Low-dielectric laser direct structuring composite material suitable for 5G communication and preparation method thereof

Abstract

The invention relates to a low-dielectric laser direct structuring composite material suitable for 5G communication. The composite material is composed of the following components in parts by weight:52 to 86 parts of base resin, 0 to 30 parts of glass fibers, 10 to 30 parts of a filling agent, 1 to 9 parts of a flame retardant, 4 to 15 parts of a toughening agent, 0.1 to 1 part of a lubricating agent, 0.2 to 1 part of an antioxidant and 10 to 30 parts of a laser sensitive additive. A preparation method of the composite material comprises the steps that a twin-screw extruder is used for processing, the melt extrusion temperature is 250-380 DEG C, and the screw rotating speed is 150-300 rpm/min. The composite material has low dielectric property, so that improvement of the transmission speed of 5G communication millimeter wave signals is facilitated, the signal delay is reduced, and the signal loss is reduced; the composite material has the LDS processing capacity, can be rapidly prepared in a small size and a large number, can be subjected to batch laser etching and chemical plating to form a metal connecting circuit, and is an optimal solution of a 5G plastic antenna oscillator material.

Description

technical field [0001] The invention relates to the field of LDS composite materials, in particular to a low-dielectric laser direct molding composite material suitable for 5G communication and a preparation method thereof. Background technique [0002] Laser Direct Structuring (LDS) is a laser manufacturing technology, also known as three-dimensional (3D) three-dimensional circuit printing technology in the industry. It is a manufacturing technology that selectively forms metal circuits on plastic parts. A popular method for cell phone antennas. Traditional plastic parts need to be combined with electrical circuits, which need to be completed through processes such as welding and compounding with metals. It is not easy to achieve miniaturization and high precision of its products. The plastic parts added with LDS additives can directly have the function of electrical interconnection after the two-step process of laser engraving and electroless plating. Obviously, the trad...

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Problems solved by technology

CN 107177180 A and CN 107177181 A respectively disclose a glass fiber reinforced polycarbonate resin composition for laser direct molding, and its aging resistance and degradation resistance need to be improved, and CN 109627665 A discloses a The thermoplastic resin composition and preparation method thereof, its impact strength needs to be improved, CN104497535 A and CN 104497537 A disclose a kind of polycarbonate composition for LDS and the polycarbonate composition for LDS with good thermal stability respectively, Both mechanical strength and low dielectric properties need to be improved

[0008] The 5G low dielectric constant LDS composite material is not a simple integration of low dielectric material and LDS material. Improper use of the modifier added to the low dielectric material will affect the performance of the laser sensitive additive of the LDS material.

Due to the differences in thermal expansion / shrinkage and surface polarity between the metal core and the plastic, the metal core is easily detached from the resin surface that has been ablated by the laser, and the part that is detached from the metal core will be missing in the next electroless electroless plating process. In order to provide the implanted crystal nuclei and seeds for the electroplated metal, there will be defects in the electroplated metal, and it is impossible to form a continuous electroplating line, which will eventually lead to poor metal adhesion and product defects

If the low-dielectric additive affects the dispersion of the LDS laser-sensitive additive and the absorption of the laser, if it affects the anchoring of the reduced metal core and the implantation of the metal during the electroplating process, it will eventually affect the LDS performance of the composite material, resulting in Product metal circuit defects and low yield

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