999results about "Heating appliances" patented technology

The invention provides wafer-level reflow soldering equipment, belongs to the technical field of reflow soldering, and solves the problems that existing reflow soldering equipment is low in efficiency, poor in wafer reflow soldering treatment effect and the like. Comprising an EFEM system and a process area box arranged on the rear side of the EFEM system, two wafer loading and unloading machines are arranged on the front side of the EFEM system, a control system is arranged on the side portion of the EFEM system, a transfer robot and an equipment fan filter are arranged in the EFEM system, and a rotary welding system, a valve terminal box, a power box, a power distribution cabinet, an exhaust system and a formic acid storage tank are arranged in the process area box. The formic acid storage tank is connected with the rotary welding system through a pipeline, and an air inlet of the formic acid storage tank is connected with an external liquid nitrogen tank through a pipeline. According to the invention, the wafer can be stably carried and placed, temperature rise and temperature reduction suspension uniform heating treatment are carried out, rapid temperature reduction suspension uniform cooling treatment is carried out, positioning loading and auxiliary temperature reduction cooling treatment are realized, high wafer processing efficiency is ensured, and the processing effect is good.

The precise welding control method for vacuum brazing comprises the steps that the geometrical shape and material characteristics of a workpiece are obtained, modeling processing is conducted in combination with the geometrical shape and the material characteristics, and a high-dimensional tensor and a high-dimensional time sequence are compared and calculated to obtain a deviation matrix; based on the deviation matrix, the brazing heating power and the brazing filler metal supply rate are adjusted, and a real-time control instruction set is generated; constructing a deep reinforcement learning model, performing iterative optimization on the real-time control instruction set based on the deep reinforcement learning model, extracting weld defect characteristics of the workpiece, generating a weld quality score according to the weld defect characteristics, and obtaining a difference value between the weld quality score and a set threshold value; and performing comprehensive optimization on the optimization parameter vector according to the difference value to generate a global optimization parameter set. According to the method, systematic dynamic control over complex geometrical shapes and multi-material workpieces is achieved, the defects of response lag and insufficient regulation and control are overcome, and therefore the process stability and production efficiency of vacuum brazing are greatly improved.

The invention discloses an infrared heating detinning device for waste circuit boards, which belongs to the technical field of metal recovery and comprises a detinning drum, the detinning drum comprises a driving drum seat, an infrared heating drum and a dynamic conveying frame are arranged at one end of the driving drum seat, and a static conveying frame is arranged on the inner wall of the other end of the driving drum seat. A slag discharging mechanism is arranged at the bottom of the infrared heating cylinder; according to the invention, the sealed continuous production of the waste circuit board is realized, the waste heat preheating is utilized to improve the detinning efficiency, the detinning rotary drum and infrared heating are combined to dynamically rotate to promote tin melting and element falling, the vibrating screen and the guide plate screen tin, the vibration and high-temperature blowing cleaning of the element are realized, and the external air draft and temperature control filter pipe accurately controls the solidification and remelting of the tin; the air injection cushion and the sealing arc plate guarantee sealing and cleaning, the whole process is efficient in detinning, elements are separated, and energy and production efficiency are improved.

The invention relates to the technical field of brazing, in particular to a brazing production line for radiator fin machining and a welding process thereof.The brazing production line comprises a plasma spot welding module and a brazing furnace, and brazing flux spraying equipment and drying equipment are sequentially arranged between the plasma spot welding module and the brazing furnace; a production line conveying belt is arranged in the plasma spot welding module, the brazing flux spraying device, the drying device and the brazing furnace and used for conveying radiator fins. The brazing filler metal in the radiator fins is melted in the welding bin, then the radiator fins are driven to vibrate in the promoting bin, and therefore when the liquid brazing filler metal flows into base metal gaps, the constraint of surface tension can be broken through moderate vibration.

