, this iron cover air inlet hole is communicated with the outside, through wafer level circuit rewiring and long bump technology, the PAD of same function signal is directly merged, and the number of pin foot is reduced, and it is not necessary to independent package MEMS and MCU chip, avoids the occupation of the additional wiring space of PCB board, can also effectively increase the area of heat dissipation.

The utility model relates to PCBA pastes and installs material technology field especially is PCBA pastes and installs mistake proof material automatic material receiving device, including placing rack and material receiving subassembly, is set up two material discharge groove on the placing rack, the material discharge groove inside places a plurality of material tray, the fixedly connected with the welding seat on the placing rack, is equipped with the welding assembly on the welding seat, and the welding assembly includes the support, the fixedly connected with the inclined block on the support, installs a plurality of first laser range finder on the inclined block, is installed on the support the rodless cylinder, the sliding block has on the rodless cylinder, one end of sliding block is equipped with hot melting block, and the material receiving subassembly includes second T block, and the sliding connection has the moving block on second T block, and the fixedly connected with the limit block on the moving block upper end. Directly detect the material band tail end through the first laser range finder, reduced the signal delay of indirect monitoring mode, improved the accuracy of material band state detection, realized real -time trigger material receiving, ensured that the material band butt joint precision, improved the material receiving efficiency, improved the reliability of PCBA pastes.

The utility model provides an engine control module circuit board and a lamination structure thereof, the lamination structure comprises a plurality of circuit boards to be laminated, each circuit board to be laminated comprises N-1 circuit board substrates and N steel plates, the N steel plates and the N-1 circuit board substrates are alternately arranged, each circuit board substrate comprises a hydrocarbon core plate, an FR-4 prepreg and an FR-4 core plate, and the hydrocarbon core plate, the FR-4 prepreg and the FR-4 core plate are alternately arranged. The hydrocarbon core plate is arranged on one surface of the FR-4 prepreg, and the FR-4 core plate is arranged on one surface, deviating from the FR-4 core plate, of the FR-4 prepreg. As the FR-4 core board has better rigidity and better thermal performance, and the hydrocarbon core board has the characteristic of low dielectric loss, can be suitable for a high-frequency environment, and can make up for the defects of the FR-4 core board, when the circuit board is manufactured by adopting a mode of mixing the FR-4 core board and the hydrocarbon core board, the problem of larger signal attenuation in the high-frequency environment can be solved, and the circuit board can be applied to the high-frequency environment. And the signal processing capability and the communication stability of the engine control module are ensured.

The invention belongs to the field of electric power field operation safety, and provides an electric power field operation inspection data safety management and control method and system, and the technical scheme is as follows: associating a two-dimensional code of equipment with equipment state information in a master station system; constructing a multi-dimensional identity information database of the operation and maintenance personnel, verifying the equipment inspection request information based on the multi-dimensional identity information database, and after the verification is passed, allocating an inspection permission to the requested inspection equipment; the inspection data is transmitted to the master station, in the transmission process, if transmission interruption occurs, breakpoint information of current transmission is recorded, after transmission is recovered, remaining data continues to be sent from the breakpoint until all the data are transmitted to the master station, and in the transmission process, the inspection data are encrypted according to a set encryption rule and then sent to the master station. And decrypting the data according to a preset decryption rule to obtain decrypted inspection data. While the quality of the inspection data is ensured, the efficiency and safety of inspection data management and control are improved.

The invention provides a stacked packaging structure corresponding to wafer back power supply of chips of 2nm and below, and high-efficiency and low-loss power supply is realized through accurate correspondence of wafer back power supply metal contacts on a carrier plate and chip back metal contacts in combination with a conductive network constructed by vertical and transverse metal blocks. According to the structure, a signal transmission path is optimized, signal delay and loss are remarkably reduced, and the working efficiency and performance of the chip are improved. The stacking design makes full use of a three-dimensional space, the carrier plate, the substrate, the adapter plate and the chip are closely integrated, and the utilization rate of the packaging space is greatly improved. The conductive network and the solder ball connection enhance the packaging mechanical strength, and improve the vibration and impact resistance. And the vertical metal blocks have conductive and supporting functions, so that the structural stability is enhanced. The packaging size of the first chips in flip connection is reduced, the density is improved, and the pinboard provides a heightening effect, so that subsequent connection is facilitated. The chip packaging efficiency, performance and stability are comprehensively improved, and the method is suitable for the field of high-end chip packaging.

