66 results about "Interfacial thermal resistance" patented technology

The application discloses a method for measuring interface thermal resistance and thermal conductivity of multilayer thin film material, comprising the following steps: arranging a first heating electrode, a second heating electrode and a detecting electrode on the top insulating layer of the multilayer thin film material; changing the frequency of the first alternating current heating current, recording the third harmonic voltage of the first heating electrode, and calculating the alternating current thermal response signal of the first heating electrode and the detecting electrode; changing the frequency of the second alternating current heating current, recording the third harmonic voltage of the second heating electrode, and calculating the alternating current thermal response signal of the second heating electrode and the detecting electrode; fitting the thermal conductivity of the substrate; and fitting the thermal conductivity and the interface thermal resistance of the multilayer thin film material. The substrate thermal conductivity slope method is used for fitting, the slope method is only sensitive to the thermal conductivity of the substrate, and the measurement error caused by the thin film layer is eliminated; the alternating current response signal in the frequency domain is used for the inversion calculation of the thermal conductivity and the interface thermal resistance of the thin film, the data amount is large, and the fitting precision can be improved.

This utility model relates to a multifunctional thermally conductive coating. The thermally conductive coating includes, from bottom to top, a base layer for adhesion, a thermally conductive layer forming a thermally conductive network structure, an insulating layer that increases dielectric breakdown voltage, and a heat dissipation layer that accelerates heat dissipation and reduces interfacial thermal resistance. This multifunctional thermally conductive coating, through the adhesion of the base layer, enables effective connection between the coating and thermally conductive pads. Simultaneously, the thermally conductive layer, insulating layer, and heat dissipation layer contribute to high thermal conductivity, thus achieving a balance between thermal conductivity and adhesion, improving the functionality of the thermally conductive coating. Furthermore, the heat dissipation layer can be connected to heat dissipation devices, further enhancing the balance between thermal conductivity and adhesion.

The application relates to the field and discloses a high-thermal-conductivity hexagonal boron nitride ceramic material and a preparation method thereof; the ceramic material is made of hexagonal boron nitride powder, an aluminum-boron interface precursor, a rare earth oxide additive, a fluoride fluxing agent and inevitable impurities; the hexagonal boron nitride powder comprises first flaky hexagonal boron nitride powder and second flaky hexagonal boron nitride powder, and the two are matched according to particle size gradation. During preparation, the aluminum-boron interface precursor formed by an aluminum source and a boron source is first attached to the surface of the flaky hexagonal boron nitride powder, then mixed with the additive to prepare slurry, the slurry is formed into an oriented blank through doctor blade flow casting, and the oriented blank is pressed into a ceramic blank body in a same direction through layering. Then, the ceramic blank body is subjected to pre-nitriding treatment and oscillation hot-pressing sintering, so that a nitridation bridging phase is formed in the contact area of adjacent flaky hexagonal boron nitride powder. The material can reduce interlamellar porosity and interfacial thermal resistance, improve the thermal conduction continuity between the flaky hexagonal boron nitride powder, and is suitable for insulating and heat-conducting ceramic components.

The present application relates to the technical field of wide band gap semiconductor devices, and particularly relates to a Ga2O3 power device heat dissipation optimization method based on a hetero-substrate structure, which comprises the following steps: combining a first principle to construct an interface atomic model, adopting the first principle to screen a high-thermal-conductivity substrate material, constructing a hetero-interface model to analyze key physical parameters, calculating an interface thermal resistance based on a machine learning potential function and a molecular dynamics method, and combining finite element thermal simulation to carry out macro-scale thermal analysis and structure optimization. The present application covers the whole process from material screening to interface optimization and then to device-level thermal simulation, systematically improves the thermal management performance of the Ga2O3 power device, and simultaneously improves the efficiency and reduces the trial and error cost, thereby providing differentiated strategies for adapting to various complex application scenarios.

This invention discloses a gas sensor based on interface thermal resistance modulation. A heating composite is partially embedded and sandwiched between a first support layer and a second support layer. The second support layer is located between the heating composite and the substrate to reduce stress and heat loss. A second compensation layer, composed of multiple layers, is provided on the substrate side. The density of the interlayer contact interfaces gradually increases towards the substrate, utilizing contact thermal resistance to block heat transfer. This structure significantly reduces energy consumption and eliminates thermal stress while maintaining mechanical strength.