The utility model provides LED lamp panel repairing equipment which is used for repairing an LED lamp panel, the LED lamp panel comprises a circuit board and at least one bad lamp bead located on the circuit board, and the LED lamp panel repairing equipment comprises a feeding assembly, a removing and die bonding assembly, a tin dispensing assembly, a surface mounting assembly and a lightening detection assembly. The feeding assembly is used for obtaining position information of bad lamp beads and bearing and conveying LED lamp panels. The rejecting and die bonding assembly is used for heating and desoldering the bad lamp beads and rejecting the bad lamp beads and the molten solder so as to expose the bonding pads corresponding to the bad lamp beads; the tin dispensing assembly is used for dispensing solder paste on the bonding pad; the surface mounting assembly is used for attaching good lamp beads to the solder paste; the laser is further used for heating and die bonding of the good lamp beads so that the good lamp beads can be installed on the circuit board. The lightening detection assembly is used for conducting lightening detection on the circuit board provided with the good lamp beads. The problem that the production efficiency of the lamp panel cannot be improved when the existing lamp panel repairing equipment is used for repairing the lamp panel is solved.

A solder reflow apparatus includes a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated when the heat transfer fluid is heated; a heater configured to heat the heat transfer fluid to generate saturated vapor; a substrate stage configured to be moved up and down within the vapor generating chamber and configured to support a substrate on which an electronic component is mounted via solder; a cleaning portion installed in an upper portion of the vapor generating chamber, wherein the cleaning portion is configured to spray a cleaning fluid onto the substrate on the substrate stage, wherein the cleaning fluid includes a material the same as the heat transfer fluid; and a guide structure configured to collect the cleaning fluid sprayed onto the substrate on the substrate stage and to direct the cleaning fluid to a reservoir that contains the heat transfer fluid.

The invention provides a copper bar welding fixing tool and copper bar welding equipment, and relates to the technical field of copper bar welding. The copper bar welding fixing tool and the copper bar welding equipment comprise an operation table, the upper end of the operation table is fixedly connected with a supporting column, the outer surface of the supporting column is connected with a shielding belt, and the upper surface of the operation table is fixedly connected with a welding base. According to the copper bar welding fixing tool and the copper bar welding equipment, an electric telescopic rod is arranged to drive a dirt removing mechanism to ascend and descend, so that a stand column can ascend to be close to a welding seam, a wiping and grinding wire is arranged at the top end of the stand column, and a cleaning motor drives a square shaft to rotate so that the stand column can be driven to rotate; the welding surface of the copper bar can be polished and wiped, so that oil stains and oxidation films on the surface of the copper bar can be conveniently removed, brazing filler metal can be connected with the surface of the copper bar more firmly, the effect of removing the oil stains and the oxidation layers on the surface of the copper bar is achieved, and the problem that the welding position is not firm due to the oil stains and the oxidation layers on the surface of the copper bar is solved.

The invention discloses an anti-deviation circuit board chip welding device and method, and relates to the field of chip welding, the anti-deviation circuit board chip welding device comprises a welding workbench, a welding robot is installed on the welding workbench, a welding positioning groove is formed in the welding workbench, a hot melting mechanism is arranged on the welding workbench, and the hot melting mechanism comprises a horizontal sliding seat, a vertical plate and a hot melting plate; the horizontal sliding seat is arranged on the welding workbench in a sliding mode, the sliding direction of the horizontal sliding seat is parallel to the welding positioning groove, the vertical plate is fixed to the horizontal sliding seat, the hot melting plate is arranged on the vertical plate in a sliding mode, a rectangular groove is formed in the middle of the hot melting plate in a penetrating mode, and a plurality of hot fuses are arranged on the two opposite inner walls of the rectangular groove at equal intervals in the horizontal direction; in the welding process, tin is plated on the chip welding holes of the circuit board through the welding robot, the thermal fuse is located between every two adjacent welding holes and used for enabling tin to be in a hot melting state, it is guaranteed that the chip cannot move in the welding process, the welding reject ratio is greatly reduced, and the welding quality is improved.

