46results about "Electrostatic transducers" patented technology

This application provides an earphone and a terminal device. The earphone includes a housing with a cavity structure inside, and a sound outlet communicating with the cavity structure. A first sound unit, a second sound unit, and a third sound unit are disposed within the cavity structure, and the third sound unit is a microelectromechanical system (MEMS) unit. The sound frequency of the second sound unit is greater than but less than the sound frequency of the first sound unit. The third sound unit, being a MEMS unit, is located between the first sound unit and the sound outlet. By incorporating the first sound unit, the second sound unit, and the MEMS unit within the earphone, the output bandwidth of the earphone can be fully guaranteed, achieving better full-frequency coverage and superior sound quality.

The utility model discloses a packaging structure and electronic equipment. The packaging structure comprises a substrate, a shell, a vibration pickup assembly, a supporting plate, an MEMS chip and an ASIC chip. The shell is arranged on the substrate, and an accommodating cavity is formed between the shell and the substrate; the vibration pick-up assembly is arranged on the substrate and located in the containing cavity, and the vibration pick-up assembly is used for picking up vibration signals; the supporting plate is stacked on the side, away from the base plate, of the vibration pickup assembly, and a through hole is formed in the supporting plate. The MEMS chip is arranged on one side, far away from the vibration pick-up assembly, of the supporting plate and is opposite to the through hole, and a vibration signal picked up by the vibration pick-up assembly can be transmitted to the MEMS chip through the through hole; and the ASIC chip is packaged in the accommodating groove and is electrically connected with the MEMS chip and the substrate respectively. The packaging structure provided by the utility model can improve the acoustic performance of the bone voiceprint sensor.

An ultrasonic pump includes a mechanical layer with at least one membrane; and an acoustic channel. A portion of the at least one membrane comprises at least a part of the acoustic channel so that a movement of the membrane changes the dimension of the acoustic channel. The membrane is configured to oscillate at ultrasonic frequencies and generate at least one audio signal.

Some demonstrative embodiments include apparatuses, systems and / or methods of testing an acoustic device, an acoustic component, and / or a device or system including one or more acoustic devices. For example, an acoustic device tester may be configured to process input acoustic information of a tested acoustic device to determine a tested acoustic value distribution for the tested acoustic device in a plurality of frequency sub-bands; to determine whether or not the tested acoustic device meets a predefined testing criterion based on the tested acoustic value distribution and a reference profile defining a plurality of reference values corresponding to the plurality of frequency sub-bands, respectively; and to generate an output to indicate whether or not the tested acoustic device meets the predefined testing criterion.

The invention discloses an ultrasonic transducer (1) for transmitting and / or receiving an ultrasonic signal, comprising a housing (2) surrounding a cavity (3). At least one electromechanical transducer element (8) for the mutual conversion of the ultrasonic signal into an electrical signal is connected to the housing (2) such that it is located within the cavity (3), and a membrane (4) spanning the cavity (3) is connected to it. The at least one electromechanical transducer element (8) is coupled to the membrane (4). The ultrasonic transducer (1) is characterized in that a plunger element (9) is provided for transmitting the ultrasonic signal between the at least one electromechanical transducer element (8) and the membrane (4), and that the plunger element (9) is articulated to the membrane (4). Furthermore, an ultrasonic transducer arrangement consisting of at least two such ultrasonic transducers (1) is described.

The invention discloses an acoustic sensor, a preparation method thereof and a detection system, and the acoustic sensor comprises a substrate which is internally provided with an acoustic inlet hole penetrating through the substrate; the first functional layer is located on the substrate, a first cavity is formed between the first functional layer and the substrate, and the first cavity is communicated with the acoustic inlet hole; the second functional layer is located on the first functional layer, a capacitor cavity is formed between the second functional layer and the first functional layer, one of the first functional layer and the second functional layer is a vibrating diaphragm, and the other one is a backboard. According to the structure, the MEMS microphone is formed, the gas sensitive film is arranged on the bottom surface of the back plate, and the gas sensitive film comprises the porous organic framework material and the cyclodextrin derivative grafted in the pore channel of the porous organic framework material, so that automatic adsorption and desorption of target gas molecules are realized without external energy input in the whole process; therefore, automatic repeated detection of the target gas is realized.

