Lamp

A technology of LED lamp and LED lamp body, which is applied in the cooling/heating device of lighting device, lighting device, light source, etc., which can solve the problems of LED lamp chip attenuation, loss of use value, and increase in heat generation, and achieve reasonable structure and good effect Dramatic, easy-to-manufacture effects

Inactive Publication Date: 2007-12-05
DONGGUAN CLED OPTOELECTRONIT TECH
View PDF0 Cites 20 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to make LED lamps adapt to the needs of general lighting, solid-state lighting sources urgently need to solve the problem of unit luminous flux. The increase in unit luminous flux of LED lamps greatly increases the calorific value per unit, and the large increase in heat causes LED lamp chips to attenuate and lose use value

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The LED lamp of the present invention is composed of an LED lamp body (1), a metal substrate (2), a heat container (3), a semiconductor refrigeration sheet (4), a cooling fin (5) and a cooling fan (6). The LED lamp body (1) is composed of LED chips and brackets, and is a commercially available high-power LED lamp; the metal substrate (2) is a connecting body of the shell, made of copper plate or aluminum plate, and has a certain heat dissipation effect; The container (3) can be selected from copper or aluminum or other materials with good thermal conductivity. The semiconductor refrigeration sheet (4) is a commercially available semiconductor refrigeration sheet. The heat sink (5) and cooling fan (6) are manufactured using the prior art. LED The lamp can be assembled and manufactured using existing technologies.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The LED lamp in this invention consists of LED lamp body, metallic base plate, hot container, refrigeration slice of semiconductor, heating slice, heating fan. It resolves effectively the problem that CMOS chip can bring greatly quantity of heat immediately after high-power LED lamp is electrified, the quantity of heat introduces base plate soon and accumulates rapidly, it results in that the temperature of the COMS chip raise fleetly, so the lightness of the LED lamp attenuate hastily, even it can burn the LED lamp. It has excellence in that reasonable frame, remarkable effect, easy production, and so on.

Description

technical field [0001] The invention belongs to an LED lamp, in particular to a high-power LED lamp. Background technique [0002] In order to make LED lamps adapt to the needs of general lighting, solid-state lighting sources urgently need to solve the problem of unit luminous flux. The increase in unit luminous flux of LED lamps greatly increases the calorific value per unit, and the large increase in heat causes LED lamp chips to attenuate and lose use value. Therefore, especially how to solve heat dissipation for high-power LED lamps is a major technical problem at present. Contents of the invention [0003] The purpose of the present invention is to propose an LED lamp in order to solve the current technical problems. [0004] The LED lamp of the present invention is composed of an LED lamp body, a metal substrate, and a heat sink, and is characterized in that a heat dissipation member is provided between the metal substrate and the heat sink, and the heat dissipati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): F21V29/00F21Y101/02F21V29/50F21Y115/10
Inventor 陈德华欧发文
Owner DONGGUAN CLED OPTOELECTRONIT TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap