The application discloses a device and method for
rework of CGA packaging devices, and belongs to the technical field of
welding tooling. The device comprises a
heat transfer block, a fixing clamp and a
handle. The fixing clamp is arranged on both sides of the
heat transfer block, clamps the CGA packaging device, and makes the
heat transfer block adhere to the upper part of the CGA packaging device. The
handle is above the heat transfer block, and the heat transfer block is connected with the heating end of a
soldering iron head. In use, the
handle is pressed downward to clamp the fixing clamp on the CGA packaging device, the
soldering iron head is turned on, the CGA packaging device is precisely heated through the heat transfer block, the
soldering point of the CGA packaging device and a soldering post reaches a
melting temperature, the CGA packaging device is separated from the soldering post, and the soldering post keeps a soldering state with a PCB board. Through the top
contact type heating technology, precise disassembly and
rework of the CGA packaging device are realized, the operation is simple, the safety is high, the
rework efficiency is high, and the device is especially suitable for maintenance scenes of high-density CGA packaging products.