This invention belongs to the technical field of thermally conductive interface materials, specifically relating to a thermally conductive interface material and its preparation method. The preparation method of this thermally conductive interface material includes the following steps: adding pretreated carbon nanotubes and epoxidized Eucommia ulmoides gum to toluene, then adding a catalyst, and heating to react, thereby obtaining modified carbon nanotubes; adding graphene and N-(3-aminopropyl)-1,4-butanediamine to isopropanol, ball milling to obtain pretreated graphene; adding the modified carbon nanotubes and pretreated graphene to epoxy resin, heating and stirring, adding a curing agent to cure and shape, and cooling to room temperature to obtain the final product. The thermally conductive interface material prepared by this invention possesses high thermal conductivity, low interfacial thermal resistance, excellent tensile properties, tear resistance, and aging and temperature resistance, solving the defects of traditional thermally conductive interface materials such as easy aging and rapid mechanical decay, and is suitable for long-term heat dissipation applications in electronic devices.

This invention belongs to the field of thermal conductive materials technology, specifically relating to a thermally conductive composite material, its preparation method, and its application. The thermally conductive composite material provided by this invention includes an organosilicon thermally conductive sheet and an alloy layer stacked sequentially. An alloy with a specific melting point is loaded into the thermally conductive sheet as the bottom layer. In actual use, the alloy layer, serving as the bottom layer, is in close contact with the heat-generating device. When the device heats up, causing the system temperature to rise and reach the alloy's melting point, the alloy melts from a solid to a liquid, rapidly filling the tiny gaps between the thermally conductive pad and the device. This effectively reduces interfacial thermal resistance, improves the heat flux density at the contact surface between the thermally conductive pad and the heat-generating device, and promotes rapid heat transfer. Simultaneously, it significantly improves the thermal conductivity, meeting the high-efficiency heat dissipation requirements of high-performance electronic equipment under extreme operating conditions, effectively ensuring the long-term stable operation of the equipment. This invention achieves a leap in the overall performance of thermally conductive pads, not only exhibiting excellent thermal conductivity but also high reliability and a wide range of applications.

This invention discloses a heat sink for driving a robot joint module and its manufacturing method. The heat sink includes a heat spreader and a heat sink base. The heat spreader includes a lower cover plate, an upper cover plate, and a capillary wick assembly. The lower cover plate has a flange around its edge, which includes a vertical section and a horizontal section. The upper cover plate covers the lower cover plate and is fixedly connected to the flange, with an evaporation chamber formed between them on the inner side of the flange. The heat sink base is integrally formed by die casting using the heat spreader plate as an insert. The base covers the upper cover plate and the horizontal section of the flange, with the downward-facing side of the lower cover plate exposed outside the base to contact the component to be cooled. This solution eliminates the interfacial thermal resistance between the heat spreader and the base in traditional solutions, resulting in a compact structure and high heat transfer efficiency. The three-dimensional capillary reflux network formed by the multi-layer liquid wick and the groove structure of the lower cover plate effectively separates vapor and liquid and enhances anti-gravity performance, making it suitable for heat dissipation of robot joint modules with compact space and variable postures.

The application relates to the technical field of continuous laser optical film, in particular to a low-heat-effect laser film and a preparation method thereof. The method comprises the following steps: designing a film system according to laser wavelengths and optical performance and simulating and optimizing; precisely polishing a substrate, ultrasonic cleaning and activating; alternately preparing high and low refractive index functional layers and interface modification layers by physical vapor deposition and atomic layer deposition, setting the interface modification layers between the adjacent high and low refractive index functional layers, forming a periodic stacking structure; and annealing treatment under an inert atmosphere at 150-300 DEG C to obtain a finished product. The method has the advantages that: phonon bridging and interface passivation are realized through nano-Al2O3 interface modification, interface thermal resistance is significantly reduced, heat accumulation and thermal lens effect are inhibited, and the laser damage threshold is improved; the process is controllable, the film layer is dense and uniform, and the method is suitable for antireflection, high-reflection or light-splitting devices of high-power continuous laser systems.