An audio converter includes a diaphragm, a converter base structure, and a diaphragm suspension system. The diaphragm suspension system has at least one contact hinge joint coupling the diaphragm to the transducer base structure to enable rotational movement of the diaphragm about a rotational axis relative to the transducer base structure. A conversion mechanism is operably coupled to the diaphragm to convert between the electrical audio signal and the acoustic pressure. In an embodiment, each contact hinge joint includes up to four contact interfaces, where each contact interface has a pair of contact surfaces movable relative to each other. Other embodiments of diaphragm suspension systems, diaphragm structures, conversion mechanisms, and audio devices incorporating the structures are also disclosed.

The application provides a MEMS device and a manufacturing method thereof. The method comprises the following steps: providing a first substrate and a second substrate, one of which is provided with a first bonding structure on a first surface, and the other of which is provided with a second bonding structure on a first surface; bonding the first bonding structure and the second bonding structure to obtain a first sacrificial layer, a first diaphragm, a second sacrificial layer, a first backplate layer, a third sacrificial layer, a second diaphragm, a fourth sacrificial layer, a second backplate layer and a fifth sacrificial layer, a first cavity is formed between the first diaphragm and the second diaphragm, a plurality of first release holes are formed in the first backplate layer, a plurality of connecting columns are formed in the first cavity, the connecting columns are arranged in the first release holes and are connected with the first diaphragm and the second diaphragm respectively; removing the second substrate, removing a part of the first substrate corresponding to the first cavity to form a back cavity, and removing part of the sacrificial layer. The application scheme can simplify the process, reduce the cost, improve the signal-to-noise ratio, sensitivity, efficiency and yield.

The invention relates to a MEMS element (1) for the mechanical-electrical conversion of frequent changes, such as pressure changes, sound waves, structure-borne sound waves, and / or ultrasound waves, into electrical signals, comprising: at least two oppositely differentially measuring capacitors, each consisting of at least one fixed electrode (17, 18, 19, 20) and at least one movable electrode (8, 9, 10, 11, 13, 14, 15, 16), wherein the movable electrode (8, 9, 10, 11, 13, 14, 15, 16) is coupled to a membrane arrangement (5) consisting of at least two membranes (3, 4) with a defined distance between each other, wherein the conversion into electrical signals is carried out by a differential measurement of at least two capacitance changes resulting from a mechanical change of an area overlap size (21-28) between the fixed electrode (17, 18, 19, 20) and the movable electrode (8, 9, 10, 11, 13, 14, 15, 16), which is defined by a lateral capacitive area between the fixed electrode (17, 18, 19, 20) and the movable electrode (8, 9, 10, 11, 13, 14, 15, 16).

The invention discloses a sensor and electronic equipment. The sensor comprises a waterproof sound transmission film, the sensor is provided with a sound hole, and the waterproof sound transmission film covers the sound hole; the waterproof sound transmission membrane is made of fluoride-free fibers, and the line diameter of the fluoride-free fibers is larger than or equal to 0.1 mu m and smaller than or equal to 1 mu m, so that the signal-to-noise ratio loss of the sensor is reduced; and the thickness of the waterproof sound transmission film is smaller than or equal to 20 microns, so that the sound loss amount and the signal-to-noise ratio loss of the sensor are reduced.

