2782results about "Non-metallic protective coating application" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention relates to the technical field of PCB machining, in particular to a full-automatic integrated vacuum hole plugging machine which comprises a bottom frame, a hole plugging device, an ink scraping device and a transferring mechanism, the hole plugging device is used for completing the hole plugging process of a PCB, the ink scraping device is used for completing the oil coating and ink scraping process of the PCB, and the transferring mechanism is used for transferring the PCB to the bottom frame. And the transferring mechanism is used for moving the PCB to be plugged into the clamping mechanism in the hole plugging device or moving the PCB subjected to hole plugging into the clamping mechanism of the ink scraping device. According to the full-automatic integrated vacuum hole plugging machine, the hole plugging and ink scraping processes of the PCB can be completed, meanwhile, the PCB is moved into the clamping mechanisms of the hole plugging device and the ink scraping device through the transferring mechanism, the feeding action of the hole plugging process or the ink scraping process of the PCB is automatically completed, and therefore the efficiency, quality and yield of the hole plugging process and the ink scraping process of the PCB are ensured.

The invention discloses a double-sided semi-embedded packaging substrate and a processing method thereof, and the processing method comprises the steps: carrying out the N times of double-sided circuit manufacturing and the N-1 times of double-sided layer adding of a multi-layer substrate alternately, and obtaining an operation board with two groups of symmetrical circuit structures; the circuit structure is provided with an outer circuit layer and (N-1) inner circuit layers which are communicated with each other, and the inner circuit layer located on the innermost side is provided with a bonding pad. Performing laser groove burning on the working board, and processing a blind groove which is provided with an opening at the outer circuit layer and takes the other inner circuit layer adjacent to the innermost inner circuit layer as the groove bottom locally on each group of circuit structure; removing the copper foil on the bottom of the blind groove; the bonding pads are completely exposed in the blind grooves corresponding to the bonding pads, the blind grooves in the two sets of circuit structures are communicated, and a through groove structure is obtained; and cleaning the surface of the bonding pad to obtain the double-sided semi-embedded packaging substrate. The processing method is simple and reasonable, the processing cost is low, the processing efficiency is high, and the reliability of the obtained double-sided semi-embedded packaging substrate is very high.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

A method for a system includes receiving with a first transceiver of an identity reader device, an ephemeral ID from a first smart device, outputting with the first transceiver, identity reader data to the first smart device, wherein the identity reader data comprises a first identifier and a challenge, receiving with the first transceiver, responsive data from the first smart device, wherein the responsive data comprises token data and contact tracing status of the first smart device, determining in a processor of the identity reader device, whether the first smart device is authorized in response to the ephemeral ID or the token data, and the contact tracing status, and directing with the processor, a peripheral device coupled to the identity reader device to perform a user-perceptible action in response to the processor determining that the first smart device is authorized.

The invention relates to the technical field of circuit boards, in particular to a production method of a circuit board, which comprises the following steps of: sequentially arranging an improved layer and a copper foil layer on the surface of a copper substrate, and then carrying out hot pressing treatment on the substrate coated with the improved layer and the copper foil layer at the hot pressing temperature of 180 DEG C for 2 hours. In the production of the circuit board, the surface of the copper substrate is matched with the improved layer and the copper foil layer, and the improved layer is formed by coating an improved material obtained by blending epoxy resin, a modified filler, a nano titanium dioxide regulator and a curing agent on the surface of the copper substrate, so that the thermal conductivity, dielectric loss and wear resistance of a product are enhanced; the performance of the product is improved in a balanced and coordinated manner, and the performance stability effect of the product is remarkable under high-heat and high-humidity conditions.

The invention provides a preparation method of a charging pile circuit board and the charging pile circuit board. The method comprises the following steps: obtaining a to-be-embedded copper block required by a charging pile circuit board; embedding the copper block to be embedded into a core plate to obtain the core plate with the copper block; laminating the copper foil, the cured sheet and the core plate with the copper block to obtain a laminated plate; performing circuit manufacturing on the laminated plate to obtain a first charging pile circuit board; obtaining a heat parameter of the first charging pile circuit board under a heat simulation model; inputting the heat parameter into a preset heat dissipation evaluation model for evaluating the heat dissipation effect of the circuit board to obtain an evaluation result; according to the evaluation result, manufacturing parameters of a target charging pile circuit board are determined; and obtaining the target charging pile circuit board according to the manufacturing parameters of the target charging pile circuit board, the target to-be-embedded copper block, the target core board, the target copper foil and the target cured sheet. The heat dissipation performance of the charging pile circuit board can be improved.

