49results about "Heating appliances" patented technology

A press-forming device for forming individual solder bodies from a wire of soldering material includes a press-forming mechanism and a separation means. The press-forming mechanism forms a continuous strand of preformed solder sections from the wire by using two notched rollers that rotate in opposite directions and that press opposite notches into the wire. The preformed solder sections are disposed equidistantly along the strand and are connected to each other by connecting links disposed at the notches. The separation means forms individual solder bodies by separating the preformed solder sections one by one at the connecting links. The separation means separates individual preformed solder sections using a cutting mechanism that moves in a direction perpendicular to the length direction of the strand. Individual solder bodies are transported to a solder jetting section where they are liquefied by a laser beam and jetted from the solder jetting section by gas pressure.

The present invention provides a simple method for joining stainless steel and copper or a copper alloy at low cost, the method being able to be carried out in the atmosphere. According to the present invention, Sn or an Sn alloy having an Sn content of 40% by mass or more is used as a joining metal. In the joining step, the copper or the copper alloy is heated by a heating device, and the stainless steel and the copper or the copper alloy are joined with each other by melting the joining metal while heating the stainless steel by means of heat transfer from the copper or the copper alloy. The highest temperature reached by the stainless steel is 350°C or less, and the residence time in the temperature range of 150°C or higher of the stainless steel is 5 seconds to 5 minutes inclusive.

This utility model relates to the field of transformer manufacturing technology, specifically an automatic soldering device for surface-mount transformers. It includes a base, a solder bath fixedly installed on the rear side of the top of the base, and a cooling tank fixedly installed on the top of the base in front of the solder bath. A conveyor belt is positioned above the top of the base, in front of the cooling tank. This automatic soldering device for surface-mount transformers, through the coordinated use of a solder bath, servo motor, heating rod, stirring shaft, stirring roller, and temperature sensor, effectively controls and stirs the temperature of the molten solder in the solder bath. The temperature sensor monitors the molten solder temperature in real time, and by adjusting the power of the heating rod, the temperature of the molten solder can be precisely stabilized within a suitable process range. The servo motor drives the stirring roller to rotate, causing convection in the molten solder, resulting in a more uniform temperature distribution, preventing localized overheating or undercooling, ensuring consistent chemical composition, and significantly improving the fluidity of the molten solder.

The disclosure relates to assemblies and methods for preheating objects in the process of underfill. Specifically, the disclosure relates to assemblies and methods for treating printed circuit boards (PCBs), integrated circuits (ICs) wafers and the like, in the preheating stage of the underfill process using an assembly operable to create a customizable hot-air bath with adjustable depth to account for surface topology and necessary clearances, for soaking the PCBs, ICs, wafers and the like in hot air, bringing these to operating temperature.

A brazing apparatus includes a brazing chamber configured to receive the first component and the second component to be coupled, the brazing chamber including a first plate that is movable relative to a second plate and between which the first component and the second component are received, an induction spool operable to heat the first plate by induction heating, a resistance heating element operable to heat the second plate by resistance heating, and an electronic control unit configured to selectively activate and deactivate the induction spool and the resistance heating element.

The control device includes a brazing controller configured to control a brazing material moving mechanism so as to retract a tip of a brazing material from a heating position to interrupt the brazing, during execution of the brazing, and a movement controller configured to, when the brazing is interrupted, control a movement machine so as to retract a heating device or a base material in a direction opposite to a movement direction during the execution of the brazing, and subsequently advance the heating device or the base material in the movement direction again. The brazing controller resumes the brazing by controlling the brazing material moving mechanism so as to cause the tip of the brazing material to reach the heating position at the same time when the heating device or the base material advanced by the movement controller reaches an interruption position at which the brazing is interrupted.

The present invention generally relates to a device, a system comprising a plurality of devices and a method for controlled heat transfer, in particular by means of a condensing liquid, to workpieces, and in particular for soldering items to be soldered in a vapor phase zone. The vapor formed when the items to be soldered are immersed in the vapor phase zone is discharged and recovered. The immersion of the items to be soldered in the vapor phase zone and the removal of the items to be soldered from the vapor phase zone is realised in a simple manner.