The MEMS sensor module of the present utility model comprises a side wall enclosing a cavity, a first circuit board, a second circuit board, a partition wall dividing the cavity into two cavity bodies, MEMS sensor assemblies respectively arranged in the two cavity bodies, and two gold finger layers that each surround the two cavity bodies and are between the side wall, the partition wall and the two circuit boards. A gold finger layer at the partition wall is provided with a slot opening connecting the two cavity bodies; an MEMS sensor assembly in one cavity body comprises an ASIC chip fixed to the second circuit board and an MEMS chip stacked and fixed on the ASIC chip, and an MEMS sensor assembly in the other cavity body comprises an ASIC chip fixed to the first circuit board and an MEMS chip fixed to the second circuit board; the side wall is provided with a conductor connecting the two circuit boards; and bonding gold wires are respectively connected between the two MEMS chips and the second circuit board. The MEMS sensor module of the present utility model can prevent a large amount of heat generated by an ASIC chip of one MEMS sensor assembly during operation from affecting the other MEMS sensor assembly.

The present invention provides a speaker device having a support structure with a support body provided with a sound chamber and an annular sound hole. The speaker device further includes an ultrasonic sound emitting unit for emitting symmetrical ultrasonic waves, and a demodulation structure with a diaphragm and multiple fixed parts. The diaphragm is spaced apart from the sound hole. The ultrasonic waves emitted by the ultrasonic sound emitting unit drive the demodulation structure to vibrate, adjusting the size of the gap. Compared with the prior art, the speaker device of the present invention has high sound wave demodulation efficiency, good improvement in vibration system amplitude, and excellent acoustic performance.

A microelectromechanical system (MEMS) chip comprises a substrate, a backplate mounted on the substrate that partially covers an opening through the substrate, a membrane between the backplate and the substrate, the membrane comprising a central section that covers the opening and an outer peripheral section that is coupled to the substrate, a plurality of springs connecting the central section of the membrane to the outer peripheral section of the membrane, each spring being located outside the opening, and a plurality of deflection limiters projecting from the backplate. The plurality of deflection limiters are arranged and configured such that, during operation of the MEMS chip, the deflection limiters make at least momentary contact with the membrane in the vicinity of the plurality of springs.

The embodiment of the invention provides a micro vibrator which comprises a base, an elastic piece, an actuating assembly and an optical element, and the actuating assembly comprises a coil and a first fan-shaped magnet. The coil is coupled with the first fan-shaped magnet, the coil is actuated when powered on, and the coil drives the optical assembly and the elastic piece to move. In the vibration process of the micro-vibrator, the coil rotates around the rotating axis located on the middle vertical plane of the first fan-shaped magnet, the magnet is of a fan-shaped structure, and the distance between the coil and the first fan-shaped magnet is kept fixed at any moment, so that the force borne by the coil at any position and in a power-on state is the same, and the vibration of the micro-vibrator is avoided. The consistency of the acting force of the actuating assembly on the optical element at different angles is realized, the subsequent angle control of the optical element is facilitated, and the scanning effect of the micro-vibrator is ensured. The embodiment of the invention further provides a display device.

The invention provides an MEMS silicon microphone structure and a preparation method thereof.In the preparation method, a sacrificial material layer, a vibrating diaphragm located in the sacrificial material layer and a back pole plate structure located on the sacrificial material layer are formed on a substrate, and the back pole plate structure comprises a silicon base layer, a supporting layer and a supporting isolation layer from bottom to top; the corresponding back polar plate structure above the working area comprises a plurality of holes; forming a first opening exposing the sacrificial material layer in the working area to obtain an initial MEMS silicon microphone structure; and at least removing the sacrificial material layer on the working area by etching through the plurality of holes and the first opening so as to form a sacrificial layer, a second opening and a third opening. In conclusion, on one hand, the support isolation layer can provide support for the support layer, so that the reliability of the MEMS silicon microphone structure is improved; and on the other hand, the supporting isolation layer can be used for protecting the surface of the supporting layer from being influenced in the process of etching the sacrificial layer through the hole, so that the performance and the stability of the MEMS silicon microphone structure are improved.

