70results about "Electrostatic transducers" patented technology

This application provides an earphone and a terminal device. The earphone includes a housing with a cavity structure inside, and a sound outlet communicating with the cavity structure. A first sound unit, a second sound unit, and a third sound unit are disposed within the cavity structure, and the third sound unit is a microelectromechanical system (MEMS) unit. The sound frequency of the second sound unit is greater than but less than the sound frequency of the first sound unit. The third sound unit, being a MEMS unit, is located between the first sound unit and the sound outlet. By incorporating the first sound unit, the second sound unit, and the MEMS unit within the earphone, the output bandwidth of the earphone can be fully guaranteed, achieving better full-frequency coverage and superior sound quality.

The application provides an acoustic piezoelectric film device structure, comprising: a support body; a piezoelectric film layer structure covering an area surrounded by the support body and fixedly connected to the support body at the periphery, the piezoelectric film layer structure comprising a piezoelectric layer and an electrode layer covering the upper and lower surfaces of the piezoelectric layer, the piezoelectric film layer structure comprising an inner area and an outer area surrounding the inner area, and the inner area and the outer area having an electrode separation zone therebetween, the electrode separation zone separating the electrode layer into a central electrode layer and a peripheral electrode layer. The acoustic piezoelectric film layer structure designed by the application can reduce the warping degree of the piezoelectric film layer structure and control the increase of the width of the acoustic transmission channel of the slit area caused by warping, the electrode layer of the application fully covers the surface of the piezoelectric film layer, and the novel separation and series or parallel electrical connection mode between the longitudinal multiple piezoelectric layers and the transverse multiple electrode layers can realize the electromechanical conversion of the whole area of the piezoelectric film layer and improve the electromechanical conversion efficiency of the piezoelectric film device.

The utility model relates to the technical field of acoustics, in particular to a bone conduction MEMS microphone structure. Comprising a first PCB, a second PCB and a third PCB, the upper end face of the second PCB is provided with an electro-acoustic conversion chip MEMS and an electric signal processing chip ASIC, the electro-acoustic conversion chip MEMS and the electric signal processing chip ASIC are connected through a gold wire, the lower end face of the second PCB is provided with a vibrating diaphragm assembly, and the first PCB, the second PCB and the third PCB are arranged in a stacked mode. Vibration is transmitted to the microphone through the skeleton, the vibrating diaphragm assembly starts to vibrate, so that the pressure in the cavity is changed, the changed pressure is transmitted to the vibrating diaphragm assembly, the vibrating diaphragm assembly vibrates, a vibration signal is converted into an electric signal through the electro-acoustic conversion chip MEMS, and the electric signal is amplified and processed by the electric signal processing chip ASIC and then output. According to the design, a mature packaging process is utilized, so that the production process of the bone conduction MEMS microphone is simpler, and the production efficiency is improved.

The ultrasonic transducer (100) comprises a stack of at least two membranes (10, 20) bonded to a substrate (50). An electric circuit (30) connected to the electrodes and having a controller is configured to apply a first electric signal (S11) to a first electrode (11) of the first membrane (10) and a second electric signal (S21) different from the first electric signal to a second electrode (21) of the second membrane (20). The first electric signal and the second electric signal (S11, S21) are configured to apply a varying voltage (ΔV1, ΔV2) between the first electrode (11) and the second electrode (12) during a vibration period (T1, T2) of each of the membranes (10, 20). A first electrode (11) on the first membrane (10) is configured to interact with the second electrode (21) on the second membrane 20 with an electrostatic force (Fe) that varies during each oscillation period (T1, T2) in response to a varying voltage (ΔV1, ΔV2).

The utility model discloses a packaging structure and electronic equipment. The packaging structure comprises a substrate, a shell, a vibration pickup assembly, a supporting plate, an MEMS chip and an ASIC chip. The shell is arranged on the substrate, and an accommodating cavity is formed between the shell and the substrate; the vibration pick-up assembly is arranged on the substrate and located in the containing cavity, and the vibration pick-up assembly is used for picking up vibration signals; the supporting plate is stacked on the side, away from the base plate, of the vibration pickup assembly, and a through hole is formed in the supporting plate. The MEMS chip is arranged on one side, far away from the vibration pick-up assembly, of the supporting plate and is opposite to the through hole, and a vibration signal picked up by the vibration pick-up assembly can be transmitted to the MEMS chip through the through hole; and the ASIC chip is packaged in the accommodating groove and is electrically connected with the MEMS chip and the substrate respectively. The packaging structure provided by the utility model can improve the acoustic performance of the bone voiceprint sensor.