The brazed lap joint according to an embodiment of the present invention has: an overlapped first steel sheet and second steel sheet; a zinc-system plating layer residing at the overlapping surface between the first steel sheet and the second steel sheet; and a braze region comprising a brazing metal that joins the end face of the first steel sheet and the surface of the second steel sheet and a heat affected zone at the perimeter of the brazing metal. The concentration of B atoms at the prior austenite grain boundary in the second steel sheet, excluding the braze region, is at least 2.0 atm%, and the average effective grain size of the second steel sheet, excluding the braze region, is 7.0 µm or less. The average effective grain size of the second steel sheet is 15.0 µm or less in a root region, terminal region, and middle region between the root region and terminal region, the Vickers hardness of the brazing metal is 250 or less, and the leg length on the side of the second steel sheet of the brazed lap joint is at least 2.0 mm.

The application relates to the technical field of packaging welding, and provides a method for improving temperature uniformity of a heating plate and a vacuum welding furnace for chip packaging. A flow guide cover is arranged in the interior of the vacuum welding furnace, an air uniformizing plate is arranged in the upper cavity of the vacuum welding furnace, an upper infrared heating pipe is arranged above the air uniformizing plate, at least one fan is arranged above the upper infrared heating pipe, and the fan, the air uniformizing plate and the upper infrared heating pipe are arranged in the interior of the flow guide cover; the interval between the air uniformizing plate and the upper infrared heating pipe is set as a first interval L1; and the interval between the air uniformizing plate and the heating plate is set as a second interval L2. The temperature uniformity of the heating plate is improved.

The multifunctional vacuum reflow soldering furnace comprises a plurality of unit furnaces which are used in a combined mode, a working cavity is arranged in each unit furnace, each working cavity comprises a sealing cover plate, a heating assembly and a cooling assembly, the heating assemblies and the cooling assemblies are arranged in the working cavities, each heating assembly is of a face heating structure, and each cooling assembly is of a refrigerant two-way heat exchange structure. And a grabbing device is arranged at the top of the unit furnace and comprises a traveling crane serving as a motion reference and a clamping jaw driven by the traveling crane, the clamping jaw grabs a tool with a product to be welded to move to a next target position at a time, and the product to be welded is subjected to heating and cooling treatment in a single working cavity. According to the invention, products of multiple specifications can be welded on the same assembly line of the same reflow furnace.

The utility model discloses a kind of small-pitch led lamp bead maintenance plane heating devices, it is related to led lamp bead maintenance technical field, including heater and cooling assembly, the heater is integrated structure, and heater upper surface is provided with insulating heat insulation pad, the cooling assembly is set to heater left side, and cooling assembly includes fixed plate, movable frame, fixed hole, fixed bolt, cooling cavity, air cooler, dust screen and air outlet, the fixed plate is set to heater left side front and rear end, and fixed plate is provided with two groups, the fixed plate right surface and heater left surface are tightly connected. The small-pitch led lamp bead maintenance plane heating device, cooling assembly makes the device have cooling mechanism, can help the lamp bead of hot welding rapid cooling, and cooling mechanism is telescopic, convenient to store, by dismounting component makes the device can realize the quick dismounting of heating and protection mechanism, to facilitate its regular maintenance or replacement.

An apparatus may include a base plate configured to support a package substrate, semiconductor chips on the package substrate in rows and columns; a lamp heater configured to irradiate light to the semiconductor chips to mount the semiconductor chips on the package substrate; and a pressurization mask including a transparent plate between the base plate and the lamp heater. The transparent plate includes a first surface facing the base plate and a second surface opposite to the first surface, light absorbing patterns on transmission regions of the first surface, such that the plurality of light absorbing patterns at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, and a light reflecting pattern on a reflection region of the second surface, wherein the reflection region is not overlapped with the transmission regions in the vertical direction.

A brazed lap joint according to an aspect of the present invention includes: a first steel sheet and a second steel sheet, the first steel sheet and the second steel sheet being stacked; a zinc-based-plated layer, the zinc-based-plated layer being an overlapping surface of the first steel sheet and the second steel sheet; and a brazed zone including a brazing metal joining an end surface of the first steel sheet and a surface of the second steel sheet, and a heat-affected zone around the brazing metal, in which a concentration of B atoms at a prior austenite grain boundary of the second steel sheet excluding the brazed zone is 2.0 atm% or more, an average effective grain size of the second steel sheet excluding the brazed zone is 7.0 µm or less, an average effective grain size of the second steel sheet in a root portion, a toe portion, and a middle portion between the root portion and the toe portion is 15.0 µm or less, a Vickers hardness of the brazing metal is 250 or less, and a leg length of the brazed lap joint on the second steel sheet side is 2.0 mm or more.