The invention discloses wave-soldering equipment based on visual inspection, and relates to the technical field of wave-soldering equipment, the wave-soldering equipment comprises a case, a clamping unit, a spraying unit, a preheating unit, a welding unit and an adjusting unit, the case is used for installing and fixing the clamping unit, the spraying unit, the preheating unit, the welding unit and the adjusting unit, the clamping unit is used for clamping a PCB, and the adjusting unit is used for adjusting the spraying unit. The spraying unit is used for coating soldering flux, the preheating unit is used for evaporating moisture in the soldering flux, the welding unit is used for welding pins of the PCB, the adjusting unit is used for adjusting wave crests, the PCB is clamped through the clamping unit in the transportation process of the PCB, and after the soldering flux is sprayed to the PCB through the spraying unit, the PCB is conveyed to the welding unit through the adjusting unit. The preheating unit evaporates moisture in the soldering flux, the PCB is welded through the welding unit, and the wave crest height is adjusted through the adjusting unit during welding, so that the welding quality is improved.

The invention relates to the technical field of dissimilar material connection, in particular to a non-equilibrium brazing connection method for graphene and aluminum alloy. The method comprises the steps that firstly, a high-thermal-conductivity graphene block, a rapid heating element, a to-be-welded face of aluminum alloy and brazing filler metal foil are cleaned and then dried; secondly, the materials are assembled into a to-be-brazed assembly according to the assembling mode of aluminum alloy / brazing filler metal foil / rapid heating element / brazing filler metal foil / graphene block / brazing filler metal foil / rapid heating element / brazing filler metal foil / aluminum alloy, and the distance between the rapid heating element and the to-be-brazed face of the graphene block is smaller than the distance between the rapid heating element and the aluminum alloy on the same side; and thirdly, the assembly to be brazed is heated in a special heating mode so as to ensure that non-equilibrium temperature fields can be formed on the two sides of the connector, after heat preservation is finished, the connector is naturally cooled to the room temperature, and brazing is completed. By the adoption of the scheme, the technical problem of high residual stress concentration of a heterogeneous joint in welding of an existing graphene material and aluminum alloy can be solved.

A glass and metal laser welding method using a double-layer structure solder and its solder, the method includes: surface pretreatment, ultrasonic cleaning of the metal and glass surfaces, using pulsed laser deposition technology to sequentially deposit nano-Si and Al double-layer thin film pre-solder in the area to be welded on the glass surface; assembly, assembling the glass and metal according to the requirements of the connection joint, placing the glass solder with the pre-solder downward on the metal, and clamping the two with a clamp; nanosecond laser welding, focusing the laser on the contact surface of the thin film solder and the glass, and keeping the focus on the same plane, turning on the laser to scan and weld on the focal plane; post-welding treatment, using high-frequency nanosecond laser for post-welding heat treatment, and naturally cooling the joint after treatment. The present invention can accurately control the thermal effect generated in the tiny welding area, improve the wettability between the glass and metal interface, inhibit interface brittle compounds, and reduce thermal stress and residual stress.

The invention discloses a micro-scale tin soldering device and method for ultrasonic laser composite energy field coordinated regulation and control. The micro-scale tin soldering device comprises a coordinated energy output module, a multi-physical field monitoring module, a wire feeding module, an intelligent regulation and control system and a motion platform, and a workpiece to be welded is arranged on the motion platform; the collaborative energy output module comprises a laser unit, an ultrasonic vibration unit and a focusable focus lens, the ultrasonic vibration unit comprises an ultrasonic generator, and the multi-physical field monitoring module comprises an infrared thermometer, a high-speed holographic imaging system and an acoustic impedance sensor; the high-speed holographic imaging system is used for recording brazing filler metal molten pool flowing and IMC nucleation dynamic states; the acoustic impedance sensor monitors the ultrasonic energy transmission efficiency; the intelligent regulation and control system is electrically connected with the multi-physics field monitoring module, and a multi-physics field coupling prediction model based on an LSTM neural network is arranged in the intelligent regulation and control system. According to the technical scheme, the structural design is reasonable, the energy field coupling efficiency is high, the material adaptability is high, the structure performance is controllable, the defect rate is remarkably reduced, and practicability is good.

