303 results about "Interfacial thermal resistance" patented technology

The invention belongs to the field of materials, and particularly relates to a composite thermal interface material and a preparation method thereof. The preparation method comprises the following steps: plating non-reactive metal, non-reactive metal carbide or non-reactive ceramic on the surface of diamond micro powder, inducing lattice defects on the surface of a plating layer and alloying a local interface by combining a mechanical force field, and defoaming to obtain the composite thermal interface material. The composite thermal interface material has high thermal conductivity and long-term stability, and the contradiction between excessive alloying of a traditional reactive coating and high interface thermal resistance of a non-reactive coating is solved. The method is particularly suitable for the field of thermal management of high-end electronic devices such as 5G chips and power modules.

The invention relates to the technical field of semiconductor devices, in particular to an active phase change heat dissipation control method and system for a silicon carbide power device, and the method specifically comprises the steps: obtaining inherent heat dissipation structure parameters, and synchronously collecting vibration data and transient heat flow data in real time; inputting the inherent heat dissipation structure parameters and the vibration data into a vibration-gap coupling influence evaluation module for evaluation to obtain an interface thermal resistance deterioration risk index; inputting the inherent heat dissipation structure parameters and the transient heat flow data into a heat flow-migration coupling influence evaluation module for evaluation to obtain a distribution uniformity degradation trend index; introducing a phase change stability correction factor, and performing fusion analysis to obtain a comprehensive heat dissipation performance index; and comparing the heat dissipation performance with a preset heat dissipation performance threshold value to generate a corresponding cooperative control instruction set. The problem that in the prior art, prospective, accurate and self-adaptive active heat dissipation cooperative control of the silicon carbide power device cannot be achieved is solved.

The invention discloses a high-heat-conductivity leakproof liquid metal phase change heat-conducting gasket and a preparation method thereof, and relates to the technical field of heat-conducting gaskets. The preparation method comprises the following steps: alloying high-heat-conductivity low-melting-point liquid metal gallium with high-heat-conductivity metal silver and copper, mixing with a polymer containing a specific functional group, adding a modified heat-conducting filler, and carrying out UV curing to form the heat-conducting gasket. Liquid metal is easily alloyed to form eutectic alloy, the melting point can be increased, a chemical cross-linked network formed by the modified heat conduction filler and UV curing can make up heat conduction loss, a heat conduction path is established, the interface thermal resistance is reduced, and the heat conduction efficiency is remarkably improved. The surface oxide layer interacts with the polar group of the polymer, and the steric hindrance effect of the cross-linked network is combined to synergistically realize the leak-proof effect. The high-heat-conductivity leakproof liquid metal phase change heat-conducting gasket prepared by the invention has the effects of high heat conductivity and leakproof.

The invention relates to a low-dielectric-loss high-thermal-conductivity epoxy resin composite material and a preparation method thereof, and the preparation method comprises the following steps: carrying out surface modification treatment on a thermal conductive filler: carrying out surface modification on the thermal conductive filler by adopting a chemical covalent bonding or physical adsorption mode, the heat-conducting filler is used for improving the compatibility of the filler and an epoxy resin matrix and reducing the interface thermal resistance, and comprises boron nitride with a two-dimensional sheet structure; epoxy resin, a curing agent and an optional modifier are evenly mixed, the epoxy resin is selected from epoxy resin with the low polarity characteristic, and the modifier comprises at least one of thermoplastic resin or elastomer. And the process is simple and controllable.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

The invention relates to a composite heat dissipation device integrating temperature equalization and liquid cooling, which comprises a liquid cooling plate cover plate, a composite upper cover and a temperature equalization plate lower shell which are sequentially arranged from top to bottom, the top of the temperature equalization plate lower shell is provided with an evaporation chamber, the peripheries of the composite upper cover and the temperature equalization plate lower shell are hermetically connected to form a vacuum cavity, and the bottom surface of the liquid cooling plate cover plate is provided with a recess. The periphery of the liquid cooling plate cover plate and the periphery of the composite upper cover are connected in a sealed mode to form a liquid cooling cavity, and the liquid cooling plate cover plate is provided with a cooling liquid inlet and a cooling liquid outlet. The lower surface of the composite upper cover is punched towards the upper surface to form a plurality of strip-shaped convex hulls; a first capillary structure covers the inner wall of the uniform temperature plate lower shell; and a second capillary structure covers the inner wall of the strip convex hull and / or the lower surface of the composite upper cover. The design is reasonable and ingenious, the functions of the upper cover of the vapor chamber and the fins of the liquid cooling plate are integrated, deep integration of the upper cover and the fins is achieved, the interface thermal resistance is effectively reduced, the structural strength is enhanced, and the manufacturing process is simplified.