The application relates to a welding strip welding device for welding a welding strip to a solar cell, and comprising a support and a fixing member. The support has a support surface which is at least partially a convex curved surface. The fixing member is arranged on the support and is configured to fix the solar cell on the support surface so that the solar cell is bent towards the side of the support surface. The welding strip welding device can use the fixing member to fix the solar cell on the support surface in a form that the electrode surface of the solar cell faces away from the support surface and makes the solar cell into a corresponding bent shape. Then, the welding strip is welded towards the electrode surface of the solar cell. After the welding, due to the difference in the expansion coefficient between the welding strip and the solar cell, the two have a tendency to bend towards the electrode surface. The bending tendency after the welding and the bending caused by the fixing of the solar cell before the welding at least partially offset each other, so that the warping of the solar cell caused by the welding is reduced.

The application discloses a gradient composite glass solder for connecting alumina and aluminum nitride ceramics and a method, and belongs to the technical field of ceramic brazing. ‑6 / K~5.7*10 ‑6 / K; the second glass solder comprises, in percentage by weight, ZnO: 15~19 wt%, B2O3: 20~24 wt%, SiO2: 36~40 wt%, Al2O3: 6~10 wt%, TiO2: 1~4 wt%, Na2O: 3~8 wt%, Li2O: 1~3 wt% and CaO: 4~6 wt%, and the thermal expansion coefficient of the second glass solder is 6.0*10 ‑6 / K~7.0*10 ‑6 / K.

This invention relates to the field of roadheader technology, specifically to a welding device for roadheader cutter heads and shanks, comprising a support assembly, a welding assembly, an adjustment assembly, and an auxiliary unit. This invention employs an inclined support seat at a set angle combined with a rotating welding method, allowing the molten brazing filler metal to flow within the groove of the shank, increasing the coverage of the filler metal on the contact surface between the cutter head and shank. Furthermore, a fitting component ensures that the filler metal remains sufficiently on both the cutter head and shank contact surfaces, coinciding with a set amplitude of vibration. This allows the filler metal to replenish the gap between the cutter head and shank, reducing resource waste caused by filler metal overflow and preventing partial weld defects at the cutter head and shank connection due to overflow. In summary, this improves the welded connection strength.

This utility model provides a lead-free soldering preheating platform for PCBA, belonging to the field of electronic manufacturing technology. It addresses the problem of residual heat inside the preheating platform easily burning workers and posing a safety hazard. The platform includes a preheating platform body, hot air ducts, an inspection port, an inspection operating handle, preheating conveying rails, a preheating alignment platform, and an inspection and protection mechanism, which in turn forms a preheating alignment mechanism. The hot air duct is fixedly connected to the top of the preheating platform body. The inspection port is located at the front of the preheating platform body. The inspection operating handle is rotatably connected to the front of the preheating platform body. The preheating conveying rails are fixedly connected to the inner side of the preheating platform body. The preheating alignment platform is fixedly connected inside the preheating platform body. The inspection and protection mechanism is located at the front end of the preheating platform body. The preheating alignment mechanism is located above the preheating alignment platform, improving worker safety when inspecting the preheating platform body.

The application belongs to the technical field of welding processing, and discloses a welding tool for power electronic components, which comprises a hot welding frame assembly, two groups of component welding plate roller arm assemblies are arranged above the hot welding frame assembly, and a centering type fixed plate and a centering type roller moving plate feeding structure during hot welding of the electronic plate are formed between the two groups of component welding plate roller arm assemblies; a self-clamping driving arm assembly for automatically centering and folding the two groups of component welding plate roller arm assemblies is arranged below the hot welding frame assembly; the clamping arm structure for the electronic plate is formed between the two groups of component welding plate roller arm assemblies; when the electronic plate is clamped between the two groups of component welding plate roller arm assemblies, the two sides of the electronic plate are clamped in the profiled roller; through rotation of the profiled roller, the roller moving plate feeding of the electronic plate in the two groups of component welding plate roller arm assemblies is realized; on one hand, the clamping and fixing of the electronic plate of different sizes are realized; on the other hand, the plate feeding treatment of the electronic plate is not affected when the plate is clamped.

The utility model discloses a kind of reflow soldering heating devices, including booster volute, motor, rectifier plate, rectifier box, air duct box, return air strip and return air board;First air outlet is penetrated in rectifier plate, rectifier plate covers the upper surface of rectifier box, rectifier box is located in air duct box, and air inlet channel is formed between rectifier box and air duct box, heating wire is equipped in air inlet channel, and the periphery of rectifier box is connected with the periphery of air duct box by return air board and return air strip;First air outlet is penetrated in rectifier box bottom, first air inlet is penetrated in air duct box bottom, booster volute is equipped with second air outlet and second air inlet, second air inlet is communicated with first air inlet, wind wheel is equipped in second air inlet, motor drives wind wheel rotation, and second air outlet extends to rectifier box after passing through air duct box. Its advantage is that air flow reciprocating circulation, improve equipment heat preservation effect, reduce reflow soldering furnace heat loss, reduce electric energy consumption, improve temperature uniformity.

This utility model discloses an automatic P-board welding device, relating to the field of welding fixture technology. The device facilitates the insertion of the welding needle cross-section through a cavity, allowing welding only at the pin and circuit board junctions, preventing damage to other areas. The welding cavity provides a closed welding environment for the relay, circuit board, and pins, isolating external interference. The cover plate positioning holes and pad screw holes are fastened with screws, ensuring alignment accuracy after repeated disassembly and assembly. Chamfered edges on the positioning holes guide the cover plate to quick alignment, preventing misalignment. Furthermore, the shape of the cavity matches the welding needle cross-section, limiting the vertical movement range of the welding needle, isolating the welding area from the non-welding area, preventing solder slag from splashing onto the relay coil or sensitive components, and ensuring the welding needle only contacts the junction of the pin and circuit board, avoiding accidental soldering of adjacent contacts. The pads are equipped with patches that disperse welding stress, reducing the risk of solder joint cracking due to thermal expansion and contraction or mechanical vibration.

Regarding electrobrazing work, the tacit knowledge of skilled workers' work procedures will be collected as data and made reproducible. [Solution] An automated data system for electric brazing operations comprising an electric brazing apparatus, a current information collection means for collecting information on the current flowing between the electrodes of the electric brazing apparatus during electric brazing operations, and an energization time collection means for collecting information on the time the current of the electric brazing apparatus is turned ON and OFF, or the energization time, during electric brazing operations, and which records the information on the current flowing between the electrodes and the information on the energization time in a linked manner.

The application discloses a novel electrode preparation and wiring process combining indium compression contact and hot air welding method, and relates to the technical field of condensed state physics and material engineering. The application comprises the following steps: S1: processing a millimeter-level bulk phase material sample to be measured into a regular long strip-shaped Hallbar structure for electrical transport measurement, and performing cleaning treatment on the surface of the processed sample. The application cooperates indium compression contact and hot air welding, relies on the good ductility and low resistance characteristics of high-purity indium, forms a gap-free ohmic contact between indium and the surface of the millimeter-level bulk phase sample under constant pressure at room temperature, simultaneously utilizes the low melting point characteristics of Sn-Bi series low-temperature soldering paste, forms a metallurgical bonding solder joint structure between the metal wire and the indium electrode through a precise temperature control hot air welding process, and forms a mutual melting diffusion layer, which effectively solves the problem of loose contact. Compared with a single contact mode, the application not only retains the advantage of small thermal damage of the indium compression method to the sample, but also has high mechanical stability of the welding connection.

The invention relates to a temperature control plate for battery cooling and to a method for producing a temperature control plate. The temperature control plate has a plate body with a first plate element (1) and a second plate element and at least one connecting piece (2) for a temperature control fluid. The components are joined together by soldering. The connecting piece (2) has an outer flange (4) and a plug-in section (5), wherein the outer flange (4) rests on the outside of the first plate element (1) and the plug-in section (5) is positioned in a mounting opening (7) in the first plate element (1). The mounting opening (7) is arranged in a recess (8) in the first plate element (1), wherein a peripheral edge (10) of the mounting opening (7) is displaced relative to the plate plane (PE) of the first plate element (1).An end section (14) of the plug-in section (5) is plastically formed into an inner flange (30), an annular groove (31) being formed between the outer flange (4) and the inner flange (30), and the edge (10) of the mounting opening (7) being located in the annular groove (31).