To provide dual wire welding or an additive manufacturing contact tip and a diffuser.SOLUTION: A welding or additive manufacturing contact tip includes an electrically-conductive body extending from a proximal end of the body to a distal end of the body. The body forms a first bore terminating at a first exit orifice at a distal end face of the body, and a second bore terminating at a second exit orifice at the distal end face of the body. The first and second exit orifices are separated from each other by a distance configured to facilitate formation of a bridge droplet between a first wire electrode delivered through the first bore and a second wire electrode delivered through the second bore during a deposition operation.SELECTED DRAWING: Figure 1

Provided in the present invention are a fully-automatic selective soldering system and method for a PCB. The fully-automatic selective soldering system comprises the following components arranged in sequence: a soldering flux spray-coating mechanism; a first conveying mechanism, which is used for conveying a PCB to a spray-coating station of the soldering flux spray-coating mechanism; a preheating mechanism, which is used for preheating the PCB after spray-coating, wherein a third conveying mechanism is provided inside the preheating mechanism; a second conveying mechanism, which is used for conveying the preheated PCB to a position above a rotary soldering mechanism; and the rotary soldering mechanism, which is used for performing soldering of the preheated PCB. The soldering flux spray-coating mechanism is located below the first conveying mechanism; the rotary soldering mechanism is located below the second conveying mechanism; and the first conveying mechanism and the second conveying mechanism are respectively connected to two ends of the third conveying mechanism. Such a configuration simplifies the structure of a conveying portion, making the overall structure of an apparatus more compact, and also significantly shortens the conveying path of a PCB between processes, thereby significantly improving working efficiency.

The invention discloses vacuum welding equipment with an accurate temperature control function, and relates to the technical field of vacuum welding, the vacuum welding equipment with the accurate temperature control function comprises a main body, two first guide rails are symmetrically mounted on one side of the main body, and first sliding seats are slidably mounted on the two first guide rails; a first guide rail is installed on one side in the processing chamber, a connecting plate is installed on the first sliding seat, an infrared thermometer is installed on the connecting plate, a second guide rail is installed on one side in the processing chamber, a second sliding seat is installed on the second guide rail in a sliding mode, a linkage rod is installed on the second sliding seat, a fixing ring is installed on the linkage rod, and a heating coil is installed on the fixing ring; when the infrared thermodetector detects that the local temperature of the workpiece is too low, the infrared thermodetector can control the second guide rail to operate through the controller, the second sliding base drives the heating coil to move to the position, temperature compensation can be achieved through the heating coil, and therefore accurate control over the overall heating temperature of the workpiece is achieved.

The invention relates to the technical field of brazing furnaces, and discloses an energy-saving vacuum brazing furnace which comprises an outer cylinder, an inner cylinder arranged in the outer cylinder, sealing covers arranged at openings in the two ends of the outer cylinder, heating equipment arranged in the inner cylinder and a supporting table and further comprises a placing assembly, and the placing assembly specifically comprises a pushing sliding groove formed in the top of the supporting table; the pushing sliding block is arranged in the pushing sliding groove, the rotating inserting groove and the stand column are formed in the top of the pushing sliding block, and the containing frame is arranged on the top of the stand column. According to the energy-saving type vacuum brazing furnace, by arranging the containing assembly and the stand columns, the containing frame is lifted, the distances between the containing frame and the heating equipment are the same in the center and the periphery of the inner barrel, and therefore parts in the containing frame are evenly heated, and the situation that the brazing degrees of the different parts are inconsistent due to uneven heating is avoided; and deviation and deformation caused by uneven heating of different positions of the part are avoided, so that the brazing effect of connection is guaranteed, and the product quality is improved.

The invention relates to the technical field of LED lamp bead substrate welding, and particularly discloses substrate welding equipment suitable for LED lamp beads, the substrate welding equipment comprises a welding rack and a piece conveying frame, a welding cavity is formed in the welding rack, and the piece conveying frame is fixedly arranged on the front side of the interior of the welding rack. The feeding assemblies on the two sides of the front face of the fifth electric sliding table are matched with the conveying frame, LED lamp beads can be efficiently and automatically conveyed into the discharging assembly, the continuous and rapid feeding process is achieved, and the production continuity and the overall efficiency are improved; a series of operations such as pin solder paste coating, LED lamp bead placement and final hot air welding can be completed in sequence by matching the welding assembly arranged in the welding cavity with the feeding assembly, frequent transfer and adjustment between different devices or working procedures are not needed, time waste of intermediate links and possible errors are reduced, and the welding efficiency is improved. And the production efficiency and the stability of the product quality are further improved.

The invention discloses an electronic component processing support leg crimping device, and relates to the technical field of circuit board production, the electronic component processing support leg crimping device comprises a base and a support mounted on the top of the base, and further comprises a rotary table, and the top of the rotary table is provided with a plurality of positioning grooves; the preheating mechanism is used for preheating the chip mounting position of the circuit board; the tin coating mechanism is used for coating tin paste at a chip mounting position along a rectangular track; the positioning and crimping mechanism is used for positioning, pressing and welding the chip; the pin correction mechanism is used for correcting pins on the chip when the chip is positioned; according to the electronic component processing supporting foot crimping device, firstly, center positioning is automatically carried out on a chip, then, the bottom end of a welding air pipe is pressed down on the top of the chip, the problem that a chip pin tilts and the circuit connection area of a circuit board is small is solved, the chip installation quality is guaranteed, and through straightening the pin, the production efficiency is improved. And the problem that the pins are bent and cannot be accurately butted with the circuit on the circuit board is solved.

The invention relates to the technical field of chip welding, and discloses a continuous vacuum welding device for an IGBT (Insulated Gate Bipolar Translator) chip, which comprises a working channel formed by connecting a plurality of working furnaces in series, vacuum gate valves used for sealing the space are installed at an inlet and an outlet of the working channel and the butt joint position of every two adjacent working furnaces, and the conveying mechanism is used for conveying product carriers, is installed in the working furnaces and comprises two conveying assemblies symmetrically distributed on the two sides of the axis of the working channel; the two ends of the product carrier are erected on the conveying parts of the two conveying assemblies correspondingly. The preheating furnace, the welding furnace and the cooling furnace are connected in series to form the working channel, and the vacuum gate valves are mounted at the inlets and the outlets of the cavities, so that the adjacent cavities are independently sealed, the oxygen content of each cavity is controlled in an extremely low range, the ceramic copper-clad plate is prevented from being oxidized, the welding void rate is reduced, and the interface bonding strength is improved.

Disclosed example systems include: a collecting device, a weighing device, and a control device. The collecting device is disposed in a cooling zone, and is configured to collect contaminants. The collecting device is mounted on the weighing device. The weighing device is configured to weigh the collecting device to obtain weight information of the collecting device. The control device is configured to determine whether the reflow oven needs to be cleaned based on the weight information of the collecting device. The method comprises collecting contaminants in a cooling zone by a collecting device, weighing the collecting device to obtain weight information of the collecting device, and determining whether the reflow oven needs to be cleaned based on the weight information of the collecting device.

The invention discloses a welding tool, a heater module and an integrated module electric compressor, and belongs to the technical field of heater welding machines.The welding tool comprises a tool body, a containing cavity is formed in the tool body, a heater is placed in the containing cavity, and the heater comprises a base plate and a heating plate; the heating plate is connected with a plurality of heat conducting fins; the tool body comprises an upper positioning assembly and a lower positioning assembly, the upper positioning assembly and the lower positioning assembly are mutually fixed through bolts, the lower surface of the upper positioning assembly, the upper surface of the lower positioning assembly and cavities in the opposite surfaces of the upper positioning assembly and the lower positioning assembly are combined to form a containing cavity, and a plurality of welding exhaust holes are formed in the containing cavity. A stress release groove is connected into the containing cavity. The substrate surface temperature can be reasonably and effectively utilized, waste of waste heat in the substrate welding process is reduced, the heat efficiency in the substrate welding process is improved, and the welding quality of the substrate and a heating plate is effectively improved.

