366 results about "Interfacial thermal resistance" patented technology

According to the device and method for controlling the connection void rate of the large-area thermal interface of the power electronic device provided by the invention, the device part ensures that an organic solvent and water vapor in a soldering paste layer can be smoothly discharged by optimizing the grid structure shape design of a steel mesh printing module, so that the void rate in the welding process is effectively reduced; according to the method, through optimization of the reflow soldering technology, temperature control and vacuum degree optimization of all stages such as the heating process, the heat preservation process, the pre-reflow process and the reflow process are included, the gas escape time is properly prolonged, the voidage is controlled to be 1% or below, the interface thermal resistance is reduced, and the heat dissipation performance is improved. Through optimization design and process, the production process is simplified, the operation is more convenient, the cost is low, and the method is suitable for large-scale production; and meanwhile, the voidage is effectively controlled, so that the product quality consistency in the production process is guaranteed, the heat dissipation efficiency of the power electronic device is improved, and the service life of the power electronic device is prolonged.

The invention belongs to the field of materials, and particularly relates to a composite thermal interface material and a preparation method thereof. The preparation method comprises the following steps: plating non-reactive metal, non-reactive metal carbide or non-reactive ceramic on the surface of diamond micro powder, inducing lattice defects on the surface of a plating layer and alloying a local interface by combining a mechanical force field, and defoaming to obtain the composite thermal interface material. The composite thermal interface material has high thermal conductivity and long-term stability, and the contradiction between excessive alloying of a traditional reactive coating and high interface thermal resistance of a non-reactive coating is solved. The method is particularly suitable for the field of thermal management of high-end electronic devices such as 5G chips and power modules.

The invention discloses an MXene-edge graphene oxide heterojunction / PBO fiber multifunctional heat-conducting composite film and a preparation method thereof.The preparation method comprises the steps that firstly, MXene and edge graphene oxide EOG are subjected to nucleophilic substitution and dehydration reaction to prepare an MXene-edge graphene oxide MEOG heterojunction filler, then the filler is added into a PBO fiber dispersion liquid to prepare acid gel, then the acid gel is subjected to heat preservation, and the composite film is prepared. And finally, carrying out hot pressing on the obtained hydrogel, so as to obtain the multifunctional heat-conducting composite film. The heat-conducting composite film provided by the invention comprises the PNFs matrix and the MEOG heterojunction filler, an effective way is provided for phonon transmission by utilizing filler-filler covalent interaction, interface thermal resistance is effectively reduced by filler-matrix hydrogen bonds and pi-pi interaction, and the heat-conducting composite film can be widely applied to the aspects of EMI shielding performance, heat dissipation and the like in electronic equipment.

The invention discloses a graphene heat dissipation film with high vertical thermal conductivity and a preparation method thereof. The preparation method comprises the following steps: preparing graphene oxide slurry containing metal salt into a first graphene oxide wet film through a film forming process; adding and forming nanofibers on the first graphene oxide wet film to construct a vertical heat conduction path, and then adding the graphene oxide slurry to form a second graphene oxide wet film to form a multi-layer material; and carrying out drying, pre-oxidation treatment, vacuum carbonization treatment and graphitization treatment on the multi-layer material to obtain the graphitized film. The obtained graphene heat dissipation film is good in interface compatibility and small in interface thermal resistance, the heat conduction performance in the vertical direction is remarkably improved, and the excellent heat conduction performance can still be kept in the plane direction.

The invention relates to the technical field of semiconductor devices, in particular to an active phase change heat dissipation control method and system for a silicon carbide power device, and the method specifically comprises the steps: obtaining inherent heat dissipation structure parameters, and synchronously collecting vibration data and transient heat flow data in real time; inputting the inherent heat dissipation structure parameters and the vibration data into a vibration-gap coupling influence evaluation module for evaluation to obtain an interface thermal resistance deterioration risk index; inputting the inherent heat dissipation structure parameters and the transient heat flow data into a heat flow-migration coupling influence evaluation module for evaluation to obtain a distribution uniformity degradation trend index; introducing a phase change stability correction factor, and performing fusion analysis to obtain a comprehensive heat dissipation performance index; and comparing the heat dissipation performance with a preset heat dissipation performance threshold value to generate a corresponding cooperative control instruction set. The problem that in the prior art, prospective, accurate and self-adaptive active heat dissipation cooperative control of the silicon carbide power device cannot be achieved is solved.