This invention discloses a steel slag-based solid thermal energy storage material and its preparation method, relating to the field of solid thermal energy storage technology. The preparation method includes: pretreating steel slag; placing the pretreated steel slag in a reducing atmosphere; heating it to the reduction temperature and holding it at that temperature for a period of time; then naturally cooling it; mixing the modified steel slag with multiple particle sizes; sequentially pressing and molding the compounded steel slag; and finally, cooling it to obtain the steel slag-based solid thermal energy storage material. This integrated design, which allows the steel slag to possess both good electrical conductivity and thermal storage properties, and allows heat to be generated and stored directly within the thermal energy storage material, eliminates the heat transfer link from the heating element to the heat storage body in traditional solid thermal energy storage methods, avoiding energy efficiency losses caused by temperature gradients and interfacial thermal resistance. Furthermore, the integrated heating and thermal storage module units can be flexibly combined in series and parallel to construct thermal energy storage systems with a full power range of 10 kW to 100 MW.

The application provides an acrylic heat-conducting gel, a preparation method and application thereof, and the preparation raw material of the acrylic heat-conducting gel comprises an acrylic ester monomer, an initiator, a plasticizer and a heat-conducting powder; the preparation raw material of the acrylic heat-conducting gel is free of silicone oil components, and no silicone oil is separated out during use, and no siloxane is volatilized, so that the circuit is not polluted, and the circuit is not short-circuited, and the acrylic heat-conducting gel can be prepared into a needle tube, is very suitable for automatic dispensing production, and has the advantages of compression damping, low interface thermal resistance and good heat conduction effect after curing, and is suitable for use in electronic equipment.

The application relates to a display device frame heat dissipation manufacturing method with a composite heat conduction structure and relates to the technical field of display device frame preparation. S1, frame pretreatment, a micron-level roughening layer is formed through a sand blasting machine; S2, a first heat conduction glue layer is grid-coated on the roughening layer and is semi-cured; S3, a composite heat conduction film composed of a graphene heat conduction layer, a three-dimensional carbon / metal composite wave absorption layer and a carbon fiber heat conduction layer is attached and is heat-pressed and cured; S4, a second heat conduction glue layer is secondarily grid-coated on the surface of the composite heat conduction film, and part of the surface is exposed; S5, frame assembly, the exposed part of the composite heat conduction film is directly contacted with a heating element, the second heat conduction glue layer provides adhesion, and a double direct contact heat conduction channel is formed. The application has the effects of low interface thermal resistance, high heat dissipation efficiency, electromagnetic shielding function, high sand material recycling rate, complete dust separation and high manufacturing process integration.

This application discloses a controller heat dissipation interface compensation control method, device, and system, belonging to the field of heat dissipation control technology for servo motors. The method includes: acquiring the trigger signal of the acceleration detection unit; resolving the target interface pressure based on the thermal management target of the power device, and calculating the fundamental amplitude and frequency of the disturbance current; sampling, conditioning, and denoising the bus current, and extracting the dynamic fluctuation component to calculate the pressure coefficient; when the pressure coefficient is less than a preset separation threshold, calculating the disturbance amplitude correction based on a model reference adaptive control algorithm, adding it to the fundamental amplitude of the disturbance current; when the energy of the current spectrum exceeds a preset energy threshold within the first offset frequency range of the structural fundamental frequency, superimposing the second offset frequency onto the fundamental frequency, generating a disturbance current signal, and superimposing it onto the motor's current control signal. This method can quickly compensate for interface contact pressure and transiently suppress the rise in target interface thermal resistance.

This application relates to the field of semiconductor packaging technology, and in particular to a high-heat-dissipation packaging method for LED chips based on thermal diffusion path reconstruction. The method includes: performing void detection on an LED chip package in a pre-cured or semi-cured state to obtain spatial distribution information of micro-scale voids and form a void topology map; determining the main thermal diffusion region within the LED chip package; identifying key void clusters based on the void topology map and the main thermal diffusion region; classifying the key void clusters according to their thermal resistance mechanisms and performing matching void topology reshaping processing; constructing a continuous thermally conductive structure along the heat flow path within the main thermal diffusion region; and performing partitioned curing of the continuous thermally conductive structure, ensuring that non-main thermal regions retain controlled micro-hole buffer zones. This application constructs a packaging structure combining a continuous thermally conductive channel in the main thermal region with a controlled micro-hole buffer zone in the non-main thermal region, effectively reducing interface thermal resistance and improving packaging reliability.

