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Drilling system and method

InactiveUS20020112888A1cost reductioneliminate time
A closed-loop drilling system and method of drilling oil, gas, or geothermal wells is described, whereby through the control of the flow rates in and out of the wellbore, and by adjusting the pressure inside the wellbore by a pressure/flow control device installed on the return line, surface pressure being increased or decreased as required, this in turn decreasing or increasing downhole pressure, occurrence of kicks and fluid losses may be greatly minimized and quickly controlled. Through the method of the invention the elimination of the kick tolerance and tripping margin on the design of the well is made possible, since the pore and fracture pressure will be determined in real-time while drilling the well, and, therefore, nearly no safety margin is necessary when designing the well, reducing significantly the number of casing strings necessary. The inventive method can be called intelligent safe drilling since the response to influx or fluid loss is nearly immediate and so smoothly done that the drilling can go on without any break in the normal course of action. The new method is applicable to the whole wellbore from the first casing string with a BOP connection, and it can be implemented and adopted to any rig or drilling installation that uses the conventional method with very few exceptions and limitations. The new method is applicable to all types of wells, onshore, offshore, deepwater and ultra-deepwater, with huge safety improvement in difficult drilling scenarios.
Owner:IMPACT ENG SOLUTIONS +2

Apparatus and method of temperature conrol during cleaving processes of thick film materials

InactiveUS20080188011A1improve utilitycost reduction
An apparatus for temperature control of manufacture of thick film materials includes a stage comprising a planar surface for supporting a bulk material to be implanted and subsequently cleaved. The bulk material has a surface region, a side region, and a bottom region which provides a volume of material and defines a length between the bottom region and the surface region. The apparatus further includes a mechanical clamp device adapted to engage the bottom region to the planar surface of the stage such that the bulk material is in physical contact with the planar surface for thermal energy to transfer through an interface region between the bulk material and the stage while the surface region is substantially exposed. Additionally, the apparatus includes a sensor device configured to measure a temperature value of the surface region and generate an input data. The apparatus further includes an implant device configured to perform implantation of a plurality of particles through one or more portions of the surface region of the bulk material and a controller configured to receive and process the input data to increase and/or decrease the temperature value of the surface region through at least the interface region between the planar surface of the stage and the bottom region of the bulk material.
Owner:SILICON GENERAL CORPORATION
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