A MEMS sensor arrangement (100) comprises a substrate (10), a pressure sensor structure (12) and a sound transducer structure (14) in a vertically stacked and mechanically coupled configuration, wherein the pressure sensor structure (12) is arranged between the substrate (10) and the sound transducer structure (14), wherein a through-hole (16) extends through the substrate (10) and the pressure sensor structure (12) and forms a sound connection (16) to the sound transducer structure (14), wherein the sound transducer structure (14) spans the through-hole (16), and wherein the pressure sensor structure (12) has a pressure sensor element (18) that is in fluid communication with the through-hole (16).

The present disclosure relates generally to the field of ultrasound, and more particularly to methods and devices that enable ultrasound transduction using a mixed array including an array of optical sensors and other transducers. The ultrasound device may include an ultrasound transducer array including one or more array elements of a first type and one or more array elements of a second type different from the first type. The first type may include a transducer configured to transmit acoustic waves. The second type may include an optical sensor. The first and second types of array elements are configured to detect acoustic echoes corresponding to the transmitted acoustic waves.

The present disclosure relates to driver circuitry for driving a piezoelectric transducer. The circuitry comprises: a power supply; a reservoir capacitance; switch network circuitry; and control circuitry. The control circuitry is configured to control operation of the switch network circuitry so as to charge the reservoir capacitance from the power supply and to transfer charge between the reservoir capacitance and the piezoelectric transducer.

The invention provides an MEMS acoustic sensor and a preparation method thereof, a substrate comprises a first region and a second region, and the first region surrounds the second region; the supporting structure is located on part of the first area; the silicon vibrating diaphragm is positioned on the substrate; each piezoresistor in the plurality of piezoresistors is located in the silicon vibrating diaphragm, and the plurality of piezoresistors form a bridge structure; the back polar plate is located on part of the supporting structure and the silicon vibrating diaphragm; the piezoresistor electrodes are positioned on the surface of each piezoresistor; the silicon diaphragm electrode is located on the surface of the edge area of the silicon diaphragm; the back pole plate electrode is located on the surface of the back pole plate on part of the first region. Therefore, the sensor can monitor the dynamic stress of the silicon vibrating diaphragm through the bridge structure integrated on the silicon vibrating diaphragm, and can regulate and control the working state of the silicon vibrating diaphragm based on the monitored dynamic stress of the silicon vibrating diaphragm, thereby preventing the silicon vibrating diaphragm from being broken due to overlarge stress, and having high sensitivity.

Membrane pot (10) for an ultrasonic transducer, with a blind-shaped recess (18) which is bounded by a side wall (12) and a bottom area (13), wherein the bottom area (13) is designed for attaching a transducer element (20), wherein the membrane pot (10) is bounded at one end face by the bottom area (13) and has a radially outwardly projecting circumferential flange (14) at the other end face, • wherein the recess (18) in a cross-sectional plane arranged perpendicular to a longitudinal axis (11) of the membrane pot (10) has an oval-shaped inner contour (25) with a principal axis (27) and a minor axis (28), • wherein the inner contour (25) is at least approximately elliptical, and wherein the inner contour (25) has, in the direction of the minor axis (28) and mirrored to the major axis (27), a central section (29) which is curved in certain areas, wherein, viewed from the two central sections (29) in the direction of the major axis (27), a contour section (31) extends which is arranged within the contour (26) of an ideal ellipse, wherein the ideal ellipse is the ellipse whose smallest diameter corresponds to the maximum extent in the direction of the minor axis (281) of the inner contour (25) and whose larger diameter corresponds to the maximum extent in the direction of the major axis (271) of the inner contour (251), wherein, viewed from the contour section (31) in the direction of the major axis (27), a further contour section (32) adjoins the contour section (31), wherein the further contour section (32) lies outside the contour (26) of the The ideal ellipse is characterized by the fact thatthat the recess (18) in the area of ​​the flange (14) has a conically shaped transition area (19).