The utility model discloses high -power load heat radiation structure, including extension assembly, be provided with cable assembly and load on the extension assembly, the extension assembly includes the box body and lid body that constitute by heat conduction plate, the lid body covers and is set up in the open end of box body, the bottom end interval distribution of box body has a plurality of mounting holes, a plurality of load one -to -one corresponding installation in mounting hole, the contact surface of load with box body still is provided with heat conduction coating layer. The utility model discloses through setting extension assembly, will connector, load and so on key components integration in the structure that the box body and lid body of heat conduction constitute, and the load is embedded through bottom mounting hole and is coated with the heat -conducting silicone grease between the contact surface of box body, effectively reduced the interface thermal resistance, has built the efficient heat conduction path from the load heat source to external environment, has improved the heat dissipation capacity of system significantly, prevents the performance decline or device damage because of local overheating.

This invention relates to the field of diamond heat sinks, specifically a diamond heat sink and its preparation method, comprising: in-situ growth of a silicon carbide nanowire array on a diamond surface; sputtering a titanium carbide layer on the diamond surface using magnetron sputtering to obtain a titanium carbide / silicon carbide nanowire array composite structure; placing solder paste between the diamond and a metal sheet to form a brazed component, wherein the titanium carbide / silicon carbide nanowire array composite structure in the brazed component faces the side of the solder paste; and finally vacuum brazing. This invention has good process compatibility, is easy to realize industrial application, and effectively solves the problems of weak interface bonding, high thermal stress, and high interface thermal resistance when connecting diamond films and metals. It has important application value for heat dissipation of high-power electronic devices.

The present application relates to a kind of epoxy resin heat conducting composite material and its preparation method, belong to heat conducting composite material field.The modified boron nitride, polyamide acid and amino-terminated amide acid are built three-dimensional skeleton by ice template method in the present application, after skeleton imidization, epoxy resin is perfused, and the epoxy resin heat conducting composite material is obtained after curing.The skeleton provides a way for phonon transport, reduces the interfacial thermal resistance between skeleton and matrix, and achieves the purpose of improving the thermal conductivity of composite material at low filler load.The epoxy resin heat conducting composite material prepared in the present application improves the interfacial thermal resistance between skeleton and matrix by building continuous boron nitride skeleton in polymer at the same time through covalent bond.

This invention discloses a low thermal conductivity coating for the meniscus region of a continuous casting crystallizer. Its microstructure consists of a continuous metallic matrix phase and uniformly dispersed low thermal conductivity nanoparticles. The metallic matrix phase is either nickel-cobalt or a nickel-cobalt-chromium alloy, and the low thermal conductivity nanoparticles are zirconium oxide. The volume fraction of the low thermal conductivity nanoparticles in the coating is 5%–20%, and the average particle size is 20 nm–100 nm. This invention introduces nanoscale second-phase particles into a wear-resistant metallic matrix, which can significantly improve the coating hardness through pinning effects, etc. Furthermore, utilizing the high-density interfacial thermal resistance and dispersion strengthening effect formed by these particles, the equivalent thermal conductivity of the coating at the operating temperature is reduced to 8–20 W / (m·K), while maintaining a hardness of not less than 550 HV. This coating can effectively suppress heat flow in the meniscus region and slow down the uneven shrinkage of the initial billet shell, thereby significantly reducing the probability of surface depressions and longitudinal cracks in the billet, ensuring the wear-resistant life of the crystallizer while improving the surface quality of the billet.

