32 results about "Hard substrate" patented technology

The invention discloses a solution immersion type fingerprint detection method based on AIEgens, which comprises the step of carrying out immersion type fluorescent fingerprint detection based on the aggregation-induced emission effect of an organic fluorescent compound TPP-APBP-P. TPP is used as a luminous substrate, a long chain is connected to the luminous substrate to improve the lipophilicity of the luminous substrate, TPP-APBP-P is obtained, meanwhile, the PH of a solution is adjusted to improve the hydrophilicity of the luminous substrate, and finally the detection effect of the luminous substrate on potential fingerprints is improved; the fingerprint detector has very excellent detection effects on fingerprints in a high-temperature environment and aged fingerprints, and has high contrast, high sensitivity and high precision on fingerprint development.

The utility model is applicable to the technical field of decorative films, and discloses a self-adhesive PVC (polyvinyl chloride) decorative film which sequentially comprises a scratch-resistant layer, a soft PVC base material layer, a pattern printing layer, a hard PVC base material layer, a back coating layer, an adhesive sticker layer and a release paper layer from top to bottom. According to the self-adhesive PVC decorative film, the scratch-resistant layer is arranged on the surface of the soft PVC base material layer, so that the scratch resistance of the self-adhesive PVC decorative film is improved, scratches on the surface of the decorative film are few, and good appearance and decorative effect can be kept. The soft PVC base material layer and the hard PVC base material layer printed with the pattern printing layer are compounded together, so that the flexibility and the elasticity of the self-adhesive decorative film are improved, the decorative film can better adapt to objects with different shapes and surfaces, construction is easy, meanwhile, the decorative film can resist external force impact when being transported, constructed and used for decoration, and the service life of the decorative film is prolonged. Therefore, the decorative film is not easy to damage and crack, and the attractiveness and the integrity of decorated and repaired articles are not influenced.

The application discloses a jig platform, a flexible display component transfer method and a peeling transfer system. The jig platform comprises a jig platform body and a one-way valve. The jig platform body has a first surface and a second surface arranged oppositely. The first surface is used for placing the flexible display component. The jig platform body is provided with at least one gas channel. The gas channel comprises a first cavity and a second cavity connected with each other. The first cavity is communicated with the first surface. The one-way valve is arranged between the first cavity and the second cavity. When the vacuum degree of the second cavity is increased, the one-way valve is opened, and the jig platform body is used for adsorbing the flexible display component. When the vacuum degree of the second cavity is reduced, the one-way valve is closed, the negative pressure in the first cavity is kept, and the jig platform continues to adsorb the flexible display component. The application can ensure that the flexible display device and the hard substrate do not fall off and relatively displace in the carrying process, so that the flexible display component is smoothly transferred.

This application relates to an embedded RFID tag packaging device and its packaging process, belonging to the field of radio frequency identification tag manufacturing technology. It includes: a base fixing support for supporting the main body of the device; a turntable sorting module disposed on the main body of the device for conveying and positioning the substrate to be packaged; a dual-mode pressure control unit for acquiring the material characteristics of the substrate and controlling the device to switch between contact pressing and non-contact suspension modes to apply packaging pressure; and a thermal coupling compensation mechanism disposed at the packaging station for temperature regulation of the packaging interface and precise displacement compensation combined with piezoelectric drive. This application utilizes the cooperation of the dual-mode pressure control unit and data acquisition sensors to obtain the substrate hardness in real time using piezoelectric detection technology and switches the execution mode accordingly. For hard substrates such as metals, the device adopts a contact pressing mode to output sufficient mechanical pressure to ensure uniform adhesive layer spreading and bonding strength.

This application discloses a peeling apparatus and a method for peeling a rigid substrate. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes an adhesion portion and an epitaxial portion surrounding the adhesion portion, the epitaxial portion extending from the edge of the adhesion portion to the outer edge of the rigid substrate. The transfer apparatus includes a rotating shaft and a transfer stage rotatably connected to the rotating shaft. A retractable first vacuum chuck and a second vacuum chuck are provided on the transfer stage. During the peeling process of the rigid substrate, when transferring the flexible display assembly (after the rigid substrate and flexible substrate have been separated) using the transfer apparatus, the first vacuum chuck adsorbs the epitaxial portion of the process protective film, and the second vacuum chuck adsorbs the rigid substrate. This prevents the rigid substrate and flexible substrate from detaching or shifting relative to each other, thereby improving product yield.

