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5results about How to "Reduce signal delay" patented technology

A high-power pulsed radiation source based on low-dimensional nanomaterials

This invention discloses a high-power pulsed radiation source based on low-dimensional nanomaterials, belonging to the field of pulsed radiation sources. It includes an integrated base, a lamp head, and internal core functional units. The lamp head has an emission window, a fan-shaped lamp cover, and a cleaning rod. Through an operating ring linked to a gear ring, gears, and a worm gear structure, the opening and closing of the lamp cover and the cleaning of the window can be achieved synchronously. The sealed emission window can isolate dust and moisture. The power supply unit, pulse drive unit, low-dimensional nanomaterial emission module, and radiation control unit within the integrated base work collaboratively. The power supply unit provides dual-path power, the pulse drive unit transmits excitation signals and receives feedback, the emission module generates pulsed radiation, and the control unit achieves timing matching through a synchronization signal. This invention is easy to operate and maintain, ensuring both the cleanliness of the emission window and the safety of internal components, while also improving the stability and power of the pulsed radiation output, solving the problems of cumbersome maintenance and insufficient coordination in existing technologies.
Owner:CHENGDU ZHIWEI TANZHI MEDICAL TECHNOLOGY CO LTD

Intelligent systems and their antenna gain enhancement equipment

ActiveCN224288593UExpand coverageSimple structureAntenna supports/mountingsAntenna gainEngineering physics
This disclosure provides an intelligent system and its antenna gain enhancement device. The antenna gain enhancement device includes several metal components and an insulating housing. Each metal component comprises an insulating main body and a metal layer and an insulating layer sequentially arranged from the inside out on the outer surface of the main body. Several independent metal components are arranged within the housing in a predetermined manner. The antenna gain enhancement device is matched with the antenna in the intelligent system. The metal components are used to generate polarization under the influence of an applied electromagnetic field to improve antenna gain. In this disclosure, by designing the antenna gain enhancement device to include several metal components and an insulating housing, these metal components do not require assembly and are directly installed into the housing in an ordered or disordered manner. This achieves polarization under the influence of an applied electromagnetic field, forming an enhanced electric field in the direction of electromagnetic wave propagation, thereby enhancing antenna gain and enabling wider communication range, smoother network speeds, and lower signal latency.
Owner:KUNSHAN INNOWAVE COMMUNICATION TECHNOLOGY CO LTD

A low-power touchpad key wake-up circuit for keyboards

ActiveCN224287384UReduce Sleep Power ConsumptionReduce signal delayProgramme controlComputer controlTouchpadLow power dissipation
This utility model discloses a low-power touchpad key wake-up circuit for a keyboard, comprising: a touch unit and a key unit. The key unit includes a main control chip, and the touch unit includes a touch chip and several touch keys. The touch chip is electrically connected to the main control chip, and has a circuit that allows the touch keys to be electrically connected to the main control chip without passing through the touch chip. This utility model reduces the sleep power consumption of the touch chip, thereby reducing the overall sleep power consumption of the keyboard.
Owner:SHENZHEN INATECK TECH CO LTD

A new MEMS and MCU combined encapsulation structure

The utility model discloses a novel MEMS and MCU joint seal structure relates to joint seal technical field, including from left to right setting substrate, MCU chip, RDL layer, iron cover, filling adhesive, iron cover air inlet hole, oil film, gold wire, MEMS chip and fixed crystal insulating adhesive, wherein, MCU chip set up on the substrate, the iron cover sets up on the substrate, and this iron cover inside is provided with MCU chip and RDL layer, the iron cover is filled with filling adhesive between substrate, MCU chip, this iron cover air inlet hole is communicated with the outside, through wafer level circuit rewiring and long bump technology, the PAD of same function signal is directly merged, and the number of pin foot is reduced, and it is not necessary to independent package MEMS and MCU chip, avoids the occupation of the additional wiring space of PCB board, can also effectively increase the area of heat dissipation.
Owner:广西华芯振邦半导体有限公司

Automatic receiving device for preventing mistake of PCBA mounting materials

The utility model relates to PCBA pastes and installs material technology field especially is PCBA pastes and installs mistake proof material automatic material receiving device, including placing rack and material receiving subassembly, is set up two material discharge groove on the placing rack, the material discharge groove inside places a plurality of material tray, the fixedly connected with the welding seat on the placing rack, is equipped with the welding assembly on the welding seat, and the welding assembly includes the support, the fixedly connected with the inclined block on the support, installs a plurality of first laser range finder on the inclined block, is installed on the support the rodless cylinder, the sliding block has on the rodless cylinder, one end of sliding block is equipped with hot melting block, and the material receiving subassembly includes second T block, and the sliding connection has the moving block on second T block, and the fixedly connected with the limit block on the moving block upper end. Directly detect the material band tail end through the first laser range finder, reduced the signal delay of indirect monitoring mode, improved the accuracy of material band state detection, realized real -time trigger material receiving, ensured that the material band butt joint precision, improved the material receiving efficiency, improved the reliability of PCBA pastes.
Owner:SHENZHEN TIANDITONG ELECTRONICS CO LTD