The invention discloses a high-heat-conductivity leakproof liquid metal phase change heat-conducting gasket and a preparation method thereof, and relates to the technical field of heat-conducting gaskets. The preparation method comprises the following steps: alloying high-heat-conductivity low-melting-point liquid metal gallium with high-heat-conductivity metal silver and copper, mixing with a polymer containing a specific functional group, adding a modified heat-conducting filler, and carrying out UV curing to form the heat-conducting gasket. Liquid metal is easily alloyed to form eutectic alloy, the melting point can be increased, a chemical cross-linked network formed by the modified heat conduction filler and UV curing can make up heat conduction loss, a heat conduction path is established, the interface thermal resistance is reduced, and the heat conduction efficiency is remarkably improved. The surface oxide layer interacts with the polar group of the polymer, and the steric hindrance effect of the cross-linked network is combined to synergistically realize the leak-proof effect. The high-heat-conductivity leakproof liquid metal phase change heat-conducting gasket prepared by the invention has the effects of high heat conductivity and leakproof.

The invention discloses a silicon carbide-diamond composite substrate and application, and belongs to the field of semiconductor materials. The silicon carbide-diamond composite substrate is characterized by sequentially comprising a silicon carbide substrate layer, an interface layer and a polycrystalline diamond layer from bottom to top, the thermal conductivity of the silicon carbide-diamond composite substrate is greater than or equal to 650 (W / (m.K)); the light transmittance is greater than or equal to 26%; the diameter is not less than 1 inch. According to the silicon carbide-diamond composite substrate, the interface layers are arranged in the silicon carbide substrate layer and the polycrystalline diamond layer, on one hand, the interface thermal resistance between the layers can be reduced, and the overall thermal conductivity of the composite substrate can be improved; on the other hand, the difference between the silicon carbide substrate layer and the polycrystalline diamond layer is reduced, delamination of the silicon carbide substrate layer and the polycrystalline diamond layer is avoided, and the composite substrate with complete crystal morphology is obtained.

The invention relates to a low-dielectric-loss high-thermal-conductivity epoxy resin composite material and a preparation method thereof, and the preparation method comprises the following steps: carrying out surface modification treatment on a thermal conductive filler: carrying out surface modification on the thermal conductive filler by adopting a chemical covalent bonding or physical adsorption mode, the heat-conducting filler is used for improving the compatibility of the filler and an epoxy resin matrix and reducing the interface thermal resistance, and comprises boron nitride with a two-dimensional sheet structure; epoxy resin, a curing agent and an optional modifier are evenly mixed, the epoxy resin is selected from epoxy resin with the low polarity characteristic, and the modifier comprises at least one of thermoplastic resin or elastomer. And the process is simple and controllable.

The invention discloses a thermistor mounting method and related equipment. The thermistor mounting method comprises the following steps: applying micro-power alternating bias excitation to a thermistor to obtain cold-state thermal resistance reference data; mounting a thermistor on the surface of the solder paste, collecting real-time resistance data in a temperature rise process, and performing normalized difference according to cold-state thermal resistance reference data to obtain a normalized dynamic resistance curve; performing derivative continuity and extreme value distribution analysis on the curve to obtain a wetting connectivity index; when the wetting connectivity index reaches a preset threshold value, executing second-order extreme value spacing analysis to obtain interface heat flux density distribution, calculating an interface thermal resistance dispersion vector field, and adjusting the transmission chain speed and furnace chamber airflow parameters according to the interface thermal resistance dispersion vector field; and a backtracking dynamic resistance curve is obtained in the cooling process, and the backtracking dynamic resistance curve and the standardized dynamic resistance curve are differentiated to obtain a curing quality factor. According to the invention, real-time identification in a defect germination stage and instant correction in a solder solidification window stage in a thermistor mounting process can be realized, and the mounting quality and reliability are improved.