This invention discloses a battery casing, battery assembly, vehicle, and a method for thermal management and stress control. The battery casing includes an open box, with a soft liner provided on the inner side of the box wall and / or bottom. The soft liner is sealed to the box and forms a sandwich cavity. The box has a medium inlet and a medium outlet communicating with the sandwich cavity. When pressurized heat exchange medium is introduced into the sandwich cavity, it expands the soft liner to fit tightly against the outer peripheral surface of the battery cell inside the box, thereby eliminating interfacial thermal resistance and achieving efficient heat exchange. By sensing the current pressure value of the heat exchange medium in the sandwich cavity and comparing it with a preset target pressure range, the supply pressure can be actively adjusted to maintain the expansion of the battery cell by the soft liner within the optimal stress range, and the supply pressure adjustment and flow rate adjustment are controlled independently. This invention integrates thermal management, support, stress servo, and thermal runaway protection functions into one unit, solving the contradiction between heat dissipation and stress caused by the cell breathing effect, and significantly improving battery safety and lifespan.

The application discloses a battery pack thermal boundary layer destruction method and a thermal management method based on acoustic streaming effect. The method comprises the following steps: generating an alternating magnetic field outside a box body, penetrating the box body wall to drive the flexible vibration element of the inner wall to generate high-frequency micro-vibration; the vibration radiates acoustic waves in the immersed liquid, and the acoustic streaming effect is generated by utilizing the viscous dissipation of the liquid; the acoustic streaming forms local shear force in the micron boundary layer near the surface of the battery cell, and destroys the thermal boundary layer attached to the surface of the battery cell. The application also provides a thermal management method comprising the method, immersing the battery cell in the insulating cooling liquid, and simultaneously removing the air film by using the acoustic streaming. The application adopts non-contact acoustic streaming disturbance, has no mechanical wear and no sealing damage, can accurately remove the micron-level air film, reduces the interface thermal resistance, and is suitable for the full-life maintenance-free energy storage system.

This invention belongs to the field of thermal insulation coating technology, specifically relating to a water-based inorganic nano-ceramic thermal insulation coating and its preparation method. It uses boron-aluminum dual-doped lithium silicate inorganic resin as the film-forming matrix, amorphous Al2O3-SiO2 nano-coated mullite hollow ceramic microspheres as thermal insulation fillers, and combines modified nanoporous zirconium dioxide and titanium dioxide to form a multi-level thermal insulation system. Specifically, the boron-aluminum dual-doped lithium silicate enhances structural density by embedding aluminum elements into the silicon-oxygen network framework, while boron elements introduce flexible sites to form an inorganic hybrid network, achieving low-temperature dense curing and enhancing the coating's high-temperature service stability. The mullite hollow ceramic microspheres, after nano-coating modification, form covalent bonds with the matrix, avoiding interface defects and reducing interface thermal resistance. The modified nanoporous zirconium dioxide and the microsphere cavities constitute a multi-level porous synergistic thermal insulation structure, combined with the infrared thermal radiation reflection effect of titanium dioxide, achieving all-round thermal insulation and adapting to the coating application needs of various high-temperature thermal insulation scenarios.

The application discloses a heterogeneous folding hexagonal boron nitride / defect-free graphene heat-conducting insulating interface material, and belongs to the technical field of thermal management materials. The material takes a defect-free graphene skeleton containing macroscopic folding and microscopic folding as a base, and a hexagonal boron nitride nano layer uniformly coats the surface of the skeleton and penetrates into a groove, thereby forming a continuous heterogeneous coating structure. The folding structure converts the high in-plane thermal conductivity of the graphene into a thickness direction heat conduction path, and the in-situ deposited hexagonal boron nitride reduces the interface thermal resistance and improves the insulation. The out-of-plane thermal conductivity of the material is up to 402 W / mK, and the surface resistivity is up to 0.1 MΩ / sq. The material can significantly reduce the working temperature of electronic devices, and is suitable for high-integration electronic, LED and other thermal management scenes.

The utility model discloses a composite heat conduction gasket, including graphene heat conduction gasket layer, the graphene heat conduction gasket layer one side is provided with first liquid metal layer, the graphene heat conduction gasket layer another layer is provided with second liquid metal layer. This structure is formed by liquid metal and graphene heat conduction gasket compound, effectively combines the advantage of both, significantly reduces the interface thermal resistance, gives product high heat conduction performance, and has certain compressibility.

