This invention relates to a
chip bonding film, its preparation method, and its application. The
chip bonding film comprises, from top to bottom, a first release film, a
chip bonding film layer, a pressure-sensitive
adhesive layer, and a chip
cutting film, arranged layer by layer. The chip bonding film layer comprises, by weight, the following components:
epoxy resin, 5-30 parts; phenolic resin, 5-30 parts; and filler, 5-20 parts. The pressure-sensitive
adhesive layer comprises, by weight, the following components:
acrylic resin, 100 parts; accelerator, 0.1-1 parts; and
coupling agent, 1-5 parts. The
advantage of this invention is that it uses
epoxy resin and phenolic resin to construct the
resin matrix. A suitable matrix combined with filler can disperse the filler in a short time, forming a highly stable
colloid with a particle size of less than 1 μm. This improves the
linear expansion coefficient of the film after the
glass transition point (Tg), enhances the adhesion of the film, and avoids
cutting defects and weak bonding points caused by filler agglomeration.