The invention relates to the technical field of
printed circuit board manufacturing, in particular to a thermal
interface bonding method of a
copper-clad laminate, which comprises the following steps of: 1, cleaning the surfaces of a
copper foil and an insulating base material, removing surface pollutants, and measuring the
contact angle of water on the surfaces of the
copper foil and the insulating base material through a
contact angle measuring instrument; 2, performing low-temperature
oxygen plasma activating treatment on the cleaned surfaces of the
copper foil and the insulating base material; 3, forming a thermal stress buffer layer on the surfaces of the activated
copper foil and the insulating base material; 4, carrying out
thermocompression bonding, wherein temperature, pressure and time parameters of
thermocompression bonding are dynamically optimized according to thickness data and
surface energy data of the buffer layer; and step 5, carrying out post-curing treatment on the copper-clad laminated board subjected to primary bonding. Through cleaning, low-temperature
oxygen plasma activation and the addition of the thermal stress buffer layer, the surface quality and
thermal stability of the
copper foil and the insulating base material are effectively improved.