107results about "Electrostatic transducers" patented technology

This application provides an earphone and a terminal device. The earphone includes a housing with a cavity structure inside, and a sound outlet communicating with the cavity structure. A first sound unit, a second sound unit, and a third sound unit are disposed within the cavity structure, and the third sound unit is a microelectromechanical system (MEMS) unit. The sound frequency of the second sound unit is greater than but less than the sound frequency of the first sound unit. The third sound unit, being a MEMS unit, is located between the first sound unit and the sound outlet. By incorporating the first sound unit, the second sound unit, and the MEMS unit within the earphone, the output bandwidth of the earphone can be fully guaranteed, achieving better full-frequency coverage and superior sound quality.

The present invention is provided with an acoustic MEMS element (100) and an acoustic path (P). The acoustic path (P) is connected to the acoustic MEMS element (100). Ultrasonic waves generated through vibration of the acoustic MEMS element (100) can acoustically resonate in the acoustic path (P). This ultrasonic transducer has, through a combination between sympathetic vibration of the acoustic MEMS element (100) and acoustic resonance in the acoustic path (P), sound pressure-frequency characteristics in which a plurality of sound pressure peaks appear. When f0 represents the sympathetic vibration frequency of the acoustic MEMS element (100) and f1 represents the acoustic resonance frequency in the acoustic path (P), the relationship -20≤(f1-f0) / f0×100≤80 is satisfied.

The application provides an acoustic piezoelectric film device structure, comprising: a support body; a piezoelectric film layer structure covering an area surrounded by the support body and fixedly connected to the support body at the periphery, the piezoelectric film layer structure comprising a piezoelectric layer and an electrode layer covering the upper and lower surfaces of the piezoelectric layer, the piezoelectric film layer structure comprising an inner area and an outer area surrounding the inner area, and the inner area and the outer area having an electrode separation zone therebetween, the electrode separation zone separating the electrode layer into a central electrode layer and a peripheral electrode layer. The acoustic piezoelectric film layer structure designed by the application can reduce the warping degree of the piezoelectric film layer structure and control the increase of the width of the acoustic transmission channel of the slit area caused by warping, the electrode layer of the application fully covers the surface of the piezoelectric film layer, and the novel separation and series or parallel electrical connection mode between the longitudinal multiple piezoelectric layers and the transverse multiple electrode layers can realize the electromechanical conversion of the whole area of the piezoelectric film layer and improve the electromechanical conversion efficiency of the piezoelectric film device.

Provided in the present invention is a loudspeaker apparatus. The loudspeaker apparatus comprises: a support structure, the support structure comprising a support body provided with a sound generation cavity, and an annular sound hole formed at one end of the support body; an ultrasonic generation unit, the ultrasonic generation unit being located inside the sound generation cavity and fixed on the inner peripheral side of the support body, and being used for generating symmetrical ultrasonic waves; and a demodulation structure, the demodulation structure comprising a diaphragm and a plurality of fixing portions extending from the outer peripheral side of the diaphragm and distributed at intervals, wherein the fixing portions are fixed to the inner side of the sound hole and suspend the diaphragm in the sound hole, the diaphragm and the sound hole are spaced apart from each other and enclose a gap together with the fixing portions, and the ultrasonic waves generated by the ultrasonic generation unit drive the demodulation structure to vibrate, so as to adjust the size of the gap. Compared with the prior art, the loudspeaker apparatus of the present invention has a high acoustic demodulation efficiency, a good effect in increasing the amplitude of a vibration system, and a good acoustic performance.

To provide an ultrasound transducer and a method.SOLUTION: An ultrasound transducer may include: a plurality of capacitive ultrasound transducer elements; and a base having a maximum dimension sized and shaped to be disposed within an external ear canal, the plurality of capacitive ultrasound transducers being mounted on the base. Each capacitive ultrasound transducer element and the ultrasound transducer are specifically constructed to achieve select desired performance characteristics. The ultrasound transducer may have an angular beam spread through a gaseous medium of greater than 15 degrees and an attenuation loss through the gaseous medium of greater than 10 dB measured at a distance 12.5 mm to 25 mm along a primary transmission axis of the ultrasound transducer. The ultrasound transducer may be particularly useful for characterizing fluid behind an ear drum to diagnose otitis media.SELECTED DRAWING: Figure 6A

