1999results about "Non-metallic protective coating application" patented technology

The invention discloses a flexible circuit board made of weldable low-temperature silver paste and a preparation process of the flexible circuit board, and relates to the technical field of flexible electronic device manufacturing, and the flexible circuit board comprises a base material layer, a low-temperature weldable silver paste conductive layer and a protective layer. According to the invention, the collaborative design of the weldable low-temperature silver paste and the self-repairing protection layer is integrated, the efficient preparation of the flexible circuit board is realized through the printing technology, the weldable low-temperature silver paste breaks through the traditional high-temperature limitation, supports a wide range of substrates and can be directly welded without surface treatment, and in addition, the polyurethane protection layer containing the dynamic disulfide bond has a self-repairing function. Compared with a traditional FPC, only two core processes of printing and baking are needed, the process is greatly simplified, the equipment investment is reduced, and double reduction of the manufacturing cost and the material cost is achieved.

The invention relates to the technical field of flexible circuit board manufacturing and packaging, in particular to an FPC assembly injection molding packaging structure and method based on dynamic mold flow control, and the structure comprises an FPC assembly, a first injection molding layer wrapping a welding spot area of the FPC assembly, and a second injection molding layer wrapping the first injection molding layer and the FPC assembly. The second injection molding layer is provided with an anchoring column penetrating through the reserved channel of the first injection molding layer or the through hole of the FPC assembly, and the anchoring column and the FPC assembly or the first injection molding layer form a mechanical interlocking structure. According to the FPC assembly injection molding packaging structure and method based on dynamic mold flow control, the electronic equipment and the storage medium, through a sandwich structure and in-situ mechanical interlocking design, the process control of a non-Newtonian fluid shear model and an unsteady state heat conduction equation is combined; the technical problems that in the prior art, procedures are tedious, stress concentration is caused by CTE mismatching, and welding spots are prone to being damaged in the injection molding process are solved.

A method for a system includes receiving with a first transceiver of an identity reader device, an ephemeral ID from a first smart device, outputting with the first transceiver, identity reader data to the first smart device, wherein the identity reader data comprises a first identifier and a challenge, receiving with the first transceiver, responsive data from the first smart device, wherein the responsive data comprises token data and contact tracing status of the first smart device, determining in a processor of the identity reader device, whether the first smart device is authorized in response to the ephemeral ID or the token data, and the contact tracing status, and directing with the processor, a peripheral device coupled to the identity reader device to perform a user-perceptible action in response to the processor determining that the first smart device is authorized.

The invention relates to the technical field of PCBA packaging, discloses a PCBA packaging method and equipment based on a fixed glue spraying assembly, and aims to solve the technical problems of complex wiring, high mechanical loss and inconvenience in maintenance in a mobile packaging scheme of an existing glue spraying assembly. The PCBA packaging method comprises the steps that a glue spraying assembly sprays a UV glue solution to a target glue spraying area of a PCBA, and a curing irradiation assembly irradiates the PCBA to cure the UV glue solution to form a packaging layer; wherein the glue spraying assembly comprises a plurality of rows of independently-controlled piezoelectric spraying holes, the positions of the piezoelectric spraying holes are fixed in the whole spraying process, and full coverage of a target glue spraying area is achieved only by driving the PCBA to move. The PCBA packaging equipment comprises a support, a conveying mechanism, a fixedly-arranged glue spraying assembly and a curing irradiation assembly, the conveying mechanism drives a PCBA to move along a preset path, and it is ensured that a target glue spraying area is exposed under the glue spraying assembly in sequence or repeatedly. According to the invention, the wiring structure of the glue spraying assembly is simplified, the mechanical wear is reduced, the equipment reliability and maintenance convenience are improved, the precision and efficiency of PCBA packaging are ensured through synchronous curing and precise movement control, and the method is especially suitable for selective protection packaging of a low-height PCBA board with the maximum height of an electronic component smaller than 1cm.

