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51 results about "Hard substrate" patented technology
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Hard substrates include ceramics such as alumina, aluminum nitride and beryllium oxide, and are desirable for applications where bare die (chips) are used such as in a hybrid module.
Solution soaking type fingerprint detection method based on AIEgens
PendingCN121384921AChemiluminescene/bioluminescenceFluorescence/phosphorescenceFluorescenceLatent fingerprint
The invention discloses a solution immersion type fingerprint detection method based on AIEgens, which comprises the step of carrying out immersion type fluorescent fingerprint detection based on the aggregation-induced emission effect of an organic fluorescent compound TPP-APBP-P. TPP is used as a luminous substrate, a long chain is connected to the luminous substrate to improve the lipophilicity of the luminous substrate, TPP-APBP-P is obtained, meanwhile, the PH of a solution is adjusted to improve the hydrophilicity of the luminous substrate, and finally the detection effect of the luminous substrate on potential fingerprints is improved; the fingerprint detector has very excellent detection effects on fingerprints in a high-temperature environment and aged fingerprints, and has high contrast, high sensitivity and high precision on fingerprint development.
Owner:ANHUI UNIV OF SCI & TECH
Self-adhesive PVC decorative film
The utility model is applicable to the technical field of decorative films, and discloses a self-adhesive PVC (polyvinyl chloride) decorative film which sequentially comprises a scratch-resistant layer, a soft PVC base material layer, a pattern printing layer, a hard PVC base material layer, a back coating layer, an adhesive sticker layer and a release paper layer from top to bottom. According to the self-adhesive PVC decorative film, the scratch-resistant layer is arranged on the surface of the soft PVC base material layer, so that the scratch resistance of the self-adhesive PVC decorative film is improved, scratches on the surface of the decorative film are few, and good appearance and decorative effect can be kept. The soft PVC base material layer and the hard PVC base material layer printed with the pattern printing layer are compounded together, so that the flexibility and the elasticity of the self-adhesive decorative film are improved, the decorative film can better adapt to objects with different shapes and surfaces, construction is easy, meanwhile, the decorative film can resist external force impact when being transported, constructed and used for decoration, and the service life of the decorative film is prolonged. Therefore, the decorative film is not easy to damage and crack, and the attractiveness and the integrity of decorated and repaired articles are not influenced.
Owner:GUANGDONG RENOLIT SILICON NEW MATERIAL CO LTD
Unattended image three-dimensional printing retail device
The invention relates to the technical field of digital manufacturing, in particular to an unattended image three-dimensional printing retail device, aims to solve the problem that personalized hard entity commodities cannot be manufactured in real time, and comprises a main control module, a user data input module, an image processing module, a substrate storage module, a marking module, a forming module and a finished product delivery module. The image processing module generates contour data based on the original image; the marking module forms an image and a positioning mark on the hard or semi-hard substrate; and before forming, the main control module corrects contour data through the image and the positioning mark formed on the substrate, and controls the forming module to perform accurate forming according to the corrected data. Through visual calibration closed-loop control, full-automatic and real-time manufacturing and selling of high-added-value personalized hard commodities are achieved, and high precision and the yield are guaranteed.
Owner:GUANGDONG GUANJUN KANGLVDA HEALTH INVESTMENT CO LTD
Jig platform, flexible display assembly transfer method, and peel transfer system
The application discloses a jig platform, a flexible display component transfer method and a peeling transfer system. The jig platform comprises a jig platform body and a one-way valve. The jig platform body has a first surface and a second surface arranged oppositely. The first surface is used for placing the flexible display component. The jig platform body is provided with at least one gas channel. The gas channel comprises a first cavity and a second cavity connected with each other. The first cavity is communicated with the first surface. The one-way valve is arranged between the first cavity and the second cavity. When the vacuum degree of the second cavity is increased, the one-way valve is opened, and the jig platform body is used for adsorbing the flexible display component. When the vacuum degree of the second cavity is reduced, the one-way valve is closed, the negative pressure in the first cavity is kept, and the jig platform continues to adsorb the flexible display component. The application can ensure that the flexible display device and the hard substrate do not fall off and relatively displace in the carrying process, so that the flexible display component is smoothly transferred.