The utility model discloses a silicone rubber ultrahigh frequency intelligent label, which relates to the technical field of radio frequency identification and comprises a top sealing layer, a substrate layer, an antenna layer, a chip, a central area, a top sealing layer, a top sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer and a bottom sealing layer, the protective flange is electrically connected with the antenna layer, the protective flange, the surrounding top sealing layer and the edge of the substrate layer are integrally formed, the section of the substrate layer is semicircular, an adhesive layer is arranged on the side, away from the antenna layer, of the substrate layer, the thickness of the adhesive layer is 0.05-0.15 mm, a fixed clamping block is embedded into the top of the substrate layer, and the chip is movably inserted into the inner side of the fixed clamping block. Ceramic microbeads are uniformly distributed in the top sealing layer and the substrate layer, and the surface of a conductive path of the antenna layer is covered with an insulating layer, so that the problems that a common UHF tag mostly adopts PET, PCB and other hard base materials, is difficult to fit with tires, cables and other curved surfaces or flexible objects, is poor in impact resistance and is easy to break are solved.

The invention discloses an anisotropic conductive stretchable electronic solder and a preparation method and application thereof, the stretchable electronic solder comprises a polymer adhesive and a silver nanosheet, and the mass ratio of the polymer adhesive to the silver nanosheet is (5-20): 1; the high-molecular adhesive is obtained by heating bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfuryl amine at 40-60 DEG C to react, and then heating with N, N '-(4, 4'-methylene diphenyl) bismaleimide at 60-80 DEG C to react. According to the anisotropic conductive stretchable electronic solder provided by the invention, by virtue of excellent flexibility and stretchability endowed by the dynamic chemical polymer adhesive, the problem of stress concentration caused by physicochemical property difference of a soft / hard base material can be effectively counteracted, stable connection of an electrical interface is always kept in a stretching deformation process, and the reliability of the electronic solder is improved. Universal welding of flexible, stretchable and rigid materials and devices is successfully achieved.

The utility model provides a circuit board structure. The circuit board structure comprises a core lamination layer and a first circuit lamination layer. The core lamination layer comprises a soft substrate, a first hard substrate and a second hard substrate. The soft substrate has a first surface and a second surface opposite to each other. The first hard substrate is arranged on the first surface. The second hard substrate is arranged on the second surface. The first circuit lamination layer is arranged on one side of the core lamination layer and comprises a first dielectric layer and a first circuit layer. The first dielectric layer is disposed on the first hard substrate. The first circuit layer is disposed on or in the first dielectric layer.

A feed adapter device for connecting to an antenna includes a feed conversion member for electrically connecting to a nano-silver antenna in an insulated, transparent and hard substrate. The feed conversion member is partially configured to attach to the insulated, transparent and hard substrate, the feed conversion member is a flexible member, and the impedance of the feed conversion member is configured for reaching a preset impedance of an antenna body together with the impedance of the nano-silver antenna.

The invention provides a pulse laser-assisted nondestructive transfer method for a fine structure of a flexible substrate. The method comprises the following steps: firstly, preparing the fine structure to be transferred on a hard substrate; then, the binding force between the to-be-transferred structure and the flexible substrate is adjusted through interface modification; then irradiating the hard substrate-to-be-transferred fine structure interface by using pulse laser subjected to spatial light field shaping, and mildly weakening the binding force between the to-be-transferred structure and the hard substrate under the condition that the to-be-transferred structure is not damaged by ablation or decomposition; and finally, the flexible film is uncovered, and the to-be-transferred structure in the irradiated area is transferred to the flexible film without damage. According to the method, a complex technological process in a wet transfer method and a sacrificial layer transfer method is avoided, no obvious thermal, mechanical or chemical damage is caused to the structure, the structures such as a multi-layer composite film and an ultrathin film with a large width-to-thickness ratio can be selectively transferred to a flexible film in one step with high technological flexibility, and the transfer efficiency and the material adaptability are effectively improved.

The invention provides a self-repairing strain sensing composite film as well as a preparation method and application thereof, the composite film comprises a photonic crystal film with a nano periodic structure and a self-repairing bonding layer coated on the bottom surface of the photonic crystal film, and repairing agent microcapsules and curing agent microcapsules are uniformly dispersed in the bonding layer; the preparation method comprises the following steps: manufacturing a nanostructure master mask on a hard base material; copying the flexible sub-plates in batches through a soft photoetching process; splicing a plurality of sub-plates into a large-area template array at high precision by adopting a visual alignment system; carrying out secondary transfer printing to obtain a photonic crystal film; finally, self-repairing adhesive slurry is coated; the film can be used for a strain monitoring system. According to the composite film disclosed by the invention, when microcracks are generated on a bonding interface, the microcapsules are broken to release repairing components, so that self-repairing is realized; meanwhile, large-area and low-cost preparation is achieved, the high-precision strain sensing and damage self-repairing functions are achieved, the sensor is suitable for structural health monitoring, and structural safety and maintenance efficiency are improved.

The invention discloses a method for preparing a shape memory alloy coating on the surface of a hard matrix and a tool, and relates to the technical field of surface modification. Amorphous deposition is formed through magnetron sputtering, the high-density and high-hardness shape memory alloy coating is obtained, and the problem that an existing tool is insufficient in hardness is solved; secondly, controllable crystallization is formed by controlling annealing parameters such as the vacuum degree, so that the shape memory alloy coating has superelasticity, energy can be dissipated through phase change, and the problem that an existing cutter is insufficient in toughness and impact resistance is solved; under the process combination of amorphous deposition and controllable crystallization, the invention provides the shape memory alloy coating capable of giving consideration to hardness and toughness at the same time, and the service life of the shape memory alloy coating under harsh working conditions is remarkably prolonged.

This invention belongs to the field of tunnel support technology and solves the problem of poor stability of hydraulic support bases in existing technologies. This invention provides a hydraulic support base, comprising: a housing; a soft pressure plate and a hard pressure rod vertically movably disposed at the bottom of the housing; a probe vertically extendable and retractable within the hard pressure rod; a sensing spring linked to the probe; a fixed stroke threshold S set on the probe's retraction path; and a mode switching mechanism driven by the probe when its retraction stroke reaches the fixed stroke threshold S. When the probe's retraction stroke reaches the fixed stroke threshold S, the mode switching mechanism locks the base in a soft contact mode where the soft pressure plate supports the hard floor of the tunnel; when the probe's retraction stroke does not reach the fixed stroke threshold S, the mode switching mechanism switches the base to a hard contact mode where the hard pressure rod inserts and compacts the soft layer of the tunnel floor, supporting the base on a hard substrate. This invention has the advantage of strong stability on both hard and soft floor surfaces.

The application belongs to the field of semiconductors, and specifically discloses a stripping assembly and a stripping process. The stripping assembly comprises a hard substrate, a flexible adhesive film and a metal adhesive film. The flexible adhesive film is adhered to the hard substrate, and the metal adhesive film is adhered to the flexible adhesive film. The metal adhesive film is provided with an openwork pattern, and the openwork pattern is the same as a photoetching pattern. The three-layer layered structure of the hard substrate, the flexible adhesive film and the metal adhesive film is adopted, and the metal adhesive film is provided with an openwork pattern which is completely consistent with the photoetching pattern. The probability of the metal adhesive film adhering to the metal layer deposited in the photoetching pattern is reduced, and the integrity of the metal circuit pattern is maintained. Meanwhile, the hard substrate provides stable support for the flexible film, improves the alignment and fitting precision, greatly reduces the process rework rate, and takes into account the precision, stability and yield of metal stripping.

The application discloses anisotropic conductive stretchable electronic solder as well as a preparation method and application thereof, the stretchable electronic solder comprises a polymer binder and silver nanosheets, and the mass ratio of the polymer binder to the silver nanosheets is (5-20):1; the polymer binder is obtained by heating reaction of bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfurylamine at 40-60 DEG C, and then heating reaction of N,N'-(4,4'-methylene diphenyl) bismaleimide at 60-80 DEG C. The anisotropic conductive stretchable electronic solder provided by the application can effectively offset the stress concentration problem caused by the difference in physical and chemical properties of soft / hard substrates, and ensure that the electrical interface always maintains stable connection in the stretching deformation process, and successfully realizes the universal welding of flexible, stretchable and rigid materials and devices.

The subject matter of the present invention is a reed holding and reed forming apparatus for a double reed musical instrument, made of a hard substrate shape holding material (e.g., metal). The internal forming design of the reed retaining and reed forming apparatus enables the generation and development of good sound production that can be repeated once again. The external design helps ensure good joining of the planed reed plates, thereby enabling good vibration of the reed plates and enhancing durability of the reed plates. Therefore, the reed holding and reed forming apparatus adjusts the vibration sound generated by the reed plate and transmits the vibration sound to the musical instrument in a manner that always can be accurately reproduced and is good. Thus, we manufacture the apparatus from a metal or shape-retaining material, in which case the reed is well attached to the metal or shape-retaining material, the internal shape always remaining unchanged. The invention can be used in all double reed musical instruments, such as Bason, clarinet, British Round Number and the like, and the invention is constructed together with or separately constructed with related tubes.

The invention relates to the technical field of flexible electronic transfer printing, and discloses a solvent-regulated flexible electronic ink shaping and transfer printing method which comprises the following steps: S1) preparing alloy ink; (S2) the alloy ink is printed on a hard substrate with low surface energy in a direct writing printing mode, a preset circuit pattern is formed, and in the printing process, the circuit alloy ink is kept in a molten state by heating the hard substrate; s3) after printing is finished, heating the hard substrate, and preferentially volatilizing the low-boiling-point solvent by utilizing the boiling point difference, so that the alloy ink is converted into a semi-solid viscoelastic circuit from a molten state to be pre-cured and shaped; s4) integrally transferring the semi-solid viscoelastic circuit from the hard substrate to a flexible substrate; and S5) removing the high-boiling-point solvent in the circuit after the transfer printing is completed. The preparation process of a traditional transfer printing process is optimized through a composite solvent system and a gradient heating process. The flowability and wettability of the direct-writing printing alloy ink are improved by introducing the low-boiling-point solvent; by introducing a high-boiling-point solvent, the elasticity and adhesion of the circuit are improved, and the influence of stress on the circuit during transfer printing is reduced; the influence of the coffee ring effect in the alloy ink volatilization process is reduced through the solvent boiling point difference design, and the circuit pattern precision is improved.

The present disclosure relates to a microneedle patch, wherein the microneedle patch includes a microneedle array, the microneedle array including a central portion and a plurality of peripheral portions connected to the central portion and surrounding the central portion, and the peripheral portion is disposed to be spaced apart from an adjacent peripheral portion, wherein the microneedle array includes a hard planar substrate and a plurality of microneedles disposed on the hard substrate, and the peripheral portion is folded through a gap between the adjacent peripheral portion, and the microneedle patch may be attached even to a curved affected area with high adhesion.

The invention relates to a preparation method of a gold-doped PdSe2 thin film thermistor. The preparation method comprises the following steps: 1) cleaning a hard substrate; 2) photoetching a prefabricated pattern on the substrate; (3) a gold-doped palladium thin film is prepared through double-target magnetron sputtering; (4) carrying out selenylation reaction to obtain a gold-doped PdSe2 thin film; according to the method, the technical contradiction between the sensitivity and the stability of an existing PdSe2 thin film thermistor can be solved, the prepared thermosensitive resistor is high in TCR and high in environment stability, the preparation process is compatible with an existing semiconductor production line, and device miniaturization and integration are facilitated.

The invention discloses a water-based radiation refrigeration coating as well as a preparation method, a composite material and application thereof. The coating comprises the following components in percentage by mass: 59.5%-70.4% of organic silicon modified styrene-acrylic polymer emulsion, 2.8%-6.8% of rutile titanium dioxide, 4.8%-5.6% of hydrophilic silicon dioxide and 21.1%-30.8% of a solvent. The coating disclosed by the invention is prepared by adopting a pre-dispersion-gradient charging process, and has excellent water whitening resistance and low water absorption. The deionized water content in the system can be adjusted according to different base material types; when the system is applied to color steel tiles and other hard base materials, the high deionized water content is kept to meet the spraying construction requirement; when applied to flexible substrates such as fabrics and the like, the system viscosity and the fabric surface adhesion performance are improved by properly reducing the content of deionized water. The coating can be sprayed on the surface of a color steel tile or coated on the surface of a fabric to form a radiation refrigeration coating, so that the application of building heat management and personal heat management is realized.