Presented herein is a corrosion inhibitor dispensing system that provides for the in-situ application of a corrosion inhibitor in order to protect internal elements of an apparatus from corrosion. In one example, an apparatus is provided that may include a housing to contain one or more electronic components. The housing includes air inflow ports configured to limit internal air from exiting the housing during a corrosion inhibitor dispensing processes, air outflow ports configured to limit external air from entering the housing during the dispensing process, and one or more fans to direct airflow for the housing. The apparatus further includes a corrosion inhibitor dispensing system that includes a dispensing container to hold a corrosion inhibitor in a non-vaporized state and includes one or more ports for dispensing the corrosion inhibitor in a vaporized state during the corrosion inhibitor dispensing processes. A controller is provided to manage the dispensing process.

According to the glass phased-array antenna control module and the manufacturing method thereof, a control circuit is manufactured on a glass substrate through a TFT manufacturing process, high-precision control over a phased-array antenna is achieved, the accuracy of beam pointing of the phased-array antenna and the quality of signal processing are guaranteed, and the manufacturing cost of the phased-array antenna is reduced. Through the combination of a TFT manufacturing process and a TGV technology, the layout space of a control circuit is saved, the installation space of an antenna chip is saved through a COB packaging mode, the high integration level of the phased-array antenna is achieved, the requirements for miniaturization and multi-functionalization of the phased-array antenna are met, and the application range of the phased-array antenna is widened. According to the phased-array antenna, the grounding isolation holes are formed in the periphery of the antenna chip, so that good crosstalk resistance is achieved, the stability and reliability of the phased-array antenna are improved, the performance of the phased-array antenna is comprehensively improved, the phased-array antenna has higher competitiveness in the fields of satellite communication, vehicle-mounted radars, military radars and the like, and the application prospect is wide. And the requirements of various fields on high-performance phased-array antennas can be better met.

A printed circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed on the upper surface of the insulating layer; a support layer which is disposed on the upper surface of the insulating layer to expose the upper surface of the circuit pattern and is in contact with the sides of the circuit pattern; and a protective layer disposed on the upper surfaces of the support layer and the circuit pattern, wherein the upper region of the insulating layer comprises a first region and a second region, and the protective layer comprises an open region exposing the upper surfaces of the support layer and the circuit pattern that are disposed in the first region, and the support layer comprises a first upper surface positioned at the highest level among the upper surfaces of the support layer and a second upper surface positioned at the lowest level among the upper surfaces of the support layer, the second upper surface being lower than the first upper surface, and the protective layer comprises a first portion which contacts the upper surface of the circuit pattern of the first region and a second portion which contacts the upper surface of the support layer of the first region, and the second portion of the protective layer contacts the second upper surface of the support layer and includes a first lower surface which is lower than the upper surface of the circuit pattern.

In order to solve the problems that an existing stretchable circuit board is large in impedance and short in service life, the stretchable circuit board comprises an elastic substrate and an elastic packaging layer, the elastic packaging layer covers the surface of one side of the elastic substrate, and the elastic packaging layer covers the surface of the other side of the elastic substrate. A fiber reinforcement area is formed on one side, facing the elastic packaging layer, of the elastic substrate, a glass fiber layer penetrating through the elastic substrate is arranged in the fiber reinforcement area, a line groove is formed in the fiber reinforcement area, the glass fiber layer partially penetrates through the line groove, the line groove is filled with a liquid metal coating, and the liquid metal coating is arranged on the elastic substrate. And a circuit pattern is formed by the liquid metal coating in the circuit groove.

