Heat conducting composite material and heat conducting composite sheet prepared by applying same

A heat-conducting composite material and sheet technology, which is applied in the field of heat-conducting materials, can solve problems such as cumbersome procedures, inability to use, and poor thermal conductivity, and achieve the effects of simple preparation process, increased heat dissipation speed, and reduced interface thermal resistance

Inactive Publication Date: 2013-06-12
SHENZHEN BORNSUN INDAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thermally conductive silicone grease has extremely low thermal resistance due to its low thickness (generally less than 0.15mm), and is suitable for occasions with high heating power; It is used for the interface generated by direct contact of components, and cannot be used for filling large gaps
The melting point of thermally conductive phase change materials is generally 40-60°C, and it is solid at room temperature, which is conducive to operation and use; when heated to the melting point, it will transform into a fluid state, which can fully fill the interfacial gap and rapidly reduce t

Method used

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  • Heat conducting composite material and heat conducting composite sheet prepared by applying same
  • Heat conducting composite material and heat conducting composite sheet prepared by applying same
  • Heat conducting composite material and heat conducting composite sheet prepared by applying same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Weigh 10 kg of simethicone oil with a viscosity of 8000 mPas, 60 kg of spherical alumina powder with a particle size of 65 μm, 10 kg of spherical aluminum powder with a particle size of 0.35 μm, 50 kg of spherical aluminum powder with a particle size of 13 μm, and 0.8 kg of diluent. For example, simethicone oil at 50mPas. Put 10kg of simethicone oil and 0.8kg of diluent weighed into the kneader in sequence for mixing, then put 120kg of heat-conducting powder into the kneader in 4 times and mix for 30-90 minutes, preferably 60 minutes in this example. During mixing, temperature has little effect on the results. After being uniformly mixed by a kneader, the heat-conducting composite material of the present invention is obtained.

[0020] The finished thermally conductive composite material is taken out from the kneader, and the thermally conductive composite material is vacuumized to remove possible air bubbles in the thermally conductive composite material. Finally, th...

Embodiment 2

[0028] Weigh 10kg of vinyl silicone oil with a viscosity of 100mPas, 70kg of spherical alumina powder with a particle size of 60μm, 70kg of spherical alumina powder with a particle size of 4μm, 20kg of block aluminum nitride powder with a particle size of 3μm, 0.5 kg thickener, for example with a specific surface area of ​​280m 2 / g of fumed silica. Put the weighed 10kg vinyl silicone oil and 0.5kg white carbon black into the kneader in turn for mixing, then put 160kg of heat-conducting powder into the kneader successively in 3 times, and mix for 30min-90min, preferably 90min in this example. After being uniformly mixed by a kneader, the heat-conducting composite material of the present invention is obtained. During mixing, temperature has little effect on the results.

[0029] The thermally conductive composite material was taken out from the kneader, and then the thermally conductive composite material was calendered into a sheet covered with a protective film on both uppe...

Embodiment 3

[0035]Weigh 10kg of long-chain alkyl methyl silicone oil with a viscosity of 980mPas, 80kg of massive alumina powder with a particle size of 20μm, 30kg of flake graphite powder with a particle size of 5μm, and 20kg of flaky nitride powder with a particle size of 1μm. Boron powder, 0.8kg silane coupling agent A171. Put the weighed 10kg of long-chain alkyl methyl silicone oil and 0.8kg of silane coupling agent into the kneader for mixing, and then put 130kg of heat-conducting powder into the kneader in 5 times and mix for 30min to 90min. , preferably 80min. After being uniformly mixed by a kneader, the heat-conducting composite material of the present invention is obtained. During mixing, temperature has little effect on the results.

[0036] The finished thermally conductive composite material is taken out from the kneader, and the thermally conductive composite material is vacuumized to remove possible air bubbles in the thermally conductive composite material. Finally, the...

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Abstract

The heat conducting composite material provided by the invention is formed by mixing silicone oil and heat conducting powder, and various functional assistants are selectively added according to demands. The heat conducting coefficient of the heat conducting composite material is greater than 5.0W/m.K, and the material can be flexibly compressed at the environmental temperature of -40 to 200 DEG C and is not hardened, so that the material can be applied to filling gaps between various heating elements and radiating elements so as to reduce interface thermal resistance, shorten the heat conducting path and increasing the radiating speed of the elements. A heat conducting composite sheet provided by the invention is formed by mould pressing or rolling the heat conducting composite, and the compression ratio is high ( the compression ratio reaches over 40% at 50Psi). The heat conducting composite sheet can be directly attached to the components and has the characteristics of simple preparation process, convenience in use and the like.

Description

【Technical field】 [0001] The invention relates to a heat conduction material, in particular to a heat conduction composite material used for filling the gap between a heating element and a heat dissipation element and a heat conduction composite sheet made of the same. 【Background technique】 [0002] With the rapid development of contemporary electronic technology, the degree of integration and assembly density of electronic components has been continuously improved. While providing powerful functions, it has also led to a sharp increase in power consumption and heat generation. As we all know, high temperature will have a harmful effect on the stability, reliability and life of electronic components. Therefore, ensuring that the heat generated by heating electronic components can be discharged in time has become an important aspect of electronic product system assembly. However, the existing heat dissipation technology and heat dissipation materials have gradually failed to...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/06C08L83/05C08L83/07C09K5/14C08K3/22C08K3/36C08K3/28C08K3/34C08K3/38C08K3/08C08K3/04C08K7/00C08K7/06
Inventor 彭建军陶藤王勇
Owner SHENZHEN BORNSUN INDAL
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