The invention relates to the technical field of PCBA packaging, discloses a PCBA packaging method and equipment based on a fixed glue spraying assembly, and aims to solve the technical problems of complex wiring, high mechanical loss and inconvenience in maintenance in a mobile packaging scheme of an existing glue spraying assembly. The PCBA packaging method comprises the steps that a glue spraying assembly sprays a UV glue solution to a target glue spraying area of a PCBA, and a curing irradiation assembly irradiates the PCBA to cure the UV glue solution to form a packaging layer; wherein the glue spraying assembly comprises a plurality of rows of independently-controlled piezoelectric spraying holes, the positions of the piezoelectric spraying holes are fixed in the whole spraying process, and full coverage of a target glue spraying area is achieved only by driving the PCBA to move. The PCBA packaging equipment comprises a support, a conveying mechanism, a fixedly-arranged glue spraying assembly and a curing irradiation assembly, the conveying mechanism drives a PCBA to move along a preset path, and it is ensured that a target glue spraying area is exposed under the glue spraying assembly in sequence or repeatedly. According to the invention, the wiring structure of the glue spraying assembly is simplified, the mechanical wear is reduced, the equipment reliability and maintenance convenience are improved, the precision and efficiency of PCBA packaging are ensured through synchronous curing and precise movement control, and the method is especially suitable for selective protection packaging of a low-height PCBA board with the maximum height of an electronic component smaller than 1cm.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

According to the glass phased-array antenna control module and the manufacturing method thereof, a control circuit is manufactured on a glass substrate through a TFT manufacturing process, high-precision control over a phased-array antenna is achieved, the accuracy of beam pointing of the phased-array antenna and the quality of signal processing are guaranteed, and the manufacturing cost of the phased-array antenna is reduced. Through the combination of a TFT manufacturing process and a TGV technology, the layout space of a control circuit is saved, the installation space of an antenna chip is saved through a COB packaging mode, the high integration level of the phased-array antenna is achieved, the requirements for miniaturization and multi-functionalization of the phased-array antenna are met, and the application range of the phased-array antenna is widened. According to the phased-array antenna, the grounding isolation holes are formed in the periphery of the antenna chip, so that good crosstalk resistance is achieved, the stability and reliability of the phased-array antenna are improved, the performance of the phased-array antenna is comprehensively improved, the phased-array antenna has higher competitiveness in the fields of satellite communication, vehicle-mounted radars, military radars and the like, and the application prospect is wide. And the requirements of various fields on high-performance phased-array antennas can be better met.

The invention relates to the technical field of circuit board processing, in particular to a manufacturing process of a high-performance inner-layer ultra-thick copper circuit board which comprises a bearing table, a back plate and the like. A back plate is arranged on the bearing table. Printing ink is stored through the storage box, the situation that printing ink is not evenly printed due to printing ink diffusion is avoided, and the printing ink printing effect of equipment is improved; through the structure that the middle of the flow dividing rod is high and the two sides of the flow dividing rod are low, ink is slowly collected into the storage box along the flow dividing rod in cooperation with flowability of the ink, the problem that the ink utilization rate is low is solved, and meanwhile the situation that the ink is accumulated and hardened for a long time is avoided. The circuit board is ejected upwards through the ejector rod, then a worker can hold the lower side of the circuit board with hands to take out the circuit board, and the circuit board is prevented from being damaged while the worker conducts discharging conveniently. And the circuit board is accurately placed on the upper side of the fixing frame through cooperation of a guide plate and a limiting block, so that feeding by workers is more convenient.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

The invention provides a vertical screen printing machine CCD automatic alignment device, and relates to the field of circuit board production, the vertical screen printing machine CCD automatic alignment device comprises a mounting plate seat, two conveying double guide rails are arranged on the two mounting plate seats, a first vertical feeding frame and a second vertical feeding frame are arranged on the two conveying double guide rails respectively, a PCB body is arranged on the first vertical feeding frame, and the PCB body is arranged on the second vertical feeding frame. And a CCD (Charge Coupled Device) camera mechanism is arranged on one mounting plate seat. The CCD camera mechanism is arranged, the problem of alignment of the vertical printing machine is solved, a target hole is automatically found after the position of a PCB area calibration hole is photographed through four cameras or two cameras at opposite angles, front and back symmetrical screen frames are controlled through algorithm software to automatically adjust the position to be aligned with a screen graph, high-precision printing is achieved, and the printing efficiency is improved. And meanwhile, when the CCD camera mechanism runs and is used, the adjusting hand wheel can be quickly locked through the hand wheel locking module after being used, the situation that the adjusting position deviates is avoided, and the printing precision is further improved.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

