Preparation method for vertically oriented boron nitride/high polymer insulating heat conducting material

A vertically oriented, boron nitride technology, applied in heat exchange materials, chemical instruments and methods, layered products, etc., can solve problems such as difficulty in improving the thermal conductivity of the substrate, expand the scope of application, and easily control the process flow , the effect of improving mechanical properties

Inactive Publication Date: 2017-06-13
PEKING UNIV +1
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Problems solved by technology

[0007] Aiming at the above-mentioned deficiencies of the prior art, the present invention provides a vertically oriented boron nitride high thermal conductivity insulating polymer composite material and its preparation method t

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  • Preparation method for vertically oriented boron nitride/high polymer insulating heat conducting material
  • Preparation method for vertically oriented boron nitride/high polymer insulating heat conducting material

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preparation example Construction

[0025] Correspondingly, the embodiments of the present invention provide a method for preparing the above-mentioned high thermal conductivity insulating composite material with a vertically oriented structure. The process steps of the preparation method of the high thermal conductivity polymer composite material of the embodiment of the present invention are as follows: figure 1 As shown, it includes the following steps:

[0026] Step 1: Add boron nitride with a mass fraction of 0.5%~2% to the mixed solution of water and ethanol (mass ratio 1:1~1:5), mix and sonicate for 0~24 hours to obtain boron nitride nanosheets mixed solution;

[0027] Preferably, the water used above is deionized water; the ethanol is absolute ethanol. The particle size of boron nitride raw material is 2~18μm;

[0028] Step 2, adding mass fraction of 0.1-0.2% tris to the mixed solution, using dilute hydrochloric acid to adjust the pH to 8-9, adding mass fraction of 0.2-2% dopamine hydrochloride, Afte...

Embodiment 1

[0039] A high thermal conductivity polymer composite material and a preparation method thereof. The high thermal conductivity polymer composite material provided in Example 1 was prepared according to the following method.

[0040] 1. Preparation of Surface Modified Boron Nitride Nanoparticles

[0041] (1). Using commercial boron nitride sheets as the basic raw material, add boron nitride with a mass fraction of 0.5% to a mixed solution of water and ethanol (mass ratio: 1:3), mix and sonicate for 12 hours to obtain boron nitride Nanosheet mixed solution;

[0042] (2). Add 0.1% trishydroxymethylaminomethane to the mixed solution, adjust the pH to 8.5 with dilute hydrochloric acid, then add dopamine hydrochloride with a mass fraction of 0.5%, and mix to obtain a mixture solution . The above solution was stirred for 12 hours in a dark environment;

[0043] (3). Add a silane coupling agent such as KH570 with a mass fraction of 1% to the above mixed solution, and then use dilu...

Embodiment 2

[0052] A high thermal conductivity polymer composite material and a preparation method thereof. The high thermal conductivity polymer composite material provided in Example 2 was prepared according to the following method.

[0053] 1. Preparation of Surface Modified Boron Nitride Nanoparticles

[0054] (1). Using commercial boron nitride sheets as the basic raw material, add boron nitride with a mass fraction of 0.5% to a mixed solution of water and ethanol (mass ratio: 1:3), mix and ultrasonically treat for 6 hours to obtain boron nitride Nanosheet mixed solution;

[0055] (2). Add 0.1% trishydroxymethylaminomethane to the mixed solution, adjust the pH to 8.5 with dilute hydrochloric acid, then add dopamine hydrochloride with a mass fraction of 0.5%, and mix to obtain a mixture solution . The above solution was stirred for 6 hours in a dark environment;

[0056] (3). Add 1% silane coupling agent such as KH550 to the above mixed solution

[0057] (4). After the above mix...

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Abstract

The invention provides a preparation method for a vertically oriented boron nitride/high polymer insulating heat conducting material, and belongs to the field of radiating material preparation. The method comprises the following steps: first, modifying the surfaces of boron nitride nano-sheets by using dopamine or a silane coupling agent; then, coating the modified boron nitride nano-sheets between two layers of high polymers; next, pressing the three layers of materials into a thin film with a certain thickness by utilizing a hot pressing process; finally, laminating the thin film into a block body or winding the thin film into a cylinder. The preparation method is simple in process and suitable for batch production; the boron nitride cannot aggregate in the polymers, and a highly oriented heat conducting network is formed, and quick conducting of heat is facilitated. The surface of the boron nitride is modified; the interface bonding between the boron nitride and resin can be enhanced; the mechanical properties and the thermal properties are further improved. The boron nitride/high polymer composite material has high heat conductivity, excellent mechanical properties, and the electrical properties of high insulating and low dielectric loss, and has wide application in the field of electronics.

Description

technical field [0001] The invention belongs to the field of preparation of insulating and heat-conducting materials, in particular to the preparation of a highly heat-conducting and insulating vertically oriented boron nitride nanosheet / high polymer thermal interface material. Background technique [0002] With the development of miniaturization, multi-function, and high-density integration of electronic devices, more and more attention has been paid to thermal management issues, and thermal failure has gradually become the main form of electronic device failure. According to statistics, whenever the operating temperature of a device rises by 10°C, its reliability drops by 50%. In terms of high-efficiency lighting, heat dissipation has become a bottleneck in the development of LED and other semiconductor light-emitting technologies, which are known as the third lighting revolution. Taking LED devices for automobiles as an example, the heat flux density of LED devices for he...

Claims

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Application Information

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IPC IPC(8): C08L75/04C08L63/00C08L23/06C08K7/00C08K9/06C08K9/04C08K3/38C09K5/14B32B9/00B32B9/04
Inventor 白树林方浩明
Owner PEKING UNIV
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