The invention relates to a composite heat dissipation device integrating temperature equalization and liquid cooling, which comprises a liquid cooling plate cover plate, a composite upper cover and a temperature equalization plate lower shell which are sequentially arranged from top to bottom, the top of the temperature equalization plate lower shell is provided with an evaporation chamber, the peripheries of the composite upper cover and the temperature equalization plate lower shell are hermetically connected to form a vacuum cavity, and the bottom surface of the liquid cooling plate cover plate is provided with a recess. The periphery of the liquid cooling plate cover plate and the periphery of the composite upper cover are connected in a sealed mode to form a liquid cooling cavity, and the liquid cooling plate cover plate is provided with a cooling liquid inlet and a cooling liquid outlet. The lower surface of the composite upper cover is punched towards the upper surface to form a plurality of strip-shaped convex hulls; a first capillary structure covers the inner wall of the uniform temperature plate lower shell; and a second capillary structure covers the inner wall of the strip convex hull and / or the lower surface of the composite upper cover. The design is reasonable and ingenious, the functions of the upper cover of the vapor chamber and the fins of the liquid cooling plate are integrated, deep integration of the upper cover and the fins is achieved, the interface thermal resistance is effectively reduced, the structural strength is enhanced, and the manufacturing process is simplified.

The invention discloses a preparation method of GaN / diamond with low interface thermal resistance, and aims to solve the bottleneck problems of interface failure, high interface thermal resistance and the like caused by growth of diamond on a GaN substrate. The preparation method of the GaN / diamond with low interface thermal resistance comprises the following steps of: 1, ultrasonically cleaning a GaN substrate; 2, carrying out reverse sputtering cleaning on the GaN substrate; 3, sputtering and depositing a Si3N4 transition layer on the GaN substrate; 4, ultrasonic cleaning; 5, spin-coating the nano-diamond suspension liquid on the GaN substrate; 6, introducing hydrogen, oxygen and methane gas, and depositing a diamond layer in stages; 7, depositing a diamond layer at a first stage under low pressure; and 8, depositing a diamond layer at a second stage under high pressure. The GaN / diamond material with low interface thermal resistance is prepared through a multi-temperature gradient low-temperature growth process in combination with collaborative optimization of air pressure and time, and gradient heat flow control is combined with stress buffering of the Si3N4 transition layer, so that the integrity of the Si3N4 film is ensured.

The invention discloses a heat-conducting composite phase change sheet and a preparation method thereof, and relates to the technical field of energy devices. The heat-conducting composite phase change sheet is composed of a polymer matrix, a phase change material, a heat-conducting filler and a micro-nano convex-concave structure. The phase-change material and the heat-conducting filler are distributed in the sheet, and the micro-nano convex-concave structure is distributed on the surface of the sheet. The micro-nano convex-concave structure has an anchoring effect and is used for inducing the heat-conducting filler and the phase-change material to be accurately assembled in a target area and constructing a locally reinforced heat management unit; meanwhile, the micro-nano convex-concave structure can obviously increase the real contact area, reduce the interface thermal resistance between other parts and the sheet, optimize the heat conduction path and improve the heat conduction efficiency. An innovative solution is provided for efficient heat management of related energy devices, and the method has high engineering application value.

The invention discloses a multi-physical-field intelligent optimization system and method for low-thermal-resistance stacked electrode packaging, and relates to the technical field of packaging thermal management. According to the system, a thermal, mechanical and electric multi-physics field coupling model of the stacked electrode packaging structure is established in a unified computational domain through a modeling module; the measurement module collects thermal resistance, thermal conductivity and interface stress data in real time through an integrated sensor; the self-correction optimization module executes a self-adaptive residual iterative algorithm based on the deviation between the model simulation result and the actually measured data, corrects model parameters and generates process control variables; and the process regulation and control module dynamically adjusts the sintering temperature, the coating thickness and the pressing pressure according to the control variables and feeds back updated data to form closed-loop optimization. According to the method, collaborative operation of modeling, measurement, optimization and process regulation and control is realized, dynamic self-correction of multi-physical field parameters and process adaptive optimization can be realized in the packaging operation process, the interface thermal resistance is remarkably reduced, and the heat-conducting property and the structural stability are improved.

The invention belongs to the technical field of metal-based composite material additive manufacturing, and particularly relates to ultrasonic-assisted green laser equipment for copper-based diamond cooling fin machining, which comprises a rack, a printing cabin, a green laser machining system, an ultrasonic-assisted system, a powder spreading system, a gas control system, an intelligent control system and an online monitoring system. By integrating a green laser processing system and an ultrasonic auxiliary system, an ultrasonic-green laser-powder multi-energy field coupling processing system is constructed, the wavelength of green laser is 532 nm, the absorption rate of copper is increased, and compared with traditional infrared laser, low-power and high-efficiency melting of copper can be achieved, the diamond graphitization risk is reduced from the angle of a heat source, and the production cost is reduced. Ultrasonic vibration is transmitted to a molten pool through a substrate coupling type structure, by means of the cavitation effect and the acoustic streaming effect, the interface wettability of copper and diamond is effectively improved, the interface bonding force is enhanced, the interface thermal resistance is reduced, meanwhile, grains are refined, pores are eliminated, residual stress is reduced, and the comprehensive performance of the cooling fin is remarkably improved.

