136results about "Electrostatic transducers" patented technology

The present invention provides a MEMS acoustic transducer and a manufacturing method, comprising: a substrate, the upper surface of which is covered with a dry film layer, a transducer diaphragm assembly is arranged above the dry film layer, including: a support layer and at least one piezoelectric composite layer; a cavity is formed between the middle area of ​​the substrate and the middle area of ​​the dry film layer, and a diaphragm structure is formed in the area opposite to the cavity in the transducer diaphragm assembly; the shape of the dry film layer is obtained by graphical processing. In the MEMS acoustic transducer, a cavity is formed by the middle area of ​​the substrate and the middle area of ​​the dry film layer. Since the inner side surface of the dry film corresponding to the dry film layer in the inner side surface of the cavity is perpendicular to the diaphragm structure, and the size of the middle area of ​​the dry film layer is a preset target size, the phenomenon of over-etching or under-etching the top of the cavity can be avoided, the accuracy and consistency of the cavity etching are improved, and then the performance of the MEMS acoustic transducer device and the yield rate of the on-chip devices of the entire wafer can be improved.

To provide a micromachined ultrasonic transducer (MUT) including an electrode designed to improve both acoustical and electrical performances of the transducer.SOLUTION: A micromachined ultrasonic transducer (MUT) (720) includes a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode, and an asymmetric top electrode (722) disposed on the piezoelectric layer. The areal density distribution of the asymmetric electrode (722) along an axis (742) has a plurality of local maxima, and locations of the plurality of local maxima coincide with locations (726) (728) where a plurality of anti-nodal points at a vibrational resonance frequency is located.SELECTED DRAWING: Figure 7B

The invention provides a sensor and an electronic device, the sensor comprises a substrate and a housing covering the substrate, the substrate and the housing enclose to form an accommodating cavity, the accommodating cavity is internally provided with a vibration assembly, an MEMS chip and an integrated chip assembly, the MEMS chip and the integrated chip assembly are in signal connection, and the integrated chip assembly is in signal connection with the substrate; the MEMS chip is installed on the substrate, the MEMS chip and the substrate define a rear cavity, the vibration assembly comprises a supporting piece and a sensing film installed on the supporting piece, the supporting piece is installed on the substrate, the supporting piece, the sensing film and the substrate define a vibration cavity, a channel is formed in the substrate, and the two ends of the channel are communicated with the rear cavity and the vibration cavity respectively. According to the sensor, the MEMS chip and the vibration assembly can be horizontally arranged on the substrate, and compared with the mode that the MEMS chip and the vibration assembly are stacked in the vertical direction, the height of the sensor is reduced, and the light and thin design is achieved.

This application provides an earphone and a terminal device. The earphone includes a housing with a cavity structure inside, and a sound outlet communicating with the cavity structure. A first sound unit, a second sound unit, and a third sound unit are disposed within the cavity structure, and the third sound unit is a microelectromechanical system (MEMS) unit. The sound frequency of the second sound unit is greater than but less than the sound frequency of the first sound unit. The third sound unit, being a MEMS unit, is located between the first sound unit and the sound outlet. By incorporating the first sound unit, the second sound unit, and the MEMS unit within the earphone, the output bandwidth of the earphone can be fully guaranteed, achieving better full-frequency coverage and superior sound quality.

The present invention is provided with an acoustic MEMS element (100) and an acoustic path (P). The acoustic path (P) is connected to the acoustic MEMS element (100). Ultrasonic waves generated through vibration of the acoustic MEMS element (100) can acoustically resonate in the acoustic path (P). This ultrasonic transducer has, through a combination between sympathetic vibration of the acoustic MEMS element (100) and acoustic resonance in the acoustic path (P), sound pressure-frequency characteristics in which a plurality of sound pressure peaks appear. When f0 represents the sympathetic vibration frequency of the acoustic MEMS element (100) and f1 represents the acoustic resonance frequency in the acoustic path (P), the relationship -20≤(f1-f0) / f0×100≤80 is satisfied.