Owner:GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
An embedded RFID tag packaging apparatus and a packaging process thereof
This application relates to an embedded RFID tag packaging device and its packaging process, belonging to the field of radio frequency identification tag manufacturing technology. It includes: a base fixing support for supporting the main body of the device; a turntable sorting module disposed on the main body of the device for conveying and positioning the substrate to be packaged; a dual-mode pressure control unit for acquiring the material characteristics of the substrate and controlling the device to switch between contact pressing and non-contact suspension modes to apply packaging pressure; and a thermal coupling compensation mechanism disposed at the packaging station for temperature regulation of the packaging interface and precise displacement compensation combined with piezoelectric drive. This application utilizes the cooperation of the dual-mode pressure control unit and data acquisition sensors to obtain the substrate hardness in real time using piezoelectric detection technology and switches the execution mode accordingly. For hard substrates such as metals, the device adopts a contact pressing mode to output sufficient mechanical pressure to ensure uniform adhesive layer spreading and bonding strength.
Owner:JIANGSU SML&CF CO LTD
Peeling apparatus and method for peeling hard substrate
This application discloses a peeling apparatus and a method for peeling a rigid substrate. The flexible display assembly includes a rigid substrate, a flexible display device, and a process protective film stacked sequentially. The process protective film includes an adhesion portion and an epitaxial portion surrounding the adhesion portion, the epitaxial portion extending from the edge of the adhesion portion to the outer edge of the rigid substrate. The transfer apparatus includes a rotating shaft and a transfer stage rotatably connected to the rotating shaft. A retractable first vacuum chuck and a second vacuum chuck are provided on the transfer stage. During the peeling process of the rigid substrate, when transferring the flexible display assembly (after the rigid substrate and flexible substrate have been separated) using the transfer apparatus, the first vacuum chuck adsorbs the epitaxial portion of the process protective film, and the second vacuum chuck adsorbs the rigid substrate. This prevents the rigid substrate and flexible substrate from detaching or shifting relative to each other, thereby improving product yield.
Owner:GUANGDONG JUHUA PRINTING DISPLAY TECH CO LTD
Automatic film pasting equipment and application method thereof
PendingCN120840943AWrapping material feeding apparatusPackaging protectionElectric machineryDrive motor
Owner:SUZHOU SHUNMING PRECISION TECH CO LTD
Silicone rubber ultrahigh frequency intelligent label
The utility model discloses a silicone rubber ultrahigh frequency intelligent label, which relates to the technical field of radio frequency identification and comprises a top sealing layer, a substrate layer, an antenna layer, a chip, a central area, a top sealing layer, a top sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer, a bottom sealing layer, a top sealing layer and a bottom sealing layer, the protective flange is electrically connected with the antenna layer, the protective flange, the surrounding top sealing layer and the edge of the substrate layer are integrally formed, the section of the substrate layer is semicircular, an adhesive layer is arranged on the side, away from the antenna layer, of the substrate layer, the thickness of the adhesive layer is 0.05-0.15 mm, a fixed clamping block is embedded into the top of the substrate layer, and the chip is movably inserted into the inner side of the fixed clamping block. Ceramic microbeads are uniformly distributed in the top sealing layer and the substrate layer, and the surface of a conductive path of the antenna layer is covered with an insulating layer, so that the problems that a common UHF tag mostly adopts PET, PCB and other hard base materials, is difficult to fit with tires, cables and other curved surfaces or flexible objects, is poor in impact resistance and is easy to break are solved.
Owner:GUANGDONG GREEN FEATHER NEW MATERIALS CO LTD
Anisotropic conductive stretchable electronic solder and preparation method and application thereof
The invention discloses an anisotropic conductive stretchable electronic solder and a preparation method and application thereof, the stretchable electronic solder comprises a polymer adhesive and a silver nanosheet, and the mass ratio of the polymer adhesive to the silver nanosheet is (5-20): 1; the high-molecular adhesive is obtained by heating bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfuryl amine at 40-60 DEG C to react, and then heating with N, N '-(4, 4'-methylene diphenyl) bismaleimide at 60-80 DEG C to react. According to the anisotropic conductive stretchable electronic solder provided by the invention, by virtue of excellent flexibility and stretchability endowed by the dynamic chemical polymer adhesive, the problem of stress concentration caused by physicochemical property difference of a soft / hard base material can be effectively counteracted, stable connection of an electrical interface is always kept in a stretching deformation process, and the reliability of the electronic solder is improved. Universal welding of flexible, stretchable and rigid materials and devices is successfully achieved.