The invention discloses a self-supporting submicron cortex electrode and a manufacturing method thereof, and belongs to the field of micro-nano manufacturing. The method comprises the following steps: firstly, spin-coating a layer of film on the surface of a hard substrate, and carrying out thermal imidization to obtain a substrate layer; secondly, preparing a layer of metal film on the surface, and patterning to obtain an electrode layer; then, spin-coating a layer of negative photosensitive polyimide film on the surface of the substrate, and carrying out patterning and thermal imidization to obtain a flexible frame as a supporting layer; spin-coating a layer of positive photosensitive polyimide film on the surface of the supporting layer, and carrying out patterning and thermal imidization to obtain a packaging layer; and finally, stripping from the hard substrate to obtain a cortex electrode. The minimum thickness of the cortical electrode is in the submicron dimension, a flexible frame can be formed by introducing the supporting layer, and the conformal fitting degree of the cortical electrode and the cerebral cortex is improved; the cortical electrode has a self-supporting capability, does not need a temporary supporting layer such as fibroin, and can be directly controlled.

The invention discloses a manufacturing method of an infrared optical lens, the infrared optical lens and an infrared optical system. The manufacturing method of the infrared optical lens comprises the following steps: carrying out pretreatment including cleaning and polishing on a hard substrate to obtain a pretreated hard substrate; plating a soft material film on the surface of one side of the pretreated hard substrate; processing the surface of the soft material film to form a diffraction structure; annealing the diffraction structure; plasma is used to treat the surface of the diffraction structure. According to the invention, the integration of high-quality diffractive optical functions on a hard substrate material is realized, the application scene of a high-hardness material in a precision optical system is expanded, and the aberration correction capability and final imaging quality of the infrared lens are remarkably improved.

The present invention relates to a cutting tool composed of a hard base material, such as cemented carbide, cermet, ceramic, and cubic boron nitride, and a hard coating film formed on the hard base material. A hard coating film for a cutting tool according to the present invention is formed in a multi-layered structure on a base material of a cutting tool, wherein the hard coating film includes one or more layers of a coating film made of an oxide and one or more layers of a coating film made of a nitride, and is characterized in that the O / (O+N) ratio in an edge center of the cutting tool is lower than the O / (O+N) ratio in a region 100 μm or further away from the edge center in the entire hard coating film.

A fastener driving tool has a movable elongated cylindrical portion of a driver that sequentially drives fasteners into a substrate. The elongated cylindrical portion of the driver is designed to drive a fastener into a harder substrate, such as concrete. The elongated cylindrical portion of the driver design is able to handle the force of driving into these harder substrates, compared to prior non-cylindrical driver designs. The fastener driving tool also has a magazine with a cutout portion along the magazine's outer housing between a user grip portion and an upper portion of the magazine. This cutout portion allows the tool to be used in a location with limited access, such as a channel.

The present invention belongs to the technical field of composite floors. Disclosed are a ceramic tile-look stone plastic floor and a manufacturing method therefor. The ceramic tile-look stone plastic floor comprises: from top to bottom, a wear-resistant layer, a decorative layer, a first rigid SPC substrate layer, a foamed SPC substrate layer and a second rigid SPC substrate layer. The components of the first rigid SPC substrate layer comprise 12-20 wt% of polyvinyl chloride resin (PVC), 12-20 wt% of organosilicon-modified acrylic resin, 50-70 wt% of calcium carbonate, and the balance being an auxiliary agent. The ceramic tile-look stone plastic floor is provided with grooves each extending downward from the top, the lowest point of each groove does not exceed half the thickness of the first rigid SPC substrate layer, and the grooves are used for simulating a grouting effect of ceramic tiles. By adding the organosilicon-modified acrylic resin to the rigid SPC substrate layers, the present application can effectively improve weather resistance, water resistance, wear resistance, stain resistance and other properties of rigid SPC substrate layers.

The application discloses a method for preparing high-density flexible organic electrochemical transistors based on excimer ultraviolet light. The application first innovates the device structure of the organic electrochemical transistor, integrates the active layer of the transistor with the source-drain electrode, so as to reduce the device size and improve the density; the 172nm excimer ultraviolet light is used to realize the patterning of the device electrode, the active layer and the channel, compared with the traditional photolithography technology, the preparation process is reduced, the cost is low, and the method is simple and easy to implement; the technology can controllably build the device with the channel length of 2-15um, and the device can normally work under the voltage of <1V; the gate electrolyte layer of the organic electrochemical transistor is effectively patterned, the common gate connection problem between the devices is solved, the density of the final device can be controlled to be 15,000-105,000 per square centimeter, and the device is successfully peeled off from the hard substrate, so as to form the flexible electrochemical device which can be attached; the application is favorable to promote the application of the electrochemical transistor in the fields of information technology and biological sensing.

