78results about "Force measurement using piezo-resistive materials" patented technology

This application relates to pressure detection technology and discloses a flexible pressure acquisition system, device, and method based on a parallel architecture. It includes a signal acquisition and control module, a pressure sensor array, and an environmental monitoring module. The signal acquisition and control module includes an MCU and analog front-end circuitry. The analog front-end circuitry includes K parallel analog multiplexers. The MCU internally has K corresponding ADC channels. The pressure sensor array is electrically connected to the signal acquisition and control module, and its M×N pressure sensing units are divided into K parallel acquisition sub-regions. Each sub-region's column electrodes are connected to an analog multiplexer input channel. The environmental monitoring module acquires real-time environmental parameters. The MCU synchronously triggers all ADC channels to synchronously convert the pressure signals of the K sub-regions, and combines the environmental parameters with an adaptive filtering algorithm for compensation and correction, outputting pressure distribution data. This application can improve the sampling rate and measurement accuracy of the pressure acquisition system.

This invention discloses a method for fabricating a near-zero temperature coefficient thin-film pressure sensor with a wide temperature range. The purpose of this invention is to address the common problem of insufficient environmental adaptability in existing flexible thin-film sensors, particularly the significant performance degradation under extreme temperature conditions. This invention proposes a wide-temperature-range intrinsically self-compensating flexible pressure sensor based on a PVDF / CFT / Cu composite sensing material thin film. This sensor achieves a near-zero temperature coefficient of resistance for the composite material by synergistically introducing carbon fiber tubes with negative temperature coefficients and copper nanoparticles with positive temperature coefficients into the flexible PVDF matrix and dynamically controlling their ratio, thereby constructing a temperature self-compensation mechanism at the material level. This invention provides an effective material solution for developing next-generation high-reliability, wide-temperature-range adaptive flexible sensing systems.

The invention relates to a method of production of a conductive layer (3) for sensors (1), comprising the steps of: a) dissolving thermoplastic polyurethane in a solvent, b) adding graphite, c) processing the thus obtained mixture in a mixer, preferably in high shear mixer, even more preferably in a planetary high shear mixer, d) casting said homogeneous mixture onto one or more supports thereby making one or more samples and e) drying said one or more samples to remove the solvent. Each of said samples constitutes a conductive layer. Therefore, the method of production according to the invention comprises a limited number of steps compared to currently known methods. Furthermore, these steps are easy to implement and do not require complex and / or expensive processes. Thanks to this method of production, it is therefore possible to obtain a conductive layer (3) and, correspondingly, a sensor (1) in a cost-effective manner.

A flexible three-dimensional (3D) pressure sensing device includes a force-sensitive component composed of a single piece of flexible and electrically conductive material with piezoresistive properties, a plurality of 3D transmission components distributed on a surface of the force-sensitive component, and a plurality of electrodes arranged on a periphery of the force-sensitive component. The 3D transmission components are configured to transmit pressure to the force-sensitive component, causing characteristic corresponding changes in electrical resistance of the force-sensitive component, the pressure including a normal pressure and shear pressure. The plurality of the electrodes are configured to lead out resistance distribution data of the force-sensitive component through wires, so that a backend circuit device calculates 3D pressure distribution information of the flexible 3D pressure sensing device at each position on the surface at each time point based on the resistance distribution data.

The present invention relates to a stretchable pressure sensor array, the stretchable pressure sensor array according to one example of the present invention comprises a sensor sheet having a thickness of a flexible material; a plurality of conductive pillars formed by self-aligning magnetic particles in a thickness direction of the sensor sheet; an upper electrode formed on the portion of the sensor sheet; and a lower electrode formed on the lower portion of the sensor sheet, and when pressure is applied from the upper side or lower side of the sensor sheet in a thickness direction, a conductive path is formed between the upper and lower electrode and the conductive pillars so that current flows.

