719results about "Heating appliances" patented technology

The precise welding control method for vacuum brazing comprises the steps that the geometrical shape and material characteristics of a workpiece are obtained, modeling processing is conducted in combination with the geometrical shape and the material characteristics, and a high-dimensional tensor and a high-dimensional time sequence are compared and calculated to obtain a deviation matrix; based on the deviation matrix, the brazing heating power and the brazing filler metal supply rate are adjusted, and a real-time control instruction set is generated; constructing a deep reinforcement learning model, performing iterative optimization on the real-time control instruction set based on the deep reinforcement learning model, extracting weld defect characteristics of the workpiece, generating a weld quality score according to the weld defect characteristics, and obtaining a difference value between the weld quality score and a set threshold value; and performing comprehensive optimization on the optimization parameter vector according to the difference value to generate a global optimization parameter set. According to the method, systematic dynamic control over complex geometrical shapes and multi-material workpieces is achieved, the defects of response lag and insufficient regulation and control are overcome, and therefore the process stability and production efficiency of vacuum brazing are greatly improved.

The invention relates to the technical field of brazing, in particular to a brazing production line for radiator fin machining and a welding process thereof.The brazing production line comprises a plasma spot welding module and a brazing furnace, and brazing flux spraying equipment and drying equipment are sequentially arranged between the plasma spot welding module and the brazing furnace; a production line conveying belt is arranged in the plasma spot welding module, the brazing flux spraying device, the drying device and the brazing furnace and used for conveying radiator fins. The brazing filler metal in the radiator fins is melted in the welding bin, then the radiator fins are driven to vibrate in the promoting bin, and therefore when the liquid brazing filler metal flows into base metal gaps, the constraint of surface tension can be broken through moderate vibration.

The invention provides a copper bar welding fixing tool and copper bar welding equipment, and relates to the technical field of copper bar welding. The copper bar welding fixing tool and the copper bar welding equipment comprise an operation table, the upper end of the operation table is fixedly connected with a supporting column, the outer surface of the supporting column is connected with a shielding belt, and the upper surface of the operation table is fixedly connected with a welding base. According to the copper bar welding fixing tool and the copper bar welding equipment, an electric telescopic rod is arranged to drive a dirt removing mechanism to ascend and descend, so that a stand column can ascend to be close to a welding seam, a wiping and grinding wire is arranged at the top end of the stand column, and a cleaning motor drives a square shaft to rotate so that the stand column can be driven to rotate; the welding surface of the copper bar can be polished and wiped, so that oil stains and oxidation films on the surface of the copper bar can be conveniently removed, brazing filler metal can be connected with the surface of the copper bar more firmly, the effect of removing the oil stains and the oxidation layers on the surface of the copper bar is achieved, and the problem that the welding position is not firm due to the oil stains and the oxidation layers on the surface of the copper bar is solved.

The invention discloses an anti-deviation circuit board chip welding device and method, and relates to the field of chip welding, the anti-deviation circuit board chip welding device comprises a welding workbench, a welding robot is installed on the welding workbench, a welding positioning groove is formed in the welding workbench, a hot melting mechanism is arranged on the welding workbench, and the hot melting mechanism comprises a horizontal sliding seat, a vertical plate and a hot melting plate; the horizontal sliding seat is arranged on the welding workbench in a sliding mode, the sliding direction of the horizontal sliding seat is parallel to the welding positioning groove, the vertical plate is fixed to the horizontal sliding seat, the hot melting plate is arranged on the vertical plate in a sliding mode, a rectangular groove is formed in the middle of the hot melting plate in a penetrating mode, and a plurality of hot fuses are arranged on the two opposite inner walls of the rectangular groove at equal intervals in the horizontal direction; in the welding process, tin is plated on the chip welding holes of the circuit board through the welding robot, the thermal fuse is located between every two adjacent welding holes and used for enabling tin to be in a hot melting state, it is guaranteed that the chip cannot move in the welding process, the welding reject ratio is greatly reduced, and the welding quality is improved.