The application provides an acoustic piezoelectric film device structure, comprising: a support body; a piezoelectric film layer structure covering an area surrounded by the support body and fixedly connected to the support body at the periphery, the piezoelectric film layer structure comprising a piezoelectric layer and an electrode layer covering the upper and lower surfaces of the piezoelectric layer, the piezoelectric film layer structure comprising an inner area and an outer area surrounding the inner area, and the inner area and the outer area having an electrode separation zone therebetween, the electrode separation zone separating the electrode layer into a central electrode layer and a peripheral electrode layer. The acoustic piezoelectric film layer structure designed by the application can reduce the warping degree of the piezoelectric film layer structure and control the increase of the width of the acoustic transmission channel of the slit area caused by warping, the electrode layer of the application fully covers the surface of the piezoelectric film layer, and the novel separation and series or parallel electrical connection mode between the longitudinal multiple piezoelectric layers and the transverse multiple electrode layers can realize the electromechanical conversion of the whole area of the piezoelectric film layer and improve the electromechanical conversion efficiency of the piezoelectric film device.

Provided in the present invention is a loudspeaker apparatus. The loudspeaker apparatus comprises: a support structure, the support structure comprising a support body provided with a sound generation cavity, and an annular sound hole formed at one end of the support body; an ultrasonic generation unit, the ultrasonic generation unit being located inside the sound generation cavity and fixed on the inner peripheral side of the support body, and being used for generating symmetrical ultrasonic waves; and a demodulation structure, the demodulation structure comprising a diaphragm and a plurality of fixing portions extending from the outer peripheral side of the diaphragm and distributed at intervals, wherein the fixing portions are fixed to the inner side of the sound hole and suspend the diaphragm in the sound hole, the diaphragm and the sound hole are spaced apart from each other and enclose a gap together with the fixing portions, and the ultrasonic waves generated by the ultrasonic generation unit drive the demodulation structure to vibrate, so as to adjust the size of the gap. Compared with the prior art, the loudspeaker apparatus of the present invention has a high acoustic demodulation efficiency, a good effect in increasing the amplitude of a vibration system, and a good acoustic performance.

The acoustic transducer includes a first layer including an elastomer. The acoustic impedance of the first layer substantially matches the acoustic impedance of a medium the transducer is configured to monitor. The transducer also includes a second layer including an electrode. The transducer also includes a third layer including a polymer. The second layer is at least partially positioned between the first and third layers.

This application provides an earphone and a terminal device. The earphone includes a housing. There is a cavity structure in the housing, and a sound output port communicating with the cavity structure is provided on the housing; a first sound production unit, a second sound production unit, and a third sound production unit are disposed in the cavity structure, the third sound production unit is a micro-electro-mechanical system unit, and a sound production frequency of the second sound production unit is greater than a sound production frequency of the first sound production unit and is less than a sound production frequency of the first sound production unit; and the third sound production unit is the micro-electro-mechanical system unit, and the third sound production unit is located between the first sound production unit and the sound output port. The first sound production unit, the second sound production unit, and the micro-electro-mechanical system unit are disposed in the earphone, so that an output bandwidth of the earphone can be effectively ensured, and good full-frequency-band coverage effect and improved sound effect can be implemented.

To provide an ultrasound transducer and a method.SOLUTION: An ultrasound transducer may include: a plurality of capacitive ultrasound transducer elements; and a base having a maximum dimension sized and shaped to be disposed within an external ear canal, the plurality of capacitive ultrasound transducers being mounted on the base. Each capacitive ultrasound transducer element and the ultrasound transducer are specifically constructed to achieve select desired performance characteristics. The ultrasound transducer may have an angular beam spread through a gaseous medium of greater than 15 degrees and an attenuation loss through the gaseous medium of greater than 10 dB measured at a distance 12.5 mm to 25 mm along a primary transmission axis of the ultrasound transducer. The ultrasound transducer may be particularly useful for characterizing fluid behind an ear drum to diagnose otitis media.SELECTED DRAWING: Figure 6A

