1156results about "Soldering iron" patented technology

An automated soldering system with an intelligent power supply that can automatically configure the power output to interchangeable soldering cartridges, where the soldering cartridges include readable information to allow the power supply to properly power the cartridge to achieve a desired, entered operating temperature. The system includes a cartridge with an identifier that contains information particular to that cartridge, a reader able to read that information, and an indicator positioned on a connector into which the cartridge is inserted.

In a temperature control system for controlling a heating member or means of a solder handling device, a plurality of solder handling devices such as soldering iron, a heater tweezer, a solder sucker and a hot air blower are selectively coupled with a temperature controller which in turn identify the solder handling device connected thereto and controls temperature of the heater of the connected device with temperature control characteristic suitable for the device. Each solder handling device may have a resistor of which resistance value represents the type of the device so that the temperature controller identify the device by the resistance value.

A novel printed circuit board (PCB) 10 that incorporates embedded into its substrate an electric heater 14 is disclosed. This electric heater 14 becomes the only source of heat for simultaneously soldering components to pads 12. The PCB 10 is the key element that permits to create apparatuses and implement processes for soldering PCB assemblies without utilizing a reflow oven. Compared against the prior art this invention requires less manufacturing equipment, reduces the manufacturing cost, reduces manufacturing energy consumption and improves the quality and reliability of soldered PCB assemblies.

The invention provides a cantilever type automatic tin soldering device. The device comprises an X-axis movement module, a Y-axis movement module, a rack and a product conveying assembly line, wherein the product conveying assembly line is installed on the rack, the X-axis movement module is installed on the rack through a supporting plate, and the Y-axis movement module is installed on the X-axis movement module. The device further comprises a Z-axis lifting module, an iron welding assembly, an iron welding assembly rotating device and a soldering tin supplying device, wherein the Z-axis lifting module is installed on the Y-axis movement module through a supporting frame, the iron welding assembly rotating device is installed on the supporting frame, the iron welding assembly is installed on the iron welding assembly rotating device, the solder wire supplying device is installed on the supporting frame, products to be subjected to tin soldering are fed into the product conveying assembly line and positioned, the iron welding assembly rotating device drives the iron welding assembly to rotate to an assigned angle, the soldering tin supplying device is used for conveying soldering tin to the iron welding assembly, and the X-axis movement module, the Y-axis movement module and the Z-axis lifting module are combined to drive the iron welding assembly to an assigned position for tin soldering.

A soldering or a desoldering tool includes a replaceable tip with a recess adapted to receive a portion of a temperature sensor to measure the temperature of the tip. Positioning the temperature sensor within the tip allows the temperature to be quickly measured so that the temperature near the tip may be more accurately monitored and controlled. The temperature sensor may be also integrated with the heater near the tip such that the temperature sensor is between the tip and the heater and near both of them so that the temperature of the tip is substantially that of the temperature of the heater. A sleeve may enclose the temperature sensor and the heater with a portion of the temperature sensor extending out from the foreward end of the sleeve. The replaceable tip may also have a bore adapted to receive a head protruding from the foreward end of the sleeve to couple the tip at a predetermined orientation with respect to the sleeve. The combination of bore and head allows the replaceable tip to be coupled with the sleeve in a consistent manner so that the temperature of the replacement tips can be measured accurately and dependably.

The present invention is intended to ease the control and management of soldering devices, and enhance convenience. In accordance with the intention of the invention, a system includes a power supply unit having a connecting cable to be connected to soldering devices, a power supply portion supplying power to the soldering devices through the connecting cable, a power supply control portion to control the power supply from the power supply portion based on a temperature setting signal T(s) set in advance and a control unit that may be physically separated from the power supply unit but which inputs the temperature setting signal T(s) to the power supply control portion of the power supply unit.

The present invention relates to a LED lamp pin welding equipment. It includes machine frame, transmission mechanism positioned under the machine frame, conveying chain positioned on the machine frame, vibration plate, LED-placing device, clamping device, stripping and wire-cutting device and welding device. It is characterized by that on the above-mentioned machine frame it has two vibration plates, two LED-placing devices, two clamping devices, two stripping and wire-cutting devices and two welding devices which are respectively positioned at two sides of conveying chain. Besides, said invention also provides the welding method matched with said LED lamp pin welding equipment.

A soldering iron is configured to heat its tip and emit inert gas near the tip. This is accomplished by providing a heater cartridge having a heater pipe with a tip portion and a base portion. The heater pipe has a first hole in the tip portion and a second hole at the base portion. The heater pipe has a passage between the first and second holes so that gas can enter through the second hole and exit through the first hole. The heater cartridge has a grip handle between the tip and base portions of the heater pipe. The soldering iron has a handle base with a cavity adapted to receive the base portion of the heater pipe and at least a portion of the grip handle. The handle base is adapted to provide power and gas to the base portion of the heater pipe. The heater pipe transfers the power and gas from the base portion to the tip portion to heat the tip and emit gas near the tip. The cavity of the handle base is configured to substantially seal gaps between the grip handle and the handle base so that gas does not leak between the handle base and the grip handle.

A method and apparatus for processing a waste product and producing a synthesis gas is provided. The system includes a sealed, heated rotatable drum for preheating and preparing the waste material suitable for a plasma reactor, and processing the material in the reactor. The synthesis gas created by the reactor is used to preheat the waste material by circulating the hot synthesis gas around the drum. In an alternative embodiment, the hot synthesis gas flows through the drum to preheat the waste material and to clean the synthesis gas. Different methods of cooling and cleaning the synthesis gas are used. The system may comprise two plasma reactors in combination with a rotating desorber drum.

Method and apparatus to recover energy from waste by means of combustion of such waste in industrial furnaces, particularly of the rotary type, that has an external calciner, feeding such waste into the tertiary air duct of the calciner and burning the waste inside the duct itself, to efficiently make use of the energy produced by such combustion, as a contribution of the total cost of fuel necessary to operate the industrial furnace. The method and apparatus permit the elimination of hazardous wastes that are efficiently disassociated when burned sufficiently to produce effluents that are typically non-toxic, producing greatly reduced or even no atmospheric pollution nor environmental damage.

A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.

A soldering iron provided with a soldering tip that melts solder at a distal end, having inside said soldering tip a substantially cylindrical insertion fit recess portion extending from a proximal end of the soldering tip to the distal end, opening at the proximal end, and a heater formed into a coil shape and whose surface is covered with an insulating oxide film being fittingly inserted into the insertion fit recess portion.

A soldering iron tip having a copper or copper alloy core and a metal particle sintered member connected to the core to transfer heat therefrom to form a working soldering tip. The sintered member can be manufactured by powder metallurgy from a base material (iron, nickel and/or cobalt particles) and an additive (silicon, copper, silver, tin, boron and/or carbon particles) where needed. The sintered member can be formed as a cap which is fitted onto the working tip with a silver paste sandwiched therebetween, a brazing filler metal ring is positioned between an abutment shoulder and the cap, flux applied to the joint and the cap brazed into place. A metal, cermet or ceramic coating sprayed on the outer surface of the core, except for the (masked) working tip end, is not wettable by solder. An Ag—Al—Cu alloy coating layer in the rearwardly-disposed cavity improves heat conduction from the heater therein.

A conductive polycrystalline diamond film having specific resistance of at least 1x10-4 OMEGAcm and less than 1x103 OMEGAcm, whose film thickness is in the range of at least 0.1 mum and not more than 500 mum, is film-formed by vapor-phase synthesis on a surface employed for pressure bonding, a surface opposite to this surface or at least two side surfaces intersecting with these surfaces on a substrate of a bonding tool tip that is applicable for bonding and packaging a semiconductor chip.

A soldering iron control module applied to a soldering iron and a soldering iron stand is provided. The soldering iron stand accommodates the soldering iron which has a soldering iron bit. The soldering iron control module includes a sensing unit and a soldering iron control system. The sensing unit provides a sensing signal indicating whether the soldering iron is accommodated in the soldering iron stand. The soldering iron control system includes a tin supply unit and a control unit. The control unit determines whether the soldering iron has been accommodated in the soldering iron stand for a first time period according to the sensing signal. When the control unit determines that the soldering iron has been accommodated in the soldering iron stand for the first time period, the tin supply unit provides the tin to the soldering iron bit and the power of the soldering iron is turned off.

The invention discloses a Microphone automated welding device and method. The Microphone automated welding device comprises a vibration disk feeding module, an image acquisition module, a soldering operation module, a lead feeding module and an electrical control cabinet. The Microphone automated welding device integrates the functions of automatic identification of adjustment of a microphone welding bonding pad, automatic peeling and cutting-off of a lead, automatic welding, automatic sorting of microphones and automatic conveying of the lead. Therefore, the problems that microphone welding efficiency is not high and automated feeding and discharging cannot be achieved can be effectively solved.