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Abietyl-based soldering flux for halogen-free no-clean bright solder wire and preparation method thereof

A no-clean, solder wire technology, used in welding equipment, welding media, manufacturing tools, etc., can solve the problems of not enough bright and beautiful surface of solder joints, low activity of halogen-free flux, and low corrosiveness of post-soldering residues. Achieve good specular reflection ability, improve surface insulation resistance after welding, and excellent surface insulation performance.

Inactive Publication Date: 2014-10-01
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention overcomes the technical defects of the existing halogen-free solder flux for lead-free solder wire such as low activity, large smoke, and insufficient bright and beautiful solder joint surface, and provides a rosin-based flux for halogen-free no-cleaning bright solder wire and its preparation method, the flux has the characteristics of high activity, fast welding speed, small spatter, bright and beautiful solder joints, low corrosion of post-welding residue and high insulation resistance.

Method used

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  • Abietyl-based soldering flux for halogen-free no-clean bright solder wire and preparation method thereof
  • Abietyl-based soldering flux for halogen-free no-clean bright solder wire and preparation method thereof
  • Abietyl-based soldering flux for halogen-free no-clean bright solder wire and preparation method thereof

Examples

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Effect test

Embodiment 1

[0037] A rosin-based flux for halogen-free no-cleaning bright solder wire, the raw material formula components are as follows:

[0038]

[0039] Preparation method: put the polymerized rosin and disproportionated rosin into the reaction kettle, heat to 150±5°C, and stir continuously for 30 minutes; add the weighed dipropylene glycol butyl ether and tripropylene glycol methyl ether into the reaction kettle where the modified rosin is located , keep the heating temperature at 150±5°C, and continue to stir for 5 minutes; add benzoic acid, sebacic acid, adipic acid, lauryl polyoxyethylene ether AEO, alkyl dimethyl sulfopropyl betaine, dimethyl succinate Add the ester and triisopropanolamine to the reaction kettle where the modified rosin is located in sequence, keep the heating temperature at 150±5°C, and continue to stir for 30 minutes until the raw materials in the reaction kettle are fully dissolved and mixed uniformly; heat the resulting mixture in the reaction kettle After...

Embodiment 2

[0041] A rosin-based flux for halogen-free no-cleaning bright solder wire, the raw material formula components are as follows:

[0042]

[0043] Preparation method: Put the polymerized rosin and disproportionated rosin into the reaction kettle, heat to 150±5°C, and stir continuously for 30 minutes; add the weighed tripropylene glycol monobutyl ether and diethylene glycol hexyl ether to the reaction where the modified rosin is located In the kettle, keep the heating temperature at 150±5°C and continue to stir for 5 minutes; add glutaric acid, sulfamic acid, sebacic acid, citric acid, alkylphenol polyoxyethylene ether OP‐10, fatty acid methyl ester polyoxyethylene ether , diethyl adipate, octyl benzoate, triethanolamine and dimethylethanolamine are sequentially added to the reaction kettle where the modified rosin is located, and the heating temperature is maintained at 150±5°C, and the stirring is continued for 30 minutes until the raw materials in the reaction kettle are ful...

Embodiment 3

[0045] A rosin-based flux for halogen-free no-cleaning bright solder wire, the raw material formula components are as follows:

[0046]

[0047]

[0048] Preparation method: put hydrogenated rosin and disproportionated rosin into the reaction kettle, heat to 150±5°C, and stir continuously for 30 minutes; add the weighed tripropylene glycol monobutyl ether and diethylene glycol hexyl ether to the reaction where the modified rosin is located In the kettle, keep the heating temperature at 150±5°C and continue to stir for 5 minutes; add sulfosalicylic acid, hexadienoic acid, maleic acid, alkyl dimethyl betaine, alkyl dimethyl sulfoethyl betaine, Add diethyl adipate, dibutyl oxalate, diethanolamine and triethanolamine in sequence to the reaction kettle where the modified rosin is located, keep the heating temperature at 150±5°C, and continue stirring for 30 minutes until the raw materials in the reaction kettle are fully dissolved and mix uniformly; the mixture obtained by he...

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Abstract

The invention discloses an abietyl-based soldering flux for a halogen-free no-clean bright solder wire and a preparation method thereof. The abietyl-based soldering flux comprises, by mass, raw materials including active agent 3.50-15.00%, surface active agent 0.08-0.42%, brightener 0.10-2.50%, corrosion inhibitor 0.10-0.45%, cosolvent 1.50-6.00% and the balance modified rosin. The ingredient proportion in the abietyl-based soldering flux is suitable for manufacture of lead-free solder wires containing the soldering flux in cores, and the soldering flux can be used for automatic welding or manual soldering iron welding. When the solder wire welding is adopted, the process stability is good, tinning speed is high, the splashing amount is small, the defects including continuous tinning, solder skips, insufficient solder, icicles and the like in the welding process can be decreased, welding spots are bright and full after welding, residues are few, the corrosivity is low, cleaning is not needed, and the surface electrical insulation property is excellent after the welded solder wires are placed for a long period of time.

Description

technical field [0001] The invention relates to a flux, in particular to a halogen-free no-cleaning bright rosin-based flux and a preparation method thereof. The flux is used for electronic assembly soldering and is a flux for the inner core of lead-free solder wire. The flux belongs to the field of soldering materials for electric and electronic products. Background technique [0002] With the continuous improvement of environmental protection requirements in the electronics industry, various materials used in the electronics industry are continuously developing towards environmental protection. The solder used in the micro-connection of electronic packaging has been developed for decades, and the tin-lead solder used in the early stage has been basically replaced by lead-free solder in recent years. Since 2006, the electronics industry in major industrial countries in the world has entered lead-free era. However, the development of flux suitable for lead-free solder has ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/362
Inventor 张新平李长征周敏波马骁
Owner SOUTH CHINA UNIV OF TECH
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