Owner:SUZHOU UNIV
An active contour-following adjustable support type precision paddy field leveling machine and leveling method
An active contour-adjustable support-type precision paddy field grader and method are disclosed. The grader includes a frame, an active contour-adjustable support mechanism, a grading mechanism, a grading shovel height and level adjustment mechanism, and a control system. The frame is connected to a tractor via a three-point suspension device. The active contour-adjustable support mechanism is mounted on the frame, and the grading mechanism is connected to the frame via the grading shovel height and level adjustment mechanism. The active contour-adjustable support mechanism includes a mounting frame, a parallel four-bar linkage, support legs, a telescopic drive mechanism, and a force sensor. The force sensor measures in real time the load force exerted by the active contour-adjustable support mechanism on the hard paddy field substrate. The control system controls the telescopic drive mechanism to extend and retract according to changes in load force, reducing fluctuations in the grader's level and elevation due to terrain, and reducing the amplitude and frequency of changes in the grading shovel tilt angle and elevation. This invention overcomes the challenges of paddy field grading operations in various complex hard substrate environments, ensuring grading results, and belongs to the field of paddy field grading machinery technology.
Owner:SOUTH CHINA AGRICULTURAL UNIVERSITY
Bonded body, imaging unit, endoscope, hard substrate, and bonding method
PCT designated stageWO2025215856A1Printed circuit assemblingPrinted circuits structural associationsMechanical engineeringEndoscope
This bonded body comprises: a hard substrate that has a first terminal, a step portion, and a wire provided from the first terminal to the step portion; and a flexible substrate that has a second terminal on the distal side thereof in the extension direction of the wire and that is disposed opposite the hard substrate. The step portion protrudes further to the flexible substrate side in comparison to the first terminal in an opposing direction in which the hard substrate and the flexible substrate are opposite one another. The hard substrate and the flexible substrate are bonded by means of solder connection between the first terminal and the second terminal.
Owner:OLYMPUS MEDICAL SYST CORP
Applying texture to hard substrate
A process for applying a texture to a hard substrate comprises cleaning a hard substrate to remove any particles. Then, a first wet pigment is applied to the hard substrate and allowed to air cure in atmosphere to create a pigmented substrate. The pigmented substrate is subjected to a first bake to further flash cure the pigment. Then, the substrate is abraded to create an abraded substrate, and a first liquid ceramic is applied to the abraded substrate. A textured substance is applied to the substrate after applying the first liquid ceramic to the substrate and is allowed to air cure in atmosphere to create a coated substrate. The coated substrate is subjected to a second bake to further cure the first liquid ceramic, and a second liquid ceramic that is different from the first liquid ceramic is applied to the substrate, which is allowed to air cure in atmosphere.
Owner:HESSELING & SONS LLC
Circuit board connecting mechanism and unmanned aerial vehicle device thereof
PendingCN120784653ACircuit bendability/stretchabilityPrinted circuit manufactureFlexible circuitsUncrewed vehicle
Owner:QISDA OPTRONICS (SUZHOU) CO LTD +1
Circuit board structure
The utility model provides a circuit board structure. The circuit board structure comprises a core lamination layer and a first circuit lamination layer. The core lamination layer comprises a soft substrate, a first hard substrate and a second hard substrate. The soft substrate has a first surface and a second surface opposite to each other. The first hard substrate is arranged on the first surface. The second hard substrate is arranged on the second surface. The first circuit lamination layer is arranged on one side of the core lamination layer and comprises a first dielectric layer and a first circuit layer. The first dielectric layer is disposed on the first hard substrate. The first circuit layer is disposed on or in the first dielectric layer.
Owner:UNIMICRON TECH CORP
Feed adapter device for connecting to antenna
PendingUS20260031544A1Coupling device connectionsElectrically conductive connectionsElectrical connectionHard substrate
A feed adapter device for connecting to an antenna includes a feed conversion member for electrically connecting to a nano-silver antenna in an insulated, transparent and hard substrate. The feed conversion member is partially configured to attach to the insulated, transparent and hard substrate, the feed conversion member is a flexible member, and the impedance of the feed conversion member is configured for reaching a preset impedance of an antenna body together with the impedance of the nano-silver antenna.
