96 results about "Hard substrate" patented technology

The present invention relates to a compact mobile display device, and more specifically, to a portable display implemented by mounting an ultra-short-throw projection optical module on a transparent, flexible, or hard substrate to project a projection image. In the present invention, when the ultra-short-throw projection optical module is mounted and the substrate that projects the image is made of a flexible and transparent material that can be bent, folded, or rolled, the user can enjoy augmented reality that overlaps reality through a transparent display. In addition to viewing images, it is possible to conveniently carry the display device by bending, folding, or rolling it while viewing the expanded display.

The invention relates to a high-crystallinity and high-C-axis preferred orientation ScAlN film and a preparation method and application thereof.The preparation method comprises the steps that a first target material and a second target material are placed in a first magnetron sputtering target position and a second magnetron sputtering target position respectively, and a hard substrate is pre-cleaned under the working vacuum degree of 0.5 Pa-1. 5 Pa through inert gas plasmas to achieve the soft etching effect; and by taking nitrogen plasma as reaction gas and inert gas as working gas, reacting and co-sputtering the first target material and the second target material on the surface of the soft etching hard substrate at the same time to obtain the ScAlN film with high crystallinity and high C-axis preferred orientation. According to the preparation method, hard substrate inert gas plasma pre-cleaning, nitrogen plasma auxiliary reaction and double-target co-sputtering are combined, and the working vacuum degree of specific pre-cleaning is matched, so that the ScAlN film with C-axis preferred orientation, which is better in structural stability, lower in surface stress, fewer in internal defects and higher in crystallinity, can be prepared.

The invention relates to an optical waveguide coupler based on a hard substrate and a preparation method thereof, and belongs to the technical field of couplers. The method comprises the following steps: preparing a lower rectangular waveguide core layer on a hard substrate through an ultraviolet lithography technology; preparing a lower reflecting micro-mirror through an excimer laser technology, and plating a reflecting film on the surface of the lower reflecting micro-mirror; then preparing an upper rectangular waveguide core layer through an ultraviolet lithography technology on the basis; preparing an upper reflecting micro-mirror at a corresponding vertical position of the lower reflecting micro-mirror through an excimer laser technology, and plating a reflecting film on the surface of the upper reflecting micro-mirror; the optical waveguide coupler prepared by the method realizes high-density interlayer interconnection, and is relatively high in application flexibility and high in interlayer coupling efficiency.

The invention relates to the technical field of robot suspension control, and discloses a terrain-adaptive underwater dredging robot dynamic suspension control method, which comprehensively considers a first expected value and a second expected value of the air volume of an air bag, and combines various key parameters such as water temperature, water depth, robot posture angle, hardness coefficient, robot speed and the like. And accurately calculating the adjusted air volume of the airbag, and finally obtaining the final air volume of the airbag according to the initial air volume of the airbag. Firstly, by dynamically adjusting the air volume of the air bag, the robot can keep the optimal working state under different topographic conditions, and it is ensured that the dredging tool can effectively make contact with and clean sediments. Particularly in a soft sediment area, the air volume of the air bag is increased, so that the robot can be prevented from falling into the sediment, and jamming or stagnation caused by insufficient buoyancy is avoided; and on the hard substrate, the robot can make contact with the sediment more tightly by reducing the air volume of the air bag, and the working efficiency of the desilting tool is improved.

The invention relates to the technical field of devices used for replacing metal wires on the surface of any transparent hard substrate to transmit power for electrical equipment, in particular to a transparent power supply device with a pre-etching circuit and a preparation method of the transparent power supply device. The transparent power supply device comprises a low-sheet-resistance conductive film coiled material and an electrode connecting kit matched with the low-sheet-resistance conductive film coiled material. The low-square-resistance conductive film coiled material is connected with the electrode connecting kit, and the electrode connecting kit is connected with a power supply for taking electricity; the low-square-resistance conducting film coiled material comprises a conducting layer, a prefabricated circuit is arranged on the conducting layer and comprises a plurality of parallel conducting areas, an etching circuit is arranged between every two adjacent conducting areas, and the etching circuits are used for insulating every two adjacent conducting areas; comprising the following steps: preparing a prefabricated circuit of a low-sheet-resistance conductive film coiled material, namely processing and forming the prefabricated circuit on the low-sheet-resistance conductive film coiled material by adopting a roll-to-roll continuous etching process; the roll-to-roll continuous etching process comprises the following steps: carrying out circuit pre-preparation on a low-square-resistance conductive film coiled material by adopting roll-to-roll continuous etching equipment; the roll-to-roll continuous etching process comprises the following steps: roll-to-roll continuous etching is carried out along the material pulling direction of equipment; the roll-to-roll continuous etching process comprises the step of roll-to-roll continuous etching in the direction perpendicular to the material pulling direction of the equipment. Compared with the prior art, the transparent power supply device with the pre-etching circuit and the preparation method of the transparent power supply device can effectively overcome the defects of the existing technical scheme, improve the product yield and reduce the production difficulty and threshold, so that the technology can be widely accepted and applied by the market.

The invention relates to an HEMT biosensor preparation method and an HEMT biosensor, and the method comprises the steps: preparing a plurality of single HEMT devices on an HEMT epitaxial layer, and forming an HEMT array; the HEMT epitaxial layer comprises a silicon substrate; etching the silicon substrate in the HEMT array to obtain an array film; transferring the array film to the surface of a flexible substrate with a first insulating layer to obtain a flexible HEMT array film; deploying a plurality of electric connection assemblies on the flexible HEMT array thin film, wherein the electric connection assemblies are correspondingly connected with the plurality of single HEMT on the flexible HEMT array thin film; and preparing a plurality of biomolecule recognition elements above the flexible HEMT array film to form the HEMT biosensor. According to the flexible HEMT array biosensor, the problems of insufficient flexibility and limited application range caused by a hard substrate of the HEMT biosensor are solved, so that the performance, the adaptability and the application field of the flexible HEMT array biosensor are remarkably improved, and powerful support is provided for application in the fields of wearable equipment, implantable medical equipment and the like.

The invention discloses a preparation method of a solvent-free polyurethane antifouling coating cured in situ at room temperature. The method comprises the following steps: firstly, introducing single-ended dihydroxy polydimethylsiloxane (PDMS) as a low surface energy material into a polyurethane side chain, and then preparing the solvent-free polyurethane by taking gamma-isocyanate propyl triethoxy silane as an end-capping reagent. When the solvent-free polyurethane antifouling coating is applied, a cross-linking agent is added into the solvent-free polyurethane, a base material is coated with the solvent-free polyurethane after uniform mixing, and the solvent-free polyurethane antifouling coating is obtained after curing is conducted for 24 h at the room temperature. The solvent-free polyurethane antifouling coating prepared by the method can be used for antifouling of surfaces of various substrates such as leather, synthetic leather, glass, metal, ceramic, wood and plastic. The antifouling coating not only has good anti-doodling property, self-cleaning property, wear resistance and corrosion resistance, but also has higher transparency and antifouling durability. The solvent-free polyurethane antifouling coating prepared by the technical scheme is suitable for various soft and hard base materials and has a wide application prospect.

The invention discloses a solution immersion type fingerprint detection method based on AIEgens, which comprises the step of carrying out immersion type fluorescent fingerprint detection based on the aggregation-induced emission effect of an organic fluorescent compound TPP-APBP-P. TPP is used as a luminous substrate, a long chain is connected to the luminous substrate to improve the lipophilicity of the luminous substrate, TPP-APBP-P is obtained, meanwhile, the PH of a solution is adjusted to improve the hydrophilicity of the luminous substrate, and finally the detection effect of the luminous substrate on potential fingerprints is improved; the fingerprint detector has very excellent detection effects on fingerprints in a high-temperature environment and aged fingerprints, and has high contrast, high sensitivity and high precision on fingerprint development.

The utility model is applicable to the technical field of decorative films, and discloses a self-adhesive PVC (polyvinyl chloride) decorative film which sequentially comprises a scratch-resistant layer, a soft PVC base material layer, a pattern printing layer, a hard PVC base material layer, a back coating layer, an adhesive sticker layer and a release paper layer from top to bottom. According to the self-adhesive PVC decorative film, the scratch-resistant layer is arranged on the surface of the soft PVC base material layer, so that the scratch resistance of the self-adhesive PVC decorative film is improved, scratches on the surface of the decorative film are few, and good appearance and decorative effect can be kept. The soft PVC base material layer and the hard PVC base material layer printed with the pattern printing layer are compounded together, so that the flexibility and the elasticity of the self-adhesive decorative film are improved, the decorative film can better adapt to objects with different shapes and surfaces, construction is easy, meanwhile, the decorative film can resist external force impact when being transported, constructed and used for decoration, and the service life of the decorative film is prolonged. Therefore, the decorative film is not easy to damage and crack, and the attractiveness and the integrity of decorated and repaired articles are not influenced.

The invention relates to the technical field of digital manufacturing, in particular to an unattended image three-dimensional printing retail device, aims to solve the problem that personalized hard entity commodities cannot be manufactured in real time, and comprises a main control module, a user data input module, an image processing module, a substrate storage module, a marking module, a forming module and a finished product delivery module. The image processing module generates contour data based on the original image; the marking module forms an image and a positioning mark on the hard or semi-hard substrate; and before forming, the main control module corrects contour data through the image and the positioning mark formed on the substrate, and controls the forming module to perform accurate forming according to the corrected data. Through visual calibration closed-loop control, full-automatic and real-time manufacturing and selling of high-added-value personalized hard commodities are achieved, and high precision and the yield are guaranteed.

The invention discloses a flexible transparent electrode and a preparation method thereof. The preparation method of the flexible transparent electrode comprises: disposing a biocompatible adhesive on a hard substrate to form a thin film adhesive layer; disposing a biocompatible thin film material with flexibility and insulation on the thin film adhesive layer to form a thin film insulating layer; disposing a transparent biocompatible photoresist on the thin film insulating layer to form a photolithographic adhesive layer; disposing a conductive material and a pattern photoresist on the photolithographic adhesive layer in sequence, and performing photolithography, development and etching operations in sequence to form a conductive layer with a preset electrode pattern; disposing the transparent biocompatible photoresist on the conductive layer, and opening a window above the electrode site in the conductive layer to form a packaging layer with the window; peeling the thin film insulating layer from the hard substrate to form a flexible transparent electrode. The invention solves the problems of opacity, chemical corrosion resistance and short service life of traditional electrodes caused by rigidity.

The application discloses a jig platform, a flexible display component transfer method and a peeling transfer system. The jig platform comprises a jig platform body and a one-way valve. The jig platform body has a first surface and a second surface arranged oppositely. The first surface is used for placing the flexible display component. The jig platform body is provided with at least one gas channel. The gas channel comprises a first cavity and a second cavity connected with each other. The first cavity is communicated with the first surface. The one-way valve is arranged between the first cavity and the second cavity. When the vacuum degree of the second cavity is increased, the one-way valve is opened, and the jig platform body is used for adsorbing the flexible display component. When the vacuum degree of the second cavity is reduced, the one-way valve is closed, the negative pressure in the first cavity is kept, and the jig platform continues to adsorb the flexible display component. The application can ensure that the flexible display device and the hard substrate do not fall off and relatively displace in the carrying process, so that the flexible display component is smoothly transferred.

This application relates to an embedded RFID tag packaging device and its packaging process, belonging to the field of radio frequency identification tag manufacturing technology. It includes: a base fixing support for supporting the main body of the device; a turntable sorting module disposed on the main body of the device for conveying and positioning the substrate to be packaged; a dual-mode pressure control unit for acquiring the material characteristics of the substrate and controlling the device to switch between contact pressing and non-contact suspension modes to apply packaging pressure; and a thermal coupling compensation mechanism disposed at the packaging station for temperature regulation of the packaging interface and precise displacement compensation combined with piezoelectric drive. This application utilizes the cooperation of the dual-mode pressure control unit and data acquisition sensors to obtain the substrate hardness in real time using piezoelectric detection technology and switches the execution mode accordingly. For hard substrates such as metals, the device adopts a contact pressing mode to output sufficient mechanical pressure to ensure uniform adhesive layer spreading and bonding strength.

This application discloses a peeling apparatus and a method for peeling a rigid substrate. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes an adhesion portion and an epitaxial portion surrounding the adhesion portion, the epitaxial portion extending from the edge of the adhesion portion to the outer edge of the rigid substrate. The transfer apparatus includes a rotating shaft and a transfer stage rotatably connected to the rotating shaft. A retractable first vacuum chuck and a second vacuum chuck are provided on the transfer stage. During the peeling process of the rigid substrate, when transferring the flexible display assembly (after the rigid substrate and flexible substrate have been separated) using the transfer apparatus, the first vacuum chuck adsorbs the epitaxial portion of the process protective film, and the second vacuum chuck adsorbs the rigid substrate. This prevents the rigid substrate and flexible substrate from detaching or shifting relative to each other, thereby improving product yield.

The utility model discloses a diamond panel heat radiation module used for an LCOS chip, comprising a main radiator, a metal auxiliary heat radiation assembly and an LCOS chip, the LCOS chip and the metal auxiliary heat radiation assembly are both arranged on the main radiator; the LCOS chip comprises a hard substrate, a flexible circuit board, a semiconductor silicon layer, a liquid crystal layer and a diamond panel which are sequentially arranged from bottom to top, one end of the metal auxiliary heat dissipation assembly is connected to the diamond panel, and the other end of the metal auxiliary heat dissipation assembly is connected to the main heat dissipation device; the lower surface of the hard substrate is attached to the main radiator; and through the hard substrate and the metal auxiliary heat dissipation assembly, upper and lower double-channel heat dissipation is realized, so that the output brightness and the service life of the LCOS are remarkably improved.

The utility model discloses a silicone rubber ultrahigh frequency intelligent label, which relates to the technical field of radio frequency identification and comprises a top sealing layer, a substrate layer, an antenna layer, a chip, a central area, a top sealing layer, a top sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer and a bottom sealing layer, the protective flange is electrically connected with the antenna layer, the protective flange, the surrounding top sealing layer and the edge of the substrate layer are integrally formed, the section of the substrate layer is semicircular, an adhesive layer is arranged on the side, away from the antenna layer, of the substrate layer, the thickness of the adhesive layer is 0.05-0.15 mm, a fixed clamping block is embedded into the top of the substrate layer, and the chip is movably inserted into the inner side of the fixed clamping block. Ceramic microbeads are uniformly distributed in the top sealing layer and the substrate layer, and the surface of a conductive path of the antenna layer is covered with an insulating layer, so that the problems that a common UHF tag mostly adopts PET, PCB and other hard base materials, is difficult to fit with tires, cables and other curved surfaces or flexible objects, is poor in impact resistance and is easy to break are solved.

The invention discloses an anisotropic conductive stretchable electronic solder and a preparation method and application thereof, the stretchable electronic solder comprises a polymer adhesive and a silver nanosheet, and the mass ratio of the polymer adhesive to the silver nanosheet is (5-20): 1; the high-molecular adhesive is obtained by heating bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfuryl amine at 40-60 DEG C to react, and then heating with N, N '-(4, 4'-methylene diphenyl) bismaleimide at 60-80 DEG C to react. According to the anisotropic conductive stretchable electronic solder provided by the invention, by virtue of excellent flexibility and stretchability endowed by the dynamic chemical polymer adhesive, the problem of stress concentration caused by physicochemical property difference of a soft / hard base material can be effectively counteracted, stable connection of an electrical interface is always kept in a stretching deformation process, and the reliability of the electronic solder is improved. Universal welding of flexible, stretchable and rigid materials and devices is successfully achieved.

The utility model provides an oncell touch module and a touch screen. The oncell touch module comprises a phase difference film, an upper polaroid, an electrode set, color filter glass, liquid crystal, a TFT switch, TFT glass, a lower polaroid and a backlight module which are sequentially arranged from top to bottom. The electrode group comprises a plurality of driving electrodes and a plurality of sub-electrode groups formed by sensing electrodes corresponding to the driving electrodes. According to the oncell touch module, the driving electrodes and the induction electrodes corresponding to the driving electrodes are arranged on the hard substrate between the upper polaroid and the color filter glass, so that the yield is increased, and the production cost is saved.

An active contour-adjustable support-type precision paddy field grader and method are disclosed. The grader includes a frame, an active contour-adjustable support mechanism, a grading mechanism, a grading shovel height and level adjustment mechanism, and a control system. The frame is connected to a tractor via a three-point suspension device. The active contour-adjustable support mechanism is mounted on the frame, and the grading mechanism is connected to the frame via the grading shovel height and level adjustment mechanism. The active contour-adjustable support mechanism includes a mounting frame, a parallel four-bar linkage, support legs, a telescopic drive mechanism, and a force sensor. The force sensor measures in real time the load force exerted by the active contour-adjustable support mechanism on the hard paddy field substrate. The control system controls the telescopic drive mechanism to extend and retract according to changes in load force, reducing fluctuations in the grader's level and elevation due to terrain, and reducing the amplitude and frequency of changes in the grading shovel tilt angle and elevation. This invention overcomes the challenges of paddy field grading operations in various complex hard substrate environments, ensuring grading results, and belongs to the field of paddy field grading machinery technology.

This bonded body comprises: a hard substrate that has a first terminal, a step portion, and a wire provided from the first terminal to the step portion; and a flexible substrate that has a second terminal on the distal side thereof in the extension direction of the wire and that is disposed opposite the hard substrate. The step portion protrudes further to the flexible substrate side in comparison to the first terminal in an opposing direction in which the hard substrate and the flexible substrate are opposite one another. The hard substrate and the flexible substrate are bonded by means of solder connection between the first terminal and the second terminal.

A process for applying a texture to a hard substrate comprises cleaning a hard substrate to remove any particles. Then, a first wet pigment is applied to the hard substrate and allowed to air cure in atmosphere to create a pigmented substrate. The pigmented substrate is subjected to a first bake to further flash cure the pigment. Then, the substrate is abraded to create an abraded substrate, and a first liquid ceramic is applied to the abraded substrate. A textured substance is applied to the substrate after applying the first liquid ceramic to the substrate and is allowed to air cure in atmosphere to create a coated substrate. The coated substrate is subjected to a second bake to further cure the first liquid ceramic, and a second liquid ceramic that is different from the first liquid ceramic is applied to the substrate, which is allowed to air cure in atmosphere.

The invention provides a high-hardness PVC material which comprises a PVC hard base material, the outer surface of the PVC hard base material is wrapped with a carbon fiber modified ceramic soft film, a metal rubber elastic layer and non-Newtonian fluid buffer colloid are wrapped in the PVC hard base material, and a plurality of high-strength hard reinforcing ribs are embedded in the PVC hard base material. According to the PVC material, the internal structure is modified and optimized, metal rubber and non-Newtonian fluid buffer colloid with good impact resistance and damping and buffering effects are introduced for embedding, the structure of a conventional PVC material is internally modified, the performance of the PVC material is improved, the outer surface of the PVC material is coated with a carbon fiber modified soft ceramic film, the high rigidity and corrosion resistance of the PVC material are improved, and the service life of the PVC material is prolonged. The PVC material of the inner layer is protected from being damaged by external force, the honeycomb supporting shell and the double-component sound-absorbing cotton fiber column are introduced into the PVC material, the PVC material is further reinforced, the strength of the PVC material is greatly improved, and the service life of the PVC material is prolonged.

The utility model relates to the technical field of double-sided flexible circuit boards, in particular to a multilayer double-sided flexible circuit board, which comprises a flexible circuit board body, and the head end and the tail end of the flexible circuit board body are fixedly connected with a first circuit joint and a second circuit joint respectively. A protective layer, a multi-layer soft board, a hard substrate and a heat dissipation cavity are arranged in the flexible circuit board body from top to bottom, and a heat conduction structure is arranged in the heat dissipation cavity and extends to the outer side of the flexible circuit board body; heat accumulated in the circuit board is guided to the end of the heat conduction block through the heat conduction piece arranged in the flexible circuit board, heat exchange is conducted through the heat conduction block and air in the external environment, and therefore the purpose of conducting heat and dissipating heat of the double-face flexible circuit board is achieved.

The utility model provides a circuit board structure. The circuit board structure comprises a core lamination layer and a first circuit lamination layer. The core lamination layer comprises a soft substrate, a first hard substrate and a second hard substrate. The soft substrate has a first surface and a second surface opposite to each other. The first hard substrate is arranged on the first surface. The second hard substrate is arranged on the second surface. The first circuit lamination layer is arranged on one side of the core lamination layer and comprises a first dielectric layer and a first circuit layer. The first dielectric layer is disposed on the first hard substrate. The first circuit layer is disposed on or in the first dielectric layer.

A feed adapter device for connecting to an antenna includes a feed conversion member for electrically connecting to a nano-silver antenna in an insulated, transparent and hard substrate. The feed conversion member is partially configured to attach to the insulated, transparent and hard substrate, the feed conversion member is a flexible member, and the impedance of the feed conversion member is configured for reaching a preset impedance of an antenna body together with the impedance of the nano-silver antenna.

The invention provides a pulse laser-assisted nondestructive transfer method for a fine structure of a flexible substrate. The method comprises the following steps: firstly, preparing the fine structure to be transferred on a hard substrate; then, the binding force between the to-be-transferred structure and the flexible substrate is adjusted through interface modification; then irradiating the hard substrate-to-be-transferred fine structure interface by using pulse laser subjected to spatial light field shaping, and mildly weakening the binding force between the to-be-transferred structure and the hard substrate under the condition that the to-be-transferred structure is not damaged by ablation or decomposition; and finally, the flexible film is uncovered, and the to-be-transferred structure in the irradiated area is transferred to the flexible film without damage. According to the method, a complex technological process in a wet transfer method and a sacrificial layer transfer method is avoided, no obvious thermal, mechanical or chemical damage is caused to the structure, the structures such as a multi-layer composite film and an ultrathin film with a large width-to-thickness ratio can be selectively transferred to a flexible film in one step with high technological flexibility, and the transfer efficiency and the material adaptability are effectively improved.

The invention discloses a bolt loosening state monitoring system based on a distributed strain switch, and belongs to the technical field of state monitoring. The system comprises a plurality of strain switches, each strain switch monitors the loosening state of one bolt, the strain switches monitor that the bolts are loosened, and the change rate of resistance of the strain switches is larger than a threshold value; the strain switch is a flexible strain switch or a disposable strain switch; the flexible strain switch comprises a flexible substrate with a micro-channel structure, and the interior of the micro-channel structure is coated with a strain sensitive material used for forming a conductive path. The two ends of the micro-channel structure are connected with first metal signal lines, and the first metal signal lines are used for outputting resistance signals of the flexible strain switch; the disposable strain switch comprises a hard substrate printed with a metal sensitive grid, two ends of the metal sensitive grid are connected with second metal signal lines, and the second metal signal lines are used for outputting resistance signals of the disposable strain switch. The method can meet the engineering requirements of bolt connection health monitoring.

The invention provides a self-repairing strain sensing composite film as well as a preparation method and application thereof, the composite film comprises a photonic crystal film with a nano periodic structure and a self-repairing bonding layer coated on the bottom surface of the photonic crystal film, and repairing agent microcapsules and curing agent microcapsules are uniformly dispersed in the bonding layer; the preparation method comprises the following steps: manufacturing a nanostructure master mask on a hard base material; copying the flexible sub-plates in batches through a soft photoetching process; splicing a plurality of sub-plates into a large-area template array at high precision by adopting a visual alignment system; carrying out secondary transfer printing to obtain a photonic crystal film; finally, self-repairing adhesive slurry is coated; the film can be used for a strain monitoring system. According to the composite film disclosed by the invention, when microcracks are generated on a bonding interface, the microcapsules are broken to release repairing components, so that self-repairing is realized; meanwhile, large-area and low-cost preparation is achieved, the high-precision strain sensing and damage self-repairing functions are achieved, the sensor is suitable for structural health monitoring, and structural safety and maintenance efficiency are improved.