An ultrasonic pump includes a mechanical layer with at least one membrane; and an acoustic channel. A portion of the at least one membrane comprises at least a part of the acoustic channel so that a movement of the membrane changes the dimension of the acoustic channel. The membrane is configured to oscillate at ultrasonic frequencies and generate at least one audio signal.

Some demonstrative embodiments include apparatuses, systems and / or methods of testing an acoustic device, an acoustic component, and / or a device or system including one or more acoustic devices. For example, an acoustic device tester may be configured to process input acoustic information of a tested acoustic device to determine a tested acoustic value distribution for the tested acoustic device in a plurality of frequency sub-bands; to determine whether or not the tested acoustic device meets a predefined testing criterion based on the tested acoustic value distribution and a reference profile defining a plurality of reference values corresponding to the plurality of frequency sub-bands, respectively; and to generate an output to indicate whether or not the tested acoustic device meets the predefined testing criterion.

An apparatus includes a chassis, a feedthrough, and a membrane having an outer perimeter portion affixed to the chassis and an inner perimeter portion affixed to the feedthrough. The membrane is configured to flex in response to a first force applied to the chassis and / or a second force applied to the feedthrough.

The invention discloses an ultrasonic transducer (1) for transmitting and / or receiving an ultrasonic signal, comprising a housing (2) surrounding a cavity (3). At least one electromechanical transducer element (8) for the mutual conversion of the ultrasonic signal into an electrical signal is connected to the housing (2) such that it is located within the cavity (3), and a membrane (4) spanning the cavity (3) is connected to it. The at least one electromechanical transducer element (8) is coupled to the membrane (4). The ultrasonic transducer (1) is characterized in that a plunger element (9) is provided for transmitting the ultrasonic signal between the at least one electromechanical transducer element (8) and the membrane (4), and that the plunger element (9) is articulated to the membrane (4). Furthermore, an ultrasonic transducer arrangement consisting of at least two such ultrasonic transducers (1) is described.

The invention discloses an acoustic sensor, a preparation method thereof and a detection system, and the acoustic sensor comprises a substrate which is internally provided with an acoustic inlet hole penetrating through the substrate; the first functional layer is located on the substrate, a first cavity is formed between the first functional layer and the substrate, and the first cavity is communicated with the acoustic inlet hole; the second functional layer is located on the first functional layer, a capacitor cavity is formed between the second functional layer and the first functional layer, one of the first functional layer and the second functional layer is a vibrating diaphragm, and the other one is a backboard. According to the structure, the MEMS microphone is formed, the gas sensitive film is arranged on the bottom surface of the back plate, and the gas sensitive film comprises the porous organic framework material and the cyclodextrin derivative grafted in the pore channel of the porous organic framework material, so that automatic adsorption and desorption of target gas molecules are realized without external energy input in the whole process; therefore, automatic repeated detection of the target gas is realized.

Systems, devices, and methods related to a capacitive micromachined ultrasonic transducer (CMUT) are provided. The CMUT includes an electrode and a plate overlying the electrode forming a cavity. The electrode is a contoured electrode and / or the plate is a contoured plate. A voltage applied across the electrode and the plate deflects the plate. The cavity is a non-uniform cavity space between the plate and the electrode, the cavity space being largest in a central region of the plate.

An audio converter includes a diaphragm, a converter base structure, and a diaphragm suspension system. The diaphragm suspension system has at least one contact hinge joint coupling the diaphragm to the transducer base structure to enable rotational movement of the diaphragm about a rotational axis relative to the transducer base structure. A conversion mechanism is operably coupled to the diaphragm to convert between the electrical audio signal and the acoustic pressure. In an embodiment, each contact hinge joint includes up to four contact interfaces, where each contact interface has a pair of contact surfaces movable relative to each other. Other embodiments of diaphragm suspension systems, diaphragm structures, conversion mechanisms, and audio devices incorporating the structures are also disclosed.

Provided in the present utility model is an MEMS package structure, comprising a housing, a circuit board that covers the housing to form an accommodating space, and an MEMS chip and an ASIC chip that are disposed in the accommodating space. The MEMS chip comprises a vibrating diaphragm and a backplate spaced apart from the vibrating diaphragm. The MEMS chip is disposed on the circuit board. The circuit board comprises an upper surface connected to the MEMS chip and a lower surface. The circuit board is further provided with a first sound hole extending from the lower surface towards the upper surface but not passing through the upper surface, a second sound hole extending from the upper surface towards the lower surface but not passing through the lower surface, and a communication passage arranged between the upper surface and the lower surface and interconnecting the first sound hole and the second sound hole. The MEMS chip covers the second sound hole, projections of the first sound hole and the second sound hole in the vibrating direction of the vibrating diaphragm not overlapping each other. A plurality of protruding structures are provided in the communication passage, the protruding structures allowing the pressure of an air flow entering from the first sound hole to be 2-3.5 times the pressure of an air flow flowing out of the second sound hole. The MEMS package structure provided in the present utility model has a strong anti-blowing capability.