The invention discloses wave-soldering equipment based on visual inspection, and relates to the technical field of wave-soldering equipment, the wave-soldering equipment comprises a case, a clamping unit, a spraying unit, a preheating unit, a welding unit and an adjusting unit, the case is used for installing and fixing the clamping unit, the spraying unit, the preheating unit, the welding unit and the adjusting unit, the clamping unit is used for clamping a PCB, and the adjusting unit is used for adjusting the spraying unit. The spraying unit is used for coating soldering flux, the preheating unit is used for evaporating moisture in the soldering flux, the welding unit is used for welding pins of the PCB, the adjusting unit is used for adjusting wave crests, the PCB is clamped through the clamping unit in the transportation process of the PCB, and after the soldering flux is sprayed to the PCB through the spraying unit, the PCB is conveyed to the welding unit through the adjusting unit. The preheating unit evaporates moisture in the soldering flux, the PCB is welded through the welding unit, and the wave crest height is adjusted through the adjusting unit during welding, so that the welding quality is improved.

The invention relates to the technical field of dissimilar material connection, in particular to a non-equilibrium brazing connection method for graphene and aluminum alloy. The method comprises the steps that firstly, a high-thermal-conductivity graphene block, a rapid heating element, a to-be-welded face of aluminum alloy and brazing filler metal foil are cleaned and then dried; secondly, the materials are assembled into a to-be-brazed assembly according to the assembling mode of aluminum alloy / brazing filler metal foil / rapid heating element / brazing filler metal foil / graphene block / brazing filler metal foil / rapid heating element / brazing filler metal foil / aluminum alloy, and the distance between the rapid heating element and the to-be-brazed face of the graphene block is smaller than the distance between the rapid heating element and the aluminum alloy on the same side; and thirdly, the assembly to be brazed is heated in a special heating mode so as to ensure that non-equilibrium temperature fields can be formed on the two sides of the connector, after heat preservation is finished, the connector is naturally cooled to the room temperature, and brazing is completed. By the adoption of the scheme, the technical problem of high residual stress concentration of a heterogeneous joint in welding of an existing graphene material and aluminum alloy can be solved.

The invention discloses a micro-scale tin soldering device and method for ultrasonic laser composite energy field coordinated regulation and control. The micro-scale tin soldering device comprises a coordinated energy output module, a multi-physical field monitoring module, a wire feeding module, an intelligent regulation and control system and a motion platform, and a workpiece to be welded is arranged on the motion platform; the collaborative energy output module comprises a laser unit, an ultrasonic vibration unit and a focusable focus lens, the ultrasonic vibration unit comprises an ultrasonic generator, and the multi-physical field monitoring module comprises an infrared thermometer, a high-speed holographic imaging system and an acoustic impedance sensor; the high-speed holographic imaging system is used for recording brazing filler metal molten pool flowing and IMC nucleation dynamic states; the acoustic impedance sensor monitors the ultrasonic energy transmission efficiency; the intelligent regulation and control system is electrically connected with the multi-physics field monitoring module, and a multi-physics field coupling prediction model based on an LSTM neural network is arranged in the intelligent regulation and control system. According to the technical scheme, the structural design is reasonable, the energy field coupling efficiency is high, the material adaptability is high, the structure performance is controllable, the defect rate is remarkably reduced, and practicability is good.

Provided in the present invention are a fully-automatic selective soldering system and method for a PCB. The fully-automatic selective soldering system comprises the following components arranged in sequence: a soldering flux spray-coating mechanism; a first conveying mechanism, which is used for conveying a PCB to a spray-coating station of the soldering flux spray-coating mechanism; a preheating mechanism, which is used for preheating the PCB after spray-coating, wherein a third conveying mechanism is provided inside the preheating mechanism; a second conveying mechanism, which is used for conveying the preheated PCB to a position above a rotary soldering mechanism; and the rotary soldering mechanism, which is used for performing soldering of the preheated PCB. The soldering flux spray-coating mechanism is located below the first conveying mechanism; the rotary soldering mechanism is located below the second conveying mechanism; and the first conveying mechanism and the second conveying mechanism are respectively connected to two ends of the third conveying mechanism. Such a configuration simplifies the structure of a conveying portion, making the overall structure of an apparatus more compact, and also significantly shortens the conveying path of a PCB between processes, thereby significantly improving working efficiency.