The invention relates to the technical field of circuit boards, in particular to a method for improving local thickness unevenness of a rigid-flex board and the rigid-flex board. The method comprises the following steps: S1, extracting residual copper rate distribution, setting a residual copper rate threshold value, and identifying a glue filling area and a non-glue filling area of a rigid-flex board plane according to the residual copper rate threshold value; s2, windowing parameters are obtained according to the hole ring height and diameter of the non-glue-filling area, and windowing is conducted on the cover film according to the windowing parameters; after windowing is completed, the covering film is attached to the corresponding position, the hole ring is sleeved with the window, and the local thickness of the rigid-flex board is consistent; or dividing a high-voltage region and a low-voltage region in the non-glue filling region according to the voltage level and the signal characteristic in the circuit design; the copper is thickened in the high-voltage area, and a step is formed by the thickened copper layer in the high-voltage area; when the glue filling area is filled with glue, pressure difference is formed, the glue layer flows towards the low-pressure area, uniform filling of the glue layer is achieved, and the local thickness of the rigid-flex board is consistent. According to the invention, uneven local thickness of the rigid-flex board is improved.

A substrate-conveying support tape includes: a support film; a primer layer provided on the support film; and a temporary fixing material layer provided on the primer layer, in which the support film is a polyimide film, the temporary fixing material layer contains a thermoplastic resin, and the primer layer contains at least one selected from the group consisting of a silane coupling agent having an epoxy group or a ureido group, an epoxy resin, a polyurethane rubber, and an acrylic rubber having an acid value of 5 mgKOH / g or more.

A printed circuit board (PCB) includes a solder resist layer including at least one of an opening and a depression and a solder resist patch disposed in at least one of the opening and the depression to have an interface with the solder resist layer in at least one of the opening and the depression.

The invention discloses a Tenting process-based system-level vehicle-mounted packaging substrate and a processing method thereof. The processing method comprises the following steps of: providing a first PNL plate provided with an outer-layer copper foil and a through hole; a connecting copper layer is formed on the inner wall of the through hole, and the connecting copper layer extends to the outer copper foil and surrounds a preset area outside the two ports of the through hole to form a ring hole copper layer; performing resin hole plugging on the through hole; grinding two ports of the through hole, reducing copper of the ring hole copper layer and grinding the whole plate in sequence so as to form a micro step between the outer copper foil and the ring hole copper layer; a thickened copper layer is formed on the outer copper foil and the ring hole copper layer, an outer pattern is manufactured on the thickened copper layer, and a second PNL plate is obtained; and after solder mask treatment is carried out on the second PNL, gold plating treatment is carried out in the mode of arranging false gold plating fingers on the edge of the second PNL and between the SET and the SET by adopting the optimal control current density, and an outer layer pattern finished product with the thickness consistency is manufactured. According to the processing method, the size consistency of the outer-layer pattern finished product is remarkably improved, and the market requirement is met.

The present invention relates to the technical field of PCB board processing, and more particularly to a fully automatic, integrated vacuum plugging machine, comprising a base frame, a plugging device, a scraping device, and a transfer mechanism. The plugging device is used to complete the plugging process of a PCB board, the scraping device is used to complete the oiling and scraping processes of the PCB board, and the transfer mechanism is used to move a PCB board to be plugged into a clamping mechanism within the plugging device, or to move a PCB board that has been plugged into the clamping mechanism of the scraping device. The fully automatic, integrated vacuum plugging machine of the present invention can complete the plugging and scraping processes of a PCB board, and simultaneously, through the transfer mechanism, enables the PCB board to be moved into the clamping mechanism of the plugging device and the scraping device, automatically completing the loading action of the PCB board for the plugging process or the scraping process, thereby ensuring the efficiency, quality, and yield of the plugging and scraping processes of the PCB board.

The invention provides a buried resistor circuit board and a preparation method thereof. According to the resistance element, one resistance material is arranged on the dielectric layer to form the first resistance layer, and then the other resistance material is arranged on the first resistance layer to form the second resistance layer, so that the binding force of the resistance layers and the dielectric layer can be enhanced, and the surface flatness of the resistance element can be improved. The resistive layer of the resistive element is protected by using the protective film, so that the shape and the length of the resistive layer are prevented from being influenced by subsequent processes. According to the preparation method, the whole process is a dry process, a differential etching process is omitted, an alkaline etching solution does not need to be used, and the preparation method is environmentally friendly.