The utility model provides an MEMS device and an electronic device. The MEMS device comprises a substrate; the first sacrificial layer is located on a part of the first surface of the substrate; the vibrating diaphragm is located above the first surface, and a first sacrificial layer is arranged between a part of the vibrating diaphragm and the substrate; a second sacrificial layer partially located on the diaphragm; the backboard layer is partially located on the second sacrificial layer, and a cavity is formed between the backboard layer and the vibrating diaphragm; the back cavity exposes part of the surface of the vibrating diaphragm; the MEMS device comprises a first wire area and a second wire area which are located on the outer side of the cavity, a first through hole penetrating through the vibrating diaphragm is formed in the vibrating diaphragm of the first wire area, a first inner cavity located in the first sacrificial layer is correspondingly formed below each first through hole, and / or a second inner cavity located in the second sacrificial layer is correspondingly formed below each second through hole. Second through holes penetrating through the backboard layer are formed in the backboard layer in the second wire area, and a second inner cavity located in the second sacrificial layer is correspondingly formed below each second through hole. According to the scheme, the parasitic capacitance of the MEMS device can be reduced.

The invention relates to a method for manufacturing a MEMS device, comprising the following steps: creating a trench structure consisting of several trenches, each having a bottom and sidewalls, in a substrate from a front side of the substrate; forming a sacrificial layer of polysilicon directly on the front side of the substrate such that the respective bottoms and sidewalls of the trenches and areas of the front side between the trenches and adjacent to the trench structure are completely and directly covered by the sacrificial layer; forming an etch stop layer directly on the sacrificial layer; forming a functional layer arrangement consisting of one or more functional layers directly on the sacrificial stop layer; and removing substrate material and at least parts of the sacrificial layer by etching from a rear side of the substrate opposite the front side.that by removing the etch stop layer and the functional layer arrangement, a self-supporting functional structure corresponding to the trench structure and connected to the front of the substrate by means of the sacrificial layer is formed. The invention further relates to a MEMS component.

Ultrasonic sensor (1), comprising: an ultrasonic wave transmitter receiver (2) comprising a vibration element (21) with a function for converting between mechanical vibration and an electrical signal and a transmitter receiver box (22) configured to cover the vibration element (21); a sensor box (5) which accommodates a control board (60) which is electrically connected to the ultrasonic wave transmitter (2), and carries the ultrasonic wave transmitter (2); and a shielding element (7) which electromagnetically shields at least a part of an electrical circuit (6) including the vibration element (21) and the control board (60) in at least five of six directions and has a first end (71) and a second end (72), wherein the shielding element (7) is designed in a thin sheet metal or wire mesh form; the part of the electrical circuit (6) to be shielded includes at least the control board (60); the first end (71) of the shielding element (7) is configured to be permanently connected to a ground wire (G) in order to electromagnetically shield at least part of the electrical circuit (6); and the second end (72) is configured to be selectively connected to a power source (B), wherein the shielding element (7) is configured to generate heat when it is powered while the second end (72) is connected to the power source (B).

The application provides a MEMS device and a manufacturing method thereof. The method comprises the following steps: providing a first substrate and a second substrate, one of which is provided with a first bonding structure on a first surface, and the other of which is provided with a second bonding structure on a first surface; bonding the first bonding structure and the second bonding structure to obtain a first sacrificial layer, a first diaphragm, a second sacrificial layer, a first backplate layer, a third sacrificial layer, a second diaphragm, a fourth sacrificial layer, a second backplate layer and a fifth sacrificial layer, a first cavity is formed between the first diaphragm and the second diaphragm, a plurality of first release holes are formed in the first backplate layer, a plurality of connecting columns are formed in the first cavity, the connecting columns are arranged in the first release holes and are connected with the first diaphragm and the second diaphragm respectively; removing the second substrate, removing a part of the first substrate corresponding to the first cavity to form a back cavity, and removing part of the sacrificial layer. The application scheme can simplify the process, reduce the cost, improve the signal-to-noise ratio, sensitivity, efficiency and yield.