This application relates to a method for fabricating a high-temperature co-fired thermal conductivity measurement sensor and the sensor itself, belonging to the field of sensor technology. This application utilizes an integrated co-fired structure of a metal thick-film pattern and a ceramic green body, enabling the metal thick-film pattern to form a continuous transition interface with the ceramic substrate during sintering. This results in high interfacial bonding strength, effectively mitigating failure problems such as interface delamination, warping, or cracking that easily occur under high-temperature or thermal cycling conditions, thereby improving the structural stability and service life of the sensor. Simultaneously, the co-fired structure effectively blocks the influence of external oxidizing or corrosive samples on the metal layer, making it suitable for complex or extreme testing environments. Since the co-firing process eliminates the bonding layer, this invention reduces the interfacial thermal resistance of Joule heat transfer to the sample during measurement, making the transient temperature rise response more closely match the theoretical heat transfer model, thereby improving the accuracy of thermal conductivity measurement.

This utility model discloses an integrated vapor chamber liquid-cooled composite heat dissipation device, including a liquid-cooled plate and a vapor chamber connected to the liquid-cooled plate; the vapor chamber is used to transfer heat from a heat source to the liquid-cooled plate; the lower surface of the liquid-cooled plate is recessed upward to form a liquid-cooling cavity; the vapor chamber includes a lower shell and an upper cover covering the lower shell, and a vapor chamber is formed between the upper cover and the lower shell; the lower surface of the lower shell is provided with a boss protruding downward, and the vapor chamber extends into the boss; the lower surface of the boss is a heat source contact surface that contacts the heat source; the upper surface of the upper cover is provided with a fin module protruding upward; the upper cover covers the liquid-cooling cavity and is sealed to the liquid-cooled plate by vacuum brazing; the fin module is located inside the liquid-cooling cavity; thereby, it can eliminate interfacial thermal resistance, has a simple structure, and ensures airtightness.

The application discloses a semiconductor chip and a preparation method thereof, a semiconductor packaging structure and a preparation method thereof. The semiconductor chip comprises a chip body, a back surface, a metallization structure layer, and a palladium capping layer. The palladium capping layer is arranged on the side surface of the metallization structure layer away from the chip body. The palladium capping layer is used for bonding with an indium-based thermal interface material to form a palladium-indium intermetallic compound layer. The palladium capping layer in the application reacts with indium to form a palladium-indium intermetallic compound layer. Compared with a brittle and easy-to-crack gold-indium intermetallic compound, the palladium-indium intermetallic compound has slower growth kinetics and better mechanical integrity, can realize lower interface thermal resistance, higher bonding strength, and significantly improve the resistance to thermal cycling and long-term thermal aging. In addition, the process of generating the palladium-indium intermetallic compound by the palladium-indium reaction is slow, so that it can exhibit higher resistance under repeated thermal shock and high-temperature assembly processes.

The invention relates to a graphene heat-conducting gasket as well as a preparation method and application thereof. The graphene heat-conducting gasket comprises a graphene heat-conducting matrix oriented in the thickness direction, the metal interface enhancement layer covers at least one surface of the graphene heat-conducting substrate; the metal interface enhancement layer comprises a transition layer and a functional layer which are sequentially arranged from the surface of the graphene heat conduction substrate to the outside. According to the graphene heat-conducting gasket provided by the invention, the interface thermal resistance can be remarkably reduced through the metal interface enhancement layer, and the metal interface enhancement layer is compact and continuous, so that graphene chippings are prevented from falling off, and the residual risk of assembly is eliminated.

The present application belongs to the technical field of micro-nano scale heat transfer simulation, and discloses a micro-nano scale heat transfer simulation method and system of a heterogeneous structure, comprising: obtaining material microcosmic phonon characteristic parameters through first principle calculation, constructing a defect scattering model in combination with the Massieu criterion, establishing an interface scattering boundary condition, and incorporating multiple key influencing factors into a unified phonon Boltzmann transport equation solving system, without relying on empirical thermal conductivity and interface thermal resistance parameters, so that local temperature distribution, heat flux density distribution, interface thermal conductivity, interface thermal resistance and other macro heat transfer parameters of the heterogeneous structure can be accurately obtained, and the accuracy, engineering applicability and cross-scene transferability of micro-nano scale heat transfer simulation are improved, and the problems of temperature rise abnormality and performance drift of a device caused by heat accumulation are effectively avoided.