The utility model relates to the technical field of acoustics, in particular to a bone conduction MEMS microphone structure. Comprising a first PCB, a second PCB and a third PCB, the upper end face of the second PCB is provided with an electro-acoustic conversion chip MEMS and an electric signal processing chip ASIC, the electro-acoustic conversion chip MEMS and the electric signal processing chip ASIC are connected through a gold wire, the lower end face of the second PCB is provided with a vibrating diaphragm assembly, and the first PCB, the second PCB and the third PCB are arranged in a stacked mode. Vibration is transmitted to the microphone through the skeleton, the vibrating diaphragm assembly starts to vibrate, so that the pressure in the cavity is changed, the changed pressure is transmitted to the vibrating diaphragm assembly, the vibrating diaphragm assembly vibrates, a vibration signal is converted into an electric signal through the electro-acoustic conversion chip MEMS, and the electric signal is amplified and processed by the electric signal processing chip ASIC and then output. According to the design, a mature packaging process is utilized, so that the production process of the bone conduction MEMS microphone is simpler, and the production efficiency is improved.

Capacitive Micromachined Ultrasonic Transducer (CMUT) device, manufacturing method, and system, and method of use. The CMUT has a substrate, a peripheral wall defining the boundary of the cavity, and a membrane joined to the peripheral wall. Projecting from the substrate is a post sealed by the peripheral wall. The post contacts but is not joined to the membrane, forming a cavity that resonates at a specific acoustic frequency. The CMUT is disposed within a patient's vascular system in a stent, catheter, or other small device. The CMUT responds to the acoustic frequency emitted from the device outside the body and thereby operates as a sensor for various characteristics of the environment surrounding the CMUT within the body.

The utility model relates to an MEMS chip. The MEMS chip comprises a substrate; the sensor comprises a back plate and a first vibrating diaphragm and a second vibrating diaphragm which are respectively positioned on two sides of the back plate, and the first vibrating diaphragm and the second vibrating diaphragm are connected through a plurality of connecting columns; the connecting structure is connected with the substrate and the sensor, so that the back plate and the substrate are relatively fixed, the first vibrating diaphragm and the second vibrating diaphragm can vibrate relative to the substrate, the connecting structure comprises a first connecting plate parallel to the back plate, the first connecting plate annularly surrounds the first vibrating diaphragm and is connected with the first vibrating diaphragm, an isolation groove is formed in the first connecting plate and surrounds the first vibrating diaphragm, and the isolation groove is communicated with the first vibrating diaphragm. The isolation groove is filled with an insulating material to form an isolation ring, the isolation ring enables the first diaphragm and the part of the first connecting plate located outside the isolation groove to form insulation, the substrate is located on one side of the first connecting plate away from the second diaphragm, and the part of the first connecting plate located outside the isolation groove is connected with the substrate. According to the invention, the parasitic capacitance generated between the first diaphragm and the substrate can be reduced, the sensitivity of the sensor is improved, and the sensitivity of the MEMS chip is improved.

The invention provides an MEMS (Micro Electro Mechanical System) packaging structure and electronic equipment. The MEMS packaging structure comprises a substrate, back electrodes and a vibrating diaphragm, the back electrodes comprise a first back electrode and a second back electrode, the first back electrode is connected with the substrate, and the second back electrode is connected with the side, away from the substrate, of the first back electrode; the vibrating diaphragm is arranged on the back electrode; wherein the first back pole comprises a first sound hole, the second back pole comprises a second sound hole, the central axis of the first sound hole and the central axis of the second sound hole are mutually staggered, and at least part of orthographic projection of the first sound hole towards the vibrating diaphragm coincides with at least part of orthographic projection of the second sound hole towards the vibrating diaphragm. According to the invention, the use performance of the MEMS packaging structure can be improved.

The ultrasonic transducer (100) comprises a stack of at least two membranes (10, 20) bonded to a substrate (50). An electric circuit (30) connected to the electrodes and having a controller is configured to apply a first electric signal (S11) to a first electrode (11) of the first membrane (10) and a second electric signal (S21) different from the first electric signal to a second electrode (21) of the second membrane (20). The first electric signal and the second electric signal (S11, S21) are configured to apply a varying voltage (ΔV1, ΔV2) between the first electrode (11) and the second electrode (12) during a vibration period (T1, T2) of each of the membranes (10, 20). A first electrode (11) on the first membrane (10) is configured to interact with the second electrode (21) on the second membrane 20 with an electrostatic force (Fe) that varies during each oscillation period (T1, T2) in response to a varying voltage (ΔV1, ΔV2).