The application relates to a flexible tactile sensor prepared by a laser direct writing graphene method and belongs to the technical field of flexible sensors. The upper half of the sensor is a graphene film, the lower half is a silver electrode film, the middle is a TPU film connecting layer, and the bottom encapsulation layer is encapsulated. The graphene film is generated by scratching the surface of a PI film with a 455nm laser, a mask plate pattern designed in advance in CAD is engraved by laser, a silver electrode film is deposited on the PI film by a physical vapor deposition method, then the two are connected in a face-to-face mode through a high-temperature melted TPU film, and a waterproof tactile sensor array is formed after being combined by pp encapsulation. The sensor has wide application potential in the fields of bionic robots, intelligent prostheses and the like. The sensor has the characteristics of high sensitivity, wide detection range, reliable piezoresistive performance and high real-time performance, the preparation process is simple, the cost is low, and the problems of high cost and complexity in the preparation of previous micro-nano structures are solved.

A plate heat exchanger is disclosed in which several heat exchanger plates are held together in a pressure frame between a frame head equipped with media connections and a cover by means of a clamping device to form a plate stack. A flow chamber is formed between each adjacent plate by a circumferential seal. The flow chambers are alternately connected to two different pairs of media connections, so that adjacent flow chambers can be supplied with different heat exchange media. To enable monitoring of the seal condition, at least one pressure sensor is arranged on the frame head along a contour line of the circumferential seals, which measures the surface pressure acting on the circumferential seals in the plate stack.

An auxetic force-sensing resistor (“force sensor”) sensor system is disclosed suitable for manufacturing via common 3D printing methods like Fused Deposition Modeling (FDM) without extensive post-processing. The force sensor may comprise a plurality of interconnected cells, and may be at least partially constructed of an elastic conductive material, such as conductive TPU. Each cell may feature sidewalls that may be configured to collapse inwardly when a compressive force is applied to the cell's top or bottom. This inward collapse may create new, lower-impedance points of contact within the cell's structure, which may thereby reduce the sensor's overall electrical resistance in a controlled manner proportional to the applied force.

Apparatuses that include a junction-isolated semiconductor strain gauge and methods for manufacturing a junction-isolated semiconductor strain gauge are disclosed. In a particular embodiment, an apparatus comprises a silicon chip that includes a silicon substrate and a semiconductor strain gauge. In this embodiment, the semiconductor strain gauge includes a plurality of resistors formed by locally doping the silicon substrate and biasing the silicon substrate such that the resistors of the plurality of resistors are junction-isolated. The silicon chip also includes a field shield layer to isolate an output signal of the semiconductor strain gauge from external electrical fields.

The application relates to the technical field of pressure-sensitive materials, and provides a self-repairing pressure-sensitive material based on solvent replacement and a preparation method and application thereof, the pressure-sensitive material comprising a hydrogel; the hydrogel comprises polyvinylpyrrolidone and gallic acid; a dynamic hydrogen bond network is formed between amide carbonyl in a molecular chain backbone of at least part of the polyvinylpyrrolidone and hydroxyl of at least part of the gallic acid; the dynamic hydrogen bond network changes a fluid structure of the hydrogel with strain change; and intermolecular pi-pi stacking structures are formed between at least part of the gallic acid molecules. The preparation method is a solvent replacement method for preparing the hydrogel, and the application has obvious advantages in aspects of preparation process simplicity, bacteriostatic safety, pressure-sensitive performance and durability, and can effectively solve problems of poor mechanical matching, unstable interface and easy damage of existing hydrogel pressure sensors, and has outstanding technical effects.

The present application discloses a conductive material and a method for preparing the same, a pressure sensor, a battery cell, and an electrical device. The conductive material includes a flexible substrate and conductive particles dispersed in the flexible substrate, wherein the conductive particles comprise a temperature rise material and a temperature drop material, the temperature rise material is a material having a resistivity that increases as the temperature rises, the temperature drop material is a material having a resistivity that decreases as the temperature rises, and the ratio of the temperature drop material to the temperature rise material is set so that within a temperature range of -40°C to +200°C, the absolute value of the change rate of the resistivity of the conductive material is less than or equal to 0.01. By mixing the temperature rise material and the temperature drop material, the resistivity of the mixed material does not change significantly when the temperature changes, that is, the resistivity of the mixed material is substantially not affected by the temperature, such that the detection sensitivity of a sensor at different temperatures is improved, and detection errors caused by a temperature change are reduced.