The present invention relates to the technical field of composite materials, and solves the technical problem that it is difficult to prepare a diamond / aluminum composite material with a tightly bonded interface while ensuring high thermal conductivity in the prior art. In particular, it relates to a diamond / aluminum composite material with a nano-gradient interface and a preparation method thereof. The present invention introduces a carburizing method on the basis of the magnetron sputtering method, and realizes the in-situ generation of new phases in each modified layer from the outermost metal element layer to the diamond surface through adsorption and diffusion, promotes the transformation of the metal modified elements on the diamond particle surface into carbides, and constructs a nano-gradient interface carbide layer. While the nano-scale interface layer improves the interface bonding between diamond and aluminum, it minimizes the introduced interface thermal resistance to the greatest extent. The present invention combines magnetron sputtering deposition with the carburizing method to prepare a nano-gradient multi-carbide interface layer with precisely controllable thickness, enhances the degree of interfacial diffusion reaction between diamond and aluminum, weakens the interfacial phonon scattering, and can give full play to the high thermal conductivity of diamond particles more fully.

The invention relates to an in-situ three-dimensional skeleton based on a powder coating method, a high-thermal-conductivity interface material of the in-situ three-dimensional skeleton and a preparation method and application of the high-thermal The in-situ three-dimensional heat-conducting network is prepared by mixing a three-dimensional framework material, a template sacrificial agent, a permanent binder and a thermal degradation catalyst in proportion, extruding and granulating, and then carrying out heat treatment. Then, polydimethylsiloxane, polyethylene glycol or paraffin and the like are used as polymer matrixes to be mixed with aluminum powder or aluminum oxide, the mixture is immersed into the in-situ three-dimensional heat-conducting network through an impregnation method for curing, and the thermal interface material of a double-heat-conducting-network skeleton structure is prepared. The double-heat-conduction network structure obviously improves the heat conduction effect of the thermal interface material, the thickness of the formed high-heat-conduction material is controllable, and the contact thermal resistance is effectively reduced. The introduction of the double-heat-conduction network skeleton structure reduces the interface thermal resistance to obtain the high-heat-conduction interface material, and the material is simple in preparation process, low in cost, recyclable and suitable for large-scale industrial production.

The invention discloses a board-level packaging method with high heat dissipation performance and a product thereof. The board-level packaging method comprises the following steps: bonding a copper plate and a substrate together; etching a groove and a chip mounting alignment mark on the copper plate; mounting the back surfaces of a plurality of chips on the copper plate; performing plastic packaging on the chip and the copper plate; opening a hole in the surface of the chip; manufacturing a redistribution structure with interconnected chips; separating the obtained structure from the substrate to expose the copper plate; etching the exposed copper plate; carrying out polishing anti-oxidation treatment on the exposed copper plate; and cutting the obtained structure into single packaging units. The copper plate is attached to the back surface of the chip, so that the heat dissipation interface thermal resistance of the chip is effectively reduced, the chip is not completely wrapped by a packaging material, and a heat dissipation channel is opened, so that the heat dissipation efficiency of the chip is improved, and the performance stability and reliability of the chip in high-load operation are improved; and the stability of the packaging structure is effectively improved.

The invention discloses a reliability evaluation method for a conductive thermal interface material. The method comprises the following steps: manufacturing a substitute sample according to a conductive thermal interface material bonding layer structure of an actual device and a sintering process; gradually increasing the environment temperature to test an actual device, and taking the amplification of the interface thermal resistance as a failure threshold value when the performance of the device cannot meet the requirement; according to the set temperature stress and current stress conditions, thermoelectric stress tests are carried out on all the alternative samples, the tests are stopped after a period of time, and interface thermal resistance tests are carried out; when the amplification of the interface thermal resistance of the alternative sample exceeds a failure threshold value, stopping the thermoelectric stress test of the alternative sample and recording the failure life until the amplification of the interface thermal resistance of all the alternative samples exceeds the failure threshold value; and obtaining the failure life of the conductive thermal interface material according to the failure life data of all the alternative samples, thereby realizing reliability evaluation of the conductive thermal interface material. According to the method, the reliability of interface thermal resistance degradation caused by the electromigration effect can be effectively evaluated.

