623 results about "Low elastic modulus" patented technology

In a semiconductor integrated circuit sandwiched between a pair of a first impact resistance layer and a second impact resistance layer, an impact diffusion layer is provided between the semiconductor integrated circuit and the second impact resistance layer. By provision of the impact resistance layer against the external stress and the impact diffusion layer for diffusing the impact, force applied to the semiconductor integrated circuit per unit area is reduced, so that the semiconductor integrated circuit is protected. The impact diffusion layer preferably has a low modulus of elasticity and high breaking modulus.

The invention provides an expanded flexible well cementing grout and a preparation method thereof. The grout comprises the following components in parts by weight: 100 parts of cement, 6-14 parts of toughening material, 3-80 parts of reinforcing material, 8-120 parts of density modifier, 0.5-2.5 parts of suspension stabilizer, 20-40 parts of high-temperature stabilizer, 35-100 parts of distilled water, 0.5-2 parts of dispersant, 0.5-4 parts of fluid loss agent, 0.3-4 parts of retarder, 0.1-2 parts of foam inhibitor and 0.1-2 parts of defoamer. The invention further provides a preparation method of the expanded flexible well cementing grout. The grout has good sedimentation stability; and the set cement has the characteristics of micro expansion, high strength and low elasticity modulus, and can avoid the phenomena of micro cracks, micro annuluses, even fracture and the like caused by cement sheaths in subsequent operation of gas storage wells, shale gas wells, dense oil-gas horizontal wells and the like, thus realizing good zonal isolation and providing a technical support for long-term, safe and effective operation of oil-gas wells.

A needle trace transfer member to which needle traces of probes are transferred is installed at a movable mounting table to align the probes before electrical characteristics of a target object on the mounting table are inspected by bringing the probes into electrical contact with the target object. The needle trace transfer member is made of a shape memory polymer transformed reversibly and rapidly between a glass state with a high modulus elasticity and a rubber state with a low modulus of elasticity near its glass transition temperature. The glass transition temperature is set to a temperature close to a set temperature of the mounting table. The shape memory polymer is mainly made of polyurethane-based resin.

An object of the present invention is to provide a semiconductor device which has flexibility and resistance to a physical change such as bending and a method for manufacturing the semiconductor device. A semiconductor device of the present invention includes a plurality of transistors provided over a flexible substrate, each of which has a semiconductor film, a gate electrode provided over the semiconductor film with a gate insulating film therebetween, and an interlayer insulating film provided to cover the gate electrode, and a bending portion provided between the plurality of transistors, in which the bending portion is provided by filling an opening formed in the interlayer insulating film with a material having a lower elastic modulus, a material having a lower glass transition point, or a material having a higher plasticity than that of the interlayer insulating film.

A high density electronic package includes a low-modulus-of-elasticity flexible adhesive interposer substrate to which an electronic device, such as a semiconductor chip or die or other component, is attached. The flexible adhesive interposer substrate includes a sheet or layer of a molecularly flexible adhesive having via holes therein in which are built up conductive vias to which contacts of the electronic device connect. A thin layer of metal foil on one surface of the flexible adhesive sheet is patterned to provide contacts and to connect electrically to the conductive vias. The electronic device may be covered by a lid or by an encapsulant attached to the flexible adhesive interposer substrate and/or the electronic device. An electronic package may include a plurality of electronic devices and respective flexible adhesive interposers that are electrically interconnected.

The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance. This object is accomplished by a polyimide ink composition for printing, comprising a mixed solvent containing an benzoic acid ester solvent and a glyme solvent, and a polyimide soluble in the mixed solvent; wherein the polyimide is obtained by polycondensing a polyimide oligomer with a tetracarboxylic dianhydride component(s) and/or a diamine component(s) having no siloxane bond in molecular skeleton thereof the polyimide oligomer being prepared by polycondensing a tetracarboxylic dianhydride component(s) and a diamine component(s) having siloxane bonds in molecular skeleton thereof in the presence of a base catalyst(s), or a mixed catalyst including a lactone(s) and/or an acidic compound(s) and a base(s); the content of the diamine component(s) having siloxane bonds based on the total diamine components being 15 to 85% by weight.

A light emitting device includes a PCB substrate, an LED die that is attached to the PCB substrate, and a silicone-based encapsulation structure that encapsulates the LED die between the silicone-based encapsulation structure and the PCB substrate. The silicone-based material that is used to form the encapsulation structure exhibits low moisture absorption and a low elastic modulus relative to epoxy-based materials.