The invention relates to a detection device comprising: a flexible substrate (20) comprising a first surface (30) and a second surface opposite the first surface; a plurality of transducers (21, 22) attached to the substrate; and a plurality of electrical tracks (23, 24) extending over the substrate. Each transducer has: an electroactive polymer film (50); and a first and a second electrode (54) that are stacked on either side of the film. Each of the first and second electrodes of the corresponding transducer (21, 22) has a conductive layer in contact respectively with a first face and a second face (66) of the film.

Instrumented nut, clamping sleeve, clamping device and method for tightening such a nut. The invention relates to an instrumented metal nut (10b) comprising a tubular body having a polygonal drive surface (14). The nut comprises, on at least one annular portion (34) of the outer surface: an electrically insulating layer (36) applied to the annular portion; a piezoresistive conductive polymer (38) whose ohmic resistance varies according to a stress exerted during tightening of the nut on a threaded fastener, said conductive polymer being applied to the electrically insulating layer; and at least two electrodes (40). Figure for the abstract: Figure 2

The application discloses a MEMS pressure sensor chip and a preparation method thereof, and belongs to the technical field of pressure sensor chips. The sensor chip is provided with two separated double-metal layer structures of a metal wiring layer (a first metal layer) and a shielding metal layer (a second metal layer), realizes independent division and collaborative optimization of circuit connection function and electromagnetic shielding function, and the independent and complete shielding metal layer can effectively isolate external environmental electromagnetic interference, reduces the influence of the external environmental electromagnetic interference on sensitive sensing elements such as a pressure-sensitive resistor, and greatly improves the signal-to-noise ratio and working stability of the sensor. Meanwhile, the metal wiring layer can be focused on low-resistance characteristics and fine wiring design, the shielding metal layer can be focused on full-coverage layout and good ground performance optimization, independent regulation and control of the two is realized, mutual interference is avoided, and the core electrical performance and shielding performance of the sensor chip are further ensured.

A wireless force sensor includes a flexible structure supported opposing a rigid structure with a gap between the flexible structure and the rigid structure. Contact traces on opposing surfaces of the flexible structure and the rigid structure form transmission lines. The contract traces are aligned to contact when a force is applied the flexible structure to cause contact between the traces on the opposing surfaces. Radio-frequency switches modulate a reflected signal from the transmission lines. An antenna receives an interrogation signal transmits the reflected signal.

This invention relates to the field of flexible electronic device technology, and particularly to a flexible pressure sensor, electronic skin, and wearable device based on a sandwich structure. The device includes an upper electrode layer, a middle sensing layer, and a lower electrode layer, which are sequentially bonded together from top to bottom. The upper electrode layer has a plurality of first electrodes arranged in an array, and the lower electrode layer has a plurality of second electrodes arranged in an array. The spacing between adjacent first electrodes is smaller than the spacing between adjacent second electrodes. This invention provides a wide-range flexible pressure sensor, electronic skin, and wearable device with a simple structural design, high sensitivity, and stable performance.

The application provides a high-precision sliding information sensing sliding tactile sensor patch, a sliding information sensing method and a preparation method. The sliding tactile sensor patch adopts a ladder-shaped electrode design, which comprises fixedly and spacedly arranged rectangular electrodes; the widths of the rectangular electrodes are consistent, and the lengths are arranged in an arithmetic progression; the signal output by the signal detection end of the ladder-shaped electrode is a periodic oscillation signal, the oscillation frequency represents the sliding speed of a sliding object, the oscillation number of the oscillation signal represents the sliding displacement of the sliding object, and the positive and negative of the low-frequency signal of the oscillation signal represents the sliding direction of the sliding object. It can be seen that the ladder-shaped electrode can encode and retain the sliding speed, sliding direction and sliding displacement information generated in the sliding process, and the sliding information can be decoupled and restored in subsequent processing; compared with the limitation that the traditional sliding tactile sensor can only detect whether sliding occurs, the sliding information detected by the sensor has higher dimensions, which is helpful for the intelligent gripper to accurately judge the gripping state.

