The invention relates to the field of
semiconductor packaging all-in-one machines, in particular to a
semiconductor packaging full-automatic vacuum packaging all-in-one
machine which comprises a
machine tool support, a material conveying belt is movably installed on the left side of the
machine tool support, and a transfer support matched with the material conveying belt is fixedly connected to the top of the
machine tool support. According to the full-automatic vacuum packaging all-in-one machine for
semiconductor packaging, through cooperation of the transferring support, the mechanical arm support and the scanning mechanism, synchronous parallel operation of semiconductor transferring and information strip
processing is achieved, and specifically, in the one-time moving process of the mechanical arm, the mechanical arm is not prone to falling off; meanwhile, clamping and transferring of semiconductors, adsorption and extraction of information strips and feeding of the information strips into a guide groove for scanning are completed, so that the traditional serial step-by-step mode of moving the information strips first and then moving the semiconductors is thoroughly changed, the idle
stroke waiting and repeated positioning time of a
manipulator is eliminated, the cycle beat of single operation is greatly shortened, and the working efficiency is improved. Therefore, the packaging efficiency and the productivity of the
production line are greatly improved on the whole.