The invention discloses a multi-physical-field intelligent optimization system and method for low-thermal-resistance stacked electrode packaging, and relates to the technical field of packaging thermal management. According to the system, a thermal, mechanical and electric multi-physics field coupling model of the stacked electrode packaging structure is established in a unified computational domain through a modeling module; the measurement module collects thermal resistance, thermal conductivity and interface stress data in real time through an integrated sensor; the self-correction optimization module executes a self-adaptive residual iterative algorithm based on the deviation between the model simulation result and the actually measured data, corrects model parameters and generates process control variables; and the process regulation and control module dynamically adjusts the sintering temperature, the coating thickness and the pressing pressure according to the control variables and feeds back updated data to form closed-loop optimization. According to the method, collaborative operation of modeling, measurement, optimization and process regulation and control is realized, dynamic self-correction of multi-physical field parameters and process adaptive optimization can be realized in the packaging operation process, the interface thermal resistance is remarkably reduced, and the heat-conducting property and the structural stability are improved.

The invention belongs to the technical field of metal-based composite material additive manufacturing, and particularly relates to ultrasonic-assisted green laser equipment for copper-based diamond cooling fin machining, which comprises a rack, a printing cabin, a green laser machining system, an ultrasonic-assisted system, a powder spreading system, a gas control system, an intelligent control system and an online monitoring system. By integrating a green laser processing system and an ultrasonic auxiliary system, an ultrasonic-green laser-powder multi-energy field coupling processing system is constructed, the wavelength of green laser is 532 nm, the absorption rate of copper is increased, and compared with traditional infrared laser, low-power and high-efficiency melting of copper can be achieved, the diamond graphitization risk is reduced from the angle of a heat source, and the production cost is reduced. Ultrasonic vibration is transmitted to a molten pool through a substrate coupling type structure, by means of the cavitation effect and the acoustic streaming effect, the interface wettability of copper and diamond is effectively improved, the interface bonding force is enhanced, the interface thermal resistance is reduced, meanwhile, grains are refined, pores are eliminated, residual stress is reduced, and the comprehensive performance of the cooling fin is remarkably improved.

The invention relates to an in-situ three-dimensional skeleton based on a powder coating method, a high-thermal-conductivity interface material of the in-situ three-dimensional skeleton and a preparation method and application of the high-thermal The in-situ three-dimensional heat-conducting network is prepared by mixing a three-dimensional framework material, a template sacrificial agent, a permanent binder and a thermal degradation catalyst in proportion, extruding and granulating, and then carrying out heat treatment. Then, polydimethylsiloxane, polyethylene glycol or paraffin and the like are used as polymer matrixes to be mixed with aluminum powder or aluminum oxide, the mixture is immersed into the in-situ three-dimensional heat-conducting network through an impregnation method for curing, and the thermal interface material of a double-heat-conducting-network skeleton structure is prepared. The double-heat-conduction network structure obviously improves the heat conduction effect of the thermal interface material, the thickness of the formed high-heat-conduction material is controllable, and the contact thermal resistance is effectively reduced. The introduction of the double-heat-conduction network skeleton structure reduces the interface thermal resistance to obtain the high-heat-conduction interface material, and the material is simple in preparation process, low in cost, recyclable and suitable for large-scale industrial production.