Owner:QUECTEL WIRELESS SOLUTIONS CO LTD
Pulse laser-assisted nondestructive transfer method for fine structure of flexible substrate
The invention provides a pulse laser-assisted nondestructive transfer method for a fine structure of a flexible substrate. The method comprises the following steps: firstly, preparing the fine structure to be transferred on a hard substrate; then, the binding force between the to-be-transferred structure and the flexible substrate is adjusted through interface modification; then irradiating the hard substrate-to-be-transferred fine structure interface by using pulse laser subjected to spatial light field shaping, and mildly weakening the binding force between the to-be-transferred structure and the hard substrate under the condition that the to-be-transferred structure is not damaged by ablation or decomposition; and finally, the flexible film is uncovered, and the to-be-transferred structure in the irradiated area is transferred to the flexible film without damage. According to the method, a complex technological process in a wet transfer method and a sacrificial layer transfer method is avoided, no obvious thermal, mechanical or chemical damage is caused to the structure, the structures such as a multi-layer composite film and an ultrathin film with a large width-to-thickness ratio can be selectively transferred to a flexible film in one step with high technological flexibility, and the transfer efficiency and the material adaptability are effectively improved.
Owner:SHANGHAI JIAOTONG UNIV
Bolt loosening state monitoring system based on distributed strain switch
PendingCN120761018AMachine part testingElectrical/magnetic solid deformation measurementElectrical resistance and conductanceMonitoring system
The invention discloses a bolt loosening state monitoring system based on a distributed strain switch, and belongs to the technical field of state monitoring. The system comprises a plurality of strain switches, each strain switch monitors the loosening state of one bolt, the strain switches monitor that the bolts are loosened, and the change rate of resistance of the strain switches is larger than a threshold value; the strain switch is a flexible strain switch or a disposable strain switch; the flexible strain switch comprises a flexible substrate with a micro-channel structure, and the interior of the micro-channel structure is coated with a strain sensitive material used for forming a conductive path. The two ends of the micro-channel structure are connected with first metal signal lines, and the first metal signal lines are used for outputting resistance signals of the flexible strain switch; the disposable strain switch comprises a hard substrate printed with a metal sensitive grid, two ends of the metal sensitive grid are connected with second metal signal lines, and the second metal signal lines are used for outputting resistance signals of the disposable strain switch. The method can meet the engineering requirements of bolt connection health monitoring.
Owner:ZHEJIANG UNIV
Self-repairing strain sensing composite film and preparation method and application thereof
The invention provides a self-repairing strain sensing composite film as well as a preparation method and application thereof, the composite film comprises a photonic crystal film with a nano periodic structure and a self-repairing bonding layer coated on the bottom surface of the photonic crystal film, and repairing agent microcapsules and curing agent microcapsules are uniformly dispersed in the bonding layer; the preparation method comprises the following steps: manufacturing a nanostructure master mask on a hard base material; copying the flexible sub-plates in batches through a soft photoetching process; splicing a plurality of sub-plates into a large-area template array at high precision by adopting a visual alignment system; carrying out secondary transfer printing to obtain a photonic crystal film; finally, self-repairing adhesive slurry is coated; the film can be used for a strain monitoring system. According to the composite film disclosed by the invention, when microcracks are generated on a bonding interface, the microcapsules are broken to release repairing components, so that self-repairing is realized; meanwhile, large-area and low-cost preparation is achieved, the high-precision strain sensing and damage self-repairing functions are achieved, the sensor is suitable for structural health monitoring, and structural safety and maintenance efficiency are improved.
Owner:ZHEJIANG UNIV
Stereoscopic display substrate and display apparatus
A display substrate is provided including: a base substrate; a display unit on the base substrate, including pixel units arranged in an array in a first direction and a second direction, where the pixel units have a periodic pixel width Δx in the first direction; a first medium layer on a side of the display unit away from the base substrate; and a cylindrical lens grating unit on a side of the first medium layer away from the base substrate, including a hard substrate and cylindrical lenses contiguously arranged in the first direction, each cylindrical lens having a pitch P. The stereoscopic display substrate has a preset field of view position with an optimal display effect in a third direction; is perpendicular to both the first and second directions. In a direction away from the field of view origin along the first direction, pitches P of the cylindrical lenses increase.
Owner:BEIJING BOE DISPLAY TECH CO LTD +2
Method for preparing shape memory alloy coating on surface of hard matrix and cutter
The invention discloses a method for preparing a shape memory alloy coating on the surface of a hard matrix and a tool, and relates to the technical field of surface modification. Amorphous deposition is formed through magnetron sputtering, the high-density and high-hardness shape memory alloy coating is obtained, and the problem that an existing tool is insufficient in hardness is solved; secondly, controllable crystallization is formed by controlling annealing parameters such as the vacuum degree, so that the shape memory alloy coating has superelasticity, energy can be dissipated through phase change, and the problem that an existing cutter is insufficient in toughness and impact resistance is solved; under the process combination of amorphous deposition and controllable crystallization, the invention provides the shape memory alloy coating capable of giving consideration to hardness and toughness at the same time, and the service life of the shape memory alloy coating under harsh working conditions is remarkably prolonged.