The invention relates to a method for controlling the temperature of parts in order to produce a soldered or sintered connection between the parts, wherein in order to provide thermal energy to be transferred to the parts, at least one controllable heat source is provided. A first temperature of a soldering or sintering device part or component which is in thermal contact with a soldering or sintering device part is contactlessly measured at at least one first temperature location using at least one first temperature sensor which is in thermal contact with the part or the component, and a second temperature of a soldering or sintering device part or component which is in thermal contact with a soldering or sintering device part is contactlessly measured at at least one second temperature location using at least one second temperature sensor, wherein the first temperature location is physically spaced from the second temperature location such that a temperature gradient between the first and second temperature can be expected in the event of a temperature change. The measured second temperature is calibrated on the basis of the measured first temperature in order to ascertain a calibrated second temperature, and the heat source is controlled at least on the basis of the calibrated second temperature. The invention additionally relates to a correspondingly designed soldering or sintering device.

The application discloses a laser brazing method and system for vertical welding position, comprising determining the vertical welding angle of the welding seam of the workpiece to be welded; according to the preset angle interval to which the vertical welding angle belongs, selecting the corresponding laser brazing process parameter combination, wherein the process parameters at least include laser power, wire feeding speed and laser spot parameters, and the process parameter combinations corresponding to different angle intervals are different; and using the selected process parameter combination to perform laser brazing on the workpiece to be welded. Through the establishment of the dynamic matching relationship between the vertical welding angle and the laser brazing process parameters, high-quality and automatic vertical welding at any angle is realized, and the technical difficulties of poor brazing material flow and poor parameter adaptability are effectively solved.

A laser press bonding method is provided, including: placing a substrate on a carrier; preheating a press head to at least a predetermined temperature; placing an electronic component on the substrate via a solder material by the preheated press head; pressing the electronic component against the substrate by the preheated press head; and irradiating a laser beam from a laser source through the preheated press head to the substrate to bond the electronic component to the substrate via the solder material.

The utility model discloses a positioning device for laser soldering machine, including workstation and two horizontal frame. Through set up horizontal shift device, horizontal shift case, spring, horizontal shift rod and the cooperation of horizontal shift groove, solved the present laser soldering machine with positioning device is a kind of in laser soldering machine operation and carry out the device of auxiliary positioning, the setting of positioning device makes welding accuracy can be improved, and can improve production quality and efficiency, usually positioning device carries out positioning to processing material by the mode of bolt adjusting positioning device accessory, due to the gap between bolt and nut, and the problems such as looseness, wear and tear that can appear in the adjustment process, lead to the positioning position after each adjustment possibly exist certain deviation, difficult to guarantee the accuracy of repeated positioning, and the adjustment process of bolt is more complicated, but the positioning device used by the present laser welding machine does not have the component problem of more accurate and stable positioning to processing material.

This utility model discloses a universal disassembly and assembly fixture applicable to various chip specifications, including a cuboid fixture body and a rectangular slide groove disposed inside the cuboid fixture body. The top of the rectangular slide groove is open, and a partition block is disposed inside the center of the rectangular slide groove. Fixture slider A and fixture slider B are respectively disposed inside the rectangular slide groove, and fixture slider A and fixture slider B are located on the right and left sides of the partition block, respectively. This utility model optimizes the universal disassembly and assembly fixture applicable to various chip specifications, and replaces the traditional single-board chip placement board with a new integrated disassembly and collection device. This device is detachable and can be quickly replaced when damaged or mismatched in size, improving versatility and applicability. When disassembling chips in batches, the overflowing solder solution can fall into the liquid storage box below through the perforated placement plate, avoiding pollution of the working environment and facilitating cleaning, thus improving the convenience and efficiency of chip disassembly and assembly work.

The application discloses a stop valve production welding device, and relates to the technical field of stop valve production welding, which comprises a rotating table, the rotating table comprises a fixed base and a rotating base rotatably arranged on the fixed base, and further comprises a plurality of welding clamp mechanisms which are fixedly arranged on the rotating base in a circumferential direction and sequentially pass through a feeding positioning station, an inspection station, a welding station and a cooling and discharging station while rotating with the rotating base, wherein the welding station is provided with a surrounding welding mechanism, an auxiliary mechanism and a micro-vibration motor, and the surrounding welding mechanism is used for surrounding heating of the butt joint of a valve body and a pipe fitting through a reciprocating swing mode. The device has the advantages that a prefabricated filler ring is adopted and is subjected to 360-degree melting and filling; uniform temperature field is provided through swing heating, so that the liquid filler maintains good fluidity; micro-vibration auxiliary cooperation makes the filler gap more sufficient and the weld structure more compact, and the mechanical properties and sealing performance of the joint are significantly improved.