The invention discloses a semiconductor heterojunction interface thermal resistance prediction method based on machine learning, and the method comprises the steps: collecting semiconductor material data, obtaining semiconductor intrinsic attribute data through a semiconductor public database, and carrying out the preprocessing of the data; calculating statistics of element attributes through a Magpie algorithm to obtain feature descriptors, eliminating redundant features by adopting a variance filtering method and recursive feature elimination, and normalizing the redundant features; model building and training are carried out by designing CNN and XGBoost algorithms; performing parameter optimization on the trained model through forward propagation, back propagation and a DBO algorithm; and predicting the thermal resistance of the semiconductor heterojunction interface based on the optimized model. The method solves the problems that in an existing semiconductor heterojunction interface thermal resistance prediction method, the experimental measurement period is long, the cost is high, environmental parameters are difficult to control accurately, the theoretical calculation complexity is high, and the deviation between a prediction result and an actual working condition is large due to the dependence on ideal interface conditions.

The invention discloses a low-thermal-resistance high-thermal-conductivity liquid metal heat-conducting sheet and a preparation method thereof, and relates to the technical field of heat-conducting materials. The nano silver wire network layers are formed on the front surface and the back surface of the liquid metal base material layer; the low-hardness heat-conducting curing layer is filled in pores of the silver nanowire network layer; and the silver nanowire network layer and the low-hardness heat-conducting curing layer jointly form the composite heat-conducting nano coating. The preparation method comprises the following steps: rolling liquid metal into sheets; coating the front side and the back side of the liquid metal sheet with the silver nanowire dispersion liquid respectively; after the coating is dried, performing vacuum hot pressing; and coating the silver nanowire network structure with a low-hardness heat-conducting coating, and carrying out vacuum curing to form a film. According to the invention, the defects in the prior art are overcome, the high heat conductivity coefficient of the composite coating can be ensured, the micro-nano interface between the interfaces can be filled by virtue of the low-hardness coating, and the interface thermal resistance is greatly reduced.

The invention relates to the technical field of high-molecular polyethylene, and particularly discloses a PE-based nano high-thermal-conductivity composite material and a pipe preparation process, the PE-based nano high-thermal-conductivity composite material is prepared from the following raw materials: high-density polyethylene, linear low-density polyethylene, an ethylene-octylene copolymer, a modified carbon nanotube, a core-shell oxide, a graphene nanosheet, an interface compatilizer, an antioxidant and a cross-linking agent; the modified carbon nano tube is obtained by depositing a SiO2 layer on the surface of a carbon nano tube and then grafting vinyltriethoxysilane; a core layer of the core-shell oxide is zirconium oxide, a shell layer of the core-shell oxide is aluminum oxide, the surface of the zirconium oxide of the core layer is coated with a zinc stearate hydrophobic layer, and the surface of the aluminum oxide of the shell layer is grafted with methacryloxypropyltrimethoxysilane. According to the invention, through compounding of the modified carbon nanotubes, the core-shell structure zirconium oxide-aluminum oxide and the graphene nanosheets, a three-dimensional heat-conducting network is constructed in a core layer, filler agglomeration is inhibited, and interface thermal resistance is reduced.

The invention provides a layered soft soil thermal drainage consolidation test method considering an interface contact thermal resistance effect, which comprises the following steps: S11, filling layered soft soil into a soil sample box according to a design thickness layer by layer, laying a heat conduction film between layers, and connecting a heat flow meter; s12, applying a preset pressure to compact the soil body, starting the heating base, raising the temperature according to a set gradient, and synchronously monitoring the thermal resistance of each layer; s13, when the temperature reaches a set value, a vacuum pump is started to maintain the preset vacuum degree, the heating power is automatically adjusted through a control algorithm based on the real-time heat flow data, and the interface thermal resistance change is compensated; s14, synchronously acquiring temperature, pressure, vacuum degree and displacement data, and establishing a heat-water-force coupling model to invert interface thermal resistance parameters; and S2, based on the interface thermal resistance parameters obtained in S1, executing a thermal drainage consolidation test stage. The problems that in the prior art, due to the fact that the interface contact thermal resistance effect is not fully considered, heat conduction efficiency evaluation is deviated, and consolidation process prediction is inaccurate are solved.

The invention discloses a high-strength graphene / metal composite heat dissipation plate with high transverse and longitudinal thermal conductivity and a preparation method thereof, and relates to the field of chips, the composite heat dissipation plate is formed by connecting a plurality of multi-layer graphene sheets through metal columns, and the upper surface, the lower surface and the peripheral side surfaces are packaged by metal foils; all the components are connected together through seamless diffusion welding. By embedding the high-strength and high-heat-conductivity metal columns into the multi-layer graphene with high transverse heat conductivity, heat can be quickly transferred in the transverse direction and the longitudinal direction at the same time. And packaging is carried out through the high-strength and high-heat-conduction metal foil, so that the strength of the heat dissipation plate is improved. An innovative graphene / metal seamless diffusion welding process is adopted, through precise optimization of the welding temperature and pressure, the part size and the like, efficient seamless combination of the metal-graphene composite material is achieved, the heat conduction performance and the mechanical strength of the composite material are improved, and the interface thermal resistance is reduced.

The invention discloses a high-thermal-conductivity copper-based composite material for heat dissipation and a preparation method thereof, and relates to the technical field of composites.The preparation method comprises the steps that graphene-tungsten graded coated diamond reinforced powder and spherical copper powder are mechanically mixed in a planetary ball mill, and uniform composite powder is obtained; and the uniform composite powder is loaded into a mold, curing forming is conducted in a vacuum environment through a spark plasma sintering technology, a diamond-tungsten carbide-tungsten-copper gradient interface structure is generated in situ in the sintering process, and the high-heat-conductivity copper-based composite material for heat dissipation is obtained. According to the invention, high thermal conductivity and low thermal expansion are realized by constructing a gradient interface, the thermal cycle reliability is improved by introducing a flexible layer, and the composite material with highly consistent performance is prepared by combining self-adaptive process regulation and control, so that the technical problems of high interface thermal resistance and unstable performance are solved.

The invention relates to a preparation method and application of a reaction type graphene reinforced spherical core-shell structure aluminum oxide-aluminum heat conduction interface material. The preparation method comprises the following steps: performing oxidation treatment on aluminum powder through an oxidizing agent to prepare a hydroxylated Al2O3 (at) Al core-shell structure spherical material, then performing covalent functional modification on the Al2O3 (at) Al core-shell structure spherical material and hydroxylated graphene by using a silane coupling agent, and grafting reactive acrylate functional groups. The thermal interface material is prepared by taking vinyl silicone oil and the like as a polymer matrix and compounding the polymer matrix with Al2O3 (at) Al and hydroxylated graphene filler. According to the thermal interface material, the dispersity of the filler in a silicone oil system is improved, agglomeration of the filler in a polymer matrix is reduced, the interface compatibility between the filler and silicon resin can be effectively improved, the flowing property of the thermal interface material is improved, meanwhile, the thermal interface material has a good heat conduction effect, and the contact thermal resistance is effectively reduced. The preparation method is simple, low in cost, high in repeatability, universal and suitable for large-scale industrial production, the thermal conductivity of the thermal interface material can be regulated and controlled to be 3.169-7.811 W.m <-1 >. K <-1 >, the interface thermal resistance can be regulated and controlled to be 0.0315-0.8792 K.cm < 2 >. W <-1 >, and the contact thermal resistance can be regulated and controlled to be 0.0129-0.3235 K.cm < 2 >. W <-1 >.

The invention provides an anti-settling heat-conducting laminated film as well as a preparation method and application thereof. The anti-settling heat-conducting laminated film is prepared from the following components in parts by mass: 20-80 parts of matrix epoxy resin, 10-50 parts of heat-resistant epoxy resin, 1-50 parts of a curing agent, 0.1-3 parts of a curing accelerator and 400-800 parts of modified aluminum oxide, the preparation method comprises the following steps: performing surface hydroxylation on alumina powder, then performing functionalization, reacting the alumina powder with a long-chain organic molecule solution, and introducing long-chain organic molecules to the surface of alumina, so that the modified alumina is uniformly dispersed in an epoxy resin system, is not easy to settle and has good uniformity; meanwhile, the interface thermal resistance between an epoxy resin system and the filler can be reduced, and the thermal conductivity and the humidity and heat resistance of the laminated film are improved. The anti-settling heat-conducting film prepared by the invention has excellent flowability, uniformity and heat and humidity resistance as well as good heat conductivity, and can be applied to IC (integrated circuit) support plate packaging.