Owner:TSINGHUA SHENZHEN INTERNATIONAL GRADUATE SCHOOL
A hydraulic support base
This invention belongs to the field of tunnel support technology and solves the problem of poor stability of hydraulic support bases in existing technologies. This invention provides a hydraulic support base, comprising: a housing; a soft pressure plate and a hard pressure rod vertically movably disposed at the bottom of the housing; a probe vertically extendable and retractable within the hard pressure rod; a sensing spring linked to the probe; a fixed stroke threshold S set on the probe's retraction path; and a mode switching mechanism driven by the probe when its retraction stroke reaches the fixed stroke threshold S. When the probe's retraction stroke reaches the fixed stroke threshold S, the mode switching mechanism locks the base in a soft contact mode where the soft pressure plate supports the hard floor of the tunnel; when the probe's retraction stroke does not reach the fixed stroke threshold S, the mode switching mechanism switches the base to a hard contact mode where the hard pressure rod inserts and compacts the soft layer of the tunnel floor, supporting the base on a hard substrate. This invention has the advantage of strong stability on both hard and soft floor surfaces.
Owner:SHANXI TIANDI COAL MINING MACHINERY +1
A peeling assembly and a peeling process
PendingCN122110635APhotosensitive material processingPhotosensitive materials for photomechanical apparatusAdhesiveRework
The application belongs to the field of semiconductors, and specifically discloses a stripping assembly and a stripping process. The stripping assembly comprises a hard substrate, a flexible adhesive film and a metal adhesive film. The flexible adhesive film is adhered to the hard substrate, and the metal adhesive film is adhered to the flexible adhesive film. The metal adhesive film is provided with an openwork pattern, and the openwork pattern is the same as a photoetching pattern. The three-layer layered structure of the hard substrate, the flexible adhesive film and the metal adhesive film is adopted, and the metal adhesive film is provided with an openwork pattern which is completely consistent with the photoetching pattern. The probability of the metal adhesive film adhering to the metal layer deposited in the photoetching pattern is reduced, and the integrity of the metal circuit pattern is maintained. Meanwhile, the hard substrate provides stable support for the flexible film, improves the alignment and fitting precision, greatly reduces the process rework rate, and takes into account the precision, stability and yield of metal stripping.
Owner:ZIBO PIONEER INTELLIGENT SENSING TECHNOLOGY CO LTD
Circuit board connection mechanism and drone device
PendingUS20250304294A1Circuit bendability/stretchabilityPrinted circuit manufactureFlexible circuitsStructural engineering
A circuit board connection mechanism is applied to a drone device and includes a base, at least one positioning component, a flexure circuit board and a hard substrate. The positioning component includes a first section, a second section and a third section connected to each other. A width of the second section is smaller than a width of the first section and a width of the third section. The flexure circuit board is disposed on the hard substrate. The hard substrate includes a hole structure and a supporting structure connected to each other. A restraint annular structure of the supporting structure can be attached to the second section. A radial dimension of the restraint annular structure is smaller than the widths of the first section and the third section, and greater than the width of the second section.
Owner:QISDA CORP
Anisotropically conductive stretchable electronic solder and methods of making and using the same
The application discloses anisotropic conductive stretchable electronic solder as well as a preparation method and application thereof, the stretchable electronic solder comprises a polymer binder and silver nanosheets, and the mass ratio of the polymer binder to the silver nanosheets is (5-20):1; the polymer binder is obtained by heating reaction of bisphenol A diglycidyl ether, polyethylene glycol diglycidyl ether and furfurylamine at 40-60 DEG C, and then heating reaction of N,N'-(4,4'-methylene diphenyl) bismaleimide at 60-80 DEG C. The anisotropic conductive stretchable electronic solder provided by the application can effectively offset the stress concentration problem caused by the difference in physical and chemical properties of soft / hard substrates, and ensure that the electrical interface always maintains stable connection in the stretching deformation process, and successfully realizes the universal welding of flexible, stretchable and rigid materials and devices.