The invention discloses a high-reliability semiconductor laser array packaging structure preparation clamp and a packaging structure preparation method using the same. The clamp is used for installing a product module of a packaging structure and comprises a base, a cylindrical pin, a horizontal moving block, a wedge-shaped block and a vertical moving block, a sunken horizontal groove is formed in the center of the base, and a sunken inclined groove is formed in one end of the horizontal groove; the inner side face, away from the horizontal groove, of the inclined groove and the side face, away from the wedge-shaped block, of the inclined groove are rough inclined faces, the product module, the cylindrical pin and the horizontal moving block are arranged in the horizontal groove side by side, and the wedge-shaped block is arranged in the inclined groove. According to the high-reliability semiconductor laser array packaging structure preparation clamp, it can be guaranteed that welding seams between the bars and the conductive heat dissipation spacer blocks are not extruded in the welding flux melting process, so that welding flux extrusion is avoided, and the problems of missing welding and excessive welding flux extrusion caused by the influence of the height difference of the bottoms of the conductive heat dissipation spacer blocks are solved; and meanwhile, the problem of secondary melting of the welding flux is avoided.

The utility model provides battery cooling plate welding equipment, which is applied to the technical field of battery cooling plate brazing, and adopts the technical scheme that the battery cooling plate welding equipment comprises a tray on which a battery cooling plate is placed; the heating unit is used for heating the battery cooling plate on the tray to realize brazing; the cooling unit is arranged on one side of the heating unit, and the cooling unit is used for cooling the brazed battery cooling plate; the conveying mechanism drives the tray to be conveyed between the heating unit and the cooling unit in a reciprocating manner; the method has the technical effects that the cooling function area and the heating function area are separated, repeated temperature rising and cooling in the traditional brazing process are avoided, and then the brazing work efficiency is improved; heat of high-temperature waste gas in the brazing cavity is recycled through the heat exchanger so as to heat new nitrogen, the repeated utilization rate of energy is increased, and energy consumption is lower; and through the arrangement of the induction heater and the thermocouple, the actual brazing temperature on the battery cooling plate is more accurately controlled.

The invention discloses a silver brazing temperature control device for a PDC (Polycrystalline Diamond Compact) drill bit. The silver brazing temperature control device comprises a base plate, a lower frame, a sliding table component, a driving component, an indexing head component, a superaudio frequency induction heating system, a closed-loop temperature control system and a foot switch. The sliding table assembly achieves X-axis position adjustment, Y-axis position adjustment and Z-axis position adjustment, the indexing head assembly achieves rotation and inclination angle adjustment through the chuck assembly and the inclination angle mechanism, and multi-axis positioning is formed. The ultrasonic frequency induction heating system adopts a profiling red copper pipe induction coil to locally heat the PDC composite sheet. The closed-loop temperature control system controls the welding temperature to be 690-700 DEG C, the temperature control precision to be + / -5 DEG C and the response time to be smaller than or equal to 10 ms in real time through an infrared thermometer, a signal system transmitting box and a single chip microcomputer, multi-point temperature measurement is supported, and heating is controlled to be started and stopped through a foot switch. A closed-loop temperature control system and superaudio frequency induction heating are combined, local real-time heating of the PDC is achieved, the welding temperature is accurately controlled, the welding quality and efficiency are improved, and the method is suitable for the complex geometry and impact resistance requirements of a coal mine PDC drill bit.

The invention relates to the technical field of vacuum welding, and discloses high-precision automatic mechanical welding equipment in a vacuum environment, which comprises an equipment shell, a supporting seat is arranged at the center position of the bottom of the equipment shell, a static tool seat is fixed at the upper end of the supporting seat, a movable tool seat is movably arranged right above the static tool seat, and the movable tool seat is movably arranged right above the static tool seat. A lead screw is rotationally arranged at the upper end of the edge of the static tool seat, a lead screw thread is arranged in the middle of the lead screw, the lower end of the lead screw is fixed to the inner layer of the static tool seat through a first bearing seat, and the upper end of the lead screw is fixed to the top of the equipment shell through a first bearing seat. A third servo motor is started, through a series of transmission, a coaxial walking gear is driven to move on a gear rail, the whole welding feeding seat is driven to do uniform-speed circular motion around an annular rail, accordingly, a welding flux guide pipe is made to evenly conduct injection welding along the outer edge of a welding seam by a circle, the uniformity is higher, the welding quality is improved, and the welding efficiency is improved. And automatic feeding is achieved, and time and labor are saved.

