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130results about "Soldering bits" patented technology

Flexible circuit board welding device

The invention relates to the field of circuit board production, and particularly discloses a flexible circuit board welding device comprising a machine frame, a cooling fan, a conveyor belt, a weldingmechanism and a control mechanism, wherein a supporting plate is fixed on the conveyor belt; the welding mechanism comprises an electric soldering iron, a cylinder and a welding fan; the cylinder isprovided with an exhaust port, and a returning spring is arranged in the cylinder; the control mechanism includes a stopping mechanism and a cooling mechanism, and the stopping mechanism and the cooling mechanism each include a cooling fan and an air bag, the air bag and the cooling fan are located on both sides of the conveyor belt respectively, the cooling fan is fixed on the machine frame, andthe air bag can slide relative to the machine frame. A first heated expansive substance is stored in the air bag of the stopping mechanism, a second heated expansive substance is stored in the air bagof the cooling mechanism, a closing switch is fixed on the machine frame, and the closing switch can shut down the conveyor belt and the welding fan, and the machine frame is provided with a compression spring. According to the scheme, the supporting plate can be cooled while a circuit board is welded.
Owner:宁波隆锐机械制造有限公司

Auxiliary device for tin soldering for circuit board

InactiveCN107520518ARemove irritating odorTo achieve the role of auxiliary solderPrinted circuit assemblingSoldering bitsDip solderingEngineering
The invention relates to an auxiliary device for tin soldering, and particularly relates to an auxiliary device for tin soldering for a circuit board. The technical problem to be solved by the invention is to provide an auxiliary device for tin soldering for a circuit board, which is high in tin soldering speed, high in tin soldering efficiency, capable of carrying out front-rear tin soldering and left-right tin soldering on the circuit board, and further capable of removing a pungent odor. In order to solve the abovementioned technical problem, the invention provides an auxiliary device for tin soldering for a circuit board. The auxiliary device comprises a bottom plate and the like, wherein an L-shaped plate is arranged at the left side of the top of the bottom plate; an adjustment device is arranged at the top of the bottom plate; a placement table is arranged at the top of the adjustment device; a movement device is arranged at the inner top of the L-shaped plate; and a soldering bit is arranged at the bottom of the movement device. The auxiliary device disclosed by the invention achieves the effects of being high in tin soldering speed, high in tin soldering efficiency, and capable of removing the pungent odor. According to the device, the front-rear tin soldering is carried out on the circuit board through the movement device, the left-right tin soldering is carried out on the circuit board through the adjustment device, and therefore, tin soldering can be carried out on each orientation of the circuit board, and an odor removal device is capable of absorbing the pungent odor.
Owner:钟光文

Solder tip production process

The invention provides a solder tip production process and belongs to the technical field of solder tip production. The solder tip production process comprises the following steps: a step of manufacturing a copper mould blank: manufacturing a copper blank from a copper raw material and processing one end of the copper blank to a cone-shaped work end; a step of processing a copper blank and iron sleeve: sleeving a copper mould blank by an iron sleeve and fixing the iron sleeve to form the copper blank and iron sleeve; processing one end of the iron sleeve through a die to a cone shape, wherein the work end of the copper mould blank is fully coated so as to form the head of the copper blank and iron sleeve; a step of correcting the dimension: correcting the dimension of the body of the copper bank and iron sleeve to meet the standard dimension; a step of surface treatment: carrying out surface treatment on the copper blank and iron sleeve. The solder tip production process provided by the invention adopts a machine assembling and processing process of embedding the copper blank into the iron sleeve to replace a process of electroplating an iron layer, is free of discharge of electroplating sewage and environmental pollution and is environmental-friendly; the dimensions of workpieces are accurate and uniform, so that the workpieces can be automatically produced and manufactured, and the product is stable in quality and short in production period.
Owner:陈爱华

Thermal compression welding head pressure-buffering tin soldering device and tin soldering technology thereof

The invention discloses a thermal compression welding head pressure-buffering tin soldering device and a tin soldering technology of the thermal compression welding head pressure-buffering tin soldering device. The device comprises a box body and a machine frame installed on the box body. Hydraulic cylinders are installed on the machine frame, the output ends of the hydraulic cylinders are connected with a sliding plate, an installation plate is installed on the sliding plate through an adjusting mechanism, and a welding head is installed on the installation plate through a welding head base. A pressure buffering mechanism is arranged on the machine frame, and a bearing platform mechanism is arranged at the position, located below the welding head, of the top of the box body. According to the device, the hydraulic cylinders push the sliding plate to move downwards, the adjusting mechanism adjusts the position of the welding head, the downward pressure is gradually buffered through the arrangement of the pressure buffering mechanism, the pressure on workpieces in the process of tin soldering operation of the welding head is gradually reduced, the quality and the reliability of welding spots of the workpieces are improved, the different machined workpieces can be conveniently positioned through the arrangement of the bearing platform mechanism, and the tin soldering operation is facilitated.
Owner:江苏诺森特电子科技有限公司
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