The invention discloses a vibration sensor, a control method thereof and electronic equipment. The vibration sensor comprises a substrate and a shell, the substrate is covered with the shell, and the shell and the substrate form a containing cavity; the vibration assembly is arranged on the substrate and located in the containing cavity; the functional assembly is arranged in the containing cavity and comprises an MEMS chip and an ASIC chip, the MEMS is electrically connected with the vibration assembly, and the ASIC chip is electrically connected with the MEMS chip and the substrate; wherein the ASIC chip comprises a chopping denoising circuit, and the chopping denoising circuit comprises a modulation circuit, an amplification circuit, a demodulation circuit, a high-pass filter circuit and a low-pass filter circuit. The vibration sensor provided by the invention has the advantage of low noise.

The utility model provides a combined sensor and electronic equipment. The combined sensor comprises a substrate, a first chip set and a second chip set, wherein the first chip set and the second chip set are arranged on the substrate; wherein a first isolation piece is arranged between the substrate and the first chip set, and a second isolation piece which is arranged in a manner of surrounding the first chip set is arranged on the first isolation piece; the first chip set and the second chip set are isolated through the first isolation piece and the second isolation piece. According to the utility model, the space can be saved, the product size can be reduced, and crosstalk among the chips can be effectively prevented.

An ultrasonic device is provided for transmitting ultrasonic waves. The ultrasonic device comprises an electrostatic drive device and an impedance matching layer. The electrostatic drive device includes a first electrode and a second electrode. The first electrode is a drive membrane and is disposed with tension applied at a position facing the second electrode. The second electrode has a through hole. At least one of the first electrode and the second electrode is a laminated membrane in which a plurality of materials with different conductivities are laminated. The impedance matching layer includes a matching membrane and gas. The matching membrane has a resonance loss equal to or less than transmitted acoustic power, and is disposed with tension applied at a position facing the first electrode. The gas is sealed between the matching membrane and the first electrode.

A composition for an acoustic wave probe comprising a polysiloxane having a vinyl group and a phenyl group, a polysiloxane having two or more Si-H groups in the molecular chain thereof, titanium oxide particles, and silica particles, and at least one of the titanium oxide particles (C) and silica particles (D) is surface-treated particles; a silicone resin for an acoustic wave probe; an acoustic wave probe; an acoustic wave measurement device; an ultrasonic diagnostic device; an ultrasonic wave probe; a photoacoustic wave measurement device; and an ultrasonic endoscope.

A device, including an implantable microphone, including a transducer, and a chamber in which a gas is located such that vibrations originating external to the microphone based on sound are effectively transmitted therethrough, wherein the transducer is in effective vibration communication with the gas, wherein the transducer is configured to convert the vibrations traveling via the gas to an electrical signal, the chamber and the transducer correspond to a microphone system, wherein the chamber corresponds to a front volume of the microphone system, and the transducer includes a back volume corresponding to the back volume of the microphone system, and the implantable microphone is configured to enable pressure adjustment of the front and / or back volume in real time.

The utility model relates to a vibration damper for MEMS device installation. The device mainly comprises MEMS devices 1, a soft band PCB 2 and a damping structure 3, the damping structure 3 is provided with a plurality of mounting parts 301, and each mounting part 301 is used for mounting one MEMS device 1; one end of the soft band PCB 2 is connected with one end of the MEMS device 1; the other end of the soft belt PCB 2 is located on the outer side of the damping structure 3 and used for being connected with a circuit board of a device to be installed, and the damping structure 3 is fixed to the device to be installed. According to the utility model, the MEMS device and the circuit board of the device to be installed are connected through the soft band PCB, so that the vibration and impact of the circuit board are firstly relieved through the soft band PCB and then transmitted to the MEMS device, and the vibration and impact transmitted from the circuit board to the MEMS device are reduced; the MEMS device is arranged on the damping structure, and vibration impact borne by the MEMS device is further reduced through the damping structure.