The application discloses a multi-gate distributed driving structure of a GaN chip and a switching circuit unit. The multi-gate distributed driving structure of the GaN chip comprises a GaN HEMT module and a driving module connected with the GaN HEMT module, the GaN HEMT module has a plurality of gates, and the plurality of gates are distributed at intervals along a direction parallel to the surface of the GaN HEMT module, wherein each gate is electrically connected with the driving module. The near end and the far end of the GaN HEMT module can simultaneously receive driving signals through the plurality of gates, the transmission time delay is effectively reduced, the switching speed of the chip is significantly improved, and the switching loss is reduced.

The application provides a ceramic substrate structure and an integrated packaging structure thereof, and belongs to the technical field of packaging. The ceramic substrate structure comprises a substrate plate body, a large chip and a small chip. The upper surface of the substrate plate body is provided with a first groove and a plurality of pads, and the lower surface is provided with a second groove. The first groove is communicated with the groove bottom surface of the second groove. A plurality of metal wires are arranged in the second groove. The metal wires are electrically connected with the pads through a via technology. The large chip is fixedly connected to the top surface of the substrate plate body, and the small chip is fixedly connected in the second groove. The large chip, the small chip and the metal wires are electrically connected through wire bonding. Through the double-sided groove structure and the multi-level electrical connection scheme, the double-sided packaging of the chip is realized, the signal transmission path is effectively shortened, the packaging size is reduced, the heat dissipation efficiency and the electrical performance are significantly improved, and the application is particularly suitable for high-performance chip packaging applications such as back incidence detectors and other double-sided electrical connection applications.

The present invention belongs to the technical field of packaging structure, and particularly relates to a high-density vertically stacked DRAM packaging structure and process. The packaging structure is formed by vertically stacking DRAM 02 chip to DRAM 04 chip on DRAM 01 chip in sequence, and the front of DRAM 04 chip has a metal bump; the DRAM chip is coated with molding compound to form a molding packaging layer, and a vertical through hole penetrates the packaging structure from the inside, and the molding compound includes finished epoxy resin molding compound, epoxy resin, liquid crystal polymer, beryllium oxide, boron nitride nanotubes, zinc oxide, curing agent, catalyst, antioxidant, flame retardant, and self-repairing agent. The present invention also provides a specific preparation process of the packaging structure. By optimizing the packaging process, packaging structure and packaging materials, the present invention not only simplifies the process flow and reduces the production cost, but also greatly improves the heat dissipation performance and reliability of the packaging structure, meeting the needs of high-performance DRAM packaging.

The invention relates to a display panel and a display device. The display panel comprises a relay circuit and a plurality of row pixel driving circuits. The relay circuit is arranged on a source driving signal line in front of a target row pixel driving circuit in the row pixel driving circuits; the relay circuit is used for amplifying the data current of the source electrode driving signal line and then outputting the data current to the far-end row pixel driving circuit; the far-end row pixel driving circuit comprises a target row pixel driving circuit and a pixel driving circuit behind the target row pixel driving circuit. According to the display panel, the data current of the source electrode driving signal line can be amplified through the relay circuit and then output to the far-end row pixel driving circuit, so that the charging time of a pixel capacitor in the far-end row pixel driving circuit can be shortened, the pixel capacitor in the far-end row pixel driving circuit can be quickly charged, and the charging efficiency is improved. The data current which is not amplified is still adopted in the near-end row pixel driving circuit, so that the signal delay at the far end of the large-size display panel is reduced, and the display effect of the display panel is improved.