The invention discloses vacuum welding equipment with an accurate temperature control function, and relates to the technical field of vacuum welding, the vacuum welding equipment with the accurate temperature control function comprises a main body, two first guide rails are symmetrically mounted on one side of the main body, and first sliding seats are slidably mounted on the two first guide rails; a first guide rail is installed on one side in the processing chamber, a connecting plate is installed on the first sliding seat, an infrared thermometer is installed on the connecting plate, a second guide rail is installed on one side in the processing chamber, a second sliding seat is installed on the second guide rail in a sliding mode, a linkage rod is installed on the second sliding seat, a fixing ring is installed on the linkage rod, and a heating coil is installed on the fixing ring; when the infrared thermodetector detects that the local temperature of the workpiece is too low, the infrared thermodetector can control the second guide rail to operate through the controller, the second sliding base drives the heating coil to move to the position, temperature compensation can be achieved through the heating coil, and therefore accurate control over the overall heating temperature of the workpiece is achieved.

The invention relates to the technical field of chip welding, and discloses a continuous vacuum welding device for an IGBT (Insulated Gate Bipolar Translator) chip, which comprises a working channel formed by connecting a plurality of working furnaces in series, vacuum gate valves used for sealing the space are installed at an inlet and an outlet of the working channel and the butt joint position of every two adjacent working furnaces, and the conveying mechanism is used for conveying product carriers, is installed in the working furnaces and comprises two conveying assemblies symmetrically distributed on the two sides of the axis of the working channel; the two ends of the product carrier are erected on the conveying parts of the two conveying assemblies correspondingly. The preheating furnace, the welding furnace and the cooling furnace are connected in series to form the working channel, and the vacuum gate valves are mounted at the inlets and the outlets of the cavities, so that the adjacent cavities are independently sealed, the oxygen content of each cavity is controlled in an extremely low range, the ceramic copper-clad plate is prevented from being oxidized, the welding void rate is reduced, and the interface bonding strength is improved.

The invention discloses a silver brazing temperature control device for a PDC (Polycrystalline Diamond Compact) drill bit. The silver brazing temperature control device comprises a base plate, a lower frame, a sliding table component, a driving component, an indexing head component, a superaudio frequency induction heating system, a closed-loop temperature control system and a foot switch. The sliding table assembly achieves X-axis position adjustment, Y-axis position adjustment and Z-axis position adjustment, the indexing head assembly achieves rotation and inclination angle adjustment through the chuck assembly and the inclination angle mechanism, and multi-axis positioning is formed. The ultrasonic frequency induction heating system adopts a profiling red copper pipe induction coil to locally heat the PDC composite sheet. The closed-loop temperature control system controls the welding temperature to be 690-700 DEG C, the temperature control precision to be + / -5 DEG C and the response time to be smaller than or equal to 10 ms in real time through an infrared thermometer, a signal system transmitting box and a single chip microcomputer, multi-point temperature measurement is supported, and heating is controlled to be started and stopped through a foot switch. A closed-loop temperature control system and superaudio frequency induction heating are combined, local real-time heating of the PDC is achieved, the welding temperature is accurately controlled, the welding quality and efficiency are improved, and the method is suitable for the complex geometry and impact resistance requirements of a coal mine PDC drill bit.

The invention relates to the technical field of LED chip welding, and discloses an LED lighting lamp chip pin positioning and welding device which comprises a base with an n-shaped cover plate installed at the upper end, a material supporting mechanism is arranged on the base, and a material taking mechanism is arranged above the base. The positioning and welding device for the LED lighting lamp chip pins can effectively solve the problems that in the prior art, LED lamp bead pins are prone to warping and deformation, and the production efficiency is high. The problems that the LED lamp bead welding efficiency is affected due to the fact that quality defects such as welding deviation and insufficient welding occur in the prior art, the distance requirements of different tin soldering work cannot be met, and suction nozzle components need to be frequently replaced and debugged are solved.

The invention relates to the technical field of chip welding, in particular to an automatic chip welding and positioning device based on machine vision. The automatic chip welding and positioning device based on machine vision comprises a support, a conveying assembly, a mechanical arm, an outer frame, a controller, a visual system, an adjusting frame, a visual sensor, a first frame strip, a second frame strip, a moving assembly, an adjusting assembly and a lifting limiting assembly, the conveying assembly is installed at the top of the support, and the outer frame is connected to the middle of the top of the support; a mechanical arm is installed on the top of the support and located on the right side of the outer frame, and a controller is installed on the front side wall of the outer frame. The visual system obtains initial coordinates of a circuit board bonding pad through three-dimensional modeling, the visual sensor monitors position deviation of the frame strips and the bonding pad in real time, the linkage moving assembly achieves accurate adjustment of the first frame strip and the second frame strip in a three-dimensional space, mechanical errors and batch difference influences are effectively eliminated, and high precision of chip welding is ensured.