The utility model relates to the technical field of acoustics, in particular to a bone conduction MEMS microphone structure. Comprising a first PCB, a second PCB and a third PCB, the upper end face of the second PCB is provided with an electro-acoustic conversion chip MEMS and an electric signal processing chip ASIC, the electro-acoustic conversion chip MEMS and the electric signal processing chip ASIC are connected through a gold wire, the lower end face of the second PCB is provided with a vibrating diaphragm assembly, and the first PCB, the second PCB and the third PCB are arranged in a stacked mode. Vibration is transmitted to the microphone through the skeleton, the vibrating diaphragm assembly starts to vibrate, so that the pressure in the cavity is changed, the changed pressure is transmitted to the vibrating diaphragm assembly, the vibrating diaphragm assembly vibrates, a vibration signal is converted into an electric signal through the electro-acoustic conversion chip MEMS, and the electric signal is amplified and processed by the electric signal processing chip ASIC and then output. According to the design, a mature packaging process is utilized, so that the production process of the bone conduction MEMS microphone is simpler, and the production efficiency is improved.

The utility model discloses an MEMS horn with high moisture resistance, which belongs to the technical field of horns and comprises a shell, two sound production covers are fixedly assembled at the top of the shell, a cover plate is fixedly mounted on one side, far away from the sound production covers, of the shell through screws, and a plurality of heat dissipation grooves are uniformly formed in the inner wall of the cover plate. A positioning strip is fixedly assembled on the inner wall of the shell, and the inner wall of the positioning strip is fixedly connected with one end of a spring; the moistureproof operation is performed on the inner cavity of the shell through the moistureproof cotton plate, when the moistureproof cotton plate needs to be replaced, the pressing plate can be pulled to move upwards, a new moistureproof cotton plate is placed between the pressing plate and the positioning strip, and then the moistureproof cotton plate is stably positioned between the positioning strip and the pressing plate by means of resetting of the acting force of the spring. The replacement convenience is improved, so that the problem of insufficient safety caused by easy short circuit of internal electronic elements and line connection ports in a humid environment due to insufficient moisture resistance is avoided.

Capacitive Micromachined Ultrasonic Transducer (CMUT) device, manufacturing method, and system, and method of use. The CMUT has a substrate, a peripheral wall defining the boundary of the cavity, and a membrane joined to the peripheral wall. Projecting from the substrate is a post sealed by the peripheral wall. The post contacts but is not joined to the membrane, forming a cavity that resonates at a specific acoustic frequency. The CMUT is disposed within a patient's vascular system in a stent, catheter, or other small device. The CMUT responds to the acoustic frequency emitted from the device outside the body and thereby operates as a sensor for various characteristics of the environment surrounding the CMUT within the body.

The utility model relates to an MEMS chip. The MEMS chip comprises a substrate; the sensor comprises a back plate and a first vibrating diaphragm and a second vibrating diaphragm which are respectively positioned on two sides of the back plate, and the first vibrating diaphragm and the second vibrating diaphragm are connected through a plurality of connecting columns; the connecting structure is connected with the substrate and the sensor, so that the back plate and the substrate are relatively fixed, the first vibrating diaphragm and the second vibrating diaphragm can vibrate relative to the substrate, the connecting structure comprises a first connecting plate parallel to the back plate, the first connecting plate annularly surrounds the first vibrating diaphragm and is connected with the first vibrating diaphragm, an isolation groove is formed in the first connecting plate and surrounds the first vibrating diaphragm, and the isolation groove is communicated with the first vibrating diaphragm. The isolation groove is filled with an insulating material to form an isolation ring, the isolation ring enables the first diaphragm and the part of the first connecting plate located outside the isolation groove to form insulation, the substrate is located on one side of the first connecting plate away from the second diaphragm, and the part of the first connecting plate located outside the isolation groove is connected with the substrate. According to the invention, the parasitic capacitance generated between the first diaphragm and the substrate can be reduced, the sensitivity of the sensor is improved, and the sensitivity of the MEMS chip is improved.

The invention provides an MEMS (Micro Electro Mechanical System) packaging structure and electronic equipment. The MEMS packaging structure comprises a substrate, back electrodes and a vibrating diaphragm, the back electrodes comprise a first back electrode and a second back electrode, the first back electrode is connected with the substrate, and the second back electrode is connected with the side, away from the substrate, of the first back electrode; the vibrating diaphragm is arranged on the back electrode; wherein the first back pole comprises a first sound hole, the second back pole comprises a second sound hole, the central axis of the first sound hole and the central axis of the second sound hole are mutually staggered, and at least part of orthographic projection of the first sound hole towards the vibrating diaphragm coincides with at least part of orthographic projection of the second sound hole towards the vibrating diaphragm. According to the invention, the use performance of the MEMS packaging structure can be improved.

