The invention relates to a
laser drilling device (10) for
processing a substrate (12) for an
electrochemical cell and to a method for
processing a substrate (12) for an
electrochemical cell by means of a
laser drilling device (10), wherein the
laser device (10) comprises a laser unit (14) which is designed to generate a laser beam (16) for
processing the substrate (12). The invention further relates to a substrate (12) for an
electrochemical cell, the substrate having been machined by means of such a
laser drilling device and / or using such a method. According to the invention, a first deflection (x1) of the laser beam (16) in a first deflection direction, in relation to a surface (22) of the substrate (12), is brought about by means of a first deflecting unit (20), and a second deflection (x2) of the laser beam (16) in a second deflection direction, in relation to the same surface (22) of the substrate (12), is brought about by means of a second deflecting unit (24), the second deflecting unit (24) being operated in such a way that in at least one
time segment (Δt1), in particular a first
time segment, the second deflection direction is opposite the first deflection direction, and in at least one
time segment (Δt2), in particular a second time segment, the second deflection direction is oriented in the same direction as the first deflection direction.