The invention provides a rigid-flex board and a manufacturing method thereof, and the manufacturing method comprises the steps: providing an auxiliary supporting plate which is provided with a first through hole; a first buffer pad, a hard substrate and an adhesive plate are sequentially stacked on the auxiliary supporting plate, and a second through hole and a hard plate via hole are formed in the first buffer pad and the hard substrate respectively; enabling a pin to pass through the adhesive plate, and then to pass through the hard board via hole, the second through hole and the first through hole in sequence; the soft substrate and the second buffer pad are continuously stacked to obtain a combined plate, and soft plate conduction holes corresponding to the conductive pins are formed in the soft substrate; the composition board is pre-cured; the rigid-flex board is obtained by press-fitting the hard substrate and the soft substrate through press-fitting forming, the technical problems that in the prior art, traditional pin insertion needles need additional procedure welding and auxiliary material fixing, and the assembly space and cost are increased can be solved, the uncovering process in the traditional rigid-flex board manufacturing process can be omitted, the production cost is reduced, and the production efficiency is improved.

The utility model provides a distance-adjustable wrist four-channel flexible sensor with a T-shaped groove structure. The distance-adjustable wrist four-channel flexible sensor comprises a T-shaped groove base and a sliding block part, the T-shaped groove base is formed by integrally cutting silica gel or rubber, and the surface of the T-shaped groove base is subjected to hard anodic oxidation treatment; a flexible sensing unit is arranged at the top of the sliding block part and is made of a piezoelectric elastomer material; a hard substrate is arranged below the flexible sensing unit, an inverted-T-shaped sliding block is arranged below the hard substrate, and the inverted-T-shaped sliding block is in clearance fit with the T-shaped groove base. Longitudinal pressure is controlled by adjusting screws at the bottoms of the sliding blocks, continuous adjustment of the four-channel sensor within the stroke range of 350 mm is achieved, and the four-channel sensor meets the wearing requirements of people with the wrist girth ranging from 150 mm to 250 mm. The solid lubricant is sprayed on the matching interface of the inverted-T-shaped sliding block and the T-shaped groove, the dynamic friction coefficient of the interface is obviously influenced by the longitudinal pressure change, and the self-locking thread angle is matched, so that the spontaneous displacement of the sliding block is smaller and the locking state is kept better under the working conditions of small-frequency and small-range random vibration.

The invention discloses a method for realizing double-sided graphical alignment by single-sided laser direct writing equipment, which relates to the technical field of photoetching and comprises the following steps of: preparing a mask which is provided with an alignment mark and a mark point; the mark points on the mask are exposed to the first side face and the second side face, opposite to each other, of the substrate, when the first side face and the second side face are exposed, the mask is aligned through the alignment mark, the mark points between the first side face and the second side face are aligned one by one, and the substrate with the double-face alignment mark points is formed; and pattern exposure: carrying out coordinate alignment on the mark points on the first side surface and the second side surface of the substrate through single-sided laser direct writing equipment, and carrying out pattern exposure on the first side surface and the second side surface. Thus, alignment of the patterns on the two sides of the hard substrate can be achieved by means of the mark points and the alignment function of the single-side laser direct writing device, double-side patterning of the hard substrate is completed by means of the single-side laser direct writing device, and manufacturing of physical masks is omitted.

The present application relates to a coating with enhanced toughness and wear resistance, and its preparation method and application, comprising a Co-containing hard substrate and a hard coating coated on the substrate; the hard coating comprises a layer of ultra-fine, nanocrystalline Ti(C x N y O z ) coating with a thickness >1 μm prepared by a chemical vapor deposition method, wherein x+y+z=1, 0.5≤x≤0.7, 0.3≤y≤0.5, and 0 The present application can effectively improve the problems of weak grain boundary strength caused by enrichment of chlorine impurities at the grain boundary and the problem of toughness reduction of the coating caused by oxygen element doping hardening. The coating of the present application has high hardness, and also has relatively high toughness and grain boundary strength, and can greatly improve the anti-collapse and anti-chip ability, wear resistance and service life when used as a metal cutting tool.