Methods and assemblies related to frame or bezel packaging of a sealed glass assembly, such as a fit-sealed OLED device, such as an OLED display panel. The frame or bezel packaging may have one or more of (a) rounded or chamfered corners, (a) a cover, (b) a reinforced lead edge, (c) openings or cutouts in the back panel to conserve material and lighten the bezel, and (d) a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the back and/or sides of the frame or bezel. The frame or bezel design may include a gap between the sealed glass assembly and the back panel of the bezel. The gap may be filled at least in part with low modulus of elasticity backing material. The glass package may have one or more of (a) rounded or chamfered corners, (b) rounded or chamfered edges, (c) a low modulus of elasticity material applied around its periphery or portions of its periphery, such as on the corners only, (d) a shortened lead end, and (e) a thickened lead end.

A material comprising two or more fibers, wherein each of the fibers has a mechanical modulus, and the mechanical modulus of at least one fiber is higher than the mechanical modulus of another fiber. The higher modulus fiber has a longer length than the lower modulus fiber. In various embodiments, the higher modulus fiber is collagen mimetic and the lower modulus fiber is elastin mimetic. A suture is also described, comprising two or more fibers. At least one of the fibers is elastin-like and has a lower elastic modulus than another fiber that is collagen-like and has a higher elastic modulus. The higher modulus collagen-like fiber is longer than the lower modulus elastin-like fiber.

A multilayer printed wiring board 10 includes: a build-up layer 30 that is formed on a core substrate 20 and has a conductor pattern 32 disposed on an upper surface; a low elastic modulus layer 40 that is formed on the build-up layer 30; lands 52 that are disposed on an upper surface of the low elastic modulus layer 40 and connected via solder bumps 66 to a IC chip 70; and conductor posts 50 that pass through the low elastic modulus layer 40 and electrically connect lands 52 with conductor patterns 32. The conductor posts 50 have the aspect ratio Rasp (height/minimum diameter) of not less than 4 and the minimum diameter exceeding 30 μm, and the aspect ratio Rasp of external conductor posts 50a, which are positioned at external portions of the low elastic modulus layer 40, is greater than or equal to the aspect ratio Rasp of internal conductor posts 50b, which are positioned at internal portions of the low elastic modulus layer 40.

In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Thermal degradation of a low-k organic dielectric material is avoided or limited in the proximity of a heat source such as a fusible element by overlaying the low-k material with a thermally conductive material and providing a low thermal resistance path from the thermally conductive material, possibly having a low modulus of elasticity, to a heat sink. The thermally conductive material thus provides crack-stop protection for further layers of an integrated circuit or interconnect structure above the fusible element by mechanical, chemical and thermal encapsulation of the heat source and low-k material.

A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics such as stress relaxation property (low stress properties), electric insulation properties, heat shock resistance, and heat resistance can be produced from the heat curable resin.

A containment flap for an absorbent article, such as an incontinence garment, has elasticity in the long axis and extensibility of the flap with a low modulus of elasticity in its transverse direction. The long axis tension of the flap has a force vector normalized to the transverse direction when the flap is placed in curvature over the body of a wearer, thereby providing a force for extending the flap in the transverse direction to maintain contact with the body of the wearer when the garment begins to sag, such as may happen due to gravity when the garment is loaded with absorbed bodily fluids. Material suitable for constructing such flaps is further disclosed.

The invention discloses a low-elasticity-modulus titanium-based jawbone implant and a preparation method of the implant. The preparation method mainly comprises the six steps that CT-scanned jawbone section image data are obtained; a rebuilt jawbone three-dimensional digital model is obtained; a jawbone implant digital model of a multi-hole structure is designed and obtained; a machining file of slice layered cross section data is obtained; the selective laser melting technology is adopted for preparing the jawbone implant; and surface treatment is carried out on the implant. The implant is used for treating a patient with jawbone defects, and the CAD digital design technology is used in the design of the implant; and jawbone repairing individualized design and multi-hole support structure design are combined, and through the selective laser melting technology, the low-elasticity-modulus titanium-based jawbone implant is prepared. The implant can meet the individual needs of the patient, and meanwhile can reduce the elastic modulus; and the problems of stress concentration and stress shielding of a traditional jawbone implant are solved, the preparation time is shortened, and the machining difficulty and the production cost are reduced.

Methods and assemblies relate to bezel packaging of a sealed glass assembly, such as a frit-sealed OLED device. The bezel packaging includes a shock absorbent intermediate layer of low modulus of elasticity material applied between the sealed glass assembly and the bezel. A bonding agent, which may include the low modulus of elasticity material and/or a separate bonding material, affixes the sealed glass assembly to the bezel. Bezel modifications may be made to stabilize the bezel. Exemplary bezel modifications include reinforced bezel side walls and supporting straps attached between bezel walls. The bezel design may include a gap between the edges of the sealed glass assembly and the bezel walls, so as to avoid direct contact therewith. The gap may be filled at least in part with low modulus of elasticity organic adhesive to provide additional shock absorbency. The low modulus of elasticity material may include foam, ceramic fiber cloth and/or a low modulus of elasticity polymeric organic coating.

