Test method and system for thermophysical parameters based on multilayer composite material

A technology of multi-layer composite materials and thermal physical properties, which is applied in the direction of thermal conductivity of materials and thermal development of materials.

Active Publication Date: 2018-10-02
JIEYAO PRECISION HARDWARE SHENZHEN
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  • Claims
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Problems solved by technology

Aiming at the problem that thermal crosstalk will be generated during the test of multi-layer composite materials, which will bring large test...

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  • Test method and system for thermophysical parameters based on multilayer composite material
  • Test method and system for thermophysical parameters based on multilayer composite material
  • Test method and system for thermophysical parameters based on multilayer composite material

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Embodiment Construction

[0035] It should be noted that, in the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0036] Such as Figure 1-3 Shown, the present invention provides a kind of test method based on the thermal physical property parameter of multilayer composite material, it may further comprise the steps:

[0037] The system heats the multi-layer composite material to be tested, and measures the time-temperature curve T(t) of the tested object;

[0038] The system calculates and obtains the thermal resistance and interface thermal resistance of each layer of material in the vertical direction of the multilayer composite material to be tested;

[0039] The system simulates and obtains the heat transfer and disturbance between the materials of each layer;

[0040] The system uses the Angstrom method to measure the thermal physical parameters of the plane and convert them into related thermal physical param...

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Abstract

The invention discloses a test method for thermophysical parameters based on a multilayer composite material, wherein the method comprises the following steps: heating a multilayer composite materialtested object by the system, and measuring the time-temperature curve T (t) of the tested object; calculating to obtain thermal resistance and interface thermal resistance of various layers of materials in the vertical direction of the multilayer composite material tested object by the system; carrying out analogue simulation by the system, to obtain heat transfer disturbance between the layers ofmaterials; and measuring planar thermophysical parameters via an Angstrom method by the system, and converting into related thermophysical parameters. A test system for the thermophysical parametersbased on the multilayer composite materials includes a time-temperature curve obtaining module, a thermal resistance conversion module, a system analogue simulation and a thermophysical parameter calculation module. The method can measure the vertical-direction thermal resistance and the horizontal-direction thermal diffusion coefficient of the multilayer composite material, and simulates the thermal crosstalk direction of heat flow among multiple layers of materials. The method can be widely applied in the field of material heat testing.

Description

technical field [0001] The invention relates to the field of thermal testing of materials, in particular to a method and system for testing thermal and physical parameters of multilayer composite materials. Background technique [0002] With the increasing development of multi-layer composite materials, it has been used more and more. At the same time, with the development of microelectronics technology, electronic components are becoming thinner, lighter, smaller, and multi-functional, and the assembly density of components is increasing. The higher the temperature, the heat dissipation of power devices has become a prominent problem. If the accumulated heat cannot be dissipated in time, the operating temperature of components will rise, which will directly affect the life and reliability of various high-precision equipment. The heat-conducting polymer material is easy to form and process, low in cost, light in weight, and high in chemical stability. Through formula adjust...

Claims

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Application Information

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IPC IPC(8): G01N25/20G01N25/18
CPCG01N25/18G01N25/20
Inventor 祝渊段淇耀孙琪
Owner JIEYAO PRECISION HARDWARE SHENZHEN
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