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Thermal compression welding head pressure-buffering tin soldering device and tin soldering technology thereof

A hot-pressing welding head and pressure-relieving technology, applied in auxiliary devices, welding positions, manufacturing tools, etc., can solve problems such as affecting soldering operation, crushing, short-circuit faults, etc., to facilitate soldering operations, increase quality and reliability, The effect of convenient positioning

Inactive Publication Date: 2021-11-19
江苏诺森特电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Thermocompression welding is a welding process that connects flexible circuit boards and rigid circuit boards. As an emerging manufacturing process and an important part of the microelectronic surface assembly technology field, a stable and efficient thermocompression welding process is undoubtedly important to ensure good product quality. Link, the existing hot-press soldering device, the pressure exerted on the workpiece during the working process is to push the welding head down through the hydraulic cylinder, and perform soldering operations on the workpiece. During the downward movement of the welding head, the welding head does not move down The pressure is gradually buffered, which will easily cause the solder to be crushed by the welding head at the moment of melting, so that the extruded molten solder will splash out, and the splashed solder will naturally solidify and form tiny tin beads. The tin beads will easily cause short circuit faults in the workpiece conductor. Reduce the quality and reliability of the solder joints of the workpiece, and at the same time, the positioning effect of the sub-processed workpiece is not good, which affects the soldering operation. Therefore, it is necessary to design a heat-pressed welding head slow-pressing soldering device and its soldering process

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  • Thermal compression welding head pressure-buffering tin soldering device and tin soldering technology thereof
  • Thermal compression welding head pressure-buffering tin soldering device and tin soldering technology thereof
  • Thermal compression welding head pressure-buffering tin soldering device and tin soldering technology thereof

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Embodiment Construction

[0027] In the following description, numerous specific details are given in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without one or more of these details. In other examples, some technical features known in the art are not described in order to avoid confusion with the present invention.

[0028] see Figure 1-6 , the present invention provides a technical solution: a thermal pressure welding head slow pressure soldering device, including a box 1 and a frame 2 installed on the box 1, a hydraulic cylinder 3 is installed on the frame 2, the hydraulic cylinder 3 The output end is connected with the slide plate 5, the slide plate 5 is equipped with a mounting plate 8 through the adjustment mechanism, the welding head 22 is installed on the mounting plate 8 through the welding head seat 21, the frame 2 is provided with a slow pressure mechanism, and t...

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Abstract

The invention discloses a thermal compression welding head pressure-buffering tin soldering device and a tin soldering technology of the thermal compression welding head pressure-buffering tin soldering device. The device comprises a box body and a machine frame installed on the box body. Hydraulic cylinders are installed on the machine frame, the output ends of the hydraulic cylinders are connected with a sliding plate, an installation plate is installed on the sliding plate through an adjusting mechanism, and a welding head is installed on the installation plate through a welding head base. A pressure buffering mechanism is arranged on the machine frame, and a bearing platform mechanism is arranged at the position, located below the welding head, of the top of the box body. According to the device, the hydraulic cylinders push the sliding plate to move downwards, the adjusting mechanism adjusts the position of the welding head, the downward pressure is gradually buffered through the arrangement of the pressure buffering mechanism, the pressure on workpieces in the process of tin soldering operation of the welding head is gradually reduced, the quality and the reliability of welding spots of the workpieces are improved, the different machined workpieces can be conveniently positioned through the arrangement of the bearing platform mechanism, and the tin soldering operation is facilitated.

Description

technical field [0001] The invention relates to the technical field of soldering, in particular to a thermal pressure welding head slow pressure soldering device and a soldering process thereof. Background technique [0002] Solder is an important industrial raw material for connecting electronic components in welding lines. It is a solder with a low melting point, mainly referring to solder made of tin-based alloys. The production method of solder is to use the melting method to make ingots, and then press to process them into materials. Solder is widely used in the electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life. [0003] Thermocompression welding is a welding process that connects flexible circuit boards and rigid circuit boards. As an emerging manufacturing process and an important part of the microelectronic surface assembly technology field, a stable and efficient thermocompression welding process is und...

Claims

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Application Information

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IPC IPC(8): B23K3/00B23K3/02B23K3/08B23K20/02B23K20/26H05K3/34B23K101/42
CPCB23K3/00B23K3/08B23K3/087B23K3/085B23K3/026B23K20/025B23K20/26H05K3/34B23K2101/42
Inventor 陈驰
Owner 江苏诺森特电子科技有限公司
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