Manufacturing method for flexible element

A component and flexible technology, applied in the direction of electrical components, final product manufacturing, sustainable manufacturing/processing, etc., can solve problems such as increased manufacturing costs, unstable quality, poor heat resistance of release layers or adhesives, etc. , to achieve the effect of reducing deviation and cost

Active Publication Date: 2011-11-02
ETERNAL MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, using the release layer and adhesive, the manufacturing process is more complicated, which also increases the manufacturing cost, and the used release layer or adhesive has poor heat resistance, and the general component manufacturing process often needs to be operated at a high temperature exceeding 200°C , so it is easy to cause unstable quality

Method used

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  • Manufacturing method for flexible element
  • Manufacturing method for flexible element
  • Manufacturing method for flexible element

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Embodiment Construction

[0043] The term "release area" used herein refers to the area where the flexible substrate is to be separated from the rigid carrier in the method of the present invention.

[0044] The term "adhesion region" used herein refers to the region where the flexible substrate and the rigid carrier are to be in contact through the adhesion promoting layer in the method of the present invention.

[0045] As used herein, the term "a portion of the flexible substrate layer" refers to about 50% to about 99.9% of the flexible substrate layer, preferably about 80% to about 99.5% of the flexible substrate layer.

[0046] The rigid substrate used in the present invention can be any rigid substrate known to those skilled in the art, including but not limited to: glass, quartz, wafer, ceramic, metal or metal oxide.

[0047]The key point of the method of the present invention is: before forming the soft substrate layer, an adhesive layer with a predetermined pattern is formed on the rigid carri...

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Abstract

The invention provides a manufacturing method for flexible elements, which is characterized in that a hard substrate is provided and formed with an adherence layer with predetermined patterns. A soft base layer is formed on the hard substrate. Part of the soft base layer contacts with the hard substrate so as to form a first contact interface and the rest part of the soft base layer contacts with the adherence layer so as to form a second contact interface. At least one element is formed on the surface opposite to the contact surface of the soft base layer with the first contact interface. The soft base layer is separated from the hard substrate form the first contact interface.

Description

technical field [0001] The present invention relates to a method for manufacturing flexible components, in particular to a method for easily separating a component with a flexible substrate from a rigid carrier. Background technique [0002] Currently, flat panel displays (Flat Panel Displays; FPDs) have replaced traditional cathode ray tubes (CRTs) and become the mainstream of the market. Known flat panel displays include liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting displays (OLEDs), and the like. Most flat panel displays are fabricated on rigid substrates such as glass. The use of such rigid displays is limited due to their lack of flexibility. Therefore, flexible displays that replace traditional glass substrates with flexible substrates have become one of the current research priorities. [0003] Flexible substrates can be divided into three categories, namely thin glass substrates, metal foil substrates and plastic substrates. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L51/00
CPCH01L2221/6835H01L21/6835Y02E10/549H01L2221/68318H01L51/003H01L51/0097H01L2221/68381H10K71/80H10K77/111Y02P70/50G09F9/00
Inventor 吴仲仁李传宗安治民石一中何长鸿
Owner ETERNAL MATERIALS CO LTD
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