1173results about "Non-metallic protective coating application" patented technology

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

The invention relates to the technical field of PCBA packaging, discloses a PCBA packaging method and equipment based on a fixed glue spraying assembly, and aims to solve the technical problems of complex wiring, high mechanical loss and inconvenience in maintenance in a mobile packaging scheme of an existing glue spraying assembly. The PCBA packaging method comprises the steps that a glue spraying assembly sprays a UV glue solution to a target glue spraying area of a PCBA, and a curing irradiation assembly irradiates the PCBA to cure the UV glue solution to form a packaging layer; wherein the glue spraying assembly comprises a plurality of rows of independently-controlled piezoelectric spraying holes, the positions of the piezoelectric spraying holes are fixed in the whole spraying process, and full coverage of a target glue spraying area is achieved only by driving the PCBA to move. The PCBA packaging equipment comprises a support, a conveying mechanism, a fixedly-arranged glue spraying assembly and a curing irradiation assembly, the conveying mechanism drives a PCBA to move along a preset path, and it is ensured that a target glue spraying area is exposed under the glue spraying assembly in sequence or repeatedly. According to the invention, the wiring structure of the glue spraying assembly is simplified, the mechanical wear is reduced, the equipment reliability and maintenance convenience are improved, the precision and efficiency of PCBA packaging are ensured through synchronous curing and precise movement control, and the method is especially suitable for selective protection packaging of a low-height PCBA board with the maximum height of an electronic component smaller than 1cm.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH / g or more.

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

A coating apparatus 10 for applying a film-forming liquid to a peripheral edge of a board while moving a board and a coating unit 20 relative to each other, wherein the coating unit 20 includes a coating mechanism 21 and an extension mechanism 30, and wherein the coating mechanism 21 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board, and wherein the extension mechanism 30 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board. The extension mechanism 30 has an extension part 31 that extends the film-forming liquid applied by the application part 22 to the peripheral edge face and the peripheral upper and lower faces of the board in the form of a thin film, and a force mechanism 34 that forces the extension part 31 toward the peripheral edge face and the peripheral upper and lower faces of the board, and the extension part 31 is configured to be removable without removing the force mechanism 34 from the extension mechanism 30.

The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof,wherein the monomer compound has the following formula:where R1, R2 and R4 are each independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl or halo alkyl or aryl optionally substituted by halo, and R3 is selected from:where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C1-C6 alkyl, halo alkyl or aryl optionally substituted by halo; and n1 is an integer from 1 to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500° C.

The invention discloses a packaging material as well as a preparation method and application thereof. The packaging material comprises the following components in parts by mass: 40-85 parts of matrix resin, 5-30 parts of phase change PCM particles, 3-20 parts of self-repairing microcapsules, 1-8 parts of an interface compatilizer and 10-20 parts of a heat-conducting network reinforcing material, the melting point of the phase change PCM particles is not more than 80 DEG C; a core layer of the self-repairing microcapsule comprises dicyclopentadiene and a ruthenium catalyst, and a shell layer of the self-repairing microcapsule comprises polyurea or polyurethane; the PCBA packaging material with the intelligent response function is formed by combining the low-melting-point phase-change PCM particles with the self-repairing microcapsule system, when the PCBA temperature is too high, the low-melting-point phase-change PCM particles are molten, junction temperature suddenly rising is restrained through melting heat absorption, meanwhile, the adjacent microcapsules are triggered to be broken through volume expansion, DCPD monomers are released and subjected to in-situ polymerization under the action of a catalyst, and the PCBA packaging material with the intelligent response function is obtained. Microcracks generated by thermal stress are rapidly repaired, and the heat dissipation stability and the electrical insulation reliability of the material in long-term thermal circulation are remarkably improved.

This application relates to the field of communication technology, and discloses an antenna, its fabrication method, and a terminal device. The antenna includes a substrate and a radiator. The radiator includes a copper plating layer and a protective layer. The copper plating layer is formed on the surface of the substrate, and a passivation layer is disposed on the side of the copper plating layer facing away from the substrate. The passivation layer can protect the copper plating layer, reduce the risk of corrosion of the copper plating layer, and thus improve the reliability of the antenna. Furthermore, since the layer structure of the radiator is relatively simple, the antenna fabrication process is significantly simplified, and the manufacturing cost is reduced.

The invention discloses a self-adaptive vacuum filling and sealing device and method, and mainly solves the problems that the existing vacuum filling and sealing technology is difficult to realize accurate adaptation and optimal adjustment of multiple types of filling and sealing adhesives, and the filling and sealing consistency and the product reliability under complex working conditions are influenced. Comprising a vacuum box, a vacuum pump, a vacuum pressure digital display meter, a control panel and an air inlet valve, wherein a liquid flow meter is arranged at a glue injection and pouring outlet in the vacuum box, and instantaneous flow data of pouring sealant is detected and fed back in real time; a refrigerating device is arranged on the side wall to inhibit local temperature rise of the two-component pouring sealant caused by heat release of a chemical reaction; a heating device is arranged at the upper part to compensate the adverse effect of environment temperature reduction on the fluidity of the pouring sealant; and meanwhile, a fusion algorithm for self-adaptive adjustment of multiple types of pouring sealants is deployed in the microprocessor, so that self-adaptive temperature balance and regulation in the pouring process are realized. According to the invention, the automation degree and the response sensitivity of the potting process can be obviously improved, and the stability and the reliability of the potting process are improved.

The invention discloses a hydrophobic anti-icing material based on silver ions and application in a power transmission line, and belongs to the technical field of hydrophobic anti-icing materials, the hydrophobic anti-icing material is prepared from the following raw materials in parts by weight: 80-120 parts of hydroxyl-terminated polydimethylsiloxane, 5-15 parts of tetraethoxysilane, 0.5-3 parts of silver nitrate, 3-10 parts of hydrophobic nano silicon dioxide and 1-5 parts of nano titanium dioxide. The invention discloses an anti-icing and deicing composite material, which is prepared from the following components in parts by weight: 80 to 120 parts of butyl acetate, 0.1 to 0.5 part of dibutyltin dilaurate, 0.5 to 2 parts of sodium citrate and 2 to 5 parts of modified fluorinated phosphotungstic acid imidazole compound, and solves the problems that the existing material is insufficient in photo-thermal utilization rate, poor in stability in a severe environment, insufficient in hydrophobic capacity and difficult to give consideration to anti-icing and deicing effects. According to the scheme, the modified fluorinated phosphotungstic acid imidazole compound and silver ions are introduced to form a synergistic effect, formation of an ice layer is inhibited, melting of the ice layer is promoted, meanwhile, lasting super-hydrophobicity is provided, a durable hydrophobic anti-icing coating based on the silver ions is formed, and the safety of a power grid is guaranteed.

A pressure-sensitive stacking structure for a sports training device of the present invention that is able to detect a pressure with which a player grips a grip portion may include: a conductive layer that is pressure-sensitive; a circuit layer disposed to face the conductive layer and having a plurality of conductive patterns; and a separating layer disposed between the conductive layer and the circuit layer and formed of a fibrous tissue including a plurality of fibers, wherein, when a pressure is generated, the conductive layer and the circuit layer may come into contact, and the pressure may be detected.

The invention belongs to the field of PCB production, and particularly relates to a production method for controlling galvanic effect generation at a PAD of a PCB, and the production method comprises the following steps: S1, manufacturing design graphic data of the PCB, and designing joints of a circuit and a square PAD and a circular PAD to be teardrop-shaped; s2, cutting the substrate into a specified size according to design graphic data, and cleaning a surface plate; s3, converting a Gerber file in the design graphic data into a film negative, and transferring a circuit pattern to a substrate copper foil coated with photosensitive resin through an exposure machine; s4, removing the unexposed photosensitive resin by using a developing solution; when image data is manufactured and designed, the connecting position of the circuit and the PAD is designed to be in a teardrop shape, after follow-up transfer printing etching, a teardrop-shaped structure is formed at the connecting position of the circuit and the PAD in the conductive circuit, the connecting area between the circuit and a bonding pad is effectively increased, and the risk that the connecting position of the circuit and the PAD is disconnected due to corrosion of a severe environment in follow-up production and use is reduced.