The invention relates to the technical field of circuit board processing, and particularly discloses an automatic film pasting process for a flexible circuit board, which comprises the steps of positioning feeding of the flexible circuit board, film pasting pretreatment and automatic film pasting processing. By adopting distributed positioning operation, accurate positioning of the flexible circuit board can be achieved, the flexible circuit board is calibrated and centralized at the center position of the top of the lifting plate, deviation and shaking of the flexible circuit board in the feeding process are effectively avoided, the feeding precision and stability are improved, and the production efficiency is improved. The stability of the flexible circuit board in the positioning process is further enhanced in cooperation with a multi-point adsorption mode, the flexible circuit board can keep the fixed position and posture in the film pasting machining process, the film pasting accuracy and completeness are guaranteed, meanwhile, due to the fact that the clamping blocks can move to the periphery of the bottom of the flexible circuit board when not carrying out clamping action, the clamping blocks can move to the periphery of the bottom of the flexible circuit board, and the clamping efficiency is improved. The film pasting process is not interfered, the smoothness of the film pasting process is ensured, and film pasting defects or process interruption caused by a positioning structure are avoided.

The invention provides a vertical silk-screen up-and-down bidirectional screen shifting device, and relates to the field of circuit board production, the vertical silk-screen up-and-down bidirectional screen shifting device comprises mounting frames, the two mounting frames are each provided with a screen shifting mechanism, screen mechanisms are arranged in the two mounting frames, and a same PCB body is arranged between the two screen mechanisms; fixed plate frames are fixedly connected to the outer walls of the two sides of the two mounting frames, and displacement processing modules are arranged on the four fixed plate frames; the displacement mechanism for moving the screen printing plate comprises four fixing frame pieces. According to the PCB printing screen shifting device, the effect of shifting of the PCB printing screen is achieved, the position between the PCB and the screen shifts between the previous printing and the current printing, printing ink left in the previous printing is staggered from the position of a hole in the printed PCB, and therefore the amount of the printing ink left on the screen is always only the amount left in the previous printing, and the printing efficiency is improved. And the ink is prevented from blocking holes.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

The invention discloses a novel silicon carbide embedded core-embedded module packaging circuit board sintering device and method, and relates to the technical field of sintering processes. The device comprises a machine table, and a plurality of stations distributed at intervals are arranged on the machine table and sequentially comprise a feeding station, a plurality of preheating stations, a sintering station, a plurality of cooling stations and a discharging station; the lifting mechanisms are arranged on the machine table and located on the two sides of the multiple stations; the supporting mechanisms are located on the two sides of the multiple stations and movably connected with the lifting mechanism. The driving mechanism is arranged on the machine table and is in transmission connection with the supporting mechanism; and the sintering mechanism is arranged above the sintering station, the sintering mechanism can ascend and descend in the vertical direction, the sintering mechanism comprises a machining bin, an upper pressing die capable of ascending and descending is arranged in the machining bin, and a spray head used for providing inert gas is further arranged in the machining bin. According to the novel sintering device for the silicon carbide embedded core-embedded module packaging circuit board, the sintering quality and the sintering efficiency can be improved.

A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH / g or more.

The invention relates to the technical field of electronic manufacturing, and discloses a circuit board printing manufacturing device which comprises a conveying belt, one end of the conveying belt is provided with a board placing device used for storing solder resist ink needing to be coated, one side of the board placing device is provided with two brushing devices, and the two brushing devices are arranged on the conveying belt. A fixing plate is arranged between the two brushing devices, the fixing plate is fixedly mounted on a fixing mounting plate of the conveying belt, a square rod is arranged between the fixing plate, one end of the square rod is rotationally connected with a gear, the other side of the gear is fixedly connected with a sliding square block, the other end of the sliding square block is slidably connected with a clamping block, and the clamping block is fixedly connected with the clamping block. One side of the clamping block communicates with an air pipe used for adsorbing a copper-clad plate, the square rod is sleeved with a torsional spring, and one end of the torsional spring is fixedly connected with the square rod. The circuit board printing and manufacturing device can fix the position of the copper-clad plate after the copper-clad plate is turned over.