The invention relates to a titanium alloy material, in particular to a multi-functional biomedical metastable beta titanium alloy material with excellent processing performance, and belongs to the technical field of titanium alloy material preparation. The alloy contains the following ingredients by mass: 18-27% of Nb, 0.5-2% of Mo, 3-5% of Zr, 7-9% of Sn, 0.1-0.3% of O and the balance of Ti. The titanium alloy has excellent comprehensive performance, and the strength and the elastic modulus of the alloy can be regulated through different thermal treatments. The elastic modulus E of the alloy is 40-7 3GPa, the yield strength sigma 0.2 is 260-864 MPa, the tensile strength sigma b is 686-1094 MPa, the elongation rate epsilon = 4-20%, and the facture surface shrinkage rate is 20-52%. The titanium alloy does not contain toxic elements, such as Al and V, and has excellent corrosion resistance, biocompatibility and cold processing performance. The titanium alloy can be used for manufacturing tissue repairing or substituting materials, such as artificial bones, artificial joints and bone plates.

The invention discloses a pressure sensor dielectric medium isolation packaging structure and a packaging method of the pressure sensor dielectric medium isolation packaging structure. The pressure sensor dielectric medium isolation packaging structure comprises a substrate, a cover body made of soft low-elasticity-modulus materials and a pressure sensor chip. The cover body and the substrate form an airtight cavity body together in order to accommodate the pressure sensor chip. When the pressure of a dielectric medium to be measured is acted on the cover body, the cover body deforms and accordingly compresses gas in the airtight cavity body to achieve balanced internal and external pressure. In the process, the dielectric medium to be measured is transmitted to a pressure sensitive membrane of the pressure sensor chip and accordingly the purpose that the pressure of pressure sensor chip and the pressure of the dielectric medium to be measured are separated is achieved. According to the pressure sensor dielectric medium isolation packaging structure and the packaging method of the pressure sensor dielectric medium isolation packaging structure, the pressure is transmitted by compressing the gas, and accordingly complex silicone oil filling procedures in a traditional silicone oil filling stainless steel packaging technology are avoided and manufacturing cost is greatly reduced.

The invention relates to a heat-resisting, low inflation double capacity compound material core aluminum stranded conductor and preparation method, the compound material core aluminum stranded conductor is composed of the compound material line core by the ultra long continual textile fiber heat-resisting resin and at least a section is tile shape pure aluminium or electric conduction outer layer with surround the aluminum alloy wire. Its preparation method is: Uses continuously pull-crowd craft to produce the excel in ultra long continual textile fiber strengthen the heat-resisting resin inner layer; Then through second time pull-crowd craft to cladding the outer layer which is formed by low elastical coefficient ultra long continual textile fiber strengthen the heat-resisting resin on the inner layer, namely makes the compound material line core; Again surrounds the tile shape pure aluminum or the aluminum alloy wire outside the compound material line core. The invention aluminum stranded conductor has low thermal-expansion coefficient, after enhances the conductor operating temperature the arc hang does not increase; the invention can long time safe working in 140degree centigrade, the aluminum, the aluminum alloy wire packing rate of the conductor layer is more than or equal to 90%, can double enhance the capacity of the electrical network transports.

The invention relates to a biomedical beta-titanium alloy material with low elastic modulus. The preparation method for the material comprises the steps of raw material preparation, raw material smelting, cogging, forging and the like, namely the method comprises the following steps: preparing a raw material alloy of Nb, Zr, Sn, Ta, Mo and Ti according to a certain proportion, mechanically stirring and mixing the alloy, then pressing the alloy on a hydraulic press to form electrodes, and later smelting the electrodes in a vacuum consumable electro-arc furnace to obtain cast ingots of the beta-titanium alloy material; taking out the cast ingots with certain diameter, heating the cast ingots in a vacuum furnace and then preserving the heat, upsetting and drawing out the heated cast ingots on the hydraulic press or a forging device, and repeating the step twice to thrice to obtain a forging stock of the beta-titanium alloy material; heating the forging stock in the vacuum furnace and then preserving the heat, drawing out the heated forging stock on the hydraulic press or the forging device to obtain the biomedical beta-titanium alloy material with the elastic modulus E of 50 to 80GPa. The alloy has the characteristic of low elastic modulus, has good combination properties such as tensile strength, yield strength, corrosion resistance and the like, and does not contain toxic elements to human body.