1520results about "Heating appliances" patented technology

A light-emitting diode (LED) tube lamp comprises a lamp tube, a first rectifying circuit, a filtering circuit and an LED driving module. The lamp tube has a first pin and a second pin for receiving an external driving signal. The first rectifying circuit is coupled to the first and second pins, for rectifying the external driving signal to produce a rectified signal. The filtering circuit is coupled to the first rectifying circuit, for filtering the rectified signal to produce a filtered signal. The LED driving module is coupled to the filtering circuit to receive the filtered signal for emitting light. Wherein, the filtering circuit includes a capacitor and an inductor connected in parallel and between one of the first and second pins and the first rectifying circuit, and the parallel-connected capacitor and inductor are configured for presenting a peak equivalent impedance to the external driving signal at a specific frequency.

A method for solder bonding a sputter target to a backing plate having a plurality of spaced-apart ridges on its bonding surface to provide a uniform spacing and a uniform solder bonded interface; and the sputter target/backing plate assembly so produced.

In a temperature control system for controlling a heating member or means of a solder handling device, a plurality of solder handling devices such as soldering iron, a heater tweezer, a solder sucker and a hot air blower are selectively coupled with a temperature controller which in turn identify the solder handling device connected thereto and controls temperature of the heater of the connected device with temperature control characteristic suitable for the device. Each solder handling device may have a resistor of which resistance value represents the type of the device so that the temperature controller identify the device by the resistance value.

The process of producing aluminum plate-fin heat exchanger includes the steps of blanking, washing, mounting, brazing, argon arc welding and pressure test. The present invention adopts numerically controlled lathe with high machining precision for blanking; ultrasonic washing for high washing efficiency and high washing quality; continuous high purity nitrogen protected brazing for high brazing quality; and argon arc welding with welding robot for high welding quality and high production efficiency.

The invention discloses a continuous vacuum welding furnace which comprises a working chamber, a feed inlet and a discharge outlet. Four vacuum cavity components are sequentially arranged inside the working chamber side by side and are respectively provided with independent temperature regulation and control systems, transmission systems, measurement systems and regulation and control systems; and a preheating area, a welding area, a precooling area and a cooling area which are four independent systems are formed inside the vacuum welding furnace, so that different processing procedures including a preheating stage, a heating stage, a precooling stage and a cooling stage can be respectively carried out. The invention further discloses an application method for the vacuum welding furnace. The continuous vacuum welding furnace and the application method have the advantages that the heating procedure and the cooling procedure can be carried out without interfering with each other under a vacuum or protective atmosphere condition, repeated temperature rise and temperature drop are omitted, accordingly, the welding time and power consumption can be saved, and the work efficiency and the welding quality can be improved.

A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.

The invention discloses a solar cell crystal silicon wafer series welding machine, which comprises a welding mechanism and a welding assisting mechanism which is directly or indirectly connected with the welding mechanism, wherein the welding assisting is an automatic feeding mechanism, a welding strip feeding mechanism or an automatic discharging mechanism. The automatic feeding mechanism, the welding strip feeding mechanism, the welding mechanism and the automatic discharging mechanism are sequentially connected. All mechanisms work cooperatively and can realize the continuous, rapid and stable welding of cells.

A soldering or a desoldering tool includes a replaceable tip with a recess adapted to receive a portion of a temperature sensor to measure the temperature of the tip. Positioning the temperature sensor within the tip allows the temperature to be quickly measured so that the temperature near the tip may be more accurately monitored and controlled. The temperature sensor may be also integrated with the heater near the tip such that the temperature sensor is between the tip and the heater and near both of them so that the temperature of the tip is substantially that of the temperature of the heater. A sleeve may enclose the temperature sensor and the heater with a portion of the temperature sensor extending out from the foreward end of the sleeve. The replaceable tip may also have a bore adapted to receive a head protruding from the foreward end of the sleeve to couple the tip at a predetermined orientation with respect to the sleeve. The combination of bore and head allows the replaceable tip to be coupled with the sleeve in a consistent manner so that the temperature of the replacement tips can be measured accurately and dependably.

The invention discloses a method for soldering metal parts and components by adopting high-frequency induction brazing, which can complete high-frequency brazing assembly molding of multiple soldering points of multiple soldering parts in one time. The method is dependent on a device, which comprises a high-frequency coil and a magnetic ring pressure lever, wherein the high-frequency coil and the magnetic ring pressure lever are connected with a high-frequency controller respectively, and are controlled uniformly by the high-frequency controller. By utilizing the device, the method comprises the following steps of: treating the surface of a part to be soldered; assembling the soldering device, and distributing the high-frequency coil and a magnetic head pressure lever; selecting a brazing filler metal to be matched with the part to be soldered, and preparing paste brazing flux FB303P; optimally allocating positions and quantities of the brazing filler metal and the brazing flux; setting corresponding process values by means of the high-frequency controller to perform heat soldering, preserving the temperature, switching off, and cooling by using cooling water to the room temperature. According to the method, one-time soldering molding can be realized by multiple soldering of multi-process multi-point and other processes.