The invention discloses a three-proofing paint precise coating method based on gradient atomization control, and relates to the field of intelligent control, and the method comprises the steps: carrying out the visual scanning of a to-be-coated PCB, and obtaining the type, position and size information of each component on the PCB based on a scanning result, so as to establish a mapping relation between the components and a coating demand; according to the method, the surface of the PCB is divided into a plurality of independent coating areas according to the mapping relation between the components and the coating requirements, and an atomization airflow pressure threshold value and a paint supply amount threshold value which are matched with the protection requirements of each coating area are set for each coating area. The protection and thickness requirements of different components can be accurately matched, blind coating is avoided, independent coating areas are divided according to the protection grade, size and gap characteristics, adaptive atomization airflow pressure and paint supply threshold values are set, the coating requirements of all the areas can be met in a more targeted mode, and paint waste and excessive coating are reduced.

A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

The present invention provides a surface treatment liquid that can form an organic film sufficiently excellent in adhesive properties between metal and resin and is also excellent in chemical resistance properties, the surface treatment liquid being excellent in storage stability. The present invention relates to a metal surface treatment liquid for forming an organic film on a metal surface, wherein the surface treatment liquid contains a silane coupling agent and an acid and has a pH of 1.9 or less.

The invention relates to the technical field of PCB (Printed Circuit Board) manufacturing, in particular to a PCB manufacturing method, which comprises the following steps of: 1, preparing raw materials, adding the prepared raw materials into a fuse machine, and changing solid raw materials into liquid raw materials; 2, liquid raw materials are added into a mold machining device, and machining of the circuit board is completed; step 3, carrying out anti-corrosion treatment on the processed circuit board; 4, performing line drawing treatment on the circuit board subjected to the anti-corrosion treatment; step 5, performing punching treatment on the circuit board after line drawing is completed; and step 6, welding the punched circuit board to complete manufacturing of the PCB, the method can process a plurality of circuit board materials at one time, and the speed of manufacturing the PCB is further improved.

The invention relates to a high-efficiency heat dissipation circuit board and a manufacturing method thereof, and the manufacturing method comprises the steps: constructing a raw material performance database through the structural collection and evaluation of the physical parameters of a high-thermal-conductivity nanofiller and a resin matrix, and guiding the nanofiller to adaptively migrate and locate along the gradient through the adjustment of the partition solvent evaporation rate and the interfacial tension gradient. And an efficient heat-conducting filler network with orderly partitions is formed. Furthermore, in-situ multi-mode detection and automatic feedback optimization are combined, the dispersion uniformity of the filler and the continuity of a heat conduction channel are guaranteed, and the circuit board with uniform heat dissipation performance is prepared through a medium-low temperature step-by-step curing latch structure.

A flexible circuit base board and a flexible flat cable are provided. The flexible flat cable includes the flexible circuit base board and a transmission element. The flexible circuit base board includes a base film, multiple conductive wires, a transmission signal pad, a conductive structure, a collecting signal pad and a cover film. The conductive wires are spaced and placed on the base film. The transmission signal pad and the collecting signal pad are electrically connected to and are disposed on the base film. The conductive structure is disposed on the base film, and is electrically connected to at least one of the conductive wires and the transmission signal pad. The cover film is disposed on the base film, and covers the conductive wires, the conductive structure, the transmission signal pad, and the collecting signal pad. The transmission element is electrically connected to the collecting signal pad.