The present disclosure relates to piezoresistive sensors. In particular, the present disclosure relates to a piezoresistive sensor element and to a piezoresistive pressure sensor that detects mechanical stress acting on a membrane and compensates for long-term and sterilization drifts. The piezoresistive sensor element (100) comprises a substrate, which in operation is subjected to mechanical stress in response to a measurand to be measured, a first array of at least four sensitive piezoresistors (114), wherein the sensitive piezoresistors (114) are arranged on the substrate and are connected to form a first Wheatstone bridge for generating a first bridge signal, a second array of at least four in-sensitive piezoresistors (122), wherein the in-sensitive piezoresistors (122) are connected to form a second Wheatstone bridge for generating a second bridge signal, wherein the sensitive piezoresistors (114) have a stress sensitivity which is higher than the stress sensitivity of the in-sensitive piezoresistors (122), and wherein an output signal of the piezoresistive sensor element (100) is generated based on a difference of the first and second bridge signals. Furthermore, the present disclosure relates to sterilizable medical devices, sterile medical devices, and invasive medical devices.

According to one embodiment, a pressure sensor manufacturing method includes forming a transistor above a support substrate, forming an insulating layer covering the transistor, forming a detection electrode connected to the transistor, and a common electrode, on the insulating layer, and forming a pressure-sensitive layer by applying a pressure-sensitive layer material onto the detection electrode by a printing method.

According to an aspect of the present invention, there is provided a cell assembly comprising: a cell; a cell enclosure configured to hold the cell; and one or more sensors for monitoring characteristics of the cell to determine a safety value of the cell; wherein one of the one or more sensors comprises a printed sensor for monitoring at least one of strain or temperature associated with the cell, wherein the printed sensor has been applied to the cell and is configured to sense the difference in at least one of strain or temperature between the cell when charged and the cell when discharged to identify the safety value.

The application discloses a kind of based on pressure pain sensation's bionic flexible touch sensor and robot active protection method, it is related to bionic robot flexible sensing and safety protection field.The sensor adopts DIW integrated printing process, including flexible silica gel base, cross intersection row and column conductive grid and spherical cap micro convex pressure resistance sensing unit, no layering, full flexibility, can adapt to robot complex curved surface whole body.It is based on the critical pressure intensity of sensor material destruction as benchmark, constructs three-stage progressive quantization bionic pain sensation system, through pain sensation value driving robot executes graded protection action, core through expanding force area to eliminate structural risk from root;While constructing whole body partition density bionic skin system, fusion foot bottom pressure and gyroscope data realizes walking balance adjustment.The application gives consideration to sensing accuracy and engineering cost, greatly improves the bionic sensing ability of humanoid robot, operation safety and structure life.

The application provides a CMOS-MEMS integrated pressure sensor and a preparation process thereof. The pressure sensor comprises a bonded MEMS wafer and a CMOS wafer; a bonding sealing area and a PAD vertical interconnection structure in the bonding sealing area are arranged between the MEMS wafer and the CMOS wafer; the bonding sealing structure is formed by eutectic bonding of a metallization layer and a metal solder ball formed in corresponding bonding areas of the two wafers, and the bonding sealing structure surrounds a sensitive element to form a sealed cavity; the PAD vertical interconnection structure comprises conductive bumps respectively formed on the two wafers, the two conductive bumps are aligned with each other and bonded, and electrical interconnection between the MEMS wafer and the CMOS wafer is realized. The electrical interconnection of the pressure sensor realizes monolithic integration, not only improves the problems of increased signal transmission loss, reduced detection precision caused by additional parasitic resistance, capacitance and inductance introduced by wire bonding, and external noise interference, but also improves the service life and reliability, and reduces the size of the chip.