The invention provides a full-automatic tackle for laminating a printed circuit board, which is used for solving the problems in the prior art that the stability of synchronous clamping of double plates is insufficient, the conductive contact pressure is uncontrollable, and the laminating quality is influenced by equipment vibration during process conversion. The full-automatic tackle comprises a chain circulating transmission system, a groove body, a full-automatic tackle body and a lifting conductive mechanism, the full-automatic tackle body can return to a loading station after the printed circuit board completes all procedures, multi-procedure continuous processing of printed circuit board film coating processing is achieved, and the working efficiency is improved. The equipment utilization rate and the laminating processing efficiency are improved; according to the utility model, the shearing force generated by the vibration of the printed circuit board can remove bubbles generated in the film coating process, the liquid medicine is pushed to permeate into the micropore structure of the circuit board, the micropore filling rate is improved, and the uniformity of the coating is ensured; transmission mechanisms of the circuit board are mostly arranged on the supporting column in the middle of the line body in a centralized mode, the occupied space is small, the structure is simple, allocation is flexible, conveying is stable, and maintenance is easy.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The present invention relates to the technical field of PCB board processing, and more particularly to a fully automatic, integrated vacuum plugging machine, comprising a base frame, a plugging device, a scraping device, and a transfer mechanism. The plugging device is used to complete the plugging process of a PCB board, the scraping device is used to complete the oiling and scraping processes of the PCB board, and the transfer mechanism is used to move a PCB board to be plugged into a clamping mechanism within the plugging device, or to move a PCB board that has been plugged into the clamping mechanism of the scraping device. The fully automatic, integrated vacuum plugging machine of the present invention can complete the plugging and scraping processes of a PCB board, and simultaneously, through the transfer mechanism, enables the PCB board to be moved into the clamping mechanism of the plugging device and the scraping device, automatically completing the loading action of the PCB board for the plugging process or the scraping process, thereby ensuring the efficiency, quality, and yield of the plugging and scraping processes of the PCB board.

The invention provides a buried resistor circuit board and a preparation method thereof. According to the resistance element, one resistance material is arranged on the dielectric layer to form the first resistance layer, and then the other resistance material is arranged on the first resistance layer to form the second resistance layer, so that the binding force of the resistance layers and the dielectric layer can be enhanced, and the surface flatness of the resistance element can be improved. The resistive layer of the resistive element is protected by using the protective film, so that the shape and the length of the resistive layer are prevented from being influenced by subsequent processes. According to the preparation method, the whole process is a dry process, a differential etching process is omitted, an alkaline etching solution does not need to be used, and the preparation method is environmentally friendly.

A high-precision impedance circuit board ink thickness uniformity control method relates to the circuit board processing field, and comprises the following steps: solder resist pretreatment: cleaning a circuit board, and roughening a copper surface; the circuit board is covered with the liquid photosensitive ink through extrusion type roller coating, the extrusion force is 2.5 + / -0.2 kg / cm < 2 >, and the speed is 1.2 + / -0.2 m / min; pre-baking: pre-curing and baking the ink; pressure is applied to the circuit board to flatten the ink on the surface of the circuit board, the applied pressure is 2 + / -0.2 kg / cm < 2 >, and the temperature is 82 + / -3 DEG C; exposure: protecting the ink at the position needing solder mask coverage through photocuring; developing: removing the unexposed ink, and exposing the electrical connection points needing surface treatment; and post-baking: further curing the ink at a high temperature to form a solder mask layer. According to the method, the ink range is reduced in an extrusion roll coating mode, the uniformity is improved through vertical coating, the requirement for the performance of the circuit board is guaranteed, and the method has high practicability.

The invention discloses a three-proofing paint precise coating method based on gradient atomization control, and relates to the field of intelligent control, and the method comprises the steps: carrying out the visual scanning of a to-be-coated PCB, and obtaining the type, position and size information of each component on the PCB based on a scanning result, so as to establish a mapping relation between the components and a coating demand; according to the method, the surface of the PCB is divided into a plurality of independent coating areas according to the mapping relation between the components and the coating requirements, and an atomization airflow pressure threshold value and a paint supply amount threshold value which are matched with the protection requirements of each coating area are set for each coating area. The protection and thickness requirements of different components can be accurately matched, blind coating is avoided, independent coating areas are divided according to the protection grade, size and gap characteristics, adaptive atomization airflow pressure and paint supply threshold values are set, the coating requirements of all the areas can be met in a more targeted mode, and paint waste and excessive coating are reduced.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

The present invention provides a surface treatment liquid that can form an organic film sufficiently excellent in adhesive properties between metal and resin and is also excellent in chemical resistance properties, the surface treatment liquid being excellent in storage stability. The present invention relates to a metal surface treatment liquid for forming an organic film on a metal surface, wherein the surface treatment liquid contains a silane coupling agent and an acid and has a pH of 1.9 or less.

The invention discloses a processing method for realizing multiple surface treatments on a PCB (Printed Circuit Board), which belongs to the technical field of printed circuit boards, and comprises the following steps of: firstly, pasting an adhesive tape to protect a tin-plated cerium alloy and a gold-plated area, processing a local nickel-gold immersion position, and then pasting the adhesive tape to protect the tin-plated cerium alloy and the nickel-gold immersion area. And finally, an adhesive tape is pasted or blue gel is printed to protect the nickel gold immersion and gold plating areas, and only the position needing tin-cerium alloy plating is exposed to complete tin-cerium alloy plating processing. Through accurate positioning and protection measures, the method can ensure that three different surface treatments of tin-cerium alloy plating, nickel-gold immersion and gold plating can be realized on the same PCB, and the highly complicated design requirements are met.