The invention discloses a board-level packaging method with high heat dissipation performance and a product thereof. The board-level packaging method comprises the following steps: bonding a copper plate and a substrate together; etching a groove and a chip mounting alignment mark on the copper plate; mounting the back surfaces of a plurality of chips on the copper plate; performing plastic packaging on the chip and the copper plate; opening a hole in the surface of the chip; manufacturing a redistribution structure with interconnected chips; separating the obtained structure from the substrate to expose the copper plate; etching the exposed copper plate; carrying out polishing anti-oxidation treatment on the exposed copper plate; and cutting the obtained structure into single packaging units. The copper plate is attached to the back surface of the chip, so that the heat dissipation interface thermal resistance of the chip is effectively reduced, the chip is not completely wrapped by a packaging material, and a heat dissipation channel is opened, so that the heat dissipation efficiency of the chip is improved, and the performance stability and reliability of the chip in high-load operation are improved; and the stability of the packaging structure is effectively improved.

The invention discloses a reliability evaluation method for a conductive thermal interface material. The method comprises the following steps: manufacturing a substitute sample according to a conductive thermal interface material bonding layer structure of an actual device and a sintering process; gradually increasing the environment temperature to test an actual device, and taking the amplification of the interface thermal resistance as a failure threshold value when the performance of the device cannot meet the requirement; according to the set temperature stress and current stress conditions, thermoelectric stress tests are carried out on all the alternative samples, the tests are stopped after a period of time, and interface thermal resistance tests are carried out; when the amplification of the interface thermal resistance of the alternative sample exceeds a failure threshold value, stopping the thermoelectric stress test of the alternative sample and recording the failure life until the amplification of the interface thermal resistance of all the alternative samples exceeds the failure threshold value; and obtaining the failure life of the conductive thermal interface material according to the failure life data of all the alternative samples, thereby realizing reliability evaluation of the conductive thermal interface material. According to the method, the reliability of interface thermal resistance degradation caused by the electromigration effect can be effectively evaluated.

The invention discloses a semiconductor heterojunction interface thermal resistance prediction method based on machine learning, and the method comprises the steps: collecting semiconductor material data, obtaining semiconductor intrinsic attribute data through a semiconductor public database, and carrying out the preprocessing of the data; calculating statistics of element attributes through a Magpie algorithm to obtain feature descriptors, eliminating redundant features by adopting a variance filtering method and recursive feature elimination, and normalizing the redundant features; model building and training are carried out by designing CNN and XGBoost algorithms; performing parameter optimization on the trained model through forward propagation, back propagation and a DBO algorithm; and predicting the thermal resistance of the semiconductor heterojunction interface based on the optimized model. The method solves the problems that in an existing semiconductor heterojunction interface thermal resistance prediction method, the experimental measurement period is long, the cost is high, environmental parameters are difficult to control accurately, the theoretical calculation complexity is high, and the deviation between a prediction result and an actual working condition is large due to the dependence on ideal interface conditions.

The invention discloses a low-thermal-resistance high-thermal-conductivity liquid metal heat-conducting sheet and a preparation method thereof, and relates to the technical field of heat-conducting materials. The nano silver wire network layers are formed on the front surface and the back surface of the liquid metal base material layer; the low-hardness heat-conducting curing layer is filled in pores of the silver nanowire network layer; and the silver nanowire network layer and the low-hardness heat-conducting curing layer jointly form the composite heat-conducting nano coating. The preparation method comprises the following steps: rolling liquid metal into sheets; coating the front side and the back side of the liquid metal sheet with the silver nanowire dispersion liquid respectively; after the coating is dried, performing vacuum hot pressing; and coating the silver nanowire network structure with a low-hardness heat-conducting coating, and carrying out vacuum curing to form a film. According to the invention, the defects in the prior art are overcome, the high heat conductivity coefficient of the composite coating can be ensured, the micro-nano interface between the interfaces can be filled by virtue of the low-hardness coating, and the interface thermal resistance is greatly reduced.