Owner:SUZHOU UNIV
Reed holding and reed forming apparatus for double reed musical instrument
The subject matter of the present invention is a reed holding and reed forming apparatus for a double reed musical instrument, made of a hard substrate shape holding material (e.g., metal). The internal forming design of the reed retaining and reed forming apparatus enables the generation and development of good sound production that can be repeated once again. The external design helps ensure good joining of the planed reed plates, thereby enabling good vibration of the reed plates and enhancing durability of the reed plates. Therefore, the reed holding and reed forming apparatus adjusts the vibration sound generated by the reed plate and transmits the vibration sound to the musical instrument in a manner that always can be accurately reproduced and is good. Thus, we manufacture the apparatus from a metal or shape-retaining material, in which case the reed is well attached to the metal or shape-retaining material, the internal shape always remaining unchanged. The invention can be used in all double reed musical instruments, such as Bason, clarinet, British Round Number and the like, and the invention is constructed together with or separately constructed with related tubes.
Owner:维罗妮卡·基斯·特里普蒂
Solvent-regulated flexible electronic ink shaping and transfer printing method
The invention relates to the technical field of flexible electronic transfer printing, and discloses a solvent-regulated flexible electronic ink shaping and transfer printing method which comprises the following steps: S1) preparing alloy ink; (S2) the alloy ink is printed on a hard substrate with low surface energy in a direct writing printing mode, a preset circuit pattern is formed, and in the printing process, the circuit alloy ink is kept in a molten state by heating the hard substrate; s3) after printing is finished, heating the hard substrate, and preferentially volatilizing the low-boiling-point solvent by utilizing the boiling point difference, so that the alloy ink is converted into a semi-solid viscoelastic circuit from a molten state to be pre-cured and shaped; s4) integrally transferring the semi-solid viscoelastic circuit from the hard substrate to a flexible substrate; and S5) removing the high-boiling-point solvent in the circuit after the transfer printing is completed. The preparation process of a traditional transfer printing process is optimized through a composite solvent system and a gradient heating process. The flowability and wettability of the direct-writing printing alloy ink are improved by introducing the low-boiling-point solvent; by introducing a high-boiling-point solvent, the elasticity and adhesion of the circuit are improved, and the influence of stress on the circuit during transfer printing is reduced; the influence of the coffee ring effect in the alloy ink volatilization process is reduced through the solvent boiling point difference design, and the circuit pattern precision is improved.
Owner:EAST CHINA UNIV OF SCI & TECH +1
Microneedle patch having improved deformability and microneedle patch kit including same
The present disclosure relates to a microneedle patch, wherein the microneedle patch includes a microneedle array, the microneedle array including a central portion and a plurality of peripheral portions connected to the central portion and surrounding the central portion, and the peripheral portion is disposed to be spaced apart from an adjacent peripheral portion, wherein the microneedle array includes a hard planar substrate and a plurality of microneedles disposed on the hard substrate, and the peripheral portion is folded through a gap between the adjacent peripheral portion, and the microneedle patch may be attached even to a curved affected area with high adhesion.
Owner:NICO MEDICAL CO LTD
Multi-modal diamond abrasive package or slurry for polishing hard substrates
ActiveEP3918023B1Other chemical processesSemiconductor/solid-state device manufacturingSlurryHard substrate
A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the plurality of diamond abrasives has a particle size. Wherein, the multi-modal diamond abrasive package or slurry includes a first diamond abrasive and a second diamond abrasive. The first diamond abrasive has a first particle size, and the second diamond abrasive has a second particle size. Where, the first particle size of the first diamond abrasive is smaller than the second particle size of the second diamond abrasive.
Owner:PUREON INC
Preparation method of super-soft transparent solar cell
The application relates to the technical field of solar cells, in particular to a preparation method of an ultra-flexible transparent solar cell, which comprises the following steps: preparing a peelable high-transparency ultra-flexible substrate on the surface of a hard substrate, constructing a heterojunction on the ultra-flexible substrate by using a photoelectric conversion material capable of effectively utilizing ultraviolet light or infrared light, preparing a transparent single-junction solar cell or a solar cell assembly with high transmittance in a visible light band by adjusting the proportion and film thickness of the heterojunction material, and finally separating the ultra-flexible substrate and the hard substrate to realize the preparation of the ultra-flexible transparent solar cell and the assembly thereof.
Owner:WEST LAKE OPTOELECTRONICS TECH (HANGZHOU) CO LTD