The invention relates to the technical field of printed circuit manufacturing, and discloses a semiconductor test printed circuit board warping control method, which comprises the following steps of: firstly, establishing a symmetric stress substrate through inner layer residual copper rate control and symmetric lamination; then, the plate is placed in the middle layer during pressing, and a uniform heat transfer path is constructed through the teflon base plates arranged up and down; and finally, long-time cold pressing is performed after hot pressing to neutralize internal stress, through the synergistic process combination, warping control of the super-multilayer thick plate is converted from dependence on later physical correction into the technological process that high flatness can be achieved in an endogenous mode in the pressing and curing stage, and the technological process is simplified. Therefore, interlayer stress generated by accumulation due to material thermal expansion difference and uneven thermal field is inhibited, and a yield-controllable engineering path is provided for reliable manufacturing of high-density and high-thickness semiconductor test boards.

A wiring substrate according to one embodiment includes a plurality of wiring layers and a plurality of insulating layers alternately stacked in a stacking direction. The plurality of wiring layers include a first wiring layer closest to a surface on one side in the stacking direction of the wiring substrate and a second wiring layer second closest to the surface. A distance from the surface to the first wiring layer is larger than a distance from the first wiring layer to the second wiring layer.

This application relates to a heat dissipation shielding structure and a processing method, a circuit board assembly, and an electronic device. The printed circuit board includes a mounting surface. Electronic components are mounted on the mounting surface. The electronic components include an active component and a passive component. The heat dissipation shielding structure includes an insulating layer. The insulating layer is covered on the mounting surface, and wraps at least a side surface of the active component, so that a side that is of the insulating layer and that faces away from the mounting surface forms a first surface together with a top surface of the active component. A shielding layer is covered on the first surface, a shape of the shielding layer matches a shape of the first surface, and the shielding layer is electrically connected to a ground network of the printed circuit board.

The present application discloses a method for laminating and preparing a high thermal conductivity circuit board and a high thermal conductivity circuit board. The preparation method comprises: dispersing and curing a liquid metal gallium-indium alloy and a fiber mixture in an inert argon atmosphere, and fusing the mixture with a matrix to obtain an adaptive thermal conductive substrate; performing gradient deposition and etching on the adaptive thermal conductive substrate to obtain a gradient spacing template; performing electrospinning infiltration and heat treatment on the gradient spacing template to obtain a substrate containing a dynamic thermal conductive network; performing a conductive layer pre-pressing treatment on the substrate containing the dynamic thermal conductive network to obtain a pre-assembled plate; performing a staged dynamic lamination treatment on the pre-assembled plate to obtain a molded circuit board; and performing surface spraying and deposition treatment on the molded circuit board to obtain the high thermal conductivity circuit board. The present application solves the problems of poor heat flow path and poor interface bonding in the prior art, significantly improving the thermal management effect and significantly improving the reliability and performance of electronic products.

A coating apparatus 10 for applying a film-forming liquid to a peripheral edge of a board while moving a board and a coating unit 20 relative to each other, wherein the coating unit 20 includes a coating mechanism 21 and an extension mechanism 30, and wherein the coating mechanism 21 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board, and wherein the extension mechanism 30 has a coating part 22 for applying the film-forming liquid to at least a peripheral edge face of the board. The extension mechanism 30 has an extension part 31 that extends the film-forming liquid applied by the application part 22 to the peripheral edge face and the peripheral upper and lower faces of the board in the form of a thin film, and a force mechanism 34 that forces the extension part 31 toward the peripheral edge face and the peripheral upper and lower faces of the board, and the extension part 31 is configured to be removable without removing the force mechanism 34 from the extension mechanism 30.

The invention relates to a protective layer coating method of a stepped golden finger three-dimensional structure. The protective layer coating method comprises the following steps: step 1, surface activating treatment: performing plasma cleaning on the surface of a printed circuit board; step 2, coating a three-dimensional curved surface: adopting non-contact spraying equipment, coating a protective material in sections along the height change direction of the step structure of the golden finger, independently controlling the coating amount of each section, and forming an inclined angle between a dispensing head and the plate surface during coating; and step 3, step curing treatment: carrying out ultraviolet light curing on the coating area. The invention provides a method for coating a protective layer of a stepped golden finger three-dimensional structure. The core of the method is to solve the covering problem of a stepped region through segmented control and non-contact coating.