The invention relates to the technical field of high-molecular polyethylene, and particularly discloses a PE-based nano high-thermal-conductivity composite material and a pipe preparation process, the PE-based nano high-thermal-conductivity composite material is prepared from the following raw materials: high-density polyethylene, linear low-density polyethylene, an ethylene-octylene copolymer, a modified carbon nanotube, a core-shell oxide, a graphene nanosheet, an interface compatilizer, an antioxidant and a cross-linking agent; the modified carbon nano tube is obtained by depositing a SiO2 layer on the surface of a carbon nano tube and then grafting vinyltriethoxysilane; a core layer of the core-shell oxide is zirconium oxide, a shell layer of the core-shell oxide is aluminum oxide, the surface of the zirconium oxide of the core layer is coated with a zinc stearate hydrophobic layer, and the surface of the aluminum oxide of the shell layer is grafted with methacryloxypropyltrimethoxysilane. According to the invention, through compounding of the modified carbon nanotubes, the core-shell structure zirconium oxide-aluminum oxide and the graphene nanosheets, a three-dimensional heat-conducting network is constructed in a core layer, filler agglomeration is inhibited, and interface thermal resistance is reduced.

The invention discloses a high-thermal-conductivity copper-based composite material for heat dissipation and a preparation method thereof, and relates to the technical field of composites.The preparation method comprises the steps that graphene-tungsten graded coated diamond reinforced powder and spherical copper powder are mechanically mixed in a planetary ball mill, and uniform composite powder is obtained; and the uniform composite powder is loaded into a mold, curing forming is conducted in a vacuum environment through a spark plasma sintering technology, a diamond-tungsten carbide-tungsten-copper gradient interface structure is generated in situ in the sintering process, and the high-heat-conductivity copper-based composite material for heat dissipation is obtained. According to the invention, high thermal conductivity and low thermal expansion are realized by constructing a gradient interface, the thermal cycle reliability is improved by introducing a flexible layer, and the composite material with highly consistent performance is prepared by combining self-adaptive process regulation and control, so that the technical problems of high interface thermal resistance and unstable performance are solved.

The invention provides a process for preparing a three-dimensional graphene foam metal composite material by a biological template method. The preparation method comprises the following steps: preparing through an innovative biological template method process, carrying out carbonization-activation treatment on a natural hierarchical porous biological structure serving as a sacrificial template to form a three-dimensional graphene foam skeleton with bionic hierarchical pore channels, and carrying out in-situ compounding of copper / silver metal nanoparticles through a pulse electrodeposition technology to obtain the composite material. And finally, the three-dimensional graphene foam metal composite material with ultrahigh thermal conductivity and eco-friendly characteristics is constructed. The core breakthrough of the heat-conducting property is as follows: a bionic heat transfer framework is optimized, graded pores derived from a biological template form a phonon efficient transfer path, and the axial heat conductivity is improved by more than 40% compared with that of a material prepared by a traditional chemical foaming method; according to graphene-metal interface cooperation, metal nanoparticles directionally grow on the edge of a graphene sheet layer and hole wall defect sites, and interface thermal resistance is reduced to 8.7 * 10 <-9 > m < 2 > K / W by forming a coherent interface; cross-scale heat flow guide control is achieved, specifically, phonon conduction with the in-plane heat conductivity being 1600 W / (m.K) is achieved through a high-crystallinity graphene domain in a micropore, and an electron conduction heat diffusion network is constructed through a metal filling layer in a macropore channel.

The invention discloses a system and a method for measuring the thermophysical property of a soft material film. The system comprises a signal generator, a pump light path, a detection light path, a photoelectric detector, a signal processing module, a sample platform, a difference measurement module and a thermal parameter inversion unit. The system can be used for independently measuring the thermal conductivity, the specific heat capacity and the interface thermal resistance of liquid, gel and soft solid thin film materials at the same time on the premise that prior parameters are not needed. In combination with periodic heating of a square wave modulation heat source and a difference measurement strategy, high-precision measurement of micro-nano-scale thermophysical properties is realized, and the method is particularly suitable for various application scenes such as thermal interface materials (TIMs) and phase change energy storage materials.

The invention discloses a heat dissipation system and a heat dissipation method applied to an air switch cabinet, particularly relates to the technical field of switch cabinet heat dissipation, and is used for solving the problem of local temperature rise fluctuation caused by unstable thermal resistance of a connection interface of a radiator and a conductive element in a continuous ship vibration environment. According to the method, ship vibration at the installation position of a switch cabinet is monitored in real time to extract a vibration main frequency band and a phase angle, a dynamic compensation parameter is determined based on cooperation of a frequency domain overlapping factor and a heat conduction phase lag angle amplitude, an elastic heat conduction gasket with an optimized direction is arranged between a radiator and a busbar, and axial pre-tightening force periodically adjusted along with the phase angle is applied. And the thermal resistance change rate of the wave crest and wave trough phase angle positions is measured synchronously, and compensation parameters are updated when the temperature exceeds the standard so as to realize dynamic stability and self-adaptive control of the heat dissipation interface.

The invention relates to the technical field of interface thermal resistance calculation, and discloses a method for measuring and calculating interface thermal resistance based on an infrared imaging technology, which comprises the following steps: fixing and aligning paired upper and lower test pieces to form a to-be-measured contact interface, respectively preheating to a preset initial temperature difference and stabilizing, and monitoring and recording temperature change and test piece thermophysical parameters; enabling the test piece to be in contact, starting infrared imaging equipment to record full-field transient temperature data in a temperature equalization process, and forming a three-dimensional data matrix; building a thermal resistance correlation model, constructing a heat conduction equation in combination with the parameters to solve a simulated temperature field, and inverting related heat conduction coefficients by using a conjugate gradient method; and calculating microscopic and total contact thermal resistance according to the inversion coefficient and the geometric parameters, and deducing macroscopic thermal resistance. According to the method, non-intrusive transient infrared temperature measurement is combined with a reverse heat transfer algorithm, so that the microscopic thermal resistance, the macroscopic thermal resistance and the total contact thermal resistance are accurately distinguished and quantified.

The invention discloses an epoxy resin heat-conducting composite material with a three-dimensional poly (ionic liquid) functionalized boron nitride skeleton, which is prepared by the following steps: by taking acrylic acid and 1-vinyl-3-ethylimidazolium bromide as monomers, preparing a poly (ionic liquid) functionalized boron nitride nanosheet heat-conducting filler by adopting an in-situ polymerization method; preparing the cellulose aqueous solution and the heat-conducting filler into a three-dimensional skeleton by an ice template method, and pouring epoxy resin to obtain the epoxy resin heat-conducting composite material. Compared with a three-dimensional framework prepared by loading boron nitride on a micromolecule modifier, the three-dimensional framework has the advantages that the macromolecular modifier is introduced in situ, so that more interaction is generated between the filler and a matrix, the interface thermal resistance is further reduced, and better heat-conducting property is realized.

The invention discloses a preparation method of a polyion liquid modified boron nitride heat-conducting filler and application of the polyion liquid modified boron nitride heat-conducting filler in a heat-conducting composite material. According to the preparation method, a powerful and continuous macromolecular interface layer, namely an imidazole polyion liquid (PIL) modification layer, is constructed on the surface of a boron nitride nanosheet (BNNS) in situ in an in-situ polymerization manner so as to improve the bonding effect at an interface and enhance the interface heat transfer efficiency of the composite material; the interface bonding force between the filler and a polymer matrix is remarkably enhanced, the interface thermal resistance is reduced, the interface heat transfer efficiency is improved, and finally the high-performance composite material with the high heat conductivity coefficient and the uniform and compact interface structure is obtained so as to meet the urgent requirement of high-frequency and high-power-density electronic devices in the 5G era for efficient heat management.

The invention discloses a wafer-level heat dissipation structure and a manufacturing method. The wafer-level heat dissipation structure comprises a heat dissipation substrate, a device wafer and a bonding layer, the heat dissipation substrate is a first silicon wafer with a diamond layer growing on the lower surface, and the upper surface of the heat dissipation substrate is plated with a first copper layer; the device wafer is a second silicon wafer of which the upper surface is integrated with an active device, and the lower surface is plated with a second copper layer; the bonding layer is composed of a Cu-Cu bonding interface formed by the first copper layer and the second copper layer through thermocompression bonding. The method comprises the following steps: growing a diamond layer on the lower surface of a first silicon wafer through MPCVD, and sputtering a Cu layer after the upper surface is thinned; sputtering a Cu layer on the back surface of the second silicon wafer of which the surface is integrated with the active device; and finally realizing interconnection of the Cu layers of the two wafers through thermocompression bonding. The problem of multi-interface thermal resistance caused by a traditional thermal interface material is avoided, an ultra-low thermal resistance path from a chip junction to a diamond heat dissipation surface is constructed, and the method is particularly suitable for thermal management of a high-power-density semiconductor device.