An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

The invention relates to the technical field of infrared temperature measurement, provides a soldering tin temperature closed-loop control method and system based on infrared temperature measurement feedback, and solves the problems that a temperature measurement result of a phase change critical region seriously deviates from a true value, and temperature measurement is not accurate due to the fact that material state changes are not considered. According to the method, the environment temperature of a welding area and the initial temperature measurement value of soldering tin in the welding process are detected, and soldering tin phase change emissivity data are obtained; the real-time state of soldering tin is determined, and the soldering tin temperature after calibration is obtained by combining the soldering tin phase change emissivity data and the environment temperature; comparing the calibrated soldering tin temperature with the phase change temperature interval to obtain a temperature comparison result, and combining the temperature comparison result with the calibrated soldering tin temperature to obtain an adjusted heating power parameter; and the soldering tin heating device is controlled to heat soldering tin according to the adjusted heating power parameters until the calibrated soldering tin temperature within the preset target temperature range is obtained, high-precision real-time calibration and dynamic closed-loop regulation and control over the soldering tin temperature are achieved, and it is ensured that the welding process is stably within the target temperature range.

A heat exchanger includes a plurality of fins arranged in a thickness direction and a plurality of heat transfer tubes penetrating the plurality of fins, the heat transfer tubes being made of aluminum. A method for manufacturing the heat exchanger includes connecting a first open end portion of open end portions of the heat transfer tubes protruding from the fins and a first connection pipe made of aluminum, and first brazing a first joint between the first open end portion and the first connection pipe by heating the first joint with a first burner that is movable around the first joint.

The invention discloses a green laser assembly, an optical module and application of the green laser assembly in photovoltaic assembly processing, a shell is provided with a first fixed reflector coated with a reflecting film for reflecting 1064nm, a first acousto-optic Q switch and a second acousto-optic Q switch are orthogonally arranged, an Nd: YAG laser uses an Nd: YAG crystal rod with the diameter of 6mm and the length of 166mm, and a second fixed reflector coated with a reflecting film for reflecting 1064nm is arranged on the Nd: YAG crystal rod. The first dichroscope transmits 1064nm and reflects 532nm to improve the conversion efficiency of frequency multiplication, the LBO crystal 16 is placed close to the second dichroscope to improve the power density and the conversion efficiency, and the second dichroscope reflects 1064nm and transmits 532nm. And the light with the wavelength of 532nm transmitted by the second dichroscope is coupled into an input end optical fiber of the optical fiber beam splitter after passing through the optical isolator and the first lens. The short-wavelength green laser is adopted, the photovoltaic welding strip is mainly composed of the copper base material and the tin alloy, the green laser absorptivity is far larger than the near-infrared wavelength (about 1 micron) absorptivity, and the laser absorptivity of the welding strip is remarkably improved.

The present disclosure provides a wire bonding apparatus, a wire bonding method and a semiconductor device. The wire bonding apparatus includes: a wire tube for containing the wire and including a wire exit; a wire heating assembly located at a side of the wire exit; and a pre-shaping assembly located at a side of the wire tube and including a wire pre-pressing face; the pre-shaping assembly having a first state in which the wire pre-pressing face of the pre-shaping assembly is configured to abut the wire tube and a second state in which the pre-shaping assembly is configured to disengage from the wire tube. The wire bonding apparatus, the wire bonding method and the semiconductor device as provided in the present disclosure can reduce or eliminate the cratering effect.

The present invention discloses a tinning device for semiconductor production, and relates to the technical field of semiconductor production. The tinning device for semiconductor production comprises a tinning box, and a gas conversion mechanism is fixedly connected to the back of the tinning box. The tinning device for semiconductor production, through the setting of the gas conversion mechanism, when the toxic gas is sucked into the exhaust pipe by the air intake fan, the power supply is started, and the power supply heats the resistance wire, so that the metal device is heated, and carbon monoxide and oxygen can react to become carbon dioxide through rapid high temperature, so that the workers can greatly reduce the abnormality of the body caused by inhaling carbon monoxide during work, and the metal device can be fixed by a fixedly connected clamp in the filter plate one, and the filter plate one can prevent the gas from passing through the exhaust pipe too quickly to cause insufficient reaction, and at the same time, the impurities in the smoke can be blocked in the exhaust pipe.