The ultrasonic transducer (100) comprises a stack of at least two membranes (10, 20) bonded to a substrate (50). An electric circuit (30) connected to the electrodes and having a controller is configured to apply a first electric signal (S11) to a first electrode (11) of the first membrane (10) and a second electric signal (S21) different from the first electric signal to a second electrode (21) of the second membrane (20). The first electric signal and the second electric signal (S11, S21) are configured to apply a varying voltage (ΔV1, ΔV2) between the first electrode (11) and the second electrode (12) during a vibration period (T1, T2) of each of the membranes (10, 20). A first electrode (11) on the first membrane (10) is configured to interact with the second electrode (21) on the second membrane 20 with an electrostatic force (Fe) that varies during each oscillation period (T1, T2) in response to a varying voltage (ΔV1, ΔV2).

The tactile device creates a mechanical energy field that can be felt but not heard. Since the tactile device includes an annular array transducer that is substantially transparent to visible light, when combined with a wavefront display, a projected visual object can be felt as a hologram. By controlling the transparent array of the annular array transducer and using the principles of interference and superposition, a steerable beam of the mechanical energy field can be provided at a point in space.

The utility model discloses a packaging structure and electronic equipment. The packaging structure comprises a substrate, a shell, a vibration pickup assembly, a supporting plate, an MEMS chip and an ASIC chip. The shell is arranged on the substrate, and an accommodating cavity is formed between the shell and the substrate; the vibration pick-up assembly is arranged on the substrate and located in the containing cavity, and the vibration pick-up assembly is used for picking up vibration signals; the supporting plate is stacked on the side, away from the base plate, of the vibration pickup assembly, and a through hole is formed in the supporting plate. The MEMS chip is arranged on one side, far away from the vibration pick-up assembly, of the supporting plate and is opposite to the through hole, and a vibration signal picked up by the vibration pick-up assembly can be transmitted to the MEMS chip through the through hole; and the ASIC chip is packaged in the accommodating groove and is electrically connected with the MEMS chip and the substrate respectively. The packaging structure provided by the utility model can improve the acoustic performance of the bone voiceprint sensor.

An ultrasonic pump includes a mechanical layer with at least one membrane; and an acoustic channel. A portion of the at least one membrane comprises at least a part of the acoustic channel so that a movement of the membrane changes the dimension of the acoustic channel. The membrane is configured to oscillate at ultrasonic frequencies and generate at least one audio signal.

The present invention discloses a touch acoustic display unit and a device. The touch acoustic display unit includes a first substrate, a functional region, and a second substrate which are sequentially stacked from top to bottom. The functional region includes a touch region and an acoustic region. Both the touch region and the acoustic region are located between the first substrate and the second substrate and are provided at intervals in the horizontal direction. The first substrate and the second substrate are shared. The acoustic region is an electrostatic ultrasonic transducer. In the present invention, by combining the electrostatic ultrasonic transducer and the touch screen, the display device can direct sound towards the screen on one side and can be touched on the other side, without interference between the two sides, realizing screen-directed sound, listening in private to avoid interference with surrounding people, and also providing a touch function to expand its application range.

Some demonstrative embodiments include apparatuses, systems and / or methods of testing an acoustic device, an acoustic component, and / or a device or system including one or more acoustic devices. For example, an acoustic device tester may be configured to process input acoustic information of a tested acoustic device to determine a tested acoustic value distribution for the tested acoustic device in a plurality of frequency sub-bands; to determine whether or not the tested acoustic device meets a predefined testing criterion based on the tested acoustic value distribution and a reference profile defining a plurality of reference values corresponding to the plurality of frequency sub-bands, respectively; and to generate an output to indicate whether or not the tested acoustic device meets the predefined testing criterion.

DETAILED DESCRIPTION A micromachined ultrasound transducer (MUT) array with grooves that reduce crosstalk between the MUTs to mitigate unwanted artifacts in ultrasound images, as well as a method of operating the same, are described.