The invention relates to a MEMS element (1) for the mechanical-electrical conversion of frequent changes, such as pressure changes, sound waves, structure-borne sound waves, and / or ultrasound waves, into electrical signals, comprising: at least two oppositely differentially measuring capacitors, each consisting of at least one fixed electrode (17, 18, 19, 20) and at least one movable electrode (8, 9, 10, 11, 13, 14, 15, 16), wherein the movable electrode (8, 9, 10, 11, 13, 14, 15, 16) is coupled to a membrane arrangement (5) consisting of at least two membranes (3, 4) with a defined distance between each other, wherein the conversion into electrical signals is carried out by a differential measurement of at least two capacitance changes resulting from a mechanical change of an area overlap size (21-28) between the fixed electrode (17, 18, 19, 20) and the movable electrode (8, 9, 10, 11, 13, 14, 15, 16), which is defined by a lateral capacitive area between the fixed electrode (17, 18, 19, 20) and the movable electrode (8, 9, 10, 11, 13, 14, 15, 16).

The invention discloses a sensor and electronic equipment. The sensor comprises a waterproof sound transmission film, the sensor is provided with a sound hole, and the waterproof sound transmission film covers the sound hole; the waterproof sound transmission membrane is made of fluoride-free fibers, and the line diameter of the fluoride-free fibers is larger than or equal to 0.1 mu m and smaller than or equal to 1 mu m, so that the signal-to-noise ratio loss of the sensor is reduced; and the thickness of the waterproof sound transmission film is smaller than or equal to 20 microns, so that the sound loss amount and the signal-to-noise ratio loss of the sensor are reduced.

The MEMS sensor module of the present utility model comprises a side wall enclosing a cavity, a first circuit board, a second circuit board, a partition wall dividing the cavity into two cavity bodies, MEMS sensor assemblies respectively arranged in the two cavity bodies, and two gold finger layers that each surround the two cavity bodies and are between the side wall, the partition wall and the two circuit boards. A gold finger layer at the partition wall is provided with a slot opening connecting the two cavity bodies; an MEMS sensor assembly in one cavity body comprises an ASIC chip fixed to the second circuit board and an MEMS chip stacked and fixed on the ASIC chip, and an MEMS sensor assembly in the other cavity body comprises an ASIC chip fixed to the first circuit board and an MEMS chip fixed to the second circuit board; the side wall is provided with a conductor connecting the two circuit boards; and bonding gold wires are respectively connected between the two MEMS chips and the second circuit board. The MEMS sensor module of the present utility model can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

The transducer structure has a flexible element which is fixed to a stationary holding element by means of a first region, a beam element which is movably fixed to the holding element by means of a first end via a flexible first connecting element, and a second connecting element which is movably fixed to the beam element by means of a second end via a second region. Wherein the beam element is movably fastened by means of the second end to the second region of the flexible element via a flexible second connecting element, and wherein the beam element is configured to be harder in terms of resistance to bending in the X-Y plane than the flexible element and the first and second connecting elements, wherein a first sensor element is arranged between the holding element and the first end face of the beam element and / or a second sensor element is arranged between the second region of the flexible element and the second end face of the beam element, wherein the first and / or the second sensor element is designed to vary the physical property depending on a change in mechanical stress of the first and / or the second sensor element, and wherein the first and / or the second sensor element experiences a change in mechanical stress when the flexible element is bent in the X-Y plane.

To provide an audio transducer diaphragm.SOLUTION: An audio transducer diaphragm includes: a diaphragm body A208 having a core material and a pair of facing major surfaces; a normal stress reinforcement material A206 / A207 coupled to the diaphragm body and coupled onto or near the pair of facing major surfaces for resisting compression-tension stresses received on or near the body during operation; and at least one inner reinforcement member A209 which is different from the core material, embedded within the body, oriented at an angle relative to the pair of facing major surfaces for resisting shear deformation received by the body during operation. The inner reinforcement member is extended adjacent to the normal stress reinforcement material and the pair of facing major surfaces.SELECTED DRAWING: Figure A2g

The present invention provides a speaker device having a support structure with a support body provided with a sound chamber and an annular sound hole. The speaker device further includes an ultrasonic sound emitting unit for emitting symmetrical ultrasonic waves, and a demodulation structure with a diaphragm and multiple fixed parts. The diaphragm is spaced apart from the sound hole. The ultrasonic waves emitted by the ultrasonic sound emitting unit drive the demodulation structure to vibrate, adjusting the size of the gap. Compared with the prior art, the speaker device of the present invention has high sound wave demodulation efficiency, good improvement in vibration system amplitude, and excellent acoustic performance.

A microelectromechanical system (MEMS) chip comprises a substrate, a backplate mounted on the substrate that partially covers an opening through the substrate, a membrane between the backplate and the substrate, the membrane comprising a central section that covers the opening and an outer peripheral section that is coupled to the substrate, a plurality of springs connecting the central section of the membrane to the outer peripheral section of the membrane, each spring being located outside the opening, and a plurality of deflection limiters projecting from the backplate. The plurality of deflection limiters are arranged and configured such that, during operation of the MEMS chip, the deflection limiters make at least momentary contact with the membrane in the vicinity of the plurality of springs.