The present invention provides an electronic or electrical device or component thereof comprising a cross-linked polymeric coating on a surface of the electronic or electrical device or component thereof; wherein the cross-linked polymeric coating is obtainable by exposing the electronic or electrical device or component thereof to a plasma comprising a monomer compound and a crosslinking reagent for a period of time sufficient to allow formation of the cross-linked polymeric coating on a surface thereof,wherein the monomer compound has the following formula:where R1, R2 and R4 are each independently selected from hydrogen, optionally substituted branched or straight chain C1-C6 alkyl or halo alkyl or aryl optionally substituted by halo, and R3 is selected from:where each X is independently selected from hydrogen, a halogen, optionally substituted branched or straight chain C1-C6 alkyl, halo alkyl or aryl optionally substituted by halo; and n1 is an integer from 1 to 27; and wherein the crosslinking reagent comprises two or more unsaturated bonds attached by means of one or more linker moieties and has a boiling point at standard pressure of less than 500° C.

The invention discloses a packaging material as well as a preparation method and application thereof. The packaging material comprises the following components in parts by mass: 40-85 parts of matrix resin, 5-30 parts of phase change PCM particles, 3-20 parts of self-repairing microcapsules, 1-8 parts of an interface compatilizer and 10-20 parts of a heat-conducting network reinforcing material, the melting point of the phase change PCM particles is not more than 80 DEG C; a core layer of the self-repairing microcapsule comprises dicyclopentadiene and a ruthenium catalyst, and a shell layer of the self-repairing microcapsule comprises polyurea or polyurethane; the PCBA packaging material with the intelligent response function is formed by combining the low-melting-point phase-change PCM particles with the self-repairing microcapsule system, when the PCBA temperature is too high, the low-melting-point phase-change PCM particles are molten, junction temperature suddenly rising is restrained through melting heat absorption, meanwhile, the adjacent microcapsules are triggered to be broken through volume expansion, DCPD monomers are released and subjected to in-situ polymerization under the action of a catalyst, and the PCBA packaging material with the intelligent response function is obtained. Microcracks generated by thermal stress are rapidly repaired, and the heat dissipation stability and the electrical insulation reliability of the material in long-term thermal circulation are remarkably improved.

This application relates to the field of communication technology, and discloses an antenna, its fabrication method, and a terminal device. The antenna includes a substrate and a radiator. The radiator includes a copper plating layer and a protective layer. The copper plating layer is formed on the surface of the substrate, and a passivation layer is disposed on the side of the copper plating layer facing away from the substrate. The passivation layer can protect the copper plating layer, reduce the risk of corrosion of the copper plating layer, and thus improve the reliability of the antenna. Furthermore, since the layer structure of the radiator is relatively simple, the antenna fabrication process is significantly simplified, and the manufacturing cost is reduced.

This invention proposes a micro / nano-scale imprinting FPC solder resist layer forming device, relating to the field of circuit board solder resist layer forming technology. It includes a forming base with a limiting base mounted on it. An imprinting head is positioned directly above the limiting base and driven by a servo electric cylinder. The limiting base has a groove, within which a rigid base is installed. A vacuum adsorption assembly is mounted inside the forming base, and a forming placement cavity is located inside the rigid base. From top to bottom, a PI thin film layer, a silicone layer, and a carbon fiber heating film layer are sequentially arranged at the bottom of the forming placement cavity. Micro / nano patterns are etched on the imprinting head, and a PDMS elastic layer is located at the lower end of the imprinting head. This invention, through the cooperation of the PI thin film layer, silicone layer, carbon fiber heating film layer, and microporous array, can adsorb, flatten, and preheat the FPC substrate before imprinting, fundamentally compensating for the deformation of the flexible substrate and providing a stable and flat reference plane for high-precision imprinting.