The invention provides an LNG (Liquefied Natural Gas) conveying flexible pipeline crack initiation and extension prediction method, which comprises the following steps of: constructing a multilayer composite structure geometric model, and defining thermal parameters and mechanical parameters of each layer of material in the model; presetting an initial crack in the model, and establishing a thermal-mechanical coupling control equation containing an interface thermal resistance effect; applying an internal ultralow temperature boundary condition, an external environment temperature boundary condition and a mechanical load boundary condition; solving the thermal-mechanical coupling control equation to obtain temperature field distribution of the section of the pipeline, applying a temperature field as a body load to the multilayer composite structure geometric model, and calculating to obtain a stress field and a stress intensity factor of a crack tip; constructing a crack propagation criterion considering the interface thermal resistance effect; and comparing the stress intensity factor obtained by calculation with a crack propagation criterion, and judging whether the crack is propagated or not. According to the method, the physical authenticity and calculation precision of crack initiation and propagation prediction of the LNG flexible pipeline in the ultralow temperature environment are improved.

The invention discloses an aerosol generating product and an aerosol generating system.The aerosol generating product comprises an aerosol forming base material sheet and a magnetic heating body sheet, and the magnetic heating body sheet and the aerosol forming base material sheet are arranged in a stacked mode in the thickness direction and attached in the stacked area in a surface contact mode; the main heat conduction path directed from the magnetic heating element sheet to the aerosol-forming substrate sheet is a path passing through the thickness direction of the laminated region. Compared with the prior art, the magnetic heating body sheet and the aerosol forming base material sheet are laminated along the thickness direction, and the surface contact is realized in the lamination area, so that the main conduction path of heat from the magnetic heating body sheet to the base material is a short path passing through the lamination thickness direction; therefore, heat conduction distance is shortened, interface thermal resistance is reduced, and heating response speed and energy utilization rate are improved. And meanwhile, the base material is heated more uniformly, so that the aerosol generation efficiency and consistency are improved, and the risk caused by local overheating is reduced.

The present invention provides a building exterior wall insulation device with high thermal insulation effect. The building exterior wall insulation device of this embodiment includes an inner insulation layer and an outer insulation layer connected to each other, the inner insulation layer includes a first insulation unit, the outer insulation layer includes a second insulation unit, the second insulation unit covers the space between two adjacent first insulation units, and the space between two adjacent second insulation units is opposite to the first insulation unit. This embodiment adopts a relative arrangement of the first insulation unit and the second insulation unit, which increases the interface thermal resistance between the first insulation unit and the second insulation unit, reduces thermal conductivity, and has a high thermal insulation effect. The first insulation unit and the second insulation unit are staggered, which reduces the heat transfer between the inside and outside of the building exterior wall, effectively reduces the dissipation of indoor heat and the entry of outdoor cold air, reduces the thermal bridge effect between the gaps, and improves the thermal insulation effect.

The invention discloses a high-thermal-conductivity self-adhesion thermal interface material and a preparation method thereof, and is characterized in that polylipoic acid (polyTA) formed by high-temperature ring opening polymerization of lipoic acid (LA) is used as a dynamic reversible polymer matrix, the dynamic reversible polymer matrix has the characteristics of recoverability, self-healing and adhesion due to the inherent dynamic property of disulfide bonds, a spherical thermal conductive filler is modified by a polyphenol compound, and the high-thermal-conductivity self-adhesion thermal interface material is prepared. Polyhydroxy functional groups are given, the surface energy is reduced, meanwhile, certain viscosity is achieved, polyethylene glycol diacrylate is added to serve as a stabilizer, ferric iron salt is evenly stirred and mixed, the reaction time is controlled, and a stable cross-linked network system is constructed. Hydroxyl groups on the surface of the polyphenol-decorated heat-conducting filler and carboxyl groups in polylipoic acid are subjected to esterification reaction, and meanwhile, Fe < 3 + > and the carboxyl groups in the polylipoic acid form supramolecular coordination, so that uniform dispersion and stable bonding of the filler in a matrix are realized, the interface thermal resistance is remarkably reduced, and a continuous heat-conducting passage is formed. The preparation method of the thermal interface material is simple in process, and the thermal interface material has high thermal conductivity and self-adhesion, has soft elasticity and is suitable for various application fields needing efficient thermal conduction and interface thermal management.

