Method for removing residual solder tin from soldering-pan during repair and replacement of ball grid array (BGA) chip

Abstract

The invention discloses a method for removing residual solder tin from a soldering-pan during the repair and replacement of a ball grid array (BGA) chip. The method comprises the following steps of: (a) well regulating a soldering temperature curve, and fixing a BGA mainboard to be repaired on a BGA repair station; (b) soldering a poor BGA chip, and taking the poor BGA chip down; (c) taking the BGA mainboard down, and sucking the residual solder tin from the soldering-pan by using a soldering wick and soldering iron; (d) cleaning the soldering-pan; (e) uniformly smearing a layer of flux paste on the soldering-pan, and placing a new BGA chip in a corresponding silk-screen printing frame wire; (f) fixing the BGA mainboard on the BGA repair station, and starting soldering the new BGA chip; and (g) after the soldering is finished, taking the BGA mainboard down. According to the method for removing the residual solder tin from the soldering-pan during the repair and replacement of the BGA chip, the residual solder tin can be effectively removed from the soldering-pan, the repair efficiency of the BGA chip is greatly improved, and the yield is also greatly improved.

Description

technical field [0001] The invention relates to a method for removing residual solder in pads, in particular to a method for removing residual solder in pads when BGA chips are repaired and replaced. Background technique [0002] With the continuous development of BGA devices (ball grid array package devices), the market demand increases and the product production capacity continues to increase. It is difficult for SMT placement technology to avoid the emergence of defective BGA chips. Due to the high price of BGA chips, it is necessary to rework and replace BGA chips in order to reduce costs and improve product yield. The commonly used rework and replacement methods cannot effectively remove the residual solder on the pad, resulting in low rework and replacement efficiency, and there are many defective products due to the failure to remove the residual solder. Contents of the invention [0003] The technical problem mainly solved by the present invention is to provide a ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem mainly solved by the present invention is to provide a method for removing the residual solder on the pad when the BGA chip is repaired and replaced, which solves the problems of long time consumption, low efficiency, and low yield rate, and can effectively remove the residual solder on the pad, greatly improving Improve the efficiency of BGA chip rework and also greatly improve the yield rate

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