The present disclosure provides a light-emitting substrate, a method for manufacturing the same, and a display device. The light-emitting substrate includes: a substrate including a light-emitting region; a first conductor on the substrate and at least in the light-emitting region, the first conductor extending along a first direction in the light-emitting region; a second conductor on the first conductor and arranged in the light-emitting region, the second conductor including a first connecting portion; and a first insulator within the light-emitting region. The first connecting portion extends along a second direction, an orthographic projection of the first connecting portion on the substrate at least partially overlaps with an orthographic projection of the first conductor on the substrate to constitute an overlapping region. The first insulator is only between the first connecting portion and the first conductor, the overlapping region is within an orthographic projection of the first insulator on the substrate.

The present disclosure relates to the technical field of circuit boards, and provides a method for manufacturing a chip-embedded circuit board, and a chip-embedded circuit board. The method for manufacturing a chip-embedded circuit board includes: providing a mounting recess in a pre-manufactured circuit board; embedding a chip packaging unit in the mounting recess such that upper and lower surfaces of the chip packaging unit are flush with upper and lower surfaces of the pre-manufactured circuit board, respectively; and forming an electrode lead-out structure on the upper surface of the pre-manufactured circuit board by: stacking a dielectric layer and a conductive layer on the upper surface of the pre-manufactured circuit board, providing through holes in the dielectric layer and the conductive layer to expose electrodes of the chip packaging unit, and filling the through holes with a conductive material to form electrode leads of the chip packaging unit; and providing slots in a back surface of the chip packaging unit to form heat dissipation fins in such a way that the heat dissipation fins are flush with the lower surface of the pre-manufactured circuit board. The manufacturing method of the present disclosure can manufacture a chip-embedded circuit board with a robust structure that meets the operational performance and the heat dissipation performance.

This wiring board comprises: a substrate having a base body having a first surface and an insulating layer positioned on the first surface; a first electrode and a second electrode positioned on the first surface; and a first via conductor and a second via conductor positioned inside the base body. The first via conductor and the second via conductor are arranged along a first direction, and a first virtual line passing through the center of the first via conductor and extending along the first direction and a second virtual line passing through the center of the second via conductor and extending along the first direction are positioned apart from each other. The first electrode is partially covered by the insulating layer, and the second electrode is spaced apart from the insulating layer in plan view.

Aspects of this disclosure configure a processor for detecting defects in the solder mask of a printed circuit board (PCB) using an optical waveguide. The processor directs an optical beam toward the input of one or more optical waveguides embedded in a protective coating layer of a PCB, the protective coating layer being adjacent to one or more conductive traces of the PCB. The processor measures a beam property of the optical beam emitted by the one or more optical waveguides. The processor detects a break in the optical beam emitted by the one or more optical waveguides based on this beam property.The processor detects a fault in the protective coating layer of the PCB based on detecting the interruption of the optical beam emitted by the one or more optical waveguides.

The invention provides a tin deposition agent, a preparation method and application. The tin depositing agent comprises the following components: 12-18 g / L of tin methanesulfonate; 120 to 160 g / L of methanesulfonic acid; 30-60 g / L of a complexing agent; the compound stabilizer is prepared from 1 g / L to 5 g / L of trimethylglycine, 0.05 g / L to 1 g / L of phosphonate and 0.5 g / L to 3 g / L of sodium hydrogen sulfite; 50 to 150 mg / L of a wetting agent; and 50 to 150 mg / L of an emulsifier. The tin immersion agent is high in tin immersion rate, has excellent deoiling resistance, can effectively avoid the problems of solder mask falling, local welding refusal or bare copper exposure and the like in the tin immersion process, and can meet the requirements of industrial large-scale production.

The utility model relates to the technical field of circuit boards, and discloses a circuit board solder mask developing device which comprises a supporting table, a plurality of sliding grooves are formed in the left side and the right side of the top of the supporting table, a machining table is slidably connected to the inner walls of the sliding grooves, and a machining box is fixedly connected to the top of the machining table. Pushing blocks are fixedly connected to the tops of the front side and the rear side of the inner wall of the machining box, a plurality of rollers are rotationally connected to the bottoms of the left side and the right side of the inner wall of the machining box, a fixing piece is fixedly connected to the rear portion of the left side of the machining table, and a servo motor is fixedly connected to the top of the right side of the fixing piece. According to the utility model, the chute allows the processing table to slide therein, the processing box is used for placing an undeveloped circuit board, the telescopic rod is controlled, the circuit board can be fed into the processing shell, and the servo motor is started to assist turnover through the gear transmission roller, the turnover circuit board and the push block, so that the developing uniformity and the processing quality are improved, and automatic operation is realized; and development requirements are met.