The invention relates to a graphite target material brazing method which comprises the following steps: (1) carrying out sand blasting on a welding surface of a graphite target material to obtain a sand-blasted graphite target material; (2) carrying out vacuum magnetron sputtering titanium plating on the welding surface of the graphite target material subjected to sand blasting to obtain a graphite target material with a titanium film; and (3) the back plate and the graphite target material with the titanium film are heated, and brazing is conducted on the heated graphite target material and the back plate. The graphite target material is subjected to sand blasting and vacuum magnetron sputtering titanium plating treatment, the problem that the wettability of the welding flux on the surface of the graphite target material is poor is solved, the risk of unsoldering in the using process of the graphite target material is greatly reduced, the production cost is reduced, the production efficiency of products is improved, meanwhile, the backboard and the graphite target material with the titanium film are brazed, and the quality of the products is improved. And the tensile strength of the graphite target material can be greatly improved.

To enable heating over substantially the entire circumference of a joint portion between a first pipe body and a second pipe body in a high-frequency induction heating device.SOLUTION: A high-frequency induction heating device comprises a coil 3 having a surrounding portion 9 that covers a part of the outer circumference of a joint portion between pipe bodies 1 and 2, and a coil 4 having a surrounding portion 9 that covers another part of the outer circumference of the joint portion between the pipe bodies 1 and 2. The surrounding portions 9 substantially cover the outer circumference of the joint portion. The coil 3 is connected to a power supply 6 including a resonator 5, and the coil 4 is connected to a resonator 7. The coil 3 is provided with a magnetic coupling portion 8, and the coil 4 is provided with a magnetic coupling portion 8 that is magnetically coupled to the magnetic coupling portion 8 of the coil 3.SELECTED DRAWING: Figure 1

The invention provides a high-uniformity step-by-step heating device which comprises a plurality of heating modules, and a partition cavity is formed between every two adjacent heating modules. Each heating module is provided with a heat source cavity and a heating cavity, the heating cavities and the heat source cavities are communicated through backflow channels, the backflow channels comprise two partition backflow channels and two inner backflow channels, the two inner backflow channels are arranged in the transverse direction, and the two partition backflow channels are arranged in the longitudinal direction; a conveying opening is formed between the heating cavity and the partition cavity and used for allowing a circuit board to pass through. A partition backflow channel is arranged at the conveying opening and is in a slit shape extending in the transverse direction, the vertical end of the partition backflow channel is located at the conveying opening, the other end of the partition backflow channel communicates with the heat source cavity, airflow vertically flowing into the heat source cavity can be formed in the conveying opening through the partition backflow channel, and then an air wall is formed to prevent air at the conveying opening from flowing in the longitudinal direction. Air flow and heat interference at the conveying port are reduced, and the heating efficiency is improved.

Methods of securing bearing elements to bearing rings are disclosed. The methods include clamping the bearing elements in place on the bearing housing and applying heat to braze the bearing elements in place while clamped. The heat may be applied using a flame ring.

The invention relates to the technical field of pin welding, in particular to welding equipment for a ceramic heating body pin. According to the technical scheme, a cross beam is installed on a base, a lifting frame is transversely and slidably installed on the cross beam through a transverse sliding module, a welding module and a tin feeding assembly are installed at the bottom end of the lifting frame, a tin roll frame is installed on the back face of the cross beam, and a negative pressure pipe is installed on the lifting frame; a first support is installed at the position, located behind the negative pressure pipe, of the lifting frame, an industrial camera is installed on the first support, a feeding assembly is installed on the base in a limiting mode, and the feeding assembly is limited on the base through a limiting block. Through the steps of industrial camera photographing, image comparison and analysis, position coordinate recording and the like, accurate recording of the specific position of the defective product is realized, and powerful support is provided for subsequent quality control and process improvement.