The utility model discloses a packaging structure and electronic equipment. The packaging structure comprises a substrate, a shell, a vibration pickup assembly, a supporting plate, an MEMS chip and an ASIC chip. The shell is arranged on the substrate, and an accommodating cavity is formed between the shell and the substrate; the vibration pick-up assembly is arranged on the substrate and located in the containing cavity, and the vibration pick-up assembly is used for picking up vibration signals; the supporting plate is stacked on the side, away from the base plate, of the vibration pickup assembly, and a through hole is formed in the supporting plate. The MEMS chip is arranged on one side, far away from the vibration pick-up assembly, of the supporting plate and is opposite to the through hole, and a vibration signal picked up by the vibration pick-up assembly can be transmitted to the MEMS chip through the through hole; and the ASIC chip is packaged in the accommodating groove and is electrically connected with the MEMS chip and the substrate respectively. The packaging structure provided by the utility model can improve the acoustic performance of the bone voiceprint sensor.

An ultrasonic pump includes a mechanical layer with at least one membrane; and an acoustic channel. A portion of the at least one membrane comprises at least a part of the acoustic channel so that a movement of the membrane changes the dimension of the acoustic channel. The membrane is configured to oscillate at ultrasonic frequencies and generate at least one audio signal.

The present invention discloses a touch acoustic display unit and a device. The touch acoustic display unit includes a first substrate, a functional region, and a second substrate which are sequentially stacked from top to bottom. The functional region includes a touch region and an acoustic region. Both the touch region and the acoustic region are located between the first substrate and the second substrate and are provided at intervals in the horizontal direction. The first substrate and the second substrate are shared. The acoustic region is an electrostatic ultrasonic transducer. In the present invention, by combining the electrostatic ultrasonic transducer and the touch screen, the display device can direct sound towards the screen on one side and can be touched on the other side, without interference between the two sides, realizing screen-directed sound, listening in private to avoid interference with surrounding people, and also providing a touch function to expand its application range.

Some demonstrative embodiments include apparatuses, systems and / or methods of testing an acoustic device, an acoustic component, and / or a device or system including one or more acoustic devices. For example, an acoustic device tester may be configured to process input acoustic information of a tested acoustic device to determine a tested acoustic value distribution for the tested acoustic device in a plurality of frequency sub-bands; to determine whether or not the tested acoustic device meets a predefined testing criterion based on the tested acoustic value distribution and a reference profile defining a plurality of reference values corresponding to the plurality of frequency sub-bands, respectively; and to generate an output to indicate whether or not the tested acoustic device meets the predefined testing criterion.

DETAILED DESCRIPTION A micromachined ultrasound transducer (MUT) array with grooves that reduce crosstalk between the MUTs to mitigate unwanted artifacts in ultrasound images, as well as a method of operating the same, are described.

The utility model discloses a capacitive sound head device, which comprises a shell, a polar plate, a sound film and a PCB (Printed Circuit Board), the shell is provided with an accommodating cavity, and the upper surface of the shell is provided with a plurality of sound inlet holes; the polar plate is arranged in the accommodating cavity; the PCB is arranged in the containing cavity and located below the voice diaphragm, and the PCB is connected with the voice diaphragm and the polar plate. The middle part of the upper surface of the shell is concaved downwards to form the concave position, the central position of the concave position protrudes upwards to form the convex part, and the concave-convex structure in the middle of the shell disperses airflow transmission flow and reduces instantaneous impact force of high and strong sound signals on the diaphragm, and the sound diaphragm is arranged in the accommodating cavity and is positioned below the polar plate, so that the sound transmission efficiency is improved. During use, airflow generated by sound source signal action firstly passes through the holes in the polar plates and then acts on the surface of the voice diaphragm, the voice diaphragm can only move and extrude in the opposite direction of the polar plates, the distance between the two polar plates is only increased, and diaphragm flapping and even diaphragm sticking caused by instantaneous overload are avoided, so that the sound effect is ensured, and the phenomena of distortion, wheat spraying and the like are effectively prevented.

An apparatus includes a chassis, a feedthrough, and a membrane having an outer perimeter portion affixed to the chassis and an inner perimeter portion affixed to the feedthrough. The membrane is configured to flex in response to a first force applied to the chassis and / or a second force applied to the feedthrough.

The invention discloses an ultrasonic transducer (1) for transmitting and / or receiving an ultrasonic signal, comprising a housing (2) surrounding a cavity (3). At least one electromechanical transducer element (8) for the mutual conversion of the ultrasonic signal into an electrical signal is connected to the housing (2) such that it is located within the cavity (3), and a membrane (4) spanning the cavity (3) is connected to it. The at least one electromechanical transducer element (8) is coupled to the membrane (4). The ultrasonic transducer (1) is characterized in that a plunger element (9) is provided for transmitting the ultrasonic signal between the at least one electromechanical transducer element (8) and the membrane (4), and that the plunger element (9) is articulated to the membrane (4). Furthermore, an ultrasonic transducer arrangement consisting of at least two such ultrasonic transducers (1) is described.