The application discloses a silicon-based piezoresistive differential pressure pressure sensor packaging structure, a method and a limiting assembly device, relates to the technical field of pressure sensor packaging, and comprises a metal base, an adapter and a silicon-based piezoresistive pressure sensitive chip. The metal base is internally provided with a penetrating internal air channel; the adapter is made of glass, is fixed to the upper surface of the metal base through a first adhesive layer, and is internally provided with a through hole in communication with the internal air channel of the metal base; the first adhesive layer is a polymer adhesive layer with stress buffering capacity; the silicon-based piezoresistive pressure sensitive chip is fixed to the upper surface of the adapter through a eutectic bonding layer and corresponds to the position of the through hole, so that the measured pressure transmitted by the internal air channel can act on the chip. The application can simultaneously consider the mechanical stability of chip connection, ultrahigh air tightness, excellent thermal stress adaptability and long-term measurement precision stability.

A sensor having multiple sensor elements that sense six degrees of freedom of force on a touch layer. The sensor includes a computer that sends prompt signals to the sensor elements and reconstructs the six degrees of freedom of force on the layer from the data signals received from the touch sense elements. A method of sensing force. A robotic hand with fingers equipped with sensors at the ends. Alternatively, the sensor includes a ribbon cable.

To provide a stretchable device having high sensitivity capable of detecting the amount of strain.SOLUTION: A strain gauge of a stretchable device includes first and second strain gauges. A wiring includes: a first potential line for applying first potential; a second potential line for applying second potential; a connection line for connecting the first potential line with the second potential line; a first signal line for detecting predetermined potential; and a second signal line for detecting predetermined potential. The predetermined potential detected by the first signal line is third potential at a first connection point; the predetermined potential detected by the second signal line is fourth potential at the midpoint of the connection line; one of the first and second strain gauges is an inner peripheral strain gauge arranged on the inner peripheral side of a hinge part; the other is an outer peripheral strain gauge arranged on the outer peripheral side of the hinge part; and a variation in the resistance of the strain gauge is detected by a potential difference between the third and fourth potentials.SELECTED DRAWING: Figure 7

A device for determining force on a cutting tool insert includes a cutting tool body configured to couple the cutting tool insert to a cutting machine, the cutting tool body defining a cavity therein. The device also includes a sensor arrangement disposed in the cavity and protruding therefrom. The sensor arrangement includes a loading body, a sensor comprising a sensor ink electrically isolated from the cutting tool body and the loading body, the sensor disposed between a bottom wall of the cavity and the loading body, and connectors coupled to the sensor ink and extending out of the cavity for connection to a data acquisition device to determine a force applied to the sensor. The cutting tool insert is coupled to the sensor arrangement and spaced from the cutting tool body such that forces on the cutting tool insert are transferred to the sensor through the loading body.

The application discloses a kind of based on neural synapse effect's tactile perception system, comprising: tactile sensing unit, synchronous generation response contact event's triboelectric transient signal and response pressure size's piezoresistive slowly varying signal;Signal processing unit receives and handles triboelectric transient signal and piezoresistive slowly varying signal, including: event detection module, the start and stop time of contact event is extracted from triboelectric transient signal, and event trigger signal is output;Pulse coding module, in response to contact event start signal, the amplitude of piezoresistive slowly varying signal is mapped into pulse frequency, generates and generates pulse sequence with pressure size positive correlation;In response to contact event end signal, stop the generation of pulse sequence.Compared with prior art, the application realizes the real-time fusion of dual-mode information and the neural pulse output of class in hardware level by event-driven pulse coding mechanism, realizes low-power and directly compatible tactile perception with neural morphological computing architecture.

The application discloses a bionic positioning sensor and a detection device, and relates to the field of sensors.The bionic positioning sensor comprises a base, a mounting hole arranged at the center of the base, a plurality of piezoresistive sensing units arranged on the upper surface of the base, and uniformly distributed along the periphery of the mounting hole.The piezoresistive sensing units are arranged along the radial direction of the base and are electrically connected with a multi-channel lead circuit to form a resistance detection loop.There is a gap between two adjacent piezoresistive sensing units, and the gap is arranged in a non-linear manner along the radial direction.A movable rod unit is inserted into the mounting hole and can be offset relative to the base to press the piezoresistive sensing units, convert the direction of external disturbance into the asymmetric distribution of multi-channel resistance signals, realize directional characteristic acquisition, eliminate the blind area through the non-linear gap, and realize 360-degree omnidirectional, continuous and high-resolution identification of the disturbance source.