An apparatus may include a base plate configured to support a package substrate, semiconductor chips on the package substrate in rows and columns; a lamp heater configured to irradiate light to the semiconductor chips to mount the semiconductor chips on the package substrate; and a pressurization mask including a transparent plate between the base plate and the lamp heater. The transparent plate includes a first surface facing the base plate and a second surface opposite to the first surface, light absorbing patterns on transmission regions of the first surface, such that the plurality of light absorbing patterns at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, and a light reflecting pattern on a reflection region of the second surface, wherein the reflection region is not overlapped with the transmission regions in the vertical direction.

The invention discloses an automatic brazing device based on graphite rod indirect heating and a brazing method thereof, and relates to the technical field of precision part welding. The automatic brazing device comprises a high-frequency induction heating system, a graphite rod heating body, a temperature closed-loop control system, an automatic transmission and positioning system and a rapid cooling system; the automatic transmission and positioning system is used for clamping and moving a workpiece, the high-frequency induction heating system and the rapid cooling system are sequentially arranged along the moving path of the workpiece, a graphite rod heating body is arranged in an induction field and is subjected to induction heating, and the temperature closed-loop system monitors the temperature of the graphite rod heating body in real time and feeds back and controls the power of the induction field. And the rapid cooling system is arranged at a downstream station of the high-frequency induction heating system and is used for carrying out forced cooling on the welded workpiece. Rapid local heating, precise temperature control and instant cooling can be achieved, and therefore the elastic performance of a workpiece is effectively protected while the welding quality and efficiency are improved.

The three-blade straight knife automatic welding equipment comprises a supporting frame, a workbench and a bottom plate are fixed to the supporting frame, and two fixing mechanisms are fixed to the workbench through turnover mechanisms; a clamping groove used for containing a tray is formed in the bottom plate, and the tray is used for containing a knife handle, a blade and a tool. A solder supply mechanism and a first mechanical arm are fixed to the upper side face of the workbench. A second mechanical arm is fixed to the lower side face of the workbench. A mounting frame is fixed on the workbench; a camera is fixed on the bottom plate; and a heating coil is fixed on one welding flux supply mechanism. According to the automatic welding equipment and method for the three-blade straight knife, firstly, an automatic mode is adopted, the quality and efficiency are improved, secondly, the double-station parallel design is adopted, the production takt is optimized, in addition, a positioning mechanism in the fixing mechanism can ensure the relative relation between a blade and a knife handle, and finally, a reliable grabbing point is provided through the tool design, so that the production efficiency is improved. Therefore, the cutter is prevented from being damaged.

This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.

The invention provides a chip welding method and system and a storage device, and the method comprises the steps: obtaining a welding pressure data set, dividing the welding pressure data into a plurality of discrete pressure data segments through the discrete characteristics of the welding pressure data set, determining a pressure deviation coefficient of a target chip, obtaining a pre-welding image of the target chip, and obtaining a pre-welding image of the target chip; the method comprises the following steps: pre-welding a target chip pin, extracting a to-be-welded spot distribution vector of the target chip pin from a pre-welding image, and determining a welding gun offset during welding of the target chip through a pressure deviation coefficient and the to-be-welded spot distribution vector, thereby determining an argon flow domain of each to-be-welded spot of the target chip pin, and further determining a flow compensation value of each pin of the target chip. Therefore, according to all the flow compensation values and the welding gun offset, the variable welding flux amounts of the target chip pins at different positions are determined, all the pins of the target chip are heated and welded through all the variable welding flux amounts, and dynamic adjustment of the welding flux amounts in the chip welding process can be achieved.

The invention relates to the technical field of welding equipment, in particular to a sewage treatment plant construction pipeline butt welding device which comprises a butt ring located between two pipelines, a circular ring arranged on the outer side of the butt ring in a sleeving mode and a coil arranged in the circular ring and used for heating the butt ring. The butt joint ring is provided with a plurality of long holes used for being filled with welding flux. The butt-joint ring and the welding flux filled on the butt-joint ring are used for performing butt-joint welding on the two pipelines, so that the whole end surfaces of the pipelines can be heated and melted, the deep-layer positions and the surface-layer positions of the end parts of the two pipelines can be connected, the welding firmness and integrity are improved, and the welding quality is further improved; meanwhile, by means of the welding flux on the butt joint ring and the induction heating mode, the end of the pipeline can be evenly heated, and therefore the situation that stress is generated at the butt joint position, and welding quality is affected is avoided.