The invention discloses an acoustic sensor, a preparation method thereof and a detection system, and the acoustic sensor comprises a substrate which is internally provided with an acoustic inlet hole penetrating through the substrate; the first functional layer is located on the substrate, a first cavity is formed between the first functional layer and the substrate, and the first cavity is communicated with the acoustic inlet hole; the second functional layer is located on the first functional layer, a capacitor cavity is formed between the second functional layer and the first functional layer, one of the first functional layer and the second functional layer is a vibrating diaphragm, and the other one is a backboard. According to the structure, the MEMS microphone is formed, the gas sensitive film is arranged on the bottom surface of the back plate, and the gas sensitive film comprises the porous organic framework material and the cyclodextrin derivative grafted in the pore channel of the porous organic framework material, so that automatic adsorption and desorption of target gas molecules are realized without external energy input in the whole process; therefore, automatic repeated detection of the target gas is realized.

Systems, devices, and methods related to a capacitive micromachined ultrasonic transducer (CMUT) are provided. The CMUT includes an electrode and a plate overlying the electrode forming a cavity. The electrode is a contoured electrode and / or the plate is a contoured plate. A voltage applied across the electrode and the plate deflects the plate. The cavity is a non-uniform cavity space between the plate and the electrode, the cavity space being largest in a central region of the plate.

Capacitive micromachined ultrasonic transducers (CMUTs) can be fabricated on prefabricated, interconnected substrates such as printed circuit boards (PCBs). PCBs can be rigid or flexible. The substrate can also be ceramic. CMUTs can be polymer- or silicon-based. Arrays of CMUTs can also be fabricated, consisting of multiple CMUT elements, each consisting of an individual CMUT cell. CMUT elements on a substrate such as a PCB are electrically connected to electrical interconnects (vias), allowing selective control of individual elements. CMUTs can be fabricated by depositing, patterning, and etching away various materials on the substrate, with the solvents used for etching being selected to be chemically compatible with the substrate and other materials deposited on it.

An audio converter includes a diaphragm, a converter base structure, and a diaphragm suspension system. The diaphragm suspension system has at least one contact hinge joint coupling the diaphragm to the transducer base structure to enable rotational movement of the diaphragm about a rotational axis relative to the transducer base structure. A conversion mechanism is operably coupled to the diaphragm to convert between the electrical audio signal and the acoustic pressure. In an embodiment, each contact hinge joint includes up to four contact interfaces, where each contact interface has a pair of contact surfaces movable relative to each other. Other embodiments of diaphragm suspension systems, diaphragm structures, conversion mechanisms, and audio devices incorporating the structures are also disclosed.

The electrical device for reducing noise comprises a first microphone (110) configured to receive sound waves from a sound source and convert the sound waves into a first electrical signal including a noise component, and a second microphone (112) configured to receive ambient noise from a surrounding environment and convert the ambient noise into a second electrical signal. The second electrical signal has an opposite polarity to the first electrical signal. The electrical device further comprises a circuit (113) connecting the first microphone (110) and the second microphone (112). The circuit (113) is configured to combine the first and second electrical signals to reduce the noise component in the first electrical signal using the second electrical signal of opposite polarity.

Provided in the present utility model is an MEMS package structure, comprising a housing, a circuit board that covers the housing to form an accommodating space, and an MEMS chip and an ASIC chip that are disposed in the accommodating space. The MEMS chip comprises a vibrating diaphragm and a backplate spaced apart from the vibrating diaphragm. The MEMS chip is disposed on the circuit board. The circuit board comprises an upper surface connected to the MEMS chip and a lower surface. The circuit board is further provided with a first sound hole extending from the lower surface towards the upper surface but not passing through the upper surface, a second sound hole extending from the upper surface towards the lower surface but not passing through the lower surface, and a communication passage arranged between the upper surface and the lower surface and interconnecting the first sound hole and the second sound hole. The MEMS chip covers the second sound hole, projections of the first sound hole and the second sound hole in the vibrating direction of the vibrating diaphragm not overlapping each other. A plurality of protruding structures are provided in the communication passage, the protruding structures allowing the pressure of an air flow entering from the first sound hole to be 2-3.5 times the pressure of an air flow flowing out of the second sound hole. The MEMS package structure provided in the present utility model has a strong anti-blowing capability.