The invention relates to the technical field of LED chip welding, and discloses an LED lighting lamp chip pin positioning and welding device which comprises a base with an n-shaped cover plate installed at the upper end, a material supporting mechanism is arranged on the base, and a material taking mechanism is arranged above the base. The positioning and welding device for the LED lighting lamp chip pins can effectively solve the problems that in the prior art, LED lamp bead pins are prone to warping and deformation, and the production efficiency is high. The problems that the LED lamp bead welding efficiency is affected due to the fact that quality defects such as welding deviation and insufficient welding occur in the prior art, the distance requirements of different tin soldering work cannot be met, and suction nozzle components need to be frequently replaced and debugged are solved.

Device (1) for displacing at least one assembly (2, 2′) between a provisioning zone (3) and a working zone (4) of at least one process chamber (5) of a process chamber apparatus (6) for soldering, in particular for reflow soldering, comprising at least one displacement device (7), wherein the at least one assembly (2, 2′) carries out, at least in sections, a displacement movement (9), or such a displacement movement (9) can be carried out, such that the at least one assembly (2, 2′) is displaced by means of a force (8), in particular pushing force, which is transmitted or generated by the displacement device (7), in particular directly, and acts on the assembly (2, 2′).

The invention relates to the technical field of circuit board welding, and discloses a vehicle-mounted domain controller circuit board welding device which comprises a box body, a fixing table and a welding gun, the fixing table is fixedly connected to the inner bottom wall of the box body, and a conveying assembly, a power assembly and a plurality of welding assemblies are arranged in the box body; smoke discharging assemblies and anti-adhesion assemblies are arranged in the multiple welding assemblies, through use of the conveying assembly, a first motor drives a first driving chain wheel and a driving gear to rotate through a first output shaft, and the first driving chain wheel drives a first driven chain wheel to rotate through a first chain; the driving gear drives the driven gear to rotate through the driven gear, the second rotating rod drives the wire guide roller to rotate, then the tin wire enters the wire guide groove, meanwhile, the first output shaft and the first rotating rod drive the tin wire to enter the extending pipe through the conveying roller, then the tin wire gets close to the welding gun, and therefore the stable conveying effect is achieved.

A reflow soldering oven for soldering and / or bonding component leads both electrically and mechanically to pads on a PCB in an SMT manufacturing system. The soldering oven includes at least one thermal infrared camera that generates thermal images of the PCB to provide thermal imaging processing to monitor and correct temperature deviations in real time. The oven generates a heat map using the thermal images and compares the heat map to a thermal gradient to provide real time profiling and to initiate changes like temperature control or the oven belt-speed monitoring to offer self-correcting capabilities.

The invention relates to the technical field of chip welding, in particular to an automatic chip welding and positioning device based on machine vision. The automatic chip welding and positioning device based on machine vision comprises a support, a conveying assembly, a mechanical arm, an outer frame, a controller, a visual system, an adjusting frame, a visual sensor, a first frame strip, a second frame strip, a moving assembly, an adjusting assembly and a lifting limiting assembly, the conveying assembly is installed at the top of the support, and the outer frame is connected to the middle of the top of the support; a mechanical arm is installed on the top of the support and located on the right side of the outer frame, and a controller is installed on the front side wall of the outer frame. The visual system obtains initial coordinates of a circuit board bonding pad through three-dimensional modeling, the visual sensor monitors position deviation of the frame strips and the bonding pad in real time, the linkage moving assembly achieves accurate adjustment of the first frame strip and the second frame strip in a three-dimensional space, mechanical errors and batch difference influences are effectively eliminated, and high precision of chip welding is ensured.