The invention discloses full automation soldering machine for heating radiator and belongs to welding machine field, which comprises frame, locating device of heating radiator, welding device, clamping device and its arm brace composed clamp head, turn power device to bring clamp head turn and lifting power device to drive the lift of drive clamp head, radiator and power device. First, weld the branch pipe and connected link box pipe; then, lifting device drives clamp head, radiator and turn device to lift and leave their locating devices; turn device drives radiator to turn for 180Deg; lifting device drives clamp head, radiator and turn device to drop and locate and clamp, welding device take similar operation to other link points; finally, it comes to the finish of the automatic welding, which increases greatly the work efficiency.

An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.

A soldering iron provided with a soldering tip that melts solder at a distal end, having inside said soldering tip a substantially cylindrical insertion fit recess portion extending from a proximal end of the soldering tip to the distal end, opening at the proximal end, and a heater formed into a coil shape and whose surface is covered with an insulating oxide film being fittingly inserted into the insertion fit recess portion.

A heating apparatus for induction heating is disclosed. The heating apparatus may comprise a bearing ring, at least one bearing element disposed in the bearing ring, and a braze material adjacent to the at least one bearing element and the bearing ring. The heating apparatus may additionally comprise an inductor positioned radially adjacent to at least a portion of the bearing ring. A current source may be electrically coupled to the inductor. A bearing orienting member may also abut a surface of the at least one bearing element. The bearing orienting member may orient a surface of the at least one bearing element. A heating method is also disclosed.

The invention relates to automatic welding equipment which is provided with a main machine platform. The automatic welding equipment comprises an index plate, a solder paste dripping assembly, a high-frequency soldering assembly and a blanking assembly which are arranged on the main machine platform. The index plate is uniformly provided with four workpiece positioning parts. Four working positions are formed on the part, on the periphery of the index plate, of the main machine platform. The first working position is the manual feeding working position, the solder paste dripping assembly is installed at the second working position, the high-frequency soldering assembly is installed at the third working position, and the blanking assembly is installed at the fourth working position. According to the automatic welding equipment, the solder paste dripping assembly and the high-frequency soldering assembly are controlled independently through independent control systems correspondingly, the precision is high, and the stability is good; compared with traditional scattered type welding working positions, the automatic welding equipment is provided with the multiple working positions integrally, and the working positions are arranged in a circle mode; the structure is compact, the occupied space is small, operation is smooth, and the production efficiency is high; in addition, operation can be conducted with only one person, and the security of the worker and the equipment is high.

A heating and cooling device including: an airtight processing chamber openable to load a member-to-be-processed in the airtight processing chamber; a transfer apparatus to adjust a distance between the member-to-be-processed and a cooling unit that cools the member-to-be-processed, by moving the member-to-be-processed and/or the cooling unit; an induction heating apparatus to heat the member-to-be-processed, including a induction heating coil; a cooling apparatus to cool the member-to-be-processed by cooling the cooling unit; a temperature sensor to determine a temperature of the member-to-be-processed; and a controller to control the induction heating apparatus and the cooling apparatus based on the temperature determined by the temperature sensor.

A soldering apparatus for connecting solar cells includes an induction heat source to connect cell conducting tracks, provided with soldering medium, with electric conductors. The heat source has a high-frequency generator and an inductor loop in which the flow of a high-frequency current causes a high-frequency magnetic field to induce in the conducting track and in the electric conductor arranged along the conducting track eddy currents that generate the heat that is necessary for the soldering operation. The inductor loop includes a U-shaped loop element that has narrowings and widening in one arm that is positioned closer to the conductor. Ferrite beads and ferrite tubes at the widening concentrate the magnetic field to optimize the heat development in the soldering zone and thus also save energy.

The invention relates to a method for binding an ITO target to a copper back plate. The method for binding the ITO target to the copper back plate comprises the steps of fixing a heating table on the copper back plate, and placing the ITO target on the copper back plate; heating the copper back plate, enabling the ITO target to adhere to the copper back plate by brazing; placing a balancing weight on the surface of the ITO target far away from the copper back plate, and taking down the balancing weight after the ITO target is cooled. According to the method, the copper back plate is fixed on the heating table, the deformation of the copper back plate in the temperature rising process is reduced, flatness of the adhesion surface is improved, preparation are made for high-quality ITO target binding, the balancing weight is placed on the ITO target after brazing, the problem of unevenness of indium liquidity is solved, generation of air holes of the adhesion surface is avoided, and accordingly binding quality of the ITO target and the copper back plate is improved.

A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.

A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.

A reflow soldering system wherein a heating oven is provided with a contact heating unit which has a transport rail and a top heat transfer heater, and with a hot gas blowing heating unit, the transport rail and top heat transfer heater are respectively provided with heaters which heat the outer edge part of the printed circuit board, and the transport rail or top heat transfer heater moves in an up-down direction so that the transport rail and top heat transfer heater clamp and heat the outer edge part of the printed circuit board.