The present disclosure relates to an in-mold electronic (IME) component comprising at least one electrically conductive elastomer adapted to electrically connect at least one terminal end of the IME component to a power source. The present disclosure further relates to a method for manufacturing such an in-mold electronic component.

The invention provides a circuit board with copper columns with different heights, a preparation method of the circuit board and a circuit board assembly. The first copper column and the second copper column which are different in height are formed by tearing off the separable copper foil layer and the base material layer, and certain base material layer and copper foil layer are reserved on the surface of the copper column, so that the uniformity (smoothness) of the height of the copper column can be improved, the heat dissipation performance can be improved, and the pollution problem caused by using a dry film is avoided. According to the circuit board, three-dimensional wiring can be achieved on a two-dimensional plane, coupling between adjacent signal lines is reduced, crosstalk between signals can be reduced, the mechanical strength balance of connecting points is ensured through the smooth copper column thickness, and therefore the reliability of a printed part can be improved.

A circuit board according to an embodiment includes: an insulating layer including first to third regions; an outer layer circuit pattern disposed on upper surfaces of the first to third regions of the insulating layer; and a solder resist including a first portion disposed in the first region of the insulating layer, a second portion disposed in the second region, and a third portion disposed in the third region, wherein the outer layer circuit pattern has a first height, the third portion of the solder resist is disposed on an upper surface of the outer layer circuit pattern to have a second height, the first region includes a first sub-region and a second sub-region, the first portion includes a first sub-portion disposed in the first sub-region and a second sub-portion disposed in the second sub-region, an upper surface of the first sub-portion is positioned higher than the upper surface of the outer layer circuit pattern and lower than an upper surface of the third portion, an upper surface of the second sub-portion is positioned lower than the upper surface of the outer layer circuit pattern, and a surface roughness of the third portion of the solder resist is different from a surface roughness of the first portion of the solder resist.

The utility model discloses a laminating machine suitable for a large-size printed circuit board, which relates to the field of printed circuit board processing and comprises a bottom plate and a movable frame, two sides of the top of the bottom plate are respectively provided with two supporting plates, and the supporting plates are provided with limiting assemblies. By arranging the limiting assembly, when the circuit board needs to be limited, the second electric push rod can be started to enable the piston rod to extend, then the movable frame is driven to move downwards, the movable plate is driven to move downwards through the connecting rod, then the pressing plate is pushed to rotate, and the pressing plate pushes the limiting block to move; in this way, the circuit board can be limited, the situation that the first air hole and the second air hole are staggered due to the fact that the circuit board deviates in the attaching process is prevented, and then the attaching efficiency of the blue film gummed paper is improved; the circuit board is prevented from being damaged due to the fact that the limiting block applies large extrusion force to the circuit board.

The invention discloses a three-dimensional multilayer circuit board and a production process thereof, the circuit board comprises a power supply mainboard and high-frequency transformer winding integrated press-fit structure and a thick copper circuit layer, the power supply mainboard and the high-frequency transformer winding are both PCBs with at least two layers, the high-frequency transformer winding forms a three-dimensional structure through pre-forming processing, and the thick copper circuit layer is arranged between the high-frequency transformer winding and the power supply mainboard. The circuit alignment tolerance is controlled within 100 [mu] m, and copper foils or / and copper plates are laminated on the upper surface and the lower surface of the integrated structure to form thick copper circuit layers. According to the invention, integration of the two parts is realized, assembly gaps are eliminated, volume power density is improved, accurate butt joint of lines is guaranteed, stability and reliability are improved, large-current bearing capacity is enhanced, conversion efficiency is improved, heat resistance is reduced through thick copper heat dissipation, conversion energy efficiency is improved, electromagnetic shielding performance is optimized, interference is reduced, and copper usage amount is reduced. And the assembly process is simplified and the cost is reduced.