The invention provides a process for preparing a three-dimensional graphene foam metal composite material by a biological template method. The preparation method comprises the following steps: preparing through an innovative biological template method process, carrying out carbonization-activation treatment on a natural hierarchical porous biological structure serving as a sacrificial template to form a three-dimensional graphene foam skeleton with bionic hierarchical pore channels, and carrying out in-situ compounding of copper / silver metal nanoparticles through a pulse electrodeposition technology to obtain the composite material. And finally, the three-dimensional graphene foam metal composite material with ultrahigh thermal conductivity and eco-friendly characteristics is constructed. The core breakthrough of the heat-conducting property is as follows: a bionic heat transfer framework is optimized, graded pores derived from a biological template form a phonon efficient transfer path, and the axial heat conductivity is improved by more than 40% compared with that of a material prepared by a traditional chemical foaming method; according to graphene-metal interface cooperation, metal nanoparticles directionally grow on the edge of a graphene sheet layer and hole wall defect sites, and interface thermal resistance is reduced to 8.7 * 10 <-9 > m < 2 > K / W by forming a coherent interface; cross-scale heat flow guide control is achieved, specifically, phonon conduction with the in-plane heat conductivity being 1600 W / (m.K) is achieved through a high-crystallinity graphene domain in a micropore, and an electron conduction heat diffusion network is constructed through a metal filling layer in a macropore channel.

The invention discloses a system and a method for measuring the thermophysical property of a soft material film. The system comprises a signal generator, a pump light path, a detection light path, a photoelectric detector, a signal processing module, a sample platform, a difference measurement module and a thermal parameter inversion unit. The system can be used for independently measuring the thermal conductivity, the specific heat capacity and the interface thermal resistance of liquid, gel and soft solid thin film materials at the same time on the premise that prior parameters are not needed. In combination with periodic heating of a square wave modulation heat source and a difference measurement strategy, high-precision measurement of micro-nano-scale thermophysical properties is realized, and the method is particularly suitable for various application scenes such as thermal interface materials (TIMs) and phase change energy storage materials.

The invention discloses a heat dissipation system and a heat dissipation method applied to an air switch cabinet, particularly relates to the technical field of switch cabinet heat dissipation, and is used for solving the problem of local temperature rise fluctuation caused by unstable thermal resistance of a connection interface of a radiator and a conductive element in a continuous ship vibration environment. According to the method, ship vibration at the installation position of a switch cabinet is monitored in real time to extract a vibration main frequency band and a phase angle, a dynamic compensation parameter is determined based on cooperation of a frequency domain overlapping factor and a heat conduction phase lag angle amplitude, an elastic heat conduction gasket with an optimized direction is arranged between a radiator and a busbar, and axial pre-tightening force periodically adjusted along with the phase angle is applied. And the thermal resistance change rate of the wave crest and wave trough phase angle positions is measured synchronously, and compensation parameters are updated when the temperature exceeds the standard so as to realize dynamic stability and self-adaptive control of the heat dissipation interface.

The high-thermal-conductivity diamond / copper composite material comprises a cooling fin red copper structural part, the cooling fin red copper structural part comprises a base body, a filling groove is formed in the top of the base body, and a first heat conduction layer, a second heat conduction layer, a third heat conduction layer and a fourth heat conduction layer are arranged in the filling groove. The ultrahigh-pressure preparation method comprises the following steps: (1) diamond micro-powder coating; 2) laying a heat conduction layer; 3) performing ultrahigh-pressure high-temperature sintering; and (4) finish machining and assembling of the sintered body. Compared with the prior art, the method has the advantages that a high-efficiency heat conduction path from a high-heat-flux chip to a structural part is realized, the interface thermal resistance is effectively reduced, and the thermal diffusivity is enhanced; the overall mechanical stability and service life of the composite material are improved; the processing time and energy consumption are reduced, and the production cost is reduced; the heat conductivity distribution is optimized, the density among the layered materials is improved, the heat conduction requirement from a chip to a heat dissipation piece is met, and the overall material quality and the product performance are improved.