The application discloses a method for measuring interface thermal resistance and thermal conductivity of multilayer thin film material, comprising the following steps: arranging a first heating electrode, a second heating electrode and a detecting electrode on the top insulating layer of the multilayer thin film material; changing the frequency of the first alternating current heating current, recording the third harmonic voltage of the first heating electrode, and calculating the alternating current thermal response signal of the first heating electrode and the detecting electrode; changing the frequency of the second alternating current heating current, recording the third harmonic voltage of the second heating electrode, and calculating the alternating current thermal response signal of the second heating electrode and the detecting electrode; fitting the thermal conductivity of the substrate; and fitting the thermal conductivity and the interface thermal resistance of the multilayer thin film material. The substrate thermal conductivity slope method is used for fitting, the slope method is only sensitive to the thermal conductivity of the substrate, and the measurement error caused by the thin film layer is eliminated; the alternating current response signal in the frequency domain is used for the inversion calculation of the thermal conductivity and the interface thermal resistance of the thin film, the data amount is large, and the fitting precision can be improved.

The present application relates to the field of metal matrix composites, and discloses a gradient porous copper-aluminum composite material, a preparation method and application thereof.The gradient porous copper-aluminum composite material comprises an aluminum substrate and a gradient porous copper arranged on one surface of the aluminum substrate; the gradient porous copper is divided into a small-pore copper layer and a large-pore copper layer which are in contact with the aluminum substrate; the transition part of the small-pore copper layer close to the aluminum substrate has a graphene layer deposited on the surface combined with the aluminum substrate and the internal pore surface, and the pores are filled with silver.The present application has the advantages of high thermal conductivity, low interfacial thermal resistance, high strength, lightweight and low cost by designing the gradient pore structure of the porous copper, strengthening the interface with graphene and filling silver glue, and the obtained composite heat dissipation plate material after being combined with the aluminum substrate.

The application discloses a MXene-edge graphene oxide heterojunction / PBO fiber multifunctional heat-conducting composite film and a preparation method thereof. First, MXene and edge graphene oxide (EOG) are subjected to nucleophilic substitution and dehydration reaction to prepare MXene-edge graphene oxide (MEOG) heterojunction fillers, then the fillers are added into a dispersion solution of PBO fibers to prepare an acid gel, the acid gel is replaced by deionized water to prepare a water gel, and finally, the water gel is subjected to heat pressing to obtain the multifunctional heat-conducting composite film. The heat-conducting composite film comprises a PNF substrate and MEOG heterojunction fillers, covalent interaction between the fillers provides an effective way for phonon transmission, hydrogen bond and pi-pi interaction between the fillers and the substrate effectively reduce the interface thermal resistance, and the heat-conducting composite film can be widely used in EMI shielding performance and heat dissipation of electronic devices.

The invention provides an interface thermal resistance testing method and testing device, and belongs to the technical field of semiconductor device testing. The test method comprises the following steps: acquiring an actual cumulative structure function curve of a plurality of contrast samples of the semiconductor device, constructing a thermal structure model of the semiconductor device, and establishing a thermal network model corresponding to the thermal structure model, the thermal network model is used for representing an equivalent thermal structure of a heat flow path of the semiconductor device from a heating junction to an environmental medium; optimizing the parameters of the thermal network model through the actual cumulative structure function of each contrast sample; and obtaining the thermal resistance value of each interface in the semiconductor device according to the optimized thermal network model. The thermal resistance of different interfaces in the semiconductor device can be determined.