The utility model provides
a domain controller and a movable platform, and the
domain controller comprises a housing, a heat dissipation
assembly and a circuit board are stacked in the housing, one side, facing the heat dissipation
assembly, of the circuit board is provided with a first
chip, the heat dissipation
assembly is provided with a first heat dissipation boss, and one side, deviating from the circuit board, of the heat dissipation assembly is also provided with an elastic member in a compressed state. The first end of the elastic piece abuts against the shell, the second end of the elastic piece abuts against the heat dissipation assembly so that the first heat dissipation boss can abut against the first
chip, the shell is provided with a supporting part, and the supporting part abuts against the circuit board. The elastic piece in the compressed state is arranged on the side, away from the circuit board, of the heat dissipation assembly, so that the first heat dissipation boss tightly abuts against the first
chip, and the distance between the first heat dissipation boss and the first chip is reduced; the shell is provided with the corresponding supporting parts to support the circuit board, so that the stress borne by the